Film pasting device for silicon carbide seed crystals
By designing a silicon carbide seed film patching device including support components, pick-up and placement components and pressure components, the problems of membrane body contamination and bubbles during the traditional film patching process are solved, and the film quality is significantly improved.
Patent Information
- Application Number
- CN202421110800.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-21
- Publication Date
- 2025-06-03
- Estimated Expiration
- 2034-05-21
AI Technical Summary
During the traditional silicon carbide seed filming process, manual operation leads to film body contamination and bubbles, affecting the film quality.
A film sticking device including a support assembly, a pick-and-place assembly and a pressure-added assembly are designed. The pick-and-place assembly absorbs and moves the membrane through the suction hole and the negative pressure generation device, and the pressure-added assembly gradually squeezes the bubbles between the membrane and the seed crystal through the deformation part.
The pollution of the membrane body by manual operation is reduced or avoided, and the bubbles between the membrane body and the seed crystal are effectively discharged, thereby improving the film quality of silicon carbide seed crystals.
Smart Images
Figure CN222934170U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of silicon carbide processing, and particularly to a film pasting device for a silicon carbide seed crystal. Background Art
[0002] With the rapid development of the semiconductor industry, silicon carbide crystals, as important semiconductor materials, play a decisive role in improving the performance of semiconductor devices. During the growth process of silicon carbide crystals, silicon carbide seed crystals, as the mother body of crystal growth, the cleanliness of their surfaces and the growth quality directly affect the quality of the final silicon carbide crystals. Therefore, the packaging and surface protection technologies of silicon carbide seed crystals are particularly important.
[0003] In traditional silicon carbide seed crystal packaging technologies, in order to ensure the cleanliness of the seed crystal surface, it is usually necessary to perform a film pasting process on the silicon surface of the seed crystal; in the traditional film pasting process, it is necessary for workers to pick up the film body, tear off the protective layer of the film body, and then manually place the film body on the surface of the seed crystal; during this operation process, when the workers pick up and place the film body, they will inevitably come into contact with the surface of the film body, which will have an adverse impact on the film pasting quality; in addition, after the film body comes into contact with the seed crystal, there will be air bubbles between the two, and the existence of air bubbles also has a great impact on the film pasting quality of the silicon carbide seed crystal. Summary of the Utility Model
[0004] The purpose of the utility model is to provide a film pasting device for a silicon carbide seed crystal, and improve the film pasting quality of the silicon carbide seed crystal by improving the structure of the film pasting device for the silicon carbide seed crystal.
[0005] To achieve the above purpose, the utility model provides a film pasting device for a silicon carbide seed crystal, which device includes a support assembly, a picking and placing assembly, and a pressing assembly. The picking and placing assembly is used to suck and move the film body; the support assembly is provided with a feeding area, and the feeding area is provided with a seed crystal to be pasted with a film; the pressing assembly is fixedly provided with a deformation part, and the pressing assembly can be opposite to the feeding area to squeeze the deformation part, and the deformation part is deformed under pressure to squeeze the film body and the seed crystal.
[0006] By setting the picking and placing assembly, it is possible to reduce or avoid the contact between workers and the film body during the process of picking up, placing, and moving the film body, ensuring the cleanliness of the film body; through the deformation part, the air bubbles between the film body and the seed crystal can be gradually squeezed from the middle to the edge area until they are discharged, thereby improving the film pasting quality of the silicon carbide seed crystal.
[0007] Optionally, the deformation part can contact the middle part of the film body above the seed crystal located in the feeding area, and the pressing assembly can squeeze the deformation part to deform, so as to gradually squeeze from the middle to the edge of the film body.
[0008] Optionally, it further includes a pressure applying member for driving the pressing assembly to move towards the direction close to the supporting assembly;
[0009] The pressing assembly is further provided with a pressing area for contacting the pressure applying member. The pressing area is located on the side of the pressing assembly away from the deformation part. When pressing, the pressing area is arranged opposite to the deformation part in the vertical direction.
[0010] Optionally, it further includes a pressure detection device located at the edge of the feeding area.
[0011] Optionally, the picking and placing assembly is provided with a plurality of suction holes which are communicated with a negative pressure generating device.
[0012] Optionally, the picking and placing assembly includes a suction plate, and a cavity is formed inside the suction plate;
[0013] The negative pressure generating device includes a connecting component and a negative pressure generating component. The connecting component has a first hole communicated with the negative pressure generating component; the connecting component further has a plurality of second holes, and the plurality of second holes are respectively and correspondingly communicated with the plurality of suction holes; the part of the connecting component provided with the second holes is located inside the cavity.
[0014] Optionally, the connecting component has a first connecting surface, and the inner wall of the cavity has a second connecting surface. The first connecting surface is adhesively bonded to the second connecting surface; the second hole penetrates through the first connecting surface, and the suction hole penetrates through the second connecting surface.
[0015] Optionally, the connecting component includes a connecting airbag located inside the cavity, and the first connecting surface is located on the connecting airbag.
[0016] Optionally, the negative pressure generating component is a suction ear ball. The suction ear ball includes a balloon. One end of the balloon is communicated with the connecting airbag, and the other end is communicated with or disconnected from the external atmospheric pressure through a valve;
[0017] When the picking and placing assembly is in a suction working condition and a release working condition, in the suction working condition, the balloon is disconnected from the external atmospheric pressure; in the release working condition, the balloon is communicated with the external atmospheric pressure.
[0018] Optionally, the supporting assembly includes a supporting plate. The supporting plate is provided with a groove body formed by concave down from the upper surface of the supporting plate. The bottom wall of the groove body serves as the feeding area; the picking and placing assembly is provided with a boss which can be inserted into the groove body, and the table surface of the boss is provided with suction holes.
[0019] Optionally, a buffer layer is further provided in the loading area. The buffer layer is bonded to the bottom wall of the tank body, and the buffer layer is made of an elastic and breathable material.
[0020] Optionally, the picking and placing component is rotatably connected to one side of the supporting component, and the pressing component is rotatably connected to the other side of the supporting component. BRIEF DESCRIPTION OF THE DRAWINGS
[0021] The drawings incorporated in and constituting a part of this specification illustrate embodiments of the specification and, together with the description, serve to explain the principles of the specification.
[0022] Figure 1 is a schematic structural diagram of a film pasting device for a silicon carbide seed crystal in an embodiment of the present invention;
[0023] Figure 2 is Figure 1 a partially enlarged schematic structural diagram of
[0024] Figure 1 - Figure 2 In
[0025] 1. Supporting component; 11. Tank body; 111. Loading area; 111a. Middle position; 111b. Edge position; 12. Support plate;
[0026] 2. Picking and placing component; 21. Suction hole; 22. Adsorption plate; 221. Cavity; 23. Connecting component; 231. Second hole; 232. Connecting airbag; 241. Balloon; 242. Valve; 25. Boss;
[0027] 3. Pressing component; 31. Deformation part; 32. Pressing plate. DETAILED DESCRIPTION OF THE EMBODIMENTS
[0028] The present invention provides a film pasting device for a silicon carbide seed crystal, and improves the film pasting quality of the silicon carbide seed crystal by improving the structure of the film pasting device for the silicon carbide seed crystal.
[0029] In order to enable those skilled in the art to better understand the solution of the present invention, the present invention will be further described in detail below with reference to the drawings and specific embodiments.
[0030] Relative terms such as "first" and "second" are only used to distinguish one component with the same name from another, and do not necessarily require or imply any actual relationship or order between these components.
[0031] Please refer to Figures 1 to 2 , Figure 1 which is a schematic structural diagram of a film pasting device for a silicon carbide seed crystal in an embodiment of the present invention; Figure 2 isFigure 1 Schematic enlarged view of a partial structure, which is a schematic structure diagram of a picking and placing component.
[0032] The film pasting device for silicon carbide seeds of the present utility model performs film pasting operations on the silicon carbide seeds to be pasted with film. The film body is a PET (Polyethylene Terephthalate) antistatic film, which is a film made of PET material. This film body can effectively prevent static electricity from accumulating on the surface of the silicon carbide seeds and avoid adverse effects of static electricity on the performance of the seeds. Specifically, in the production and application processes of silicon carbide seeds, the PET antistatic film can be used to protect the surface of the seeds and prevent interference and damage caused by static electricity. By covering the PET antistatic film on the surface of the silicon carbide seeds, a protective barrier can be formed to reduce the influence of the external environment on the seeds and improve the performance and stability of the seeds. The film body is provided with a silica gel layer or a pressure-sensitive adhesive layer, and is connected to the silicon carbide seeds through the silica gel layer or the pressure-sensitive adhesive layer.
[0033] As Figure 1 and Figure 2 shown, the film pasting device provided in this application includes a support component 1, a picking and placing component 2, and a pressing component 3. The picking and placing component 2 is used to suck and move the film body. The picking and placing component 2 can selectively form an adsorption force on the film body to suck the film body and drive its movement, or release the film body to separate from the film body. In a specific implementation manner, the picking and placing component 2 is provided with a plurality of suction holes 21, and the suction holes 21 are communicated with a negative pressure generating device. After the suction holes 21 are aligned with the film body, the negative pressure generating device starts to work, adsorbs the film body to the picking and placing component 2 through the suction holes 21, and moves the film body by moving the picking and placing component 2. By providing the picking and placing component 2, it can be avoided that during the process of picking and placing the film body and moving the film body, the staff comes into contact with the film body, ensuring the cleanliness of the film body.
[0034] The support component 1 includes a support plate 12. The support plate 12 is provided with a loading area 111. The loading area 111 extends horizontally and is used to place the silicon carbide seeds to be pasted with film and the film body. In the direction perpendicular to the loading area 111, that is, in the vertical direction, the seeds to be pasted with film and the film body are stacked in sequence. The seeds are located between the loading area 111 and the film body. The film body conforms to the shape of the seeds and is generally aligned with the loading area 111. The pressing component 3 is arranged opposite to the support component 1 to define an operation cavity, and the loading area 111 constitutes a part of the cavity wall of the operation cavity.
[0035] The pressing component 3 can be opposite to the loading area 111 to squeeze the deformation part 31. The deformation part 31 is deformed under pressure to squeeze the film body and the seed crystal. It includes a pressing plate 32. The deformation part 31 is fixedly arranged on the pressing plate 32. The deformation part 31 can contact the middle part of the film body above the seed crystal located in the loading area 111. The pressing component can squeeze the deformation part 31 to gradually squeeze from the middle part of the film body to the edge of the film body; the deformation part 31 changes its shape under the drive of an external force; the deformation part 31 is, for example, a deformable bladder or bag, etc. The deformable bladder is made of a flexible material and is a closed structure. It is pre-filled with a fluid filler (such as water, fluid glue or gas) inside. When the fluid filler inside it is pressed, the bladder and the bag will deform correspondingly; the bladder and the bag here are made of rubber or plastic materials; the deformable bladder is bonded to the pressing plate 32; the deformation part 31 is located in the operation cavity and presses against the surface of the film body and the seed crystal that is opposite to each other. The deformation part 31 can extend from the middle position 111a of the loading area 111 to the edge position 111b of the loading area 111 along the extension direction of the loading area 111 in the operation cavity; that is to say, when not being squeezed, the deformation part 31 presses against the middle position 111a of the loading area 111 and is spaced from the edge position 111b of the loading area 111; after being pressed, the deformation part 31 presses against the middle position 111a and the edge position 111b, so as to be able to apply a squeezing force extending from the middle to the edge to the film body; among them, the edge position 111b is arranged around the middle position 111a, the edge position 111b is located outside the middle position 111a and is connected to the middle position 111a, and the center of the loading area 111 is located at the middle position 111a.
[0036] During the actual operation process, the pressing plate 32 is driven to move towards the direction close to the support plate 12, and the vertical dimension of the operation cavity defined by the two of them becomes smaller, thereby squeezing the deformable bladder. When not being pressed, the deformable bladder can press against the middle position 111a of the film body. After being pressed, the position where the deformable bladder presses against the film body can gradually move from the middle position 111a to the edge position 111b. During its movement, the air bubbles between the film body and the seed crystal can be squeezed out, thereby improving the film pasting quality of the silicon carbide seed crystal.
[0037] In the above technical solution, the film pasting device for the silicon carbide seed crystal further includes a pressure applying member. The pressing component 3 is also provided with a pressing area for contacting the pressure applying member. The pressing area is located on the side of the pressing plate 32 away from the deformation part 31 and is arranged opposite to the deformation part 31 in the vertical direction; the pressure applying member is used to drive the pressing component 3 to move towards the direction close to the support component 1; the pressure applying member can be a weight manually placed in the pressing area, or a driving motor and a pressing block connected by transmission. The pressing block is connected to the output end of the driving motor and can move vertically. The pressing block abuts against the pressing area.
[0038] Since the current film pasting process mainly relies on the proficiency and experience of operators, the quality of film pasting is often affected by human factors. This is because the silicon carbide seed crystal itself is relatively brittle, and precise control of force is required during the operation. Excessive force is likely to cause the wafer to crack, while too little force is not conducive to exhausting the air bubbles between the seed crystal and the protective film, which requires relatively high skills for operators; this makes the entire film pasting process time-consuming, laborious and inefficient.
[0039] However, in the technical solution of this application, instead of directly pressing against the film body and the seed crystal through the pressing plate 32, the elastic deformation part 31 is in contact with the film body. The pressing member applies pressure to the pressing plate 32, and the pressing plate 32 performs the first uniform pressure on the pressure; the pressing plate 32 then cooperates with the support plate 12 to jointly squeeze the deformable bladder, and the deformable bladder performs the second uniform pressure on the pressure, thereby effectively avoiding the damage to the seed crystal caused by manually exhausting air bubbles.
[0040] As an optional solution, the film pasting device for silicon carbide seed crystal further includes a pressure detection device, and the pressure detection device is located at the edge position 111b of the loading area 111; the pressure detection device has a set threshold value, and when the set threshold value is reached, a signal is sent outwards to prompt to stop applying pressure to the pressing assembly 3; the set threshold value is characterized in that the pressure received by the edge of the loading area 111 is sufficient to exhaust the air bubbles between the film body and the silicon carbide seed crystal.
[0041] The technical solution of this application will be further illustrated by taking the specific embodiments shown in the accompanying drawings as a specific implementation manner.
[0042] Embodiment 1
[0043] As shown in Figure 1 and Figure 2 , the support assembly 1 includes a support plate 12, and the support plate 12 can be a solid plate-like structure; it can also be a hollow box-shaped structure, etc.; the support plate 12 is provided with a groove 11, and the groove 11 is formed by concave from the upper surface of the support plate 12, and the bottom wall of the groove 11 serves as the loading area 111; of course, the groove 11 can also not be provided. In the case where the groove 11 is not provided, the loading area 111 is a partial area of the upper surface of the support plate 12; by setting the groove 11 on the upper surface of the support plate 12, a relatively independent space can be enclosed. After placing the silicon carbide seed crystal and the film body in the groove 11, the inner side wall of the groove 11 can limit and protect the silicon carbide seed crystal and the film body, which is convenient for subsequent film pasting operations.
[0044] To be adapted to the slot body 11, the picking and placing component 2 is provided with a boss 25 which can be inserted into the slot body 11. The table surface of the boss 25 is provided with suction holes 21. By setting the boss 25, when the picking and placing component 2 operates on the film body, positioning is formed between the boss 25 and the slot body 11. Of course, the boss 25 can also not be set. In the case of not setting the boss 25, the suction holes 21 can be opened on the surface of the film body picking and placing device. The picking and placing component 2 includes a suction plate 22 which has an end face. The boss 25 is located on the end face and protrudes from the end face to form. A cavity 221 is formed in the suction plate 22. The suction holes 21 opened on the table surface are communicated with the cavity 221, that is, the boss 25 constitutes part of the cavity wall of the cavity 221. The negative pressure generating device includes a communicating component 23 and a negative pressure generating component. The communicating component 23 has a first hole communicated with the negative pressure generating component. The communicating component 23 also has a plurality of second holes 231 which are in one-to-one correspondence and communicated with the plurality of suction holes 21. The part of the communicating component 23 provided with the second holes 231 is located in the cavity 221. The communicating component 23 has a first connecting surface, and the inner wall of the cavity 221 has a second connecting surface. The first connecting surface is adhesively bonded to the second connecting surface. The second holes 231 penetrate the first connecting surface, and the suction holes 21 penetrate the second connecting surface. In this way, the pipeline layout in the cavity 221 can be simplified. Specifically, the communicating component 23 includes a communicating airbag 232 which is located in the cavity 221, and the first connecting surface is located on the communicating airbag 232. The negative pressure generating component is a suction ear ball which includes a balloon 241. One end of the balloon 241 is communicated with the communicating airbag 232, and the other end is communicated with or disconnected from the external atmospheric pressure through a valve 242. The picking and placing component 2 has a suction working condition and a release working condition. In the suction working condition, the balloon 241 is disconnected from the external atmospheric pressure. In the release working condition, the balloon 241 is communicated with the external atmospheric pressure.
[0045] Optionally, in this embodiment, a buffer layer is further provided in the loading area 111. The buffer layer is adhesively bonded to the bottom of the slot. The buffer layer is made of an elastic and breathable material, so as to protect the seed crystal.
[0046] Optionally, the picking and placing component 2 is rotatably connected to one side of the support component 1, and the pressing component 3 is rotatably connected to the other side of the support component 1. In this way, the relative positions of the support component 1, the pressing component 3 and the picking and placing component 2 can be ensured to be fixed, and the accuracy of the film pasting operation can be further improved.
[0047] The working process of the above-mentioned film pasting device for silicon carbide seed crystal is as follows:
[0048] Step 1: First, stack the seed crystal to be pasted with the film on the loading area 111. Vertically, the seed crystal is located between the film and the loading area 111.
[0049] Step 2: Squeeze the ear bulb to evacuate the air in the connecting airbag 232;
[0050] Flip the adsorption plate 22 so that the boss 25 is inserted into the groove body 11, and the suction holes 21 are aligned with the membrane body; Release the ear bulb, and the membrane body is adsorbed by the suction holes 21;
[0051] Step 3: Flip the adsorption plate 22 to move the membrane body to the outside of the groove body 11, and remove the protective layer of the membrane body to expose the silica gel layer (or pressure-sensitive adhesive layer) of the membrane body;
[0052] Step 4: Flip the adsorption plate 22 again to insert the boss 25 into the groove body 11 again and reset the membrane body;
[0053] Open the valve 242 of the ear bulb to connect the ear bulb with the outside atmosphere, so as to release the membrane body and separate it from the membrane body;
[0054] After the membrane body is released, flip the adsorption plate 22 again to extract the boss 25 from the groove body 11;
[0055] Step 5: Flip the pressing plate 32, and a part of the deformation part 31 extends into the groove body 11 and presses against the middle position 111a of the membrane body. At this time, in the vertical direction, an operation cavity is formed between the pressing plate 32 and the support plate 12, and the groove body 11 is a part of the operation cavity; In the vertical direction, the size of the operation cavity is larger than the size of the groove body 11 in the vertical direction, so that there is a space for relative displacement between the pressing plate 32 and the support plate 12 in the vertical direction;
[0056] Step 6: Apply pressure to the pressure application area, and the deformation part 31 deforms in the groove body 11; When the pressure detection device reaches the set threshold, stop applying pressure; Flip the pressing plate 32 to take out the silicon carbide seed crystal after the film is pasted.
[0057] In this article, specific examples are used to elaborate on the principle and implementation manner of the present utility model. The description of the above embodiments is only used to help understand the core idea of the present utility model. It should be pointed out that for those of ordinary skill in the art of this technology, without departing from the principle of the present utility model, several improvements and modifications can be made to the present utility model, and these improvements and modifications also fall within the protection scope of the claims of the present utility model.
Claims
1. A film attaching device for silicon carbide seed crystal, characterized in that: The device comprises a support component (1), a pick-and-place component (2) and a pressure component (3), wherein the pick-and-place component (2) is used to absorb and move the film body; the support component (1) is provided with a loading area (111), and the loading area (111) is provided with a seed crystal to be attached with the film; The pressure-applying component (3) is fixedly provided with a deformation portion (31), and the pressure-applying component (3) can be opposite to the loading area (111) to squeeze the deformation portion (31), and the deformation portion (31) is deformed under pressure to squeeze the film body and the seed crystal.
2. The film attaching device for silicon carbide seed crystal according to claim 1, characterized in that: The deformable portion (31) can contact the middle of the membrane body above the seed crystal in the loading area (111), and the pressure component (3) can squeeze the deformable portion (31) to gradually squeeze from the middle of the membrane body to the edge of the membrane body.
3. The film attaching device for silicon carbide seed crystal according to claim 1, characterized in that: It also includes a pressure applying member, which is used to drive the pressure applying component (3) to move in a direction close to the supporting component (1); The pressure-applying component (3) is also provided with a pressure-applying area, which is used to contact the pressure-applying member, and the pressure-applying area is located on a side of the pressure-applying component (3) away from the deformation portion (31); when pressure is applied, the pressure-applying area is arranged vertically opposite to the deformation portion (31).
4. The film attaching device for silicon carbide seed crystal according to claim 3, characterized in that: It also comprises a pressure detection device, wherein the pressure detection device is arranged at an edge position (111b) of the loading area (111).
5. The film attaching device for silicon carbide seed crystal according to claim 1, characterized in that: The pick-and-place assembly (2) has a plurality of suction holes (21), and the suction holes (21) are connected to a negative pressure generating device.
6. The film attaching device for silicon carbide seed crystal according to claim 5, characterized in that: The pick-and-place assembly (2) comprises an adsorption plate (22), and a cavity (221) is formed in the adsorption plate (22); The negative pressure generating device comprises a connecting component (23) and a negative pressure generating component, wherein the connecting component (23) has a first hole connected to the negative pressure generating component; The connecting component (23) further comprises a plurality of second holes (231), and the plurality of second holes (231) are connected to the plurality of suction holes (21) in a one-to-one correspondence; the portion of the connecting component (23) provided with the second holes (231) is located in the cavity (221).
7. The film attaching device for silicon carbide seed crystal according to claim 6, characterized in that: The connecting component (23) has a first connecting surface, the inner wall of the cavity (221) has a second connecting surface, and the first connecting surface is glued to the second connecting surface; The second hole (231) passes through the first connection surface, and the suction hole (21) passes through the second connection surface.
8. The film attaching device for silicon carbide seed crystal according to claim 7, characterized in that: The connecting component (23) comprises a connecting airbag (232), the connecting airbag (232) is located in the cavity (221), and the first connecting surface is located in the connecting airbag (232).
9. The film attaching device for silicon carbide seed crystal according to claim 8, characterized in that: The negative pressure generating component is an ear suction ball, which includes a balloon (241), one end of which is connected to the connecting air bag (232), and the other end of which is connected to or disconnected from the external atmospheric pressure through a valve (242); The pick-and-place assembly (2) has an absorption working condition and a release working condition. In the absorption working condition, the balloon (241) is disconnected from the external atmospheric pressure; in the release working condition, the balloon (241) is connected to the external atmospheric pressure.
10. The film attaching device for silicon carbide seed crystal according to any one of claims 4 to 9, characterized in that: The support assembly (1) comprises a support plate (12), the support plate (12) is provided with a trough body (11), the trough body (11) is formed by a concave upper surface of the support plate (12), and the bottom wall of the trough body (11) serves as the loading area (111); the pick-and-place assembly (2) is provided with a boss (25), the boss (25) can be inserted into the trough body (11), and the boss (25) has a suction hole (21) on its surface.
11. The film attaching device for silicon carbide seed crystal according to claim 10, characterized in that: The loading area (111) is also provided with a buffer layer, the buffer layer is bonded to the bottom wall of the trough body (11), and the buffer layer is made of an elastic and breathable material.
12. The film attaching device for silicon carbide seed crystal according to any one of claims 1 to 9, characterized in that: The pick-and-place assembly (2) is rotatably connected to one side of the support assembly (1), and the pressure-applying assembly (3) is rotatably connected to the other side of the support assembly (1).