Dismounting device and production equipment

Abstract

The utility model relates to a dismounting device and production equipment, the production equipment comprises the dismounting device and a carrier, the carrier is provided with a through hole in a penetrating manner along the thickness direction, and a semiconductor device can cover the through hole. The dismounting device comprises a bearing assembly and a separating assembly. The bearing assembly comprises a bearing body and a protruding part protruding out of the bearing body in the first direction. The separation assembly comprises a moving part arranged on the side, away from the bearing body, of the convex part, the moving part comprises a first surface facing the bearing body and an avoiding space formed by inwards sinking the first surface, and the first surface and the bearing body are arranged in a spaced mode in the first direction to form a gap space; and the projection of the convex part in the first direction is located in the projection of the avoiding space in the first direction. According to the dismounting device and the production equipment in the embodiment of the invention, the whole dismounting process is convenient and rapid, the dismounting effect is stable and reliable, and meanwhile, the probability of damage to the chip can be reduced.

Description

Technical Field

[0001] The present application relates to the technical field of semiconductor manufacturing equipment, and in particular to a disassembly device and production equipment. Background Art

[0002] Semiconductor devices are electronic devices made using the special properties of semiconductor materials and play an extremely important role in modern electronic technology. In the actual production process, semiconductor devices usually include a copper base plate, a copper-clad ceramic substrate and a chip. The chip and the copper-clad ceramic substrate, and the copper-clad ceramic substrate and the base plate need to be soldered together using solder paste.

[0003] During the production process, the various components of the semiconductor device need to be stacked one by one, and then the components are welded. During welding, the flux in the solder paste will evaporate and splash between the semiconductor device and the carrier, making it difficult to disassemble and separate the semiconductor device and the carrier after welding. Utility Model Content

[0004] The disassembly device and production equipment provided in the embodiments of the present application can make the entire disassembly process convenient and quick, and the disassembly effect is stable and reliable, while also reducing the probability of damage to the chip.

[0005] In a first aspect, an embodiment of the present application provides a disassembly device for disassembling a semiconductor device on a carrier, wherein the carrier is provided with a through hole along its thickness direction, and the semiconductor device can be covered by the through hole, and the disassembly device comprises:

[0006] A bearing assembly, comprising a bearing body and a convex portion protruding from the bearing body along a first direction;

[0007] A separation assembly, comprising a moving member disposed on a side of the convex portion away from the carrier body, the moving member comprising a first surface facing the carrier body, and an escape space formed by the first surface being recessed inwardly, the first surface being spaced apart from the carrier body to form a gap space, and a projection of the convex portion in the first direction being located within a projection of the escape space in the first direction;

[0008] Among them, the gap space is used to accommodate the carrier, the protrusion can penetrate into the through hole and contact and fix with the semiconductor device, and the moving part can contact and drive the carrier along the first direction to approach the supporting body so that the semiconductor device is located in the avoidance space.

[0009] In some embodiments, the avoidance space includes an avoidance groove formed by the first surface being recessed inwardly, and the avoidance groove has a groove bottom surface;

[0010] The disassembly device is configured such that the projection of the semiconductor device in the first direction overlaps with the projection of the bottom surface of the groove in the first direction.

[0011] In some embodiments, the separation assembly further includes a buffer structure disposed on the bottom surface of the groove. The hardness of the buffer structure is less than that of the moving member, and the dimension of the buffer structure in the first direction is less than the dimension of the bottom surface of the groove in the first direction.

[0012] In some embodiments, the semiconductor device includes a bottom plate and a chip disposed on the bottom plate. The projection of the bottom plate in the first direction is at least partially outside the projection of the chip in the first direction;

[0013] The avoidance space further includes an avoidance hole formed by inward depression of the bottom surface of the groove. The disassembly device is configured such that the projection of the chip in the first direction is within the projection of the avoidance hole in the first direction and outside the projection of the bottom surface of the groove in the first direction.

[0014] In some embodiments, there are multiple convex portions. The multiple convex portions all protrude from the bearing body in the first direction, and at least some of the convex portions are spaced apart in the second direction;

[0015] The avoidance space includes multiple avoidance holes spaced apart in the second direction. The projections of at least some different convex portions in the first direction are within the projections of different avoidance holes in the first direction, and the first direction intersects with the second direction.

[0016] In some embodiments, the bottom surface of the groove includes a first sub-surface located between adjacent avoidance holes in the second direction, and second sub-surfaces located on both sides of at least one of the multiple avoidance holes in the third direction. The second sub-surfaces are connected to the multiple first sub-surfaces. The first direction, the second direction, and the third direction intersect pairwise;

[0017] The separation assembly further includes a buffer structure disposed on the second sub-surface. The buffer structure covers at least the second sub-surface.

[0018] In some embodiments, the separation assembly further includes a driving member. The output end of the driving member is connected to the moving member, and the driving member is used to drive the moving member to slide in the first direction;

[0019] The positive projection of the moving member in the first direction is partially outside the positive projection of the bearing body in the first direction, and the connection position between the output end and the moving member is outside the positive projection of the bearing body in the first direction.

[0020] In some embodiments, the carrier assembly further includes two enclosing portions protruding from the carrier body along the first direction. The two enclosing portions and the convex portion are on the same side of the carrier body along the first direction. The two enclosing portions are respectively arranged on two sides of the convex portion in the second direction, and the second direction intersects with the first direction.

[0021] And / or, the carrier assembly further includes a positioning portion protruding from the carrier body along the first direction. The positioning portion and the convex portion are on the same side of the carrier body along the first direction. The positioning portion is spaced from the convex portion along the third direction, and the positioning portion is configured to be able to contact the carrier. The third direction intersects with the first direction.

[0022] In a second aspect, an embodiment of the present application provides a production device for producing semiconductor devices, which is characterized by including the disassembly device and the carrier. A first receiving groove is provided on one side surface of the carrier along its thickness direction. The orthographic projection of the through hole in the thickness direction of the carrier is inside the orthographic projection of the first receiving groove in the thickness direction of the carrier. The first receiving groove is configured to receive the semiconductor device.

[0023] In some embodiments, a plurality of the first receiving grooves and the through holes are provided on the carrier, and a second receiving groove communicating with the first receiving groove is further provided on the carrier.

[0024] According to the production device and the disassembly device provided by the present application, the semiconductor device is supported by the carrier, and the semiconductor on the carrier is disassembled by the disassembly device. Specifically, the convex portion can penetrate into the through hole and contact and fix the semiconductor device, so as to realize the support of the semiconductor device and at the same time realize the support of the carrier. The moving member can contact and drive the carrier to approach the carrier body along the first direction. During the entire disassembly and separation process, the convex portion supports the semiconductor device in the first direction and forms a gap between the carrier and the carrier body. The moving member drives the carrier to approach the carrier body in the first direction, so that the semiconductor device is disassembled and separated from the carrier. The entire disassembly process is convenient and fast, and the disassembly effect is stable and reliable. At the same time, the convex portion is on the side of the bottom plate away from the chip and contacts and supports the bottom plate, which can avoid the contact of the convex portion with the chip during the entire disassembly process and reduce the probability of damage to the chip. Description of the Drawings

[0025] The features, advantages and technical effects of the exemplary embodiments of the present application will be described below with reference to the drawings.

[0026] Figure 1 An isometric structural schematic diagram of a disassembly device, a carrier and a semiconductor device provided for some embodiments of the present application;

[0027] Figure 2 Front view of a disassembly device, a vehicle, and a semiconductor device provided for some embodiments of the present application;

[0028] Figure 3 Schematic axonometric structure diagram of a disassembly device provided for some embodiments of the present application;

[0029] Figure 4 Schematic axonometric structure diagram of a vehicle provided for some embodiments of the present application;

[0030] Figure 5 Schematic diagram of the cooperation relationship between the moving part and the buffer structure in a disassembly device provided for some embodiments of the present application;

[0031] Figure 6 Schematic diagram of the structure of the moving part in a disassembly device provided for some embodiments of the present application;

[0032] Figure 7 Schematic diagram of the cooperation relationship between the moving part, the buffer structure, and the semiconductor device in a disassembly device provided for some embodiments of the present application;

[0033] Figure 8 Front view of the cooperation relationship between the moving part, the buffer structure, and the semiconductor device in a disassembly device provided for some embodiments of the present application;

[0034] Figure 9 Schematic diagram of the cooperation relationship between a vehicle and a semiconductor device provided for some embodiments of the present application.

[0035] Marking description:

[0036] 100, disassembly device;

[0037] 10, bearing assembly; 11, bearing body; 12, convex part; 13, enclosing part; 14, positioning part;

[0038] 20, separation assembly; 21, moving part; 211, avoidance space; 2111, avoidance groove; 2112, avoidance hole; 22, buffer structure; 23, driving part;

[0039] 30, clearance space;

[0040] 200, vehicle; 201, through hole; 202, first accommodation groove; 203, second accommodation groove;

[0041] 300, semiconductor device;

[0042] B1, first surface; B2, bottom surface of the groove; B21, first sub-surface; B22, second sub-surface;

[0043] X, the first direction; Y, the second direction; Z, the third direction.

[0044] In the accompanying drawings, like parts are designated by like reference numerals. The drawings are not drawn to actual scale. Detailed implementation manners

[0045] The features and exemplary embodiments of various aspects of the present application will be described in detail below. To make the objectives, technical solutions and advantages of the present application clearer, the present application will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are only intended to explain the present application, rather than limiting the present application. For those skilled in the art, the present application can be implemented without some of these specific details. The following description of the embodiments is only to provide a better understanding of the present application by showing examples of the present application.

[0046] It should be noted that, in this document, relational terms such as "first" and "second" are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "comprising", "including" or any other variant thereof are intended to cover non-exclusive inclusion, such that a process, method, article or device comprising a series of elements includes not only those elements, but also other elements not expressly listed, or elements inherent to such process, method, article or device. Without further limitation, the elements defined by the statement "comprising..." do not exclude the presence of additional identical elements in the process, method, article or device comprising the said elements.

[0047] A semiconductor device is an electronic device made using the special properties of semiconductor materials and has an extremely important position in modern electronic technology. In the actual production process, a semiconductor device usually includes a copper bottom plate, a copper-clad ceramic substrate, and a chip, and it is necessary to solder the chip to the copper-clad ceramic substrate and the copper-clad ceramic substrate to the bottom plate simultaneously using solder paste.

[0048] In the production process, first, the various components in the semiconductor device need to be stacked in sequence, and then the various components are soldered. During soldering, the flux in the solder paste will volatilize and splash between the semiconductor device and the carrier, making it difficult to disassemble and separate the semiconductor device from the carrier after soldering.

[0049] In the related art, usually, the tail of a pair of tweezers with a high-temperature tape attached is used to pry the bottom plate to separate the bottom plate from the carrier. In this process, not only is it time-consuming and laborious for technicians, but there is also a certain probability of prying and damaging the chip or the bottom plate, causing damage to the semiconductor device.

[0050] For this reason, please see Figures 1 to 4 , an embodiment of the present application provides a production device, which is used to produce a semiconductor device 300. The production device includes a disassembly device 100 and a carrier 200, wherein the carrier 200 is provided with a through hole 201 along its thickness direction, and the semiconductor device 300 can be covered in the through hole 201. The disassembly device 100 includes a carrying component 10 and a separation component 20, wherein the carrying component 10 includes a carrying body 11 and a convex portion 12 protruding from the carrying body 11 along a first direction X. The separation component 20 includes a moving member 21 disposed on the side of the convex portion 12 away from the carrying body 11, the moving member 21 includes a first surface B1 facing the carrying body 11, and an avoidance space 211 formed by the first surface B1 being recessed inwardly, the first surface B1 and the carrying body 11 are spaced apart in the first direction X to form a gap space 30, and the projection of the convex portion 12 in the first direction X is located inside the projection of the avoidance space 211 in the first direction X. The gap space 30 is used to accommodate the carrier 200 , the protrusion 12 can penetrate into the through hole 201 and contact and fix with the semiconductor device 300 , and the moving member 21 can contact and drive the carrier 200 to approach the carrier body 11 along the first direction X so that the semiconductor device 300 is located inside the avoidance space 211 .

[0051] The semiconductor device 300 generally includes a copper base plate, a copper-clad ceramic substrate, and a chip. During the production process, the chip and the copper-clad ceramic substrate, and the copper-clad ceramic substrate and the base plate need to be soldered together by solder paste at the same time. The projection of the copper-clad ceramic substrate in the thickness direction is inside the projection of the base plate in the thickness direction, and the projection of the chip in the thickness direction is inside the projection of the copper-clad ceramic substrate in the thickness direction.

[0052] The carrier 200 provided in the embodiment of the present application is used to carry the semiconductor device 300 in the production process. Specifically, the carrier 200 is in contact with the base plate, and the copper-clad ceramic substrate and the chip are on the side of the base plate away from the carrier 200. A through hole 201 is provided on the carrier 200 along its thickness. When the carrier 200 carries the semiconductor device 300, the base plate can cover the through hole 201. The disassembly device 100 provided in the embodiment of the present application corresponds to the carrier 200, and the disassembly device 100 is used to disassemble the semiconductor device 300 on the carrier 200.

[0053] Specifically, the disassembly device 100 includes a carrier assembly 10. The carrier assembly 10 includes a carrier body 11 and a convex portion 12 protruding from the carrier body 11 along the first direction X. The convex portion 12 can penetrate into the through hole 201 and contact and fix the semiconductor device 300, so as to support the semiconductor device 300 and support the carrier 200 at the same time. After the bottom plate, the copper-clad ceramic substrate and the chip are welded on the carrier 200, usually adhesion occurs between the bottom plate and the carrier 200, and the bottom plate is on one side of the carrier 200 and can cover the through hole 201 on the carrier 200. During the process of the carrier 200 approaching the carrier body 11, the side of the carrier 200 facing away from the bottom plate faces the carrier body 11, and the through hole 201 on the carrier 200 corresponds to the convex portion 12 on the carrier body 11. One end of the convex portion 12 facing away from the carrier body 11 can enter the through hole 201 and support the bottom plate. The dimension of the convex portion 12 in the first direction X is greater than the distance between the contact surface of the bottom plate and the carrier 200 in the first direction X and the surface of the carrier 200 facing away from the bottom plate in the first direction X, so as to support the bottom plate by the convex portion 12 and there is a gap between the carrier 200 and the carrier body 11 in the first direction X.

[0054] Furthermore, the disassembly device 100 further includes a separation assembly 20. The separation assembly 20 includes a moving member 21 disposed on the side of the convex portion 12 facing away from the carrier body 11. The moving member 21 can contact and drive the carrier 200 to approach the carrier body 11 along the first direction X. After the convex portion 12 supports and fixes the bottom plate, the moving member 21 slides along the first direction X and contacts the carrier 200. There is a gap between the carrier 200 and the carrier body 11 in the first direction X. When the moving member 21 contacts the carrier 200, it can drive the carrier 200 to displace a certain distance along the first direction X, while the position of the bottom plate is fixed under the support of the convex portion 12, so as to disassemble and separate the semiconductor device 300 on the carrier 200. During the whole disassembly and separation process, the convex portion 12 supports the semiconductor device 300 in the first direction X and forms a gap between the carrier 200 and the carrier body 11. The moving member 21 drives the carrier 200 to approach the carrier body 11 in the first direction X, so that the semiconductor device 300 and the carrier 200 are disassembled and separated. The whole disassembly process is convenient and fast, and the disassembly effect is stable and reliable. At the same time, the convex portion 12 is on the side of the bottom plate facing away from the chip and contacts and supports the bottom plate, which can avoid the contact between the convex portion 12 and the chip during the whole disassembly process and reduce the probability of damage to the chip.

[0055] Specifically, the moving member 21 includes a first surface B1 facing the carrying body 11 and an avoidance space 211 formed by being recessed inward from the first surface B1. The first surface B1 and the carrying body 11 are spaced apart to form a gap space 30. The projection of the convex portion 12 in the first direction X is located inside the projection of the avoidance space 211 in the first direction X. The gap space 30 is used to accommodate the carrier 200. When the moving member 21 contacts and drives the carrier 200 to move, at least a part of the semiconductor device 300 can be located inside the avoidance space 211. It can be understood that the moving member 21 and the carrying body 11 are spaced apart in the first direction X to form the gap space 30, which facilitates technicians to place the semiconductor and the carrier 200 on the carrying body 11. During the process that the moving member 21 contacts the carrier 200 and drives the carrier 200 to move toward the side close to the carrying body 11, relatively, the semiconductor device 300 moves toward the side close to the moving member 21. Thus, the avoidance space 211 is formed by the first surface B1 being recessed inward, and the semiconductor device 300 can be located inside the avoidance space 211. At the same time, in order to ensure the smooth operation of the disassembly device 100, the projection of the convex portion 12 in the first direction X is located inside the projection of the avoidance space 211 in the first direction X, which can avoid interference between the convex portion 12 and the moving member 21 during the movement of the moving member 21 and affect the disassembly of the semiconductor device 300.

[0056] In summary, according to the production equipment and the disassembly device 100 provided by the embodiments of the present application, the semiconductor device 300 is supported by the carrier 200, and the semiconductor on the carrier 200 is disassembled by the disassembly device 100. Specifically, the convex portion 12 can penetrate into the through hole 201 and contact and fix the semiconductor device 300 to realize the support of the semiconductor device 300 and at the same time realize the support of the carrier 200. The moving member 21 can contact and drive the carrier 200 to approach the carrying body 11 along the first direction X. During the entire disassembly and separation process, the convex portion 12 supports the semiconductor device 300 in the first direction X, and a gap is formed between the carrier 200 and the carrying body 11. The moving member 21 drives the carrier 200 to approach the carrying body 11 in the first direction X, so that the disassembly and separation between the semiconductor device 300 and the carrier 200 are completed. The entire disassembly process is convenient and fast, and the disassembly effect is stable and reliable. At the same time, the convex portion 12 is located on the side of the bottom plate facing away from the chip and contacts and supports with the bottom plate, which can avoid the contact of the convex portion 12 with the chip during the entire disassembly process and reduce the probability of damage to the chip.

[0057] In some embodiments, please refer to Figures 1 to 6 , the avoidance space 211 includes an avoidance groove 2111 formed by being recessed inward from the first surface B1, and the avoidance groove 2111 has a groove bottom surface B2. The disassembly device 100 is configured such that the projection of the semiconductor device 300 in the first direction X and the projection of the groove bottom surface B2 in the first direction X are overlapped.

[0058] In the present application, the moving member 21 is configured as an integral structure, and a relief groove 2111 is formed on the first surface B1 of the moving member 21, and the relief groove 2111 forms a part of the relief space 211, wherein the relief groove 2111 has a groove bottom surface B2, and the projection of the semiconductor device 300 in the first direction X overlaps with the projection of the groove bottom surface B2 in the first direction X. An abutment portion is formed around the relief groove 2111 on the first surface B1 of the moving member 21, and the abutment portion is configured to contact the carrier 200 and drive the moving member 21 to move toward a side close to the carrier body 11. By setting the avoidance groove 2111 and forming an abutment portion around the avoidance groove 2111, when the moving part 21 contacts the carrier 200, the avoidance groove 2111 can accommodate the semiconductor device 300, and the abutment portion acts on the carrier 200 and is arranged around the semiconductor device 300, which can ensure that the force applied by the moving part 21 to the carrier 200 is arranged around the semiconductor device 300, so that the part where the semiconductor device 300 and the carrier 200 are connected is evenly stressed, thereby ensuring the disassembly effect between the semiconductor device 300 and the carrier 200.

[0059] In some embodiments, see Figures 1 to 8 The bottom wall of the avoidance groove 2111 is configured to contact the semiconductor device 300 to limit the distance that the moving member 21 moves along the first direction X. After the moving member 21 contacts the carrier 200, the semiconductor device 300 begins to be inside the avoidance space 211. As the moving member 21 moves, the semiconductor device 300 gradually moves deeper into the avoidance space 211. When the bottom wall of the avoidance groove 2111 contacts the semiconductor device 300, the side of the semiconductor device 300 that is away from the bottom wall of the avoidance groove 2111 is supported by the convex portion 12. Under the restriction of the convex portion 12, the moving member 21 cannot continue to move along the first direction X, which limits the distance that the moving member 21 moves along the first direction X, thereby controlling the distance that the carrier 200 moves along the first direction X. Specifically, the dimension of the avoidance groove 2111 along the first direction X is smaller than the thickness dimension of the semiconductor device 300. By controlling the dimension relationship between the avoidance groove 2111 and the semiconductor device 300, the moving distance of the carrier 200 is controlled. Under the above-mentioned dimension relationship, the carrier 200 and the semiconductor device 300 can be in a state of being about to be separated but not completely separated, which facilitates the subsequent removal of the carrier 200 and the semiconductor device 300 without affecting the technician's removal of the semiconductor device 300 from the carrier 200.

[0060] In some embodiments, the separation component 20 also includes a buffer structure 22 disposed on the groove bottom surface B2, the hardness of the buffer structure 22 is less than the hardness of the moving part 21, and the size of the buffer structure 22 in the first direction X is smaller than the size of the groove bottom surface B2 in the first direction X.

[0061] To reduce the damage of the semiconductor device 300, a buffer structure 22 with a hardness less than that of the moving member 21 is provided on the bottom surface B2 of the avoidance groove 2111. By using the buffer structure 22 to contact the semiconductor device 300 instead of the moving member 21, the semiconductor structure can be effectively protected. Specifically, the moving member 21 is usually made of steel, and the buffer structure 22 is made of polytetrafluoroethylene. Further, the convex portion 12 can also be made of polytetrafluoroethylene to achieve double-sided protection of the semiconductor device 300. For positions that do not contact the semiconductor device 300, the buffer structure 22 may not be provided. Thus, in the embodiment of the present application, the size of the buffer structure 22 in the first direction X is smaller than the size of the bottom surface B2 of the groove in the first direction X. Setting the size of the buffer structure 22 to a smaller form can also facilitate the installation of the buffer structure 22 inside the avoidance groove 2111.

[0062] In some embodiments, since at least a part of the projection of the bottom plate in the first direction X is located outside the projection of the chip in the first direction X, the avoidance space 211 further includes an avoidance hole 2112 formed by inward depression of the bottom surface B2 of the groove. The disassembly device 100 is configured such that the projection of the chip in the first direction X is located inside the projection of the avoidance hole 2112 in the first direction X and outside the projection of the bottom surface B2 in the first direction X.

[0063] Based on the actual production situation, after the semiconductor device 300 is welded, the projection of the copper-clad ceramic substrate in the thickness direction is inside the projection of the bottom plate in the thickness direction, and the projection of the chip in the thickness direction is inside the projection of the copper-clad ceramic substrate in the thickness direction. The buffer structure 22 is configured to contact the bottom plate. In the thickness direction of the semiconductor device 300, the bottom plate, the copper-clad ceramic substrate, and the chip are stacked in sequence. The protection requirement for the chip is higher than that for the bottom plate. The avoidance hole 2112 is provided to avoid the chip.

[0064] The avoidance hole 2112 is formed by inward depression of the bottom surface B2 of the groove. During the disassembly process, the projection of the chip in the first direction X is inside the projection of the avoidance hole 2112 in the first direction X and outside the projection of the bottom surface B2 in the first direction X. By providing the above-mentioned avoidance hole 2112, on the one hand, the chip can be avoided, and on the other hand, it is also convenient for technicians to observe the semiconductor device 300 through the avoidance hole 2112 and control the situation during the disassembly process.

[0065] In some embodiments, there are multiple convex portions 12, and the multiple convex portions 12 all protrude from the carrying body 11 along the first direction X, and at least some of the convex portions 12 are spaced apart along the second direction Y. The avoidance space 211 includes a plurality of avoidance holes 2112 spaced apart along the second direction Y, and at least some of the different convex portions 12 are located inside the projections of the different avoidance holes 2112 in the first direction X when projected in the first direction X, and the first direction X intersects the second direction Y.

[0066] To improve production efficiency and mass-produce semiconductor devices 300, there are multiple through holes 201 provided on the carrier 200, and the multiple through holes 201 are spaced apart along the length direction of the carrier 200 to enable multiple semiconductor devices 300 to be provided on the carrier 200 at one time. There are also multiple convex portions 12, and the convex portions 12 are provided corresponding to the positions of the through holes 201. The multiple convex portions 12 all protrude from the carrying body 11 along the first direction X, and at least some of the convex portions 12 are spaced apart along the second direction Y. When the semiconductor device 300 and the carrier 200 are on the disassembly device 100, the length direction of the carrier 200 is consistent with the second direction Y, and the thickness direction of the carrier 200 is consistent with the first direction X. Correspondingly, there are also multiple avoidance holes 2112, and the multiple avoidance holes 2112 are spaced apart along the second direction Y. At least some of the convex portions 12 and the avoidance holes 2112 correspond to each other, and at least some of the convex portions 12 are located inside the projections of the different avoidance holes 2112 in the first direction X when projected in the first direction X. Exemplarily, one convex portion 12 can support one semiconductor device 300, and one convex portion 12 corresponds to one avoidance hole 2112; or two convex portions 12 support one semiconductor device 300, and two convex portions 12 correspond to one avoidance hole 2112.

[0067] In some embodiments, the groove bottom surface B2 includes a first sub-surface B21 located between adjacent avoidance holes 2112 along the second direction Y and second sub-surfaces B22 located on both sides of at least one of the multiple avoidance holes 2112 along the third direction Z. The second literal surfaces are connected to the multiple first sub-surfaces B21, and the first direction X, the second direction Y, and the third direction Z intersect pairwise. The separation assembly 20 further includes a buffer structure 22 provided on the second sub-surface B22, and the buffer structure 22 at least covers the second sub-surface B22.

[0068] In order to facilitate the protection of the semiconductor device 300 while ensuring the production efficiency, the bottom surface B2 of the groove includes a first sub-surface B21 between adjacent avoidance holes 2112 and second sub-surfaces B22 on both sides of the avoidance holes 2112 along the third direction Z. The first sub-surface B21 and the second sub-surfaces B22 are connected to each other. Through the arrangement of the first sub-surface B21 and the second literal surface, the adjacent avoidance holes 2112 are communicated. At the same time, a buffer structure 22 is provided, and the buffer structure 22 covers at least the second sub-surfaces B22. Further, the buffer structure 22 also covers the first sub-surface B21. Through the above structural arrangement, a whole buffer structure 22 can be used to protect multiple semiconductor devices 300, which is convenient for the installation of the buffer structure 22 by technical installation.

[0069] In some embodiments, in order to avoid the installation of the buffer structure 22, the entire moving member 21 can be made of the material of the buffer structure 22. Exemplarily, the moving member 21 is made of polytetrafluoroethylene, and the entire moving member 21 is made of a softer material. The moving member 21 as a whole serves as the buffer structure 22 to achieve the protection of the semiconductor device 300.

[0070] In some embodiments, the separation assembly 20 includes a driving member 23. The output end of the driving member 23 is connected to the moving member 21, and the driving member 23 is used to drive the moving member 21 to slide along the first direction X. The orthographic projection of the moving member 21 in the first direction X is partially outside the orthographic projection of the carrying body 11 in the first direction X, and the connection position of the output end to the moving member 21 is outside the orthographic projection of the carrying body 11 in the first direction X.

[0071] The driving member 23 is used to drive the moving member 21 to move along the first direction X. In this application, the positions of the carrying body 11 and the convex portion 12 are fixed, and the moving member 21 moves. The output end of the driving member 23 is connected to the moving member 21, and the driving member 23 can be set as a telescopic cylinder. Alternatively, the driving member 23 is set as a motor, and a transmission structure is further provided to convert the rotation of the motor into a movement along the first direction X, so as to drive the moving member 21 to move in the first direction X.

[0072] In order to avoid interference with other structures and ensure the structural compactness of the disassembly device 100, the orthographic projection of the moving member 21 in the first direction X is partially outside the orthographic projection of the carrying body 11 in the first direction X, and the connection position of the output end to the moving member 21 is outside the orthographic projection of the carrying body 11 along the first direction X.

[0073] In some embodiments, the carrier assembly 10 further includes two enclosing portions 13 protruding from the carrier body 11 along the first direction X. The two enclosing portions 13 and the protruding portion 12 are on the same side of the carrier body 11 along the first direction X, and the two enclosing portions 13 are respectively disposed on two sides of the protruding portion 12 along the second direction Y. The two enclosing portions 13 form an enclosing space on the carrier body 11, which can accommodate the carrier 200, the semiconductor device 300, and the other structural components used in the production process, reducing the probability of their dropping.

[0074] In some embodiments, the carrier assembly 10 further includes a positioning portion 14 protruding from the carrier body 11 along the first direction X. The positioning portion 14 and the protruding portion 12 are on the same side of the carrier body 11 along the first direction X, and the positioning portion 14 is spaced from the protruding portion 12 along the third direction Z. The positioning portion 14 is configured to be able to contact the carrier 200. When the carrier 200 and the semiconductor device 300 are installed on the disassembly device 100, the positioning portion 14 first contacts the carrier 200 to preliminarily determine the relative position between the carrier 200 and the carrier body 11, facilitating the correspondence between the carrier 200 and the protruding portion 12.

[0075] Specifically, two positioning posts are provided on the carrier body 11, and two corresponding positioning slots are provided on the carrier 200. The positioning posts and the positioning slots are arranged corresponding to each other. After the two positioning posts contact the two positioning slots, a line positioning is formed, which can quickly and accurately determine the relative position relationship between the carrier 200, the carrier body 11, and the protruding portion 12.

[0076] In some embodiments, please refer to Figures 1 to 9 , a first receiving groove 202 is provided on one side surface of the carrier 200 along its thickness direction. The orthographic projection of the through hole 201 in the thickness direction of the carrier 200 is inside the orthographic projection of the first receiving groove 202 in the thickness direction of the carrier 200. The first receiving groove 202 is configured to receive the semiconductor device 300. The first receiving groove 202 is used to ensure the position stability of the semiconductor device 300 on the carrier 200. At the same time, the orthographic projection of the through hole 201 in the thickness direction of the carrier 200 is inside the orthographic projection of the first receiving groove 202 in the thickness direction of the carrier 200, so that when the semiconductor device 300 is inside the first receiving groove 202, it covers the through hole 201, facilitating subsequent disassembly and separation.

[0077] In some embodiments, a plurality of first receiving grooves 202 are provided on the carrier 200, and a second receiving groove 203 communicating with the first receiving groove 202 is further provided on the carrier 200. When the semiconductor device 300 is welded inside the first receiving groove 202, a soldering agent is required. Since the soldering agent remains between the carrier 200 and the bottom plate, it is difficult to disassemble the semiconductor device 300. The second receiving groove 203 is used to receive the soldering agent, so that the soldering agent can be inside the second receiving groove 203, reducing the amount of the soldering agent remaining between the carrier 200 and the bottom plate, thereby reducing the connection strength between the bottom plate and the carrier 200, so as to facilitate the subsequent separation between the semiconductor device 300 and the carrier 200.

[0078] Although the present invention has been described with reference to the preferred embodiments, various modifications can be made to it and components therein can be replaced with equivalents without departing from the scope of the present invention. In particular, as long as there is no structural conflict, the technical features mentioned in each embodiment can be combined in any way. The present invention is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

Claims

1. A disassembly device for disassembling a semiconductor device on a carrier, wherein the carrier is provided with a through hole along its thickness direction, and the semiconductor device can be covered by the through hole, characterized in that: The disassembly device comprises: A bearing assembly, comprising a bearing body and a convex portion protruding from the bearing body along a first direction; A separation assembly, comprising a moving member disposed on a side of the convex portion away from the carrier body, the moving member comprising a first surface facing the carrier body, and an escape space formed by the first surface being recessed inwardly, the first surface being spaced apart from the carrier body to form a gap space, and a projection of the convex portion in the first direction being located within a projection of the escape space in the first direction; Among them, the gap space is used to accommodate the carrier, the protrusion can penetrate into the through hole and contact and fix with the semiconductor device, and the moving part can contact and drive the carrier along the first direction to approach the supporting body so that the semiconductor device is located in the avoidance space.

2. The disassembly device according to claim 1, characterized in that: The avoidance space comprises an avoidance groove formed by the first surface being recessed inwardly, and the avoidance groove has a groove bottom surface; The disassembling device is configured so that a projection of the semiconductor device in the first direction overlaps with a projection of the groove bottom surface in the first direction.

3. The disassembly device according to claim 2, characterized in that: The separation component also includes a buffer structure arranged on the bottom surface of the groove, the hardness of the buffer structure is smaller than the hardness of the moving part, and the size of the buffer structure in the first direction is smaller than the size of the bottom surface of the groove in the first direction.

4. The disassembly device according to claim 2, characterized in that: The semiconductor device comprises a base plate and a chip arranged on the base plate, wherein a projection of the base plate in the first direction is at least partially located outside a projection of the chip in the first direction; The avoidance space also includes an avoidance hole formed by the inward depression of the groove bottom surface, and the disassembly device is configured so that the projection of the chip in the first direction is located within the projection of the avoidance hole in the first direction and outside the projection of the groove bottom surface in the first direction.

5. The disassembly device according to claim 4, characterized in that: There are a plurality of protrusions, all of which protrude from the carrier body along the first direction, and at least some of the protrusions are spaced apart along the second direction; The avoidance space includes a plurality of avoidance holes spaced apart in the second direction, at least some projections of different convex portions in the first direction are located within projections of different avoidance holes in the first direction, and the first direction intersects with the second direction.

6. The disassembly device according to claim 5, characterized in that: The groove bottom surface includes a first sub-surface located between adjacent avoidance holes along the second direction, and a second sub-surface located on both sides of at least one of the plurality of avoidance holes along the third direction, the second sub-surface is connected to the plurality of first sub-surfaces, and the first direction, the second direction and the third direction intersect each other; The separation component further includes a buffer structure disposed on the second sub-surface, and the buffer structure is disposed at least covering the second sub-surface.

7. The disassembly device according to claim 1, characterized in that: The separation assembly further includes a driving member, an output end of which is connected to the moving member, and the driving member is used to drive the moving member to slide along the first direction; The orthographic projection of the moving member in the first direction is outside the orthographic projection of the bearing body in the first direction, and the connection position between the output end and the moving member is outside the orthographic projection of the bearing body in the first direction.

8. The disassembly device according to claim 1, characterized in that: The bearing assembly further comprises two enclosing portions protruding from the bearing body along the first direction, the two enclosing portions and the protruding portion are located on the same side of the bearing body along the first direction, and the two enclosing portions are respectively arranged on both sides of the protruding portion in a second direction, and the second direction intersects with the first direction; And / or, the supporting assembly also includes a positioning portion protruding from the supporting body along the first direction, the positioning portion and the convex portion are on the same side of the supporting body along the first direction, the positioning portion is spaced apart from the convex portion along a third direction, the positioning portion is configured to be able to contact the carrier, and the third direction intersects with the first direction.

9. A production equipment for producing semiconductor devices, characterized in that: It comprises the disassembly device as described in any one of claims 1 to 8 and the carrier, wherein the carrier is provided with a first receiving groove on one side along the thickness direction thereof, the orthographic projection of the through hole in the thickness direction of the carrier is located inside the orthographic projection of the first receiving groove in the thickness direction of the carrier, and the first receiving groove is configured to receive the semiconductor device.

10. The production equipment according to claim 9, characterized in that The carrier is provided with a plurality of the first accommodating grooves and the through holes, and the carrier is also provided with a second accommodating groove communicating with the first accommodating grooves.

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