Drying device for cleaning semiconductor wafer

Abstract

The utility model provides a drying device for cleaning semiconductor wafers, which relates to the technical field of drying devices and comprises a storage box, a plurality of groups of bearing shafts are fastened and connected to the bottom end of the storage box, a processing box is fastened and connected to the top end of the storage box, and two groups of limiting plates are fastened and connected to the inner bottom end of the storage box. Through cooperation of the storage box, the cleaning plate, the telescopic shaft and the motor, the semiconductor wafer is clamped at the top end of the cleaning plate, the telescopic shaft can be driven by the motor to perform lifting operation, and in the lifting process of the telescopic shaft, the cleaning plate and the semiconductor wafer can be synchronously driven to ascend and descend; when the semiconductor wafer and the cleaning plate are lifted to a preset position, the semiconductor wafer can be completely soaked in the cleaning liquid stored in the storage box, the semiconductor wafer does not need to be manually adjusted by a constructor, and pollution to the semiconductor wafer in the process of adjusting the semiconductor wafer is avoided.

Description

Technical Field

[0001] The utility model relates to the technical field of drying devices, in particular to a drying device for semiconductor wafer cleaning. Background Art

[0002] The drying process is a crucial step in wafer manufacturing. It follows the cleaning process and aims to remove residual moisture and other solvents on the wafer surface, preventing chemical reactions of contaminants during subsequent high-temperature processing, which may lead to device defects. Through efficient and uniform drying, contamination caused by moisture residue can be reduced, the purity of the wafer and the yield of integrated circuits can be improved, thus directly affecting the performance and reliability of the final semiconductor product. Drying is a necessary step before certain thin film depositions in wafer preparation, such as soft baking or hard baking of photoresist, which helps to improve the adhesion and uniformity of the film layer and provides a good foundation for subsequent processes such as lithography and etching. The wafer drying device plays a key role in ensuring the cleanliness of the wafer surface, optimizing the process flow and improving the product quality in semiconductor manufacturing.

[0003] However, in the existing drying device for semiconductor wafer cleaning, during the cleaning process of the semiconductor wafer, operators need to manually adjust the semiconductor wafer, which is likely to cause contamination to the semiconductor wafer, resulting in a deteriorated cleaning effect. Moreover, during the drying process of the semiconductor wafer, vapor is generated, which is likely to contaminate and corrode the semiconductor wafer. Therefore, a new drying device for semiconductor wafer cleaning needs to be proposed. Summary of the Utility Model

[0004] The purpose of the utility model is to solve the above-mentioned problems that during the cleaning process of the semiconductor wafer, operators need to manually adjust the semiconductor wafer, which is likely to cause contamination to the semiconductor wafer, resulting in a deteriorated cleaning effect, and during the drying process of the semiconductor wafer, vapor is generated, which is likely to contaminate and corrode the semiconductor wafer. A drying device for semiconductor wafer cleaning is proposed.

[0005] To achieve the above purpose, the utility model adopts the following technical scheme: A drying device for semiconductor wafer cleaning includes a storage box. Multiple load-bearing shafts are fixedly connected to the bottom end of the storage box. A processing box is fixedly connected to the top end of the storage box. Two limiting plates are fixedly connected to the inner bottom end of the storage box. A moving block is slidably connected to the middle side between the two limiting plates. A connecting plate is fixedly connected to one side surface of the moving block. A cleaning plate is fixedly connected to one end of the connecting plate. A telescopic shaft is inserted through the middle of the bottom end of the storage box. A rubber sealing ring is arranged at the junction of the telescopic shaft and the storage box. A timing device is arranged at the top of one side of one of the limiting plates.

[0006] Preferably, the top end of the telescopic shaft is fixedly connected to the bottom end of the cleaning plate, and the bottom end of the telescopic shaft is connected to a motor.

[0007] Preferably, two mounting boxes are fixedly connected to the middle of the inside of the processing box, and a heating fan is arranged inside the mounting box.

[0008] Preferably, a partition board is tightly connected to the top end of the processing box, and an exhaust fan is inserted through the middle of the partition board.

[0009] Preferably, the top end of the exhaust fan is fixedly connected to a ventilation plate, and a guide rod is inserted through the middle of the ventilation plate.

[0010] Preferably, the top end of the guide rod is connected to a rotary motor, and the bottom end of the guide rod is fixedly connected to a fan blade.

[0011] Preferably, a condenser is tightly connected to one side of the top end of the partition board, and drainage grooves are formed at the top end of the partition board and on one side of the processing box. One end of the drainage groove communicates with one side of the storage box.

[0012] Compared with the prior art, the advantages and positive effects of the present utility model are as follows.

[0013] 1. In the present utility model, with the cooperation of the storage box, the cleaning plate, the telescopic shaft and the motor, the semiconductor wafer is clamped on the top end of the cleaning plate. When using the motor, it can drive the telescopic shaft to perform lifting operations. During the lifting process of the telescopic shaft, the cleaning plate and the semiconductor wafer can be synchronously driven to lift. When the semiconductor wafer and the cleaning plate are lifted to a preset position, the semiconductor wafer can be completely immersed in the cleaning liquid stored inside the storage box, without the need for construction personnel to manually adjust the semiconductor wafer, avoiding contamination of the semiconductor wafer during the adjustment process.

[0014] 2. In the present utility model, with the cooperation of the partition board, the ventilation plate, the fan blade, the rotary motor, the condenser and the drainage groove, the rotary motor is used to drive the fan blade to rotate, and the vapor inside the processing box is inhaled to the top end of the partition board. The ventilation plate is used to conveniently install the fan blade inside the exhaust fan. When the vapor enters the inside of the partition board, the condenser is used to condense the vapor into a liquid, which flows into the storage box through the drainage groove. The drainage grooves formed on the surface of the partition board all have an inclination angle of 15 degrees. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 is a schematic cross-sectional structure diagram of a drying device for semiconductor wafer cleaning proposed by the present utility model;

[0016] Figure 2 is a schematic three-dimensional structure diagram of a drying device for semiconductor wafer cleaning proposed by the present utility model;

[0017] Figure 3 Schematic installation diagram of the cleaning plate, telescopic shaft, rubber sealing ring and motor structure of a drying device for semiconductor wafer cleaning proposed by the present utility model;

[0018] Figure 4 Partial structural schematic diagram of a drying device for semiconductor wafer cleaning proposed by the present utility model.

[0019] Legend: 1. Storage box; 2. Load-bearing shaft; 3. Processing box; 4. Installation box; 5. Partition board; 6. Exhaust fan; 7. Drainage groove; 8. Limiting plate; 9. Timing device; 10. Moving block; 11. Cleaning plate; 12. Telescopic shaft; 13. Rubber sealing ring; 14. Motor; 15. Condenser; 16. Heating fan; 17. Ventilation plate; 18. Fan blade; 19. Rotating motor; 20. Connecting plate. Detailed implementation manners

[0020] In order to more clearly understand the above-mentioned objects, features and advantages of the present utility model, the present utility model will be further described below with reference to the accompanying drawings and embodiments. It should be noted that, without conflict, the embodiments of the present application and the features in the embodiments can be combined with each other.

[0021] In the following description, many specific details are set forth in order to fully understand the present utility model. However, the present utility model can also be implemented in other ways different from those described herein. Therefore, the present utility model is not limited by the specific embodiments disclosed in the following specification. Embodiment 1

[0022] As Figures 1-4 shown, the present utility model provides a technical solution: a drying device for semiconductor wafer cleaning, including a storage box 1, a plurality of load-bearing shafts 2 are fixedly connected to the bottom end of the storage box 1, a processing box 3 is fixedly connected to the top end of the storage box 1, two limiting plates 8 are fixedly connected to the inner bottom end of the storage box 1, a moving block 10 is slidably connected to one side between the two limiting plates 8, a connecting plate 20 is fixedly connected to one side surface of the moving block 10, a cleaning plate 11 is fixedly connected to one end of the connecting plate 20, a telescopic shaft 12 is inserted and connected to the middle of the bottom end of the storage box 1, and a rubber sealing ring 13 is arranged at the junction of the telescopic shaft 12 and the storage box 1. A timing device 9 is arranged at the top end of one of the limiting plates 8, the top end of the telescopic shaft 12 is fixedly connected to the bottom end of the cleaning plate 11, and the bottom end of the telescopic shaft 12 is connected to a motor 14.

[0023] In this embodiment, with the cooperation of the storage box 1 and the processing box 3 provided, it is convenient for subsequent equipment to be installed. Then, under the action of the load-bearing shaft 2, the load-bearing effect of the overall equipment can be improved. Then, by using the limit plate 8, the cleaning plate 11 can be installed inside the processing box 3. When using the motor 14, it can drive the telescopic shaft 12 to perform lifting operations. During the lifting process of the telescopic shaft 12, the cleaning plate 11 can be driven to perform lifting operations synchronously. And under the action of the moving block 10 and the connecting plate 20, the cleaning plate 11 performs lifting operations along one side of the limit plate 8, preventing the cleaning plate 11 from shifting during the lifting process and affecting the subsequent use effect. The semiconductor wafer is clamped on the top of the cleaning plate 11. When the semiconductor wafer and the cleaning plate 11 are lifted to the preset position, the semiconductor wafer can be completely immersed in the cleaning liquid stored inside the storage box 1, eliminating the need for construction workers to manually adjust the semiconductor wafer, and avoiding contamination of the semiconductor wafer during the adjustment process. Using the rubber sealing ring 13 can improve the sealing effect between the telescopic shaft 12 and the storage box 1, preventing the cleaning liquid from leaking and affecting subsequent use. Using the timing device 9 can control the soaking time of the semiconductor wafer. When the soaking reaches the preset time, the motor 14 will drive the cleaning plate 11 to lift upward, providing convenience for subsequent drying operations. Embodiment 2

[0024] As Figures 1-4 As shown, two installation boxes 4 are fixedly connected in the middle of the inside of the processing box 3. A heating fan 16 is arranged inside the installation box 4. A partition plate 5 is tightly connected to the top of the processing box 3. A suction fan 6 is inserted through the middle of the partition plate 5. A ventilation plate 17 is fixedly connected to the top of the suction fan 6. A guide rod is inserted through the middle of the ventilation plate 17. The top of the guide rod is connected to a rotary motor 19. The bottom of the guide rod is fixedly connected to a fan blade 18. A condenser 15 is tightly connected to one side of the top of the partition plate 5. Drainage grooves 7 are opened at the top of the partition plate 5 and on one side of the processing box 3. One end of the drainage groove 7 communicates with one side of the storage box 1.

[0025] In this embodiment, by providing the installation box 4, it is convenient to install the heating fan 16 inside the processing box 3. Connecting the heating fan 16 to the power supply can dry the semiconductor wafer. During the drying process of the semiconductor wafer, vapor is generated. When using the rotary motor 19 to drive the fan blade 18 to perform rotational operations, the vapor inside the processing box 3 is sucked to the top of the partition plate 5. Using the ventilation plate 17 facilitates the installation of the fan blade 18 inside the suction fan 6. When the vapor enters the inside of the partition plate 5, the condenser 15 condenses the vapor into a liquid, which flows into the storage box 1 through the drainage groove 7. The drainage grooves 7 opened on the surface of the partition plate 5 all have an inclination angle of 15 degrees, preventing the vapor from contaminating and corroding the semiconductor wafer.

[0026] Working principle of this embodiment: During use, first install the device in an open location, then engage the semiconductor wafer on the top of the cleaning plate 11. When using the motor 14, it can drive the telescopic shaft 12 to perform lifting operations. During the lifting process of the telescopic shaft 12, it can synchronously drive the cleaning plate 11 to perform lifting operations. Under the action of the moving block 10 and the connecting plate 20, the cleaning plate 11 performs lifting operations along one side of the limiting plate 8, preventing the cleaning plate 11 from shifting during the lifting process and affecting the subsequent use effect. When the semiconductor wafer and the cleaning plate 11 are lifted to the preset position, the semiconductor wafer can be completely immersed in the cleaning liquid stored inside the storage tank 1, eliminating the need for construction personnel to manually adjust the semiconductor wafer and avoiding contamination of the semiconductor wafer during the adjustment process. Using the rubber sealing ring 13 can improve the sealing effect between the telescopic shaft 12 and the storage tank 1, preventing the cleaning liquid from leaking and affecting subsequent use. When using the timing device 9, it can control the soaking time of the semiconductor wafer. When the soaking reaches the preset time, the motor 14 will drive the cleaning plate 11 to lift upward, providing convenience for subsequent drying operations. Use the heating fan 16 to dry the semiconductor wafer. During the drying process of the semiconductor wafer, steam is generated. Then use the rotating motor 19 to drive the fan blade 18 to rotate, sucking the steam inside the processing box 3 to the top of the partition plate 5. Use the ventilation plate 17 to facilitate the installation of the fan blade 18 inside the exhaust fan 6. When the steam enters the partition plate 5, use the condenser 15 to condense the steam into a liquid, which flows into the storage tank 1 through the drainage groove 7. The drainage grooves 7 formed on the surface of the partition plate 5 all have an inclination angle of 15 degrees, preventing the steam from contaminating and corroding the semiconductor wafer. Under the action of the load-bearing shaft 2, the load-bearing effect of the overall device can be improved.

[0027] The above are only the preferred embodiments of the present invention, and are not intended to limit the present invention in other forms. Any person skilled in the art may use the disclosed technical content to make changes or modifications into equivalent embodiments with equivalent changes and apply them to other fields. However, as long as it does not depart from the technical solution content of the present invention, any simple modification, equivalent change, and modification made to the above embodiments based on the technical essence of the present invention still fall within the protection scope of the technical solution of the present invention.

Claims

1. A drying device for cleaning semiconductor wafers, characterized in that: The invention comprises a storage box (1), wherein the bottom end of the storage box (1) is fastened with a plurality of groups of load-bearing shafts (2), the top end of the storage box (1) is fastened with a processing box (3), the inner bottom end of the storage box (1) is fastened with two groups of limit plates (8), a moving block (10) is slidably connected to one side in the middle of the two groups of limit plates (8), a connecting plate (20) is fixedly connected to one side surface of the moving block (10), a cleaning plate (11) is fixedly connected to one end of the connecting plate (20), a telescopic shaft (12) is inserted and connected to the middle of the bottom end of the storage box (1), a rubber sealing ring (13) is provided at the junction of the telescopic shaft (12) and the storage box (1), and a timing device (9) is provided at the top end of one side of one group of the limit plates (8).

2. The drying device for cleaning semiconductor wafers according to claim 1, characterized in that: The top end of the telescopic shaft (12) is fixedly connected to the bottom end of the cleaning plate (11), and the bottom end of the telescopic shaft (12) is connected to a motor (14).

3. The drying device for cleaning semiconductor wafers according to claim 2, characterized in that: The middle of the two groups of the processing boxes (3) are fixedly connected with installation boxes (4), and a heating fan (16) is arranged inside the installation box (4).

4. The drying device for cleaning semiconductor wafers according to claim 3, characterized in that: A partition plate (5) is fixedly connected to the top of the processing box (3), and an exhaust fan (6) is inserted and connected in the middle of the partition plate (5).

5. The drying device for cleaning semiconductor wafers according to claim 4, characterized in that: A ventilation plate (17) is fixedly connected to the top end of the exhaust fan (6), and a guide rod is inserted and connected in the middle of the ventilation plate (17).

6. The drying device for cleaning semiconductor wafers according to claim 5, characterized in that: The top end of the guide rod is connected to a rotating motor (19), and the bottom end of the guide rod is fixedly connected to a fan blade (18).

7. The drying device for cleaning semiconductor wafers according to claim 4, characterized in that: A condenser (15) is fastened to one side of the top end of the partition (5), a drainage groove (7) is provided at the top end of the partition (5) and one side of the processing box (3), and one end of the drainage groove (7) is connected to one side of the storage box (1).

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