Electroplating device

Abstract

The utility model relates to the technical field of photovoltaic cells, and discloses an electroplating device, which comprises an electroplating bath, an electroplating liquid inlet, an electroplating liquid outlet and an electroplating liquid outlet, the hoisting mechanism and / or the supporting structure are / is used for immersing at least part of the battery piece into the electroplating liquid and enabling the battery piece to be in a static state during electroplating; and the flow uniformizing structure is arranged in the electroplating bath, the flow uniformizing structure is separated between the electroplating liquid inlet and a notch of the electroplating bath and is provided with a plurality of flow uniformizing holes, and during electroplating, the flow uniformizing structure is located between the electroplating liquid inlet and the battery piece. When the electroplating device disclosed by the embodiment of the utility model is used, the electroplating liquid can firstly penetrate through the flow uniformizing holes in the flow uniformizing structure when entering the electroplating bath, so that the uniformity of the electroplating liquid is improved, the density of the electroplating liquid at the upper part of the electroplating bath is more uniform, a metal layer deposited on a battery piece is more uniform, and the service life of the battery piece is prolonged. And the qualified rate of battery pieces can be improved.

Description

Technical Field

[0001] The utility model relates to the technical field of photovoltaic cells, and particularly relates to an electroplating device. Background Art

[0002] Horizontal electroplating is an electroplating process, which is characterized in that the object to be electroplated is horizontally placed during the electroplating process, rather than being vertically suspended in the traditional way. This method can improve the uniformity and quality of the electroplated layer.

[0003] In the related art, a horizontal electroplating device includes an electroplating tank and conveying rollers arranged on the electroplating tank. During the electroplating process, the battery wafers can be arranged on the conveying rollers and move along the liquid level in the electroplating tank driven by the conveying rollers. However, in order to accommodate the moving battery wafers, the electroplating tank of the horizontal electroplating device needs to be set longer, resulting in a larger size of the electroplating tank. In addition, the density of the electroplating solution inside the electroplating tank is prone to be uneven, causing the metal layer deposited on the battery wafers to be uneven. Summary of the Utility Model

[0004] In view of this, the utility model provides an electroplating device to solve the problems in the related art that the size of the electroplating tank of the electroplating device is set too large and it is easy to cause uneven electroplating of the battery wafers.

[0005] The utility model provides an electroplating device, including:

[0006] An electroplating tank for containing electroplating solution, and the electroplating tank has an electroplating solution inlet;

[0007] A hoisting mechanism and / or a supporting structure for immersing at least part of the battery wafers into the electroplating solution and making the battery wafers in a static state during electroplating;

[0008] A flow equalizing structure arranged in the electroplating tank, the flow equalizing structure is separated between the electroplating solution inlet and the tank opening of the electroplating tank, and is provided with a plurality of flow equalizing holes. During electroplating, the flow equalizing structure is located between the electroplating solution inlet and the battery wafers.

[0009] Beneficial effects: During the use of the electroplating device according to the embodiment of the utility model, the battery wafers can be arranged above the liquid level of the electroplating solution, and the bottom surface of the battery wafers can be in contact with the liquid surface of the electroplating solution, so as to realize electroplating. Since the battery wafers can be statically arranged above the liquid level of the electroplating solution during the use of the electroplating device according to the embodiment of the utility model, it is allowed that the size of the electroplating tank does not need to be set too large, and only needs to be able to accommodate the battery wafers. Thus, the size of the electroplating tank is reduced, the space occupied by the electroplating tank is reduced, and the cost of the electroplating device can be saved.

[0010] On this basis, a flow equalizing structure is provided in the plating tank of the plating device according to the embodiments of the present application. When the plating solution enters the plating tank, it can first pass through the flow equalizing holes on the flow equalizing structure, thereby improving the uniformity of the plating solution, making the density of the plating solution in the upper part of the plating tank more uniform, so that the metal layer deposited on the battery chip is more uniform, and the qualification rate of the battery chip can be improved.

[0011] In an alternative embodiment, the flow equalizing structure includes:

[0012] A flow equalizing cover, which is arranged at the plating solution inlet. A plurality of flow equalizing holes are provided on the peripheral wall and / or the top wall of the flow equalizing cover.

[0013] Beneficial effects: By setting it in this way, the plating solution can enter the flow equalizing cover through the plating solution inlet and be evenly released into the plating tank through the flow equalizing holes on the side wall and the top wall of the flow equalizing cover, so that the density of the plating solution in the plating tank is more uniform, and then a uniform metal layer can be deposited on the battery chip.

[0014] In an alternative embodiment, the flow equalizing cover includes a first section and a second section that are sequentially connected in the direction away from the plating solution outlet. In the direction approaching the plating solution outlet, the inner diameter of the first section gradually increases, and a plurality of flow equalizing holes are respectively provided on the outer circumference and the top surface of the second section.

[0015] Beneficial effects: After the plating solution enters the flow equalizing cover, it can generate a component velocity in the radial direction of the flow equalizing cover under the guidance of the first section. Part of the plating solution is released into the plating tank through the flow equalizing holes on the circumference of the flow equalizing cover, and the remaining plating solution is released into the plating tank through the flow equalizing holes on the top of the flow equalizing cover, so that the density of the plating solution in the plating tank is more uniform.

[0016] In an alternative embodiment, the flow equalizing structure further includes:

[0017] A flow equalizing plate, which is separated between the bottom of the plating tank and the tank opening. A plurality of flow equalizing holes are evenly distributed on the flow equalizing plate.

[0018] In an alternative embodiment, the flow equalizing plate includes a first flow equalizing plate and a second flow equalizing plate that are sequentially arranged from top to bottom. The aperture of the flow equalizing holes on the first flow equalizing plate is smaller than the aperture of the flow equalizing holes on the second flow equalizing plate.

[0019] Beneficial effects: The first flow equalizing plate and the second flow equalizing plate can perform secondary flow equalization on the plating solution, thereby further improving the uniformity of the plating solution density.

[0020] In an alternative embodiment, the support structure includes an abutting boss formed on the inner wall of the plating tank. The edge of the battery chip can be lapped on the abutting boss, and the bottom surface is in contact with the plating solution;

[0021] and / or,

[0022] An anode, which is disposed in the electroplating tank and is connected to the positive electrode of the electroplating power supply;

[0023] A cathode, at least partially disposed in the electroplating solution, and the cathode and the anode can be electrically connected to the battery cell through the electroplating solution.

[0024] In an optional embodiment, the electroplating device further includes: a vacuum adsorption device, which is used to evacuate the area between the battery cell and the liquid level of the electroplating solution.

[0025] In an optional embodiment, the electroplating device further includes:

[0026] A driving mechanism, which is used to drive the hoisting mechanism to move in the horizontal plane and lift in the vertical direction.

[0027] In an optional embodiment, the electroplating device further includes:

[0028] A loading buffer tank, which is used to buffer the battery cells to be electroplated, and the driving mechanism can drive the hoisting mechanism to move the battery cells in the loading buffer tank above the electroplating liquid level in the electroplating tank;

[0029] An unloading buffer tank, and the driving mechanism can drive the hoisting mechanism to move the electroplated battery cells into the unloading buffer tank.

[0030] In an optional embodiment, the electroplating device further includes:

[0031] An anode, the anode is disposed in the electroplating tank and is connected to the positive electrode of the electroplating power supply, an adsorption structure for adsorbing the battery cell is provided at the bottom end of the hoisting mechanism, and a cathode is provided on the periphery of the adsorption structure, and the cathode is connected to the negative electrode of the electroplating power supply.

[0032] In an optional embodiment, the electroplating device further includes:

[0033] An overflow tank, and the electroplating tank is disposed in the overflow tank;

[0034] An overflow hole, which is formed on the tank wall of the electroplating tank and is used to communicate the electroplating tank and the overflow tank. The overflow hole is disposed at the upper part of the electroplating tank and is located below the battery cell.

[0035] Beneficial effects: By setting like this, during the electroplating process, after reacting for a period of time, the density of the electroplating solution above the electroplating tank will decrease. The overflow hole is disposed at the upper position of the electroplating tank, and the low-density upper-layer electroplating solution can flow out through the overflow hole into the overflow tank. At the same time, the electroplating solution inlet can inject new electroplating solution into the electroplating tank to ensure that the density of the electroplating solution remains unchanged. Description of the Drawings

[0036] In order to more clearly illustrate the specific embodiments of the present utility model or the technical solutions in the prior art, the following will briefly introduce the drawings required for use in the description of the specific embodiments or the prior art. Obviously, the drawings in the following description are some embodiments of the present utility model. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0037] Figure 1 Schematic diagram of a plating device according to an embodiment of the present utility model;

[0038] Figure 2 Schematic diagram of another plating device according to an embodiment of the present utility model;

[0039] Figure 3 Cross-sectional view of a plating device according to an embodiment of the present utility model at one angle;

[0040] Figure 4 Cross-sectional view of a plating device according to an embodiment of the present utility model at another angle;

[0041] Figure 5 Schematic diagram of a plating device according to an embodiment of the present utility model in a working state.

[0042] Explanation of reference numerals:

[0043] 1. Plating tank; 101. Plating solution inlet; 102. Contact boss; 103. Overflow hole; 104. Plating solution outlet;

[0044] 2. Flow equalizing structure; 201. Flow equalizing cover; 2011. First section; 2012. Second section; 2013. Flow equalizing hole; 202. First flow equalizing plate; 203. Second flow equalizing plate;

[0045] 3. Anode;

[0046] 4. Cathode;

[0047] 5. Plating power supply;

[0048] 6. Driving mechanism;

[0049] 7. Overflow tank; 701. Overflow pipe;

[0050] 8. Loading buffer tank; 9. Unloading buffer tank;

[0051] 10. Hoisting mechanism;

[0052] 11. Battery chip. Specific embodiments

[0053] To make the objectives, technical solutions, and advantages of the embodiments of the present utility model clearer, the technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are some, but not all, of the embodiments of the present utility model. All other embodiments obtained by those skilled in the art based on the embodiments of the present utility model without creative efforts shall fall within the protection scope of the present utility model.

[0054] The electroplating device can deposit a layer of metallic copper on the surface of the silicon wafer through electrolytic reaction to fabricate grid lines and collect carriers generated by the photovoltaic effect. It can replace the traditional screen printing process. This electroplating method has a wide range of application fields (compatible with HJT, XBC, Topcon) and is suitable for large-scale production.

[0055] In related technologies, the electroplating process is generally divided into horizontal electroplating and vertical electroplating. During vertical electroplating, due to the different solubilities of some solutions and the inconsistent current magnitudes, there are uniformity problems in the electroplating process. Especially during vertical electroplating, due to the different positions of different regions of a single cell and different cells in the solution, the concentrations of the solutions they contact are also different, which will cause inconsistencies in the electroplating thickness inside the product and between wafers.

[0056] The horizontal electroplating device includes an electroplating tank and conveying rollers arranged on the electroplating tank. During electroplating, the cell can be arranged on the conveying rollers and move along the liquid level in the electroplating tank driven by the conveying rollers. However, in order to accommodate the moving cells, the electroplating tank of the horizontal electroplating device needs to be set longer, resulting in a larger size of the electroplating tank. In addition, the density of the electroplating solution inside the electroplating tank is prone to unevenness, causing uneven deposition of the metal layer on the cells.

[0057] The following combines Figures 1 to 5 , to describe the embodiments of the present utility model.

[0058] According to the embodiments of the present utility model, an electroplating device is provided, which includes an electroplating tank 1 and a flow equalizing structure 2. Among them, the electroplating tank 1 is used to accommodate the electroplating solution, and the electroplating tank 1 has an electroplating solution inlet 101. A hoisting mechanism 10 or a support structure is used to immerse the cell 11 at least partially into the electroplating solution and keep the cell 11 stationary during electroplating. The flow equalizing structure 2 is arranged inside the electroplating tank 1. The flow equalizing structure 2 is separated between the electroplating solution inlet 101 and the tank opening of the electroplating tank 1 and is provided with a plurality of flow equalizing holes 2013. During electroplating, the flow equalizing structure 2 is located between the electroplating solution inlet 101 and the cell 11.

[0059] During the use of the electroplating device according to the embodiment of the present utility model, the battery chip 11 can be arranged above the liquid level of the electroplating solution, and the bottom surface of the battery chip 11 can be in contact with the liquid surface of the electroplating solution, so as to realize electroplating. Since during the use of the electroplating device according to the embodiment of the present utility model, the battery chip 11 can be statically arranged above the liquid level of the electroplating solution, it is allowed that the size of the electroplating tank 1 does not need to be set too large, and only needs to be able to accommodate the battery chip 11, thereby reducing the size of the electroplating tank 1, reducing the space occupied by the electroplating tank 1, and being able to save the cost of the electroplating device.

[0060] On this basis, a flow equalizing structure 2 is arranged in the electroplating tank 1 of the electroplating device according to the embodiment of the present application. When the electroplating solution enters the electroplating tank 1, it can first pass through the flow equalizing holes 2013 on the flow equalizing structure 2, thereby improving the uniformity of the electroplating solution, making the density of the electroplating solution in the upper part of the electroplating tank 1 more uniform, so that the metal layer deposited on the battery chip 11 is more uniform, and the qualified rate of the battery chip 11 can be improved.

[0061] Among them, the battery chip 11 is preferably but not limited to a silicon crystal battery chip 11.

[0062] When the electroplating device includes a hoisting mechanism, the battery chip can be selected to be statically placed in the electroplating tank 1 under the limitation of the hoisting mechanism and in contact with the liquid surface of the electroplating solution.

[0063] As a changeable implementation manner, the electroplating device includes a support structure, and the battery chip 11 can be statically placed in the electroplating tank 1 under the support of the support structure and in contact with the liquid surface of the electroplating solution.

[0064] Such as Figure 1 and Figure 2 As shown, the battery chip 11 is preferably horizontally arranged in the electroplating tank 1. As a changeable implementation manner, the battery chip 11 can also be selected to be inclinedly arranged in the electroplating tank 1, or vertically arranged in the electroplating tank 1.

[0065] In one embodiment, the electroplating device further includes a liquid inlet pipe, a liquid discharge pipe and a pump body. The liquid inlet pipe is connected to the electroplating solution inlet 101, and the liquid discharge pipe is connected to the electroplating solution outlet 104. During electroplating, the electroplating solution can be injected into the electroplating tank 1 through the liquid inlet pipe under the drive of the pump body. After electroplating, the electroplating solution is discharged through the liquid discharge pipe. Among them, the pump body is preferably but not limited to a pneumatic diaphragm pump.

[0066] In one embodiment, both the electroplating solution inlet 101 and the electroplating solution outlet 104 are arranged on the bottom wall of the electroplating tank 1. As a changeable implementation manner, the electroplating solution inlet 101 can also be selected to be arranged on the side wall of the electroplating tank 1.

[0067] In one embodiment, such as Figure 3 and Figure 4As shown, the uniform flow structure 2 includes a uniform flow cover 201. The uniform flow cover 201 is disposed over the electroplating solution inlet 101, and a plurality of uniform flow holes 2013 are provided on the peripheral wall and / or the top wall of the uniform flow cover 201.

[0068] By setting it in this way, the electroplating solution can enter the uniform flow cover 201 through the electroplating solution inlet 101, and be uniformly released into the electroplating tank 1 through the uniform flow holes 2013 on the side wall and the top wall of the uniform flow cover 201, so that the density of the electroplating solution in the electroplating tank 1 is more uniform, and then a uniform metal layer can be deposited on the battery chip 11.

[0069] In one embodiment, the uniform flow cover 201 includes a first section 2011 and a second section 2012 that are sequentially connected in a direction away from the electroplating solution outlet 104. In a direction approaching the electroplating solution outlet 104, the inner diameter of the first section 2011 gradually increases, and a plurality of uniform flow holes 2013 are respectively provided on the outer periphery and the top surface of the second section 2012.

[0070] After the electroplating solution enters the uniform flow cover 201, it can generate a component velocity in the radial direction of the uniform flow cover 201 under the guidance of the first section 2011. Part of the electroplating solution is released into the electroplating tank 1 through the uniform flow holes 2013 on the circumference of the uniform flow cover 201, and the remaining electroplating solution is released into the electroplating tank 1 through the uniform flow holes 2013 on the top of the uniform flow cover 201, so that the density of the electroplating solution in the electroplating tank 1 is more uniform.

[0071] As a transformable implementation manner, the uniform flow cover 201 can also be selected as a cylindrical shell.

[0072] In one embodiment, the uniform flow structure 2 further includes a uniform flow plate, which is separated between the bottom and the opening of the electroplating tank 1, and a plurality of uniform flow holes 2013 are uniformly distributed on the uniform flow plate.

[0073] The uniform flow plate can further homogenize the electroplating solution after passing through the uniform flow cover 201, thereby further improving the uniformity of the density of the electroplating solution.

[0074] In one embodiment, as Figure 4 shown, the uniform flow plate includes a first uniform flow plate 202 and a second uniform flow plate 203 that are sequentially arranged from top to bottom. The aperture of the uniform flow holes 2013 on the first uniform flow plate 202 is smaller than that of the uniform flow holes 2013 on the second uniform flow plate 203.

[0075] The first uniform flow plate 202 and the second uniform flow plate 203 can perform secondary uniform flow on the electroplating solution, thereby further improving the uniformity of the density of the electroplating solution.

[0076] In one embodiment, the electroplating device further includes a vacuum adsorption device. The vacuum adsorption device is used to evacuate the area between the battery chip 11 and the liquid surface of the electroplating solution.

[0077] By setting it in this way, the battery cell 11 can first be set on the support structure, and then the vacuum adsorption device can evacuate the space between the battery cell 11 and the liquid surface of the electroplating solution, thereby fixing the battery cell 11 on the electroplating tank 1.

[0078] In one embodiment, the support structure includes an abutting boss 102 formed on the inner wall of the electroplating tank 1, and the edge of the battery cell 11 can overlap on the abutting boss 102.

[0079] By setting it in this way, the battery cell 11 can be horizontally arranged in the electroplating tank 1, and its bottom surface is in contact with the electroplating solution.

[0080] In one embodiment, the electroplating device further includes an anode 3 and a cathode 4. The anode 3 is arranged in the electroplating tank 1 and is connected to the positive pole of the electroplating power supply 5. The cathode 4 is at least partially arranged in the electroplating solution, and the cathode 4 and the anode 3 can be conductively connected to the battery cell 11 through the electroplating solution. The current flows out from the positive pole of the electroplating power supply 5, flows to the anode 3, flows through the electroplating solution as a conductive medium to the battery cell 11, the battery cell 11 is connected to the cathode 4, the current flows into the cathode 4, and flows back to the electroplating power supply 5 from the cathode 4 to form a circuit.

[0081] In one embodiment, the electroplating device further includes an anode 3 and a cathode 4. The anode 3 is arranged in the electroplating tank 1 and is connected to the positive pole of the electroplating power supply 5. The bottom end of the hoisting mechanism 10 is provided with an adsorption structure for adsorbing the battery cell 11, and the cathode 4 is arranged outside the adsorption structure, and the cathode 4 is connected to the negative pole of the electroplating power supply 5.

[0082] By setting it in this way, during the electroplating process, the battery cell 11 can be statically placed above the liquid surface of the electroplating solution under the limitation of the hoisting mechanism 10, and its bottom surface is in contact with the electroplating solution. The current flows out from the positive pole of the electroplating power supply 5, flows to the anode 3, flows through the electroplating solution as a conductive medium to the battery cell 11, the battery cell 11 is connected to the cathode 4, the current flows into the cathode 4, and flows back to the electroplating power supply 5 from the cathode 4 to form a circuit.

[0083] On this basis, the hoisting mechanism 10 can adsorb the battery cell 11 through the adsorption structure. After adsorption, the battery cell 11 comes into contact with the cathode 4 arranged outside the adsorption structure. During the electroplating process, the cathode 4 will not be immersed in the electrolyte solution. Since the cathode 4 is completely separated from the electrolyte solution, no metal deposition will occur on the cathode 4, eliminating the possibility of the cathode 4 sticking to the battery cell 11 after becoming larger, and thus avoiding the occurrence of fragmentation of the battery cell 11; the conductivity of the cathode 4 is not affected, and there is no need to stop the machine to replace the cathode 4, ensuring the electroplating efficiency of the battery cell 11.

[0084] In one embodiment, the driving mechanism includes a manipulator. The hoisting mechanism 10 can optionally include a suction cup.

[0085] As a transformable embodiment, the driving mechanism 6 may alternatively include a three-dimensional motion module.

[0086] As another transformable embodiment, the electroplating device further includes a pressing sheet. When electroplating the battery sheet 11, the driving mechanism 6 can first drive the hoisting mechanism 10 to place the battery sheet 11 at the notch of the electroplating tank 1, and then press the pressing sheet above the battery sheet 11 to fix the battery sheet 11 on the electroplating tank 1.

[0087] In one embodiment, the electroplating device further includes an overflow tank 7 and an overflow hole 103. Among them, the electroplating tank 1 is arranged in the overflow tank 7. The overflow hole 103 is formed on the tank wall of the electroplating tank 1 for communicating the electroplating tank 1 and the overflow tank 7. The overflow hole 103 is arranged at the upper part of the electroplating tank 1 and below the battery sheet 11.

[0088] By setting it like this, during the electroplating process, after reacting for a period of time, the density of the electroplating solution above the electroplating tank 1 will decrease. The overflow hole 103 is arranged at the upper position of the electroplating tank 1, and the low-density upper-layer electroplating solution can flow out through the overflow hole 103 into the overflow tank 7. At the same time, the electroplating solution inlet 101 can inject new electroplating solution into the electroplating tank 1 to ensure that the density of the electroplating solution remains unchanged.

[0089] In one embodiment, an overflow pipe 701 is connected to the bottom of the overflow tank 7, and the overflow pipe 701 is used to discharge the electroplating solution in the overflow tank 7 after electroplating.

[0090] In one embodiment, the electroplating device further includes a loading buffer tank 8 and an unloading buffer tank 9. Among them, the loading buffer tank 8 is used to buffer the battery sheets 11 to be electroplated, and the driving mechanism 6 can drive the hoisting mechanism 10 to move the battery sheets 11 in the loading buffer tank 8 above the electroplating liquid level of the electroplating tank 1. The unloading buffer tank 9 is used to buffer the electroplated battery sheets 11. The driving mechanism 6 can drive the hoisting mechanism 10 to move the electroplated battery sheets 11 into the unloading buffer tank 9.

[0091] In one embodiment, during the use of the electroplating device of the present utility model embodiment, the driving mechanism 6 can first drive the hoisting mechanism 10 to move the battery sheets 11 in the loading buffer tank 8 above the electroplating liquid level of the electroplating tank 1. During the electroplating process, the battery sheets 11 can be statically placed in the electroplating tank 1 under the limitation of the hoisting mechanism 10. After electroplating, the driving mechanism 6 drives the hoisting mechanism 10 to move the battery sheets 11 into the unloading buffer tank 9.

[0092] As a transformable embodiment, the driving mechanism 6 can first drive the hoisting mechanism 10 to move the battery wafers 11 in the loading buffer tank 8 to the abutting ledge of the electroplating tank 1. Then, the vacuum adsorption device can evacuate the space between the battery wafers 11 and the liquid level of the electroplating solution, thereby fixing the battery wafers 11 on the electroplating tank 1. After electroplating, the driving mechanism 6 drives the hoisting mechanism 10 to move the battery wafers 11 to the unloading buffer tank 9.

[0093] Although the embodiments of the present invention have been described in conjunction with the accompanying drawings, those skilled in the art can make various modifications and variations without departing from the spirit and scope of the present invention, and such modifications and variations fall within the scope defined by the appended claims.

Claims

1. An electroplating device, characterized in that: include: An electroplating tank (1) for containing an electroplating solution, wherein the electroplating tank (1) has an electroplating solution inlet (101); A lifting mechanism (10) and / or a supporting structure, used to immerse at least part of the battery cell (11) in the electroplating solution and to keep the battery cell (11) in a stationary state during electroplating; A flow-uniform structure (2) is arranged in the electroplating tank (1), the flow-uniform structure (2) is separated between the electroplating solution inlet (101) and the slot of the electroplating tank (1), and is provided with a plurality of flow-uniform holes (2013). During electroplating, the flow-uniform structure (2) is located between the electroplating solution inlet (101) and the battery cell (11).

2. The electroplating device according to claim 1, characterized in that: The flow-uniform structure (2) comprises: A flow-uniform cover (201) is arranged at the electroplating solution inlet (101), and a plurality of flow-uniform holes (2013) are arranged on the peripheral wall and / or the top wall of the flow-uniform cover (201).

3. The electroplating device according to claim 2, characterized in that: The flow equalizer (201) comprises a first section (2011) and a second section (2012) which are connected in sequence in a direction away from the electroplating solution outlet (104); the inner diameter of the first section (2011) gradually increases in a direction approaching the electroplating solution outlet (104); and a plurality of flow equalizer holes (2013) are respectively arranged on the outer periphery and the top surface of the second section (2012).

4. The electroplating device according to claim 1, characterized in that: The flow-uniform structure (2) further comprises: A flow equalizer plate is separated between the bottom and the slot opening of the electroplating slot (1), and a plurality of flow equalizer holes (2013) are evenly distributed on the flow equalizer plate.

5. The electroplating device according to claim 4, characterized in that: The flow equalizer plate comprises a first flow equalizer plate (202) and a second flow equalizer plate (203) which are arranged in sequence from top to bottom, and the aperture of the flow equalizer hole (2013) on the first flow equalizer plate (202) is smaller than the aperture of the flow equalizer hole (2013) on the second flow equalizer plate (203).

6. The electroplating device according to any one of claims 1 to 5, characterized in that: The support structure comprises an abutment boss (102) formed on the inner wall of the electroplating tank (1), the edge of the battery cell (11) can overlap the abutment boss (102), and the bottom surface is in contact with the electroplating solution; and / or, an anode (3), disposed in the electroplating tank (1) and connected to the positive electrode of an electroplating power source (5); The cathode (4) is at least partially disposed in the electroplating solution, and the cathode (4) and the anode (3) can be electrically connected to the battery cell (11) through the electroplating solution.

7. The electroplating device according to claim 6, characterized in that: Also includes: A vacuum adsorption device is used to evacuate the area between the battery cell (11) and the liquid surface of the electroplating solution.

8. The electroplating device according to any one of claims 1 to 5, characterized in that: Also includes: An anode (3), the anode (3) is arranged in the electroplating tank (1) and is connected to the positive electrode of the electroplating power supply (5), the bottom end of the lifting mechanism (10) is provided with an adsorption structure for adsorbing the battery cell (11), the periphery of the adsorption structure is provided with a cathode (4), and the cathode (4) is connected to the negative electrode of the electroplating power supply (5).

9. The electroplating device according to any one of claims 1 to 5, characterized in that: Also includes: The driving mechanism is used to drive the hoisting mechanism (10) to move in a horizontal plane and to rise and fall in a vertical direction.

10. The electroplating device according to claim 9, characterized in that: Also includes: A loading buffer tank (8) is used to buffer the battery cells (11) to be electroplated, and the driving mechanism is capable of driving the lifting mechanism to move the battery cells (11) in the loading buffer tank (8) to above the electroplating liquid level of the electroplating tank (1); A material unloading buffer tank (9), wherein the driving mechanism can drive the lifting mechanism to move the electroplated battery cell (11) into the material unloading buffer tank (9).

11. The electroplating device according to any one of claims 1 to 5, characterized in that: Also includes: An overflow trough (7), wherein the electroplating tank (1) is arranged in the overflow trough (7); An overflow hole (103) is formed on the wall of the electroplating tank (1) and is used to connect the electroplating tank (1) and the overflow tank (7). The overflow hole (103) is arranged at the upper part of the electroplating tank (1) and is located below the battery cell (11).

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