Circuit board heat dissipation structure and clothes dryer

Abstract

The utility model discloses a circuit board heat dissipation structure and a clothes dryer, the heat dissipation structure comprises a machine body, a roller, an air duct piece, a support, a circuit board and a heat dissipation piece, the roller is rotatably installed in the machine body, the air duct piece forms an air supply channel, and the air supply channel communicates with the roller and is used for conveying hot air; a limiting frame is arranged on the outer wall face of the air duct piece in a protruding mode, a limiting hole is formed between the limiting frame and the inner wall face of the air duct piece, a limiting part matched with the limiting hole for limiting is arranged on the support, and the support is locked to the outer wall face of the air duct piece through a fastener. A mounting cavity for embedding and mounting the circuit board is formed in the support, the heat dissipation piece is attached to the back face of the circuit board, and a cooling water pipe is arranged in the heat dissipation piece. According to the application, the heat dissipation piece is arranged on the circuit board, the cooling water pipe is arranged in the heat dissipation piece, heat generated by the circuit board can be effectively taken away through water cooling, and the purpose of effective heat dissipation is achieved.

Description

Technical Field

[0001] This application relates to the technical field of dryers, and particularly to a circuit board heat dissipation structure and a dryer. Background Art

[0002] A dryer is a type of cleaning household appliance that uses electric heating to instantly evaporate and dry the moisture in washed clothes. Inside the dryer, since it is necessary to continuously maintain a relatively high drying temperature, the temperature inside the machine body remains at a relatively high level. Moreover, the circuit board also generates heat continuously during operation, which easily causes the circuit board to overheat and damage the circuit board. Utility Model Content

[0003] The purpose of the embodiments of this application is to provide a circuit board heat dissipation structure and a dryer. By arranging a heat dissipation component on the circuit board and a cooling water pipe inside the heat dissipation component, the heat generated by the circuit board can be effectively removed through water cooling, achieving the purpose of effective heat dissipation.

[0004] To achieve the above object, this application adopts the following technical solutions:

[0005] On the one hand, a circuit board heat dissipation structure is provided, including: a machine body, a drum, an air duct component, a bracket, a circuit board, and a heat dissipation component. The drum is rotatably installed inside the machine body. The air duct component forms an air supply channel, and the air supply channel is communicated with the drum for conveying hot air into the drum. A limiting frame protrudes from the outer wall surface of the air duct component, and a limiting hole is formed between the limiting frame and the inner wall surface of the air duct component. The bracket is provided with a limiting portion that cooperates with the limiting hole for limiting, and the bracket is locked to the outer wall surface of the air duct component through fasteners. An installation cavity for the circuit board to be fitted and installed is formed on the bracket. The heat dissipation component is attached to the back surface of the circuit board, and a cooling water pipe is arranged inside the heat dissipation component.

[0006] Further, a cooling water tank is also provided. The cooling water tank is installed inside the machine body, and the water inlet of the cooling water pipe is connected to the cooling water tank.

[0007] Further, a return water pipe is also included. One end of the return water pipe is connected to the water outlet of the cooling water pipe, and the other end is connected to the cooling water tank.

[0008] Further, a middle partition is arranged inside the cooling water tank. The middle partition divides the interior of the cooling water tank into a cold water chamber and a return water chamber. The cold water chamber is connected to the water inlet of the cooling water pipe, and the return water chamber is connected to the return water pipe.

[0009] Further, a connection port is arranged on the middle partition, and a one-way valve is arranged on the connection port. The one-way valve is configured to only convey water from the return water chamber to the cold water chamber.

[0010] Further, an opening is provided on the bracket, and the opening faces the front of the circuit board.

[0011] Further, the heat dissipation member is snap-fitted into the installation cavity.

[0012] Further, the fastener is a screw or a bolt.

[0013] Further, a temperature sensor is provided on the circuit board, and a control valve is provided on the cooling water pipe, and the control valve is electrically connected to the temperature sensor.

[0014] On the other hand, a dryer is further provided, including the circuit board heat dissipation structure as described in any one of the above and a driving assembly, and a power end of the driving assembly is connected to the drum.

[0015] The beneficial effects of the present application are as follows: When the dryer starts to work, hot air is conveyed into the drum through the air supply channel of the air duct member, thereby heating and evaporating the moisture in the clothes. During the operation of the dryer, the circuit board generates heat due to work. A long-term high-temperature environment may cause the performance of the circuit board to decline or even be damaged. By attaching the heat dissipation member to the back of the circuit board and arranging a cooling water pipe inside the heat dissipation member, the cooling water flowing through the cooling water pipe absorbs and takes away the heat generated by the circuit board, thereby achieving efficient heat dissipation. At the same time, through a specific installation structure, the heat dissipation member, the circuit board and the bracket are fixed on the air duct member to ensure the stability and reliability of the entire heat dissipation structure. During the operation of the dryer, this heat dissipation structure can continuously and effectively reduce the temperature of the circuit board, ensure the normal operation of the circuit board and extend its service life. Through the water-cooled heat dissipation method, the cooling water pipe inside the heat dissipation member can effectively take away the heat generated by the circuit board, ensure that the circuit board operates at a lower temperature, extend its service life and performance stability. Compared with the traditional air-cooled heat dissipation method, the water-cooled heat dissipation method has higher heat dissipation efficiency, can reduce the energy consumption of the dryer, and at the same time reduce the energy waste and environmental pollution caused by overheating of the circuit board. In addition, through the cooperation of the limiting frame and the limiting portion and the fixation of the fastener, the circuit board and the bracket can be firmly installed on the air duct member to ensure that they will not loosen or fall off during the operation of the dryer. Description of the Drawings

[0016] The following further describes the present application in detail according to the drawings and embodiments.

[0017] Figure 1 It is a schematic internal structure diagram of the dryer according to the embodiment of the present application;

[0018] Figure 2 It is an assembly schematic diagram of the air duct member, the bracket and the cooling water tank according to the embodiment of the present application;

[0019] Figure 3A perspective view of the air duct member described in the embodiments of the present application;

[0020] Figure 4 An assembly schematic diagram of the bracket and the circuit board described in the embodiments of the present application;

[0021] Figure 5 A perspective view of the heat dissipation member described in the embodiments of the present application;

[0022] Figure 6 A sectional schematic diagram of the cooling water tank described in the embodiments of the present application.

[0023] In the figure: 1, the body; 2, the drum; 3, the air duct member; 301, the limiting frame; 302, the limiting hole; 4, the bracket; 401, the limiting part; 5, the circuit board; 6, the heat dissipation member; 7, the cooling water pipe; 8, the cooling water tank; 801, the cold water chamber; 802, the return water chamber; 9, the return water pipe; 10, the middle partition board; 1001, the connection port. Detailed implementation manners

[0024] To make the technical problems solved by the present application, the technical solutions adopted and the achieved technical effects clearer, the technical solutions of the embodiments of the present application will be further described in detail below. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative efforts belong to the scope of protection of the present application.

[0025] In the description of the present application, unless otherwise clearly defined and limited, the terms "connected", "connected", "fixed" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or integrated; it can be a mechanical connection, an electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, and it can be the communication inside two elements or the interaction relationship between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific situations.

[0026] In the present application, unless otherwise clearly defined and limited, the first feature being "above" or "below" the second feature may include the direct contact between the first and second features, or may include the situation where the first and second features are not in direct contact but through other features between them. Moreover, the first feature being "above", "above" and "on" the second feature includes that the first feature is directly above and obliquely above the second feature, or only means that the horizontal height of the first feature is higher than that of the second feature. The first feature being "below", "below" and "under" the second feature includes that the first feature is directly below and obliquely below the second feature, or only means that the horizontal height of the first feature is lower than that of the second feature.

[0027] Such as Figures 1-6As shown in the figure, this embodiment provides a circuit board heat dissipation structure, including: a body 1, a drum 2, an air duct member 3, a bracket 4, a circuit board 5, and a heat dissipation member 6. The drum 2 is rotatably installed inside the body 1. The air duct member 3 is formed with an air supply channel, and the air supply channel is communicated with the drum 2 for delivering hot air into the drum 2. A limiting frame 301 protrudes from the outer wall surface of the air duct member 3, and a limiting hole 302 is formed between the limiting frame 301 and the inner wall surface of the air duct member 3. The bracket 4 is provided with a limiting portion 401 that cooperates with the limiting hole 302 for limiting, and the bracket 4 is locked to the outer wall surface of the air duct member 3 through a fastener. An installation cavity for the circuit board 5 to be fitted and installed is formed on the bracket 4. The heat dissipation member 6 is attached to the back surface of the circuit board 5, and a cooling water pipe 7 is arranged inside the heat dissipation member 6.

[0028] Based on the above solution, when the dryer starts to work, hot air is delivered into the drum 2 through the air supply channel of the air duct member 3, so as to heat and evaporate the moisture in the clothes. During the operation of the dryer, the circuit board 5 generates heat due to work. A long-term high-temperature environment may cause the performance of the circuit board 5 to decline or even be damaged. By attaching the heat dissipation member 6 to the back surface of the circuit board 5 and arranging the cooling water pipe 7 inside the heat dissipation member 6, the cooling water flowing in the cooling water pipe 7 is used to absorb and carry away the heat generated by the circuit board 5, thereby realizing efficient heat dissipation. At the same time, the heat dissipation member 6, the circuit board 5, and the bracket 4 are fixed on the air duct member 3 through a specific installation structure, ensuring the stability and reliability of the entire heat dissipation structure. During the operation of the dryer, this heat dissipation structure can continuously and effectively reduce the temperature of the circuit board 5, ensure the normal operation of the circuit board 5, and extend its service life. Through the water-cooled heat dissipation method, the cooling water pipe 7 inside the heat dissipation member 6 can effectively carry away the heat generated by the circuit board 5, ensure that the circuit board 5 operates at a lower temperature, extend its service life and performance stability. Compared with the traditional air-cooled heat dissipation method, the water-cooled heat dissipation method has higher heat dissipation efficiency, can reduce the energy consumption of the dryer, and at the same time reduce the energy waste and environmental pollution caused by the overheating of the circuit board 5. In addition, through the cooperation of the limiting frame 301 and the limiting portion 401 and the fixation of the fastener, the circuit board 5 and the bracket 4 can be firmly installed on the air duct member 3, ensuring that they will not loosen or fall off during the operation of the dryer.

[0029] Furthermore, a cooling water tank 8 and a return water pipe 9 are also provided. The cooling water tank 8 is installed inside the body 1. The water inlet of the cooling water pipe 7 is connected to the cooling water tank 8, and one end of the return water pipe 9 is connected to the water outlet of the cooling water pipe 7, and the other end is connected to the cooling water tank 8. The cooling water tank 8 is installed inside the body 1 of the dryer and serves as a storage and circulating supply source of cooling water. A cooling water pipe 7 is provided inside the heat dissipation member 6 on the back of the circuit board 5, and the water inlet of the cooling water pipe 7 is connected to the cooling water tank 8. When the dryer starts to work, the cooling water is pumped from the cooling water tank 8 into the cooling water pipe 7 by a water pump or other power device. When flowing through the heat dissipation member 6, it absorbs the heat generated by the circuit board 5. Then the cooling water flows out from the water outlet of the cooling water pipe 7 and returns to the cooling water tank 8 through the return water pipe 9. The cooling water tank 8 dissipates the heat to the outside of the body 1 through its own heat dissipation design such as heat sinks, fans, etc. At the same time, the cooling water is continuously cooled during the circulation process, forming a stable low-temperature circulating water system. This circulation process continues to ensure that the heat generated by the circuit board 5 can be taken away in time and maintain the stable operation of the circuit board 5. Through the combination of the cooling water tank 8 and the cooling water pipe 7, a closed-loop cooling water circulation system is formed, which can continuously and stably provide a low-temperature heat dissipation environment for the circuit board 5, effectively take away the heat generated by the circuit board 5, and ensure the stable operation of the circuit board 5. The cooling water is continuously cooled by the cooling water tank 8 during the circulation process, and there is no need to replace it frequently, reducing the waste of water resources. At the same time, due to the improvement of the heat dissipation effect, the dryer can work more efficiently, reduce unnecessary running time, reduce energy consumption and carbon emissions. Moreover, the stable low-temperature heat dissipation environment can reduce problems such as aging and damage of the circuit board 5 caused by high temperature, thereby prolonging the service life of the circuit board 5 and reducing the maintenance cost. In addition, due to the adoption of the water-cooled heat dissipation method, there is no need to use noisy heat dissipation equipment such as fans, making the dryer quieter during operation and providing a more comfortable use environment. At the same time, components such as the cooling water tank 8 and the cooling water pipe 7 are relatively independent, easy to maintain and replace, and a closed-loop cooling water circulation system is adopted, reducing the influence of external factors such as dust and sundries on the heat dissipation system, and improving the reliability and stability of the system.

[0030] Furthermore, a middle partition 10 is provided inside the cooling water tank 8. The middle partition 10 divides the interior of the cooling water tank 8 into a cold water chamber 801 and a return water chamber 802. The cold water chamber 801 is connected to the water inlet of the cooling water pipe 7, and the return water chamber 802 is connected to the return water pipe 9. After adding the middle partition 10, the interior of the cooling water tank 8 is divided into the cold water chamber 801 and the return water chamber 802. The cold water chamber 801 is connected to the water inlet of the cooling water pipe 7 and is used to supply cooling water to the cooling water pipe 7; while the return water chamber 802 is connected to the return water pipe 9 and is used to receive the heated water flowing out of the cooling water pipe 7. The setting of the middle partition 10 completely isolates the cold water chamber 801 and the return water chamber 802, preventing the mixing of cold and hot water, ensuring the constancy and low temperature of the water temperature in the cold water chamber 801, and thus improving the heat dissipation effect of the cooling water on the circuit board 5. Since the cooling water always maintains a low temperature, the circuit board 5 can work in a relatively stable and low-temperature environment, reducing the risk of performance degradation or damage caused by high temperature.

[0031] Meanwhile, a connection port 1001 is provided on the middle partition 10, and a one-way valve is provided on the connection port 1001. The one-way valve is configured to only convey water from the return water chamber 802 into the cold water chamber 801. To achieve the water volume balance and temperature adjustment between the two chambers, a connection port 1001 is provided on the middle partition 10, and a one-way valve is installed on the connection port 1001. This one-way valve only allows water to flow from the return water chamber 802 to the cold water chamber 801, preventing the cold water in the cold water chamber 801 from flowing back into the return water chamber 802. When the cooling water absorbs heat in the heat dissipation member 6 and its temperature rises, and flows back into the return water chamber 802 through the return water pipe 9, if the water volume in the cold water chamber 801 decreases or the water temperature in the return water chamber 802 drops, the one-way valve will allow part of the water in the return water chamber 802 to flow into the cold water chamber 801 through the connection port 1001. Due to the function of the one-way valve, this process is unidirectional, ensuring that the cold water chamber 801 always maintains a low temperature. At the same time, in order to maintain the circulation and replenishment of the cooling water, the cooling water tank 8 also needs to be connected to an external water source to replenish new cold water when needed.

[0032] In some embodiments, an opening is provided on the bracket 4, and the opening faces the front of the circuit board 5. When an opening is provided on the bracket 4 and this opening faces the front of the circuit board 5, such a design is mainly to facilitate the inspection, maintenance or replacement of the circuit board 5. When the circuit board 5 needs to be operated, the front of the circuit board 5 can be directly accessed through this opening without disassembling the entire heat dissipation structure or other parts of the dryer, which greatly improves the convenience of repair and replacement and also reduces the repair cost.

[0033] In addition, the heat sink 6 is snap-fitted into the installation cavity. The snap-fitting method is achieved by designing specific slot and buckle structures, enabling the heat sink 6 to be stably installed on the bracket 4 while facilitating disassembly and replacement. The snap-fitting method ensures a tight connection between the heat sink 6 and the bracket 4, reducing the risk of reduced heat transfer efficiency caused by loosening or vibration. The heat sink 6 is installed on the bracket 4 by snap-fitting, eliminating the need for complex installation steps and tools, improving the convenience of the installation process, ensuring a tight connection between the heat sink 6 and the bracket 4, avoiding problems such as reduced heat transfer efficiency caused by loosening or vibration, and guaranteeing the stability and reliability of the heat dissipation structure. Moreover, when it is necessary to clean, repair, or replace the heat sink 6, the heat sink 6 can be easily detached from the bracket 4, reducing maintenance costs and time consumption.

[0034] Optionally, the fastener is a screw or a bolt. As a fastener, a screw or a bolt can provide a stronger fixing force. After the bracket 4 is fitted with the limiting portion 401 and the limiting hole 302, the bracket 4 can be further locked with a screw or a bolt to ensure that the bracket 4 is stably installed on the outer wall surface of the air duct member 3.

[0035] Preferably, a temperature sensor is provided on the circuit board 5, and a control valve is provided on the cooling water pipe 7. The control valve is electrically connected to the temperature sensor. A temperature sensor is provided on the circuit board 5, which can monitor the temperature of the circuit board 5 in real time. At the same time, a control valve is installed on the cooling water pipe 7, and the control valve is electrically connected to the temperature sensor, forming a closed-loop temperature control system. When the temperature of the circuit board 5 rises, the temperature sensor will sense this change and send a temperature signal to the control valve. The control valve automatically adjusts its opening according to the received temperature signal, thereby controlling the flow rate of the cooling water through the cooling water pipe 7. If the temperature of the circuit board 5 is too high, the control valve will increase the opening to increase the flow rate of the cooling water to accelerate heat dissipation. If the temperature of the circuit board 5 is moderate or low, the control valve will reduce the opening to reduce the flow rate of the cooling water to save water resources and energy.

[0036] On the other hand, a dryer is also provided, including the circuit board heat dissipation structure as described in any one of the above, and a driving component. The power end of the driving component is connected to the drum 2.

[0037] In the description of this article, it should be understood that the orientation or positional relationships such as "upper", "lower", "left", "right", etc. are only for the convenience of description and simplifying the operation, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be construed as a limitation to this application. In addition, the terms "first" and "second" are only used for distinction in description and have no special meaning.

[0038] In the description of this specification, the description with reference to the terms "an embodiment", "example", etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example.

[0039] In addition, it should be understood that although this specification is described according to implementation methods, not every implementation method contains only one independent technical solution. This narrative method of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation methods that can be understood by those skilled in the art.

[0040] The technical principles of the present application are described above in conjunction with specific embodiments. These descriptions are only for explaining the principles of the present application and cannot be interpreted as limiting the scope of protection of the present application in any way. Based on the explanations herein, those skilled in the art can think of other specific implementation methods of the present application without creative work, and these methods will fall within the scope of protection of the present application.

Claims

1. A circuit board heat dissipation structure, characterized in that: include: A machine body (1), a drum (2), an air duct member (3), a bracket (4), a circuit board (5) and a heat sink (6); the drum (2) is rotatably mounted inside the machine body (1); the air duct member (3) is formed with an air supply channel, the air supply channel is communicated with the drum (2) and is used to transport hot air into the drum (2); a limiting frame (301) is convexly provided on the outer wall surface of the air duct member (3); a limiting hole (302) is formed between the limiting frame (301) and the inner wall surface of the air duct member (3); a limiting portion (401) is provided on the bracket (4) and is limited by the limiting hole (302); the bracket (4) is locked to the outer wall surface of the air duct member (3) by a fastener; an installation cavity for the circuit board (5) to be embedded and installed is formed on the bracket (4); the heat sink (6) is attached to the back of the circuit board (5); and a cooling water pipe (7) is provided inside the heat sink (6).

2. The circuit board heat dissipation structure according to claim 1, characterized in that: A cooling water tank (8) is also provided. The cooling water tank (8) is installed inside the machine body (1), and the water inlet of the cooling water pipe (7) is connected to the cooling water tank (8).

3. The circuit board heat dissipation structure according to claim 2, characterized in that: It also comprises a water return pipe (9), one end of which is connected to the water outlet of the cooling water pipe (7), and the other end of which is connected to the cooling water tank (8).

4. The circuit board heat dissipation structure according to claim 3, characterized in that: A middle partition (10) is provided inside the cooling water tank (8), and the middle partition (10) divides the interior of the cooling water tank (8) into a cold water chamber (801) and a return water chamber (802); the cold water chamber (801) is connected to the water inlet of the cooling water pipe (7), and the return water chamber (802) is connected to the return water pipe (9).

5. The circuit board heat dissipation structure according to claim 4, characterized in that: The middle partition plate (10) is provided with a connection port (1001), and the connection port (1001) is provided with a one-way valve, and the one-way valve is configured to only transport water from the return water chamber (802) to the cold water chamber (801).

6. The circuit board heat dissipation structure according to any one of claims 1 to 5, characterized in that: The bracket (4) is provided with an opening, and the opening is opposite to the front side of the circuit board (5).

7. The circuit board heat dissipation structure according to any one of claims 1 to 5, characterized in that: The heat sink (6) is clamped in the installation cavity.

8. The circuit board heat dissipation structure according to any one of claims 1 to 5, characterized in that: The fasteners are screws or bolts.

9. The circuit board heat dissipation structure according to any one of claims 1 to 5, characterized in that: The circuit board (5) is provided with a temperature sensor, and the cooling water pipe (7) is provided with a control valve, and the control valve is electrically connected to the temperature sensor.

10. A clothes dryer, characterized in that: It comprises a circuit board heat dissipation structure as claimed in any one of claims 1 to 9, and a drive component, wherein a power end of the drive component is connected to the roller (2).

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