Wafer bonding pressure head and wafer bonding machine

Abstract

The utility model relates to the technical field of semiconductor material processing equipment, in particular to a wafer bonding pressure head and a wafer bonding machine. The wafer bonding pressure head comprises a base which comprises a top wall and a side wall formed by extending the outer edge of the top wall; the top wall and the side wall are enclosed to form a cavity with an opening surface; one end of the telescopic part is connected to the cavity through a connecting piece, and the other end of the telescopic part is provided with an end plate; a closed space is defined by the connecting piece, the telescopic part, the end plate and the top wall and / or the side wall of the base; the outer edge of the end plate is matched with the side wall of the base; the end plate is configured to move along the side wall of the base when the closed space is pressurized or depressurized; the end, away from the cavity, of the end plate is provided with a pressing disc. The wafer bonding machine comprises the wafer bonding pressure head. The pressure generated by the wafer bonding pressure head provided by the utility model is uniform. The pressure head is simple in overall structure and small in occupied space, so that the overall size of the wafer bonding machine comprising the wafer bonding pressure head is small.

Description

Technical Field

[0001] This application relates to the technical field of semiconductor material processing equipment, and particularly to a wafer bonding head and a wafer bonder. Background Art

[0002] In semiconductor material manufacturing technology, the use of bonding technology to bond two wafers together has been widely applied. When bonding wafers, it is necessary to uniformly apply pressure to two or more wafers that have been aligned and adhered. In the prior art, a servo motor is used to drive a ball screw to transmit pressure to the head. In this pressurization method, the pressure gradually decreases from the central pressure point to the edge, and the force distribution on the entire pressing surface of the head is uneven. The structure itself is complex and occupies a large space, which is not conducive to the development of the whole machine towards miniaturization. Summary of the Utility Model

[0003] The purpose of the present utility model is to provide a wafer bonding head and a wafer bonder for uniformly applying pressure to a wafer.

[0004] To achieve this purpose, the present utility model adopts the following technical solutions:

[0005] A wafer bonding head, comprising: a base, the base includes a top wall, and a side wall extending from the outer edge of the top wall;

[0006] The top wall and the side wall enclose a chamber having an open surface;

[0007] A telescopic part, one end of the telescopic part is connected to the chamber through a connecting piece, and the other end of the telescopic part is provided with an end plate;

[0008] The connecting piece, the telescopic part, the end plate and the top wall and / or the side wall of the base enclose a closed space;

[0009] The outer edge of the end plate is matched with the side wall of the base;

[0010] The end plate is configured such that when the closed space is pressurized or depressurized, the end plate moves along the side wall of the base;

[0011] A pressing plate is provided at the end of the end plate away from the chamber.

[0012] Further, it further includes a joint disposed on the base;

[0013] The joint is communicated with the closed space.

[0014] Further, the medium for pressurizing or depressurizing the closed space includes a gaseous medium and a liquid medium;

[0015] The gaseous medium and the liquid medium enter and exit the closed space through the joint.

[0016] Further, the telescopic part is a corrugated pipe;

[0017] The corrugated pipe is made of metal.

[0018] Further, the end plate and the pressure plate are connected by a plurality of adjusting nuts;

[0019] The adjusting nut is used to adjust the parallelism between the pressure plate and the end plate.

[0020] Further, a heater is arranged on the pressure plate.

[0021] Further, an insulating structure is arranged between the pressure plate and the heater.

[0022] Further, a connecting rod is further included, and the connecting rod passes through the top wall;

[0023] One end of the connecting rod located in the closed space is connected to the end plate;

[0024] The other end of the connecting rod is connected to the driving part.

[0025] Further, the driving part includes a supporting unit connected to the base and a cylinder installed on the supporting unit.

[0026] A wafer bonding machine includes a substrate, the substrate is arranged on the wall of the wafer bonding machine, or the substrate is a part of the wall of the wafer bonding machine; the above-mentioned wafer bonding head is arranged on the substrate.

[0027] Advantages of the present utility model:

[0028] The wafer bonding head provided by this application drives the pressure plate to press against the wafer through the pressure formed in the closed space, and the pressure is uniform. The overall structure of the head is simple and occupies a small space, making the overall volume of the wafer bonding machine including this wafer bonding head small. Description of the drawings

[0029] Figure 1 is a schematic structural diagram of the wafer bonding head of the present utility model;

[0030] Figure 2 is a three-dimensional schematic diagram of the wafer bonding head of the present utility model;

[0031] In the figure: 1. Driving part; 2. Connecting rod; 3. Base; 31. Top wall; 32. Side wall; 4. Substrate; 5. End plate; 6. Connector; 7. Chamber; 8. Telescopic part; 9. Connecting piece; 10. Pressure plate; 11. Temperature control plate. Detailed implementation manners

[0032] The present utility model will be further described in detail below in conjunction with the accompanying drawings and embodiments. It can be understood that the specific embodiments described herein are only for explaining the present utility model, rather than limiting the present utility model. Additionally, it should be noted that for the convenience of description, only the parts related to the present utility model rather than all the structures are shown in the drawings.

[0033] In the description of the present utility model, unless otherwise clearly defined and limited, the terms "connected", "connected to", and "fixed" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or integrated; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two elements or the interaction relationship between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.

[0034] In the present utility model, unless otherwise clearly defined and limited, the first feature being "above" or "below" the second feature can include the direct contact between the first and second features, or can also include the situation where the first and second features are not in direct contact but in contact through other features between them. Moreover, the first feature being "above", "above the top", and "on the top" of the second feature includes the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature has a higher horizontal height than the second feature. The first feature being "below", "below the bottom", and "under the bottom" of the second feature includes the first feature being directly below and obliquely below the second feature, or simply indicating that the first feature has a lower horizontal height than the second feature.

[0035] In the description of this embodiment, the orientation or positional relationships such as "above", "below", "right", etc. are based on the orientation or positional relationships shown in the drawings, and are only for the convenience of description and simplifying the operation, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, so it cannot be understood as a limitation to the present utility model. In addition, the terms "first" and "second" are only used for distinction in description and do not have special meanings.

[0036] See Figure 1 and Figure 2 , this embodiment provides a wafer bonding head for uniformly applying pressure to the wafer during the wafer bonding process. It includes a base 3, and the base 3 includes a top wall 31 and a side wall 32 perpendicular to the top wall 31. In some embodiments, the side wall 32 can also exist in a form that is not perpendicular to the top wall 31.

[0037] The top wall 31 and the side wall 32 enclose a chamber 7 with an opening surface. A telescopic part 8 is arranged in the chamber 7. In this embodiment, the telescopic part 8 is a metal bellows. One end of the metal bellows is connected to the top wall 31 of the base 3 through a connector 9, and the other end of the metal bellows is connected with an end plate 5. The end plate 5, the metal bellows, and the top wall 31 of the base 3 jointly enclose a closed space.

[0038] In this embodiment, a joint 6 is arranged on the top wall 31 of the base 3, and the joint 6 communicates the closed space with the outside of the base. When pressurizing or depressurizing the closed space through the joint 6, the metal bellows expands and contracts, and the end plate 5 moves along the side wall 32 of the base 3. In this embodiment, the pressurizing or depressurizing uses gas as the medium, and air pressure is filled into or released from the closed space.

[0039] In this embodiment, a pressure plate 10 is arranged on the side of the end plate 5 away from the closed space, and the pressure plate 10 is used to apply pressure to the wafer.

[0040] In this embodiment, by controlling the pressure of the pressure plate 10 to apply pressure to the wafer, the actual pressure on the wafer can be made uniform, solving the problem of the central pressure point existing in the existing method. Since the pressure generated by the pressure plate 10 in this embodiment is uniform, a relatively large pressure can be applied, so that a higher bonding force is generated between the bonded wafers.

[0041] In this embodiment, a temperature control plate 11 is arranged on the pressure plate 10, and an insulating and heat-insulating structure is also arranged between the pressure plate 10 and the temperature control plate 11 to isolate the electrical and heat conduction between the pressure plate 10 and the temperature control plate 11. Heating while bonding can improve the bonding effect between the wafers.

[0042] In this embodiment, a connecting rod 2 is further included. The connecting rod 2 penetrates through the top wall 31 of the base 3. One end of the connecting rod 2 located in the closed space is connected to the end plate 5, and the other end of the connecting rod 2 is connected to the driving part 1. The driving part 1 is installed on the base 3 through a supporting unit.

[0043] In this embodiment, by driving the pressure plate to press down through the driving part 1, pre-pressing or pre-bonding of the wafer can be carried out, and the wafer drift caused by the change of the air pressure environment during wafer bonding can be solved.

[0044] This embodiment also provides a wafer bonding machine, including the above-mentioned wafer bonding head. The wafer bonding head is installed on the wafer bonding machine body through a substrate 4. When bonding wafers by the wafer bonding machine of this embodiment, a relatively large and uniform bonding pressure can be generated.

[0045] Obviously, the above embodiments of the present utility model are merely examples for clearly illustrating the present utility model, rather than limitations on the implementation manners of the present utility model. For those of ordinary skill in the art, various obvious changes, re-adjustments and substitutions can be made without departing from the protection scope of the present utility model. It is not necessary and impossible to enumerate all implementation manners here. Any modifications, equivalent substitutions and improvements made within the spirit and principle of the present utility model shall be included within the protection scope of the claims of the present utility model.

Claims

1. A wafer bonding head, characterized in that: The invention comprises: a base, wherein the base comprises a top wall and a side wall formed by extending from the outer edge of the top wall; The top wall and the side wall enclose a chamber having an opening surface; A telescopic portion, one end of which is connected to the chamber via a connecting piece, and the other end of which is provided with an end plate; The connecting member, the telescopic portion, the end plate and the top wall and / or the side wall of the base are enclosed to form a closed space; The outer edge of the end plate matches the side wall of the base; The end plate is configured to move along the side wall of the base when the closed space is pressurized or released; A pressure plate is disposed at one end of the end plate away from the chamber.

2. The wafer bonding head according to claim 1, characterized in that: Also included is a connector configured on the base; The joint is in communication with the closed space.

3. The wafer bonding head according to claim 2, characterized in that: The medium for charging or releasing pressure into the enclosed space includes a gaseous medium or a liquid medium; The gaseous medium and the liquid medium enter and exit the closed space through the joint.

4. The wafer bonding head according to claim 1, characterized in that: The telescopic part is a bellows; The bellows is made of metal.

5. The wafer bonding head according to claim 1, characterized in that: The end plate is connected to the pressure plate via a plurality of adjusting nuts; The adjusting nut is used to adjust the parallelism between the pressure plate and the end plate.

6. The wafer bonding head according to claim 1, characterized in that: The pressure plate is provided with a heater.

7. The wafer bonding head according to claim 6, characterized in that: An insulating structure is arranged between the pressure plate and the heater.

8. The wafer bonding head according to claim 1, characterized in that: It also includes a connecting rod, wherein the connecting rod is penetrated through the top wall; One end of the connecting rod located in the closed space is connected to the end plate; The other end of the connecting rod is connected to the driving part.

9. The wafer bonding head according to claim 8, characterized in that: The driving part includes a supporting unit connected to the base and a cylinder installed on the supporting unit.

10. A wafer bonding machine, characterized in that: It comprises the wafer bonding press head described in any one of claims 1-9.

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