Small-size inversion device

Abstract

The utility model relates to the technical field of inverters, and discloses a small-size inversion device, which effectively satisfies miniaturization and has better heat dissipation performance by improving a shell structure and a semiconductor device. The device comprises a mounting shell and a semiconductor assembly arranged in the mounting shell, the mounting shell comprises a bottom plate and a first surrounding plate arranged along the upper edge of the bottom plate by a circle, and a mounting cavity is formed in the middle of the bottom plate; the semiconductor assembly comprises a PCB (Printed Circuit Board), and the PCB is fixedly arranged above the mounting cavity; a three-phase rectification integration module and an IGBT integration module are arranged on the side, close to the installation cavity, of the PCB, the three-phase rectification integration module and the IGBT integration module are connected with the bottom plate through a heat conduction layer, and cooling fins are arranged below the bottom plate.

Description

Technical Field

[0001] The utility model relates to the technical field of inverters, and particularly relates to a small-volume inverter device. Background Art

[0002] An inverter is a device that can convert alternating current to direct current or direct current to alternating current. The main structure of the mainstream inverter device includes a housing and semiconductor devices arranged inside the housing. Among them, the semiconductor devices mainly include a PCB board and control switches arranged on the PCB board. Among them, circuits are etched on the PCB board, and the control switches are IGBTs, silicon-based MOSFETs or SiC switch devices.

[0003] However, conventional inverters have some disadvantages. For example, the module devices inside them are relatively scattered, and the connection circuit lines are very complicated, which directly leads to a large volume of the inverter and is difficult to reduce. At the same time, since each device generates heat during operation, if the device components are integrated only for the miniaturization of the inverter, it will pose a certain test to the heat dissipation of the inverter. Summary of the Utility Model

[0004] I. Technical Problems to be Solved

[0005] Aiming at the phenomenon that the existing inverters in the prior art are difficult to be miniaturized or have poor heat dissipation after miniaturization, the utility model provides a small-volume inverter device, which has good heat dissipation performance while meeting the miniaturization requirement by improving the housing structure and semiconductor devices.

[0006] II. Specific Technical Solutions

[0007] A small-volume inverter device includes an installation housing and a semiconductor component arranged inside the installation housing. The installation housing includes a bottom plate and a first surrounding plate arranged along the upper edge of the bottom plate for one week. An installation cavity is arranged in the middle of the bottom plate. The semiconductor component includes a PCB board, and the PCB board is fixedly arranged above the installation cavity. A three-phase rectification integrated module and an IGBT integrated module are arranged on the side of the PCB board close to the installation cavity. The three-phase rectification integrated module and the IGBT integrated module are connected to the bottom plate through a heat conduction layer, and a heat sink is arranged below the bottom plate.

[0008] Implementation Principle, Working Principle:

[0009] In this solution, a three-phase rectifier integrated module and an IGBT integrated module are used as the main components. The three-phase rectifier integrated module is a module formed by integrating three thyristors and three diodes, and the IGBT integrated module is a module formed by integrating 4 IGBTs. Compared with the conventional discrete components soldered on the PCB board, it has fewer pins, is simple and convenient to install, and has a higher integration degree, which is also beneficial to miniaturization of the volume. At the same time, both the three-phase rectifier integrated module and the IGBT integrated module are located in the installation cavity. When they generate heat, the heat can be quickly exported to the heat sink through the heat conduction layer to achieve heat dissipation.

[0010] Preferably: A second enclosure is provided in the middle above the bottom plate. The second enclosure and the bottom plate form the installation cavity, and the three-phase rectifier integrated module and the IGBT integrated module are located in the installation cavity. The beneficial effect of this preference is that the second enclosure and the bottom plate form the installation cavity. When the PCB board is installed, the second enclosure can support and limit the PCB board, avoiding deformation of the PCB board due to heat generated by the components.

[0011] Preferably: Mounting seats are also provided around the bottom plate. The mounting seats are provided with threaded holes in the vertical direction of the bottom plate, and the periphery of the PCB board is provided with mating holes corresponding to the threaded holes. The beneficial effect of this preference is that the PCB board is installed on the installation housing through screws. The screws pass through the approval holes and are threadedly connected to the threaded holes to achieve the installation of the PCB board, which is simple and convenient.

[0012] Preferably: Connecting pieces are also spaced between the second enclosure and the first enclosure. Both ends of the connecting piece are respectively connected to the first enclosure and the second enclosure. The beneficial effect of this preference is that the second enclosure, the PCB board and the bottom plate form a sealed chamber. When the temperature in the chamber rises, the heat can be exported to the first enclosure through the connecting piece to achieve the effect of heat dissipation. The connecting piece can also support the second enclosure and the first enclosure, and the structural strength is better.

[0013] Preferably, the upper end of the connecting piece is an inclined edge. One side of the inclined edge is connected to the upper end of the second enclosure, and the other side of the inclined edge is flush with the height of the mounting seat. The beneficial effect of this preference is that such a connecting piece can provide a larger bearing space for the PCB board and has stronger adaptability.

[0014] As a preference, the heat conduction layer is any one of a heat dissipation silicone grease layer, a graphene layer or a carbon nanotube layer. The beneficial effect of this preference is that in actual application, different heat conduction materials can be selected as the heat conduction layer according to requirements, and the replaceability is strong.

[0015] The beneficial effect of this solution is:

[0016] 1. Converting the rectifier device and the IGBT device from discrete devices to integrated modules is more conducive to the miniaturization of the inverter. Among them, the three-phase rectifier integrated module and the IGBT integrated module are in contact with the bottom plate through the heat-conducting layer, and can quickly conduct heat through the heat sink of the bottom plate, with good heat dissipation performance.

[0017] 2. In this solution, the setting of the connecting piece can improve the structural strength inside the installation housing, and at the same time can provide a certain heat-conducting effect, which is more conducive to heat dissipation.

[0018] 3. The PCB board divides the three-phase rectifier integrated module and the IGBT integrated module into upper and lower sides, which can separate the heat sources, avoid heat concentration, and is more convenient for heat dissipation. Description of the Drawings

[0019] Figure 1 It is a schematic structural diagram of the installation housing of the small-volume inverter device of the present utility model.

[0020] Figure 2 It is an exploded view of the small-volume inverter device of the present utility model.

[0021] Description of the reference numerals in the drawings: installation housing 1, semiconductor component 2, bottom plate 3, first enclosing plate 4, PCB board 5, three-phase rectifier integrated module 6, IGBT integrated module 7, heat-conducting layer 8, heat sink 9, second enclosing plate 10, mounting seat 11, mating hole 12, connecting piece 13. Detailed Embodiment

[0022] The following elaborates on the preferred embodiments of the present utility model in conjunction with the drawings, so that the advantages and features of the present utility model can be more easily understood by those skilled in the art, thereby making a clearer and more definite definition of the protection scope of the present utility model. Based on the embodiments in the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present utility model.

[0023] As Figure 1 and Figure 2 shown:

[0024] A small-volume inverter device mainly consists of an installation housing 1 and a semiconductor component 2, wherein the semiconductor component 2 is fixedly arranged inside the installation housing 1.

[0025] The installation housing 1 includes a bottom plate 3 and a first enclosing plate 4. As an implementation manner, the bottom plate 3 is a rectangular bottom plate, and there are four first enclosing plates 4 arranged around the perimeter of the bottom plate 3. Specifically, the bottom plate 3 and the first enclosing plate 4 are integrally formed. Among them, a second enclosing plate 10 is also integrally formed on the bottom plate 3. The second enclosing plate 10 and the bottom plate 3 form an installation cavity, and the second enclosing plate 10 and the first enclosing plate 4 are on the same side of the bottom plate 3.

[0026] During implementation, in order to improve the structural strength of the first enclosing plate 4 and the second enclosing plate 10, connecting pieces 13 are provided between the two enclosing plates. The two ends of the connecting piece 13 are respectively connected to the first enclosing plate 4 and the second enclosing plate 10, and there are multiple connecting pieces 13, which are evenly spaced between the two enclosing plates. Specifically, both the connecting piece 13 and the second enclosing plate 10 can support the semiconductor component 2. Specifically, in order to better support the semiconductor component 2, the upper end of the connecting piece 13 is an inclined edge, providing a larger area of support points. One end of its inclined edge is connected to the upper end of the first enclosing plate 4, and the other end is flush with the height of the mounting seat 11. During implementation, the connecting piece 13 can also conduct the heat dissipated by the components inside the first enclosing plate 4 through heat transfer.

[0027] During implementation, for the mounting seats 11 on the bottom plate 3, there are four of them corresponding to the four top corners of the bottom plate 3 respectively. Threaded holes are provided on the mounting seats 11, and the depth direction of the threaded holes is perpendicular to the bottom plate 3. Specifically, heat sinks 9 are provided on the other side of the bottom plate 3, and the heat sinks 9 are specifically heat dissipation fins. The mounting seats 11 are specifically used for mounting the semiconductor component 2.

[0028] During implementation, for the semiconductor component 2, it includes a PCB board 5. A mating hole that matches the threaded hole of the mounting seat is provided on the outer side of the PCB board, facilitating the installation of the PCB board through screws. Other components such as capacitors and resistors are provided on the upper part of the PCB board 5, and a three-phase rectifier integrated module 6 and an IGBT integrated module 7 are provided on the lower part of the PCB board 5. The advantage of this is that the PCB board divides the heat-generating components into upper and lower layers, dispersing the heat sources and facilitating heat dissipation. Among them, heat conduction layers 8 are bonded to both the three-phase rectifier integrated module 6 and the IGBT integrated module 7. The other side of the heat conduction layer 8 is closely attached to or closely connected to the bottom plate 3. The advantage of this is that through the heat conduction layer 8, the heat generated by the three-phase rectifier integrated module 6 and the IGBT integrated module 7 can be transferred to the heat sink 9 for heat dissipation. During implementation, the heat conduction layer 8 is specifically any one of a heat dissipation silicone grease layer, a graphene layer, or a carbon nanotube layer, all of which have good heat conduction effects.

[0029] Although the embodiments of the present invention have been shown and described, for those of ordinary skill in the art, it can be understood that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principles and spirit of the present invention. The scope of the present invention is defined by the appended claims.

Claims

1. A small-volume inverter device, comprising a mounting housing (1) and a semiconductor assembly (2) arranged in the mounting housing (1), wherein the mounting housing (1) comprises a bottom plate (3) and a first enclosure plate (4) arranged along an upper edge of the bottom plate (3), characterized in that: The bottom plate (3) is provided with a mounting cavity in the middle; the semiconductor assembly (2) comprises a PCB board (5), and the PCB board (5) is fixedly arranged above the mounting cavity; a three-phase rectifier integrated module (6) and an IGBT integrated module (7) are arranged on a side of the PCB board (5) close to the mounting cavity, and the three-phase rectifier integrated module (6) and the IGBT integrated module (7) are connected to the bottom plate (3) via a heat conducting layer (8); and a heat sink (9) is arranged below the bottom plate (3).

2. The small-volume inverter device according to claim 1, characterized in that: A second enclosure (10) is provided in the middle portion above the base plate (3); the second enclosure (10) and the base plate (3) form the installation cavity; the three-phase rectifier integrated module (6) and the IGBT integrated module (7) are located in the installation cavity.

3. The small-volume inverter device according to claim 1, characterized in that: The base plate (3) is also provided with a mounting seat (11) around it, the mounting seat (11) is provided with a threaded hole in the vertical direction of the base plate (3), and the PCB board (5) is provided with matching holes (12) corresponding to the threaded holes around it.

4. The small-volume inverter device according to claim 1, characterized in that: A connecting piece (13) is also arranged at intervals between the second enclosure (10) and the first enclosure (4), and two ends of the connecting piece (13) are respectively connected to the first enclosure (4) and the second enclosure (10).

5. The small-volume inverter device according to claim 4, characterized in that: The upper end of the connecting piece (13) is an inclined edge, one side of the inclined edge is connected to the upper end of the second enclosure (10), and the other side of the inclined edge is flush with the height of the mounting seat (11).

6. The small-volume inverter device according to claim 1, characterized in that: The heat-conducting layer (8) is any one of a heat-dissipating silicone grease layer, a graphene layer or a carbon nanotube layer.

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