GM150 half-bridge testing device

Abstract

The utility model discloses a GM150 half-bridge testing device, which belongs to the technical field of power electronic equipment testing, comprises a signal processing unit, an optical fiber T1, an optical fiber T2, an optical fiber T3, a power supply POW1, a power supply POW2, a low-voltage power supply module, equipment to be tested and an electric reactor L1, and solves the technical problem of accurately controlling an upper bridge arm and a lower bridge arm in the GM150 when the GM150 is tested. According to the utility model, the working state of the IGBT module can be accurately controlled and measured, through the integrated design, the test operation steps can be simplified, the manual operation error and time cost are reduced, the operation safety in the test process is ensured, and the test error and equipment damage caused by the unstable power supply are avoided.

Description

Technical Field

[0001] The utility model belongs to the technical field of power electronic equipment testing, and particularly relates to a GM150 half-bridge testing device. Background Art

[0002] In the field of power electronic equipment testing, a half-bridge testing device is an important tool for testing and verifying the performance of IGBT (Insulated Gate Bipolar Transistor) modules.

[0003] GM150 is a device under test with the model of GM150 IGBT-Powercard, mainly used for IGBT module testing in high-performance power electronic applications. It has the characteristics of high efficiency, high reliability and high integration, and is widely used in fields such as industrial control, transportation and power systems.

[0004] The existing half-bridge testing devices usually have the following disadvantages:

[0005] Low testing accuracy: Many existing half-bridge testing devices have insufficient accuracy in signal processing and data acquisition, resulting in inaccurate test results.

[0006] Complicated operation: Traditional testing devices require manual operation of multiple steps, and the testing process is cumbersome and prone to errors.

[0007] Insufficient safety: In a high-voltage and high-frequency operation environment, traditional testing devices lack effective isolation and protection measures, presenting potential safety hazards. Summary of the Utility Model

[0008] The purpose of the utility model is to provide a GM150 half-bridge testing device, which solves the technical problem of accurately controlling the upper and lower bridge arms in GM150 during testing.

[0009] To achieve the above purpose, the utility model adopts the following technical scheme:

[0010] A GM150 half-bridge testing device includes a signal processing unit, optical fibers T1, T2, T3, power supplies POW1, POW2, a low-voltage power supply module, a device under test and a reactor L1. The device under test includes IGBT modules Q1 and Q2;

[0011] The E terminal of IGBT module Q1 is connected to the C terminal of IGBT module Q2, the C terminal of IGBT module Q1 is connected to the positive pole of power supply POW1, the E terminal of IGBT module Q2 is connected to the negative pole of power supply POW2, and the negative pole of power supply POW1 is connected to the positive pole of power supply POW2;

[0012] The G terminals of the IGBT module Q1 and the G terminal of the IGBT module Q2 are respectively connected to the signal processing unit through the optical fibers T1 and T2. The signal processing unit is also connected to an external test host through the optical fiber T3. The signal processing unit is also connected to an external waveform signal source;

[0013] One end of the reactor L1 is connected to the negative pole of the power supply POW1, and the other end is connected to the E terminal of the IGBT module Q1;

[0014] The power supply VCC output by the low-voltage power supply module powers the signal processing unit;

[0015] The signal processing unit includes a main controller IC2, a driver IC3, a driver IC4, and a communication module IC1. The driver IC3, the driver IC4, and the communication module IC1 are all connected to the main controller IC2;

[0016] The driver IC3 is connected to the optical fiber T1. The driver IC4 is respectively connected to the optical fibers T2 and T3. The communication module IC1 is connected to the external waveform signal source.

[0017] Preferably, the optical fiber T1 includes an interface OS1 and an interface T1-R. The interface OS1 is connected to the driver IC3, and the interface T1-R is connected to the G terminal of the IGBT module Q1;

[0018] The optical fiber T2 includes an interface OS2 and an interface T2-R. The interface OS2 is connected to the driver IC4, and the interface T2-R is connected to the G terminal of the IGBT module Q2;

[0019] The optical fiber T3 includes an interface OS3 / OR1 and an interface T3-0 / R. The interface OS3 / OR1 is respectively connected to the driver IC4 and the main controller IC2, and the interface T3-0 / R is connected to the external test main board;

[0020] The communication module IC1 communicates with the external waveform signal source through a serial bus.

[0021] Preferably, the VBUS pin, D- pin, and D+ pin of the communication module IC1 are all connected to a USB interface. The USB interface is connected to the external waveform signal source. The pins 23 to 28, 1, 2, 9, 11, and 12 of the communication module IC1 are respectively connected to different IO ports of the main controller IC2;

[0022] Pin 1 of the driver IC3 is connected to the power supply VCC, pin 4 is connected to the ground wire, pin 5 is connected to pin 1 of the interface OS1, pin 6 is connected to an IO port of the main controller IC2, pins 7 and 8 are both connected to the power supply VCC. Pin 2 of the interface OS1 is connected to the ground wire, and pin 1 of the interface OS1 is also connected to the power supply VCC through a resistor R3;

[0023] Pin 1 of the driver IC4 is connected to the power supply VCC, pin 2 is connected to an IO port of the main controller, pin 3 is connected to pin 1 of the interface OS2, pin 4 is connected to the ground wire, pin 5 is connected to the OS3 port of the interface OS3 / OR1, pin 6 is connected to an IO port of the main controller IC2, and pins 7 and 8 are both connected to the power supply VCC;

[0024] Pin 2 of the OR1 port is connected to the ground wire, pin 3 is connected to an IO port of the main controller IC2 through the resistor R10. This IO port is connected to the VBUS power supply, and the VBUS power supply can be obtained by dividing the power supply VCC output by the low-voltage power supply module, or it can directly be the power supply VCC.

[0025] Pin 4 of the OR1 port is connected to an IO port of the main controller IC2.

[0026] Pin 1 of the resistor R10 is connected to the ground wire through the resistor R6, the capacitor C1 is in parallel with the resistor R6, and pin 3 of the OR1 port is also connected to the ground wire through the capacitor C2.

[0027] Preferably, the model of the communication module IC1 is CP2102, the model of the main controller IC2 is the 10M08SAM153C8G type FPGA controller, and the models of the driver IC3 and the driver IC4 are both the DS75451 type dual peripheral drivers.

[0028] Preferably, the models of the interface OS1, the interface OS2, and the OS3 port in the interface OS3 / OR1 are all T-1521Z, and the model of the OR1 port in the interface OS3 / OR1 is R-2521Z; the model of the reactor L1 is YKDG-100 / 90.69KV 100A 9mH.

[0029] Preferably, the model of the device under test is GM150 IGBT-Powercard, and the models of the IGBT module Q1 and the IGBT module Q2 are both

[0030] A5E00337012 / FZ1200R33KF2C_B3_S2, and the IGBT module Q1 and the IGBT module Q2 form the upper and lower two bridge arms of the device under test.

[0031] A GM150 half-bridge test device according to the present utility model solves the technical problem of precisely controlling the upper and lower bridge arms in GM150 during testing. The present utility model can accurately control and measure the working state of the IGBT module. The high-precision processing and optical fiber transmission of signals ensure the accuracy and reliability of test data. Through an integrated design, the test operation steps can be simplified. The signal processing unit can automatically control the working state of the IGBT module and transmit and process data in real time, enabling operators to perform tests more simply and efficiently, reducing human operation errors and time costs. By using optical fibers T1, T2, and T3 for signal transmission and isolation, electrical interference and safety hazards in a high-voltage environment are effectively avoided. Optical fiber transmission not only ensures the integrity and accuracy of signals but also ensures the operation safety during the test. Power supplies POW1 and POW2 provide a stable working power supply for the IGBT module, and the low-voltage power supply module provides a stable working voltage for the signal processing unit. The reactor L1 is used for filtering and energy storage. The coordinated operation of all these components ensures the stable operation of the entire test device and avoids test errors and equipment damage caused by unstable power supplies. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 is the system architecture diagram of the present utility model;

[0033] Figure 2 is the schematic diagram of the optical fiber connection of the present utility model;

[0034] Figure 3 is the circuit diagram of the signal processing unit of the present utility model. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0035] A GM150 half-bridge test device shown by Figures 1 - 3 includes a signal processing unit, optical fibers T1, T2, T3, power supplies POW1, POW2, a low-voltage power supply module, a device under test, and a reactor L1. The device under test includes an IGBT module Q1 and an IGBT module Q2;

[0036] The model of the device under test is GM150 IGBT-Powercard, and the models of both the IGBT module Q1 and the IGBT module Q2 are

[0037] A5E00337012 / FZ1200R33KF2C_B3_S2. The IGBT module Q1 and the IGBT module Q2 form the upper and lower bridge arms of the device under test.

[0038] The SINAMICS GM150 frequency conversion cabinet is an air-cooled medium-voltage single-machine drive device under Siemens. Parameters: power 1 - 10.1 MVA, output voltage 2.3 - 4.16 KV. Three-level NPC voltage source inverter. Designed for single-machine drive, it can be applied to applications with square-law or constant load characteristics and no feedback requirements. Mainly applied to loads such as pumps, fans, compressors, extruders, mixers, crushers, and ship drives. Widely used in fields such as oil and gas, chemical and petrochemical, mining, water / sewage, ships, cement, etc.

[0039] In this embodiment, the specific model of the GM150 IGBT-Powercard is 6SL3912 0AP360AA0.

[0040] The voltages of power supplies POW1 and POW2 are ±690 VDC, and the low-voltage power supply module is a switching power supply.

[0041] The E terminal of IGBT module Q1 is connected to the C terminal of IGBT module Q2, the C terminal of IGBT module Q1 is connected to the positive pole of power supply POW1, the E terminal of IGBT module Q2 is connected to the negative pole of power supply POW2, and the negative pole of power supply POW1 is connected to the positive pole of power supply POW2;

[0042] The G terminals of IGBT module Q1 and IGBT module Q2 are respectively connected to the signal processing unit through optical fibers T1 and T2. The signal processing unit is also connected to the external test host through optical fiber T3, and the signal processing unit is also connected to the external waveform signal source;

[0043] One end of reactor L1 is connected to the negative pole of power supply POW1, and the other end is connected to the E terminal of IGBT module Q1;

[0044] The models of interface OS1, interface OS2, and port OS3 of interface OS3 / OR1 are all T-1521Z, and the model of port OR1 of interface OS3 / OR1 is R-2521Z; the model of reactor L1 is YKDG-100 / 9 0.69 KV 100 A 9 mH.

[0045] The power supply VCC output by the low-voltage power supply module powers the signal processing unit;

[0046] The signal processing unit includes main controller IC2, driver IC3, driver IC4, and communication module IC1. Driver IC3, driver IC4, and communication module IC1 are all connected to main controller IC2;

[0047] The model number of the communication module IC1 is CP2102, the model number of the main controller IC2 is the 10M08SAM153C8G type FPGA controller, and the model numbers of the driver IC3 and the driver IC4 are both DS75451 type dual peripheral drivers.

[0048] The driver IC3 is connected to the optical fiber T1, the driver IC4 is respectively connected to the optical fibers T2 and T3, and the communication module IC1 is connected to an external waveform signal source.

[0049] The VBUS pin, D- pin, and D+ pin of the communication module IC1 are all connected to a USB interface, the USB interface is connected to an external waveform signal source, and the pins 23 to 28, 1, 2, 9, 11, and 12 of the communication module IC1 are respectively connected to different IO ports of the main controller IC2;

[0050] The 1st pin of the driver IC3 is connected to the power supply VCC, the 4th pin is connected to the ground wire, the 5th pin is connected to the 1st pin of the interface OS1, the 6th pin is connected to an IO port of the main controller IC2, the 7th and 8th pins are both connected to the power supply VCC, the 2nd pin of the interface OS1 is connected to the ground wire, and the 1st pin of the interface OS1 is also connected to the power supply VCC through the resistor R3;

[0051] The 1st pin of the driver IC4 is connected to the power supply VCC, the 2nd pin is connected to an IO port of the main controller, the 3rd pin is connected to the 1st pin of the interface OS2, the 4th pin is connected to the ground wire, the 5th pin is connected to the OS3 port of the interface OS3 / OR1, the 6th pin is connected to an IO port of the main controller IC2, and the 7th and 8th pins are both connected to the power supply VCC;

[0052] In this embodiment, the interface OS3 / OR1 includes a data transmission port, namely the OS3 port, and also includes a data reception port, namely the OR1 port.

[0053] The 5th pin of the driver IC4 is connected to the 1st pin of the OS3 port of the interface OS3 / OR1, and the 2nd pin of the OS3 port is connected to the ground wire.

[0054] The OR1 port of the interface OS3 / OR1 is connected to an IO port of the main controller; in this embodiment, the 2nd pin of the OR1 port is connected to the ground wire, the 3rd pin is connected to an IO port of the main controller IC2 through the resistor R10, and this IO port is connected to the VBUS power supply. The VBUS power supply can be obtained by dividing the power supply VCC output by the low-voltage power supply module, or it can directly be the power supply VCC.

[0055] The 4th pin of the OR1 port is connected to an IO port of the main controller IC2.

[0056] The 1st pin of the resistor R10 is connected to the ground wire through the resistor R6, the capacitor C1 is in parallel with the resistor R6, and the 3rd pin of the OR1 port is also connected to the ground wire through the capacitor C2.

[0057] The optical fiber T1 includes an interface OS1 and an interface T1-R. The interface OS1 is connected to the driver IC3, and the interface T1-R is connected to the G terminal of the IGBT module Q1;

[0058] The optical fiber T2 includes an interface OS2 and an interface T2-R. The interface OS2 is connected to the driver IC4, and the interface T2-R is connected to the G terminal of the IGBT module Q2;

[0059] The optical fiber T3 includes an interface OS3 / OR1 and an interface T3-0 / R. The interface OS3 / OR1 is respectively connected to the driver IC4 and the main controller IC2, and the interface T3-0 / R is connected to an external test main board;

[0060] The communication module IC1 communicates with an external waveform signal source through a serial bus.

[0061] In this embodiment, the signal processing unit is responsible for receiving the signal from the external waveform signal source, transmitting it to the IGBT module through the optical fiber, and controlling its working state. At the same time, it collects the working data of the IGBT module and transmits it to the external test host through the optical fiber for analysis. Among them, the main controller IC2 is the core of the entire system and is responsible for the processing and control of all signals. The main controller IC2 receives the waveform signal or data from the communication module IC1. The driver IC3 is connected to the optical fiber T1 and is responsible for driving the G terminal of the IGBT module Q1 to control its turn-on and turn-off. The driver IC4 is respectively connected to the optical fiber T2 and the optical fiber T3, is responsible for driving the G terminal of the IGBT module Q2, and at the same time transmits and receives signals from the external test host. The communication module IC1 is responsible for communicating with the external waveform signal source, receiving the waveform signal through the serial bus, and transmitting it to the main controller IC2.

[0062] The optical fibers T1, T2, and T3 are used for signal transmission and isolation to ensure the safe transmission of signals in a high-voltage environment. By using the optical fibers T1, T2, and T3 for signal transmission and isolation, electrical interference and safety hazards in a high-voltage environment are effectively avoided. Optical fiber transmission not only ensures the integrity and accuracy of signals but also ensures the operational safety during the test.

[0063] The power supplies POW1 and POW2 provide the working power for the IGBT module to ensure its normal operation.

[0064] The low-voltage power supply module provides the working power VCC for the signal processing unit to ensure its stable operation.

[0065] The power supplies POW1 and POW2 provide a stable working power for the IGBT module, and the low-voltage power supply module provides a stable working voltage for the signal processing unit. The reactor L1 is used for filtering and energy storage. The coordinated work of all these components ensures the stable operation of the entire test device and avoids test errors and equipment damage caused by unstable power supplies.

[0066] The reactor L1 is used for load simulation to simulate the load conditions under actual working conditions.

[0067] A GM150 half-bridge test device described in the present utility model solves the technical problem of precisely controlling the upper and lower bridge arms in the GM150 during the test. The present utility model can accurately control and measure the working state of the IGBT module. The high-precision processing and optical fiber transmission of signals ensure the accuracy and reliability of the test data. Through the integrated design, the test operation steps can be simplified. The signal processing unit can automatically control the working state of the IGBT module, and transmit and process data in real time, enabling the operator to perform the test more simply and efficiently, reducing the human operation error and time cost. By using optical fibers T1, T2, and T3 for signal transmission and isolation, electrical interference and safety hazards in the high-voltage environment are effectively avoided. The optical fiber transmission not only ensures the integrity and accuracy of the signal, but also ensures the operation safety during the test. The power supplies POW1 and POW2 provide a stable working power supply for the IGBT module, and the low-voltage power supply module provides a stable working voltage for the signal processing unit. The reactor L1 is used for filtering and energy storage. The coordinated work of all these components ensures the stable operation of the entire test device, avoiding test errors and equipment damage caused by unstable power supplies.

Claims

1. A GM150 half-bridge test device, characterized in that: It includes a signal processing unit, an optical fiber T1, an optical fiber T2, an optical fiber T3, a power supply POW1, a power supply POW2, a low-voltage power supply module, a device under test and a reactor L1, wherein the device under test includes an IGBT module Q1 and an IGBT module Q2; The E end of the IGBT module Q1 is connected to the C end of the IGBT module Q2, the C end of the IGBT module Q1 is connected to the positive electrode of the power supply POW1, the E end of the IGBT module Q2 is connected to the negative electrode of the power supply POW2, and the negative electrode of the power supply POW1 is connected to the positive electrode of the power supply POW2; The G end of the IGBT module Q1 and the G end of the IGBT module Q2 are connected to the signal processing unit through optical fiber T1 and optical fiber T2 respectively. The signal processing unit is also connected to an external test host through optical fiber T3. The signal processing unit is also connected to an external waveform signal source; One end of the reactor L1 is connected to the negative pole of the power supply POW1, and the other end is connected to the E end of the IGBT module Q1; The power supply VCC output by the low-voltage power supply module supplies power to the signal processing unit; The signal processing unit includes a main controller IC2, a driver IC3, a driver IC4 and a communication module IC1, and the driver IC3, the driver IC4 and the communication module IC1 are all connected to the main controller IC2; The driver IC3 is connected to the optical fiber T1, the driver IC4 is connected to the optical fiber T2 and the optical fiber T3 respectively, and the communication module IC1 is connected to an external waveform signal source.

2. A GM150 half-bridge test device as claimed in claim 1, characterized in that: The optical fiber T1 includes an interface OS1 and an interface T1-R, the interface OS1 is connected to the driver IC3, and the interface T1-R is connected to the G end of the IGBT module Q1; The optical fiber T2 includes an interface OS2 and an interface T2-R, the interface OS2 is connected to the driver IC4, and the interface T2-R is connected to the G end of the IGBT module Q2; The optical fiber T3 includes an interface OS3 / OR1 and an interface T3-0 / R, the interface OS3 / OR1 is connected to the driver IC4 and the main controller IC2 respectively, and the interface T3-0 / R is connected to the external test mainboard; The communication module IC1 communicates with the external waveform signal source through the serial port bus.

3. A GM150 half-bridge test device as claimed in claim 2, characterized in that: The VBUS pin, D- pin and D+ pin of the communication module IC1 are all connected to a USB interface, the USB interface is connected to an external waveform signal source, and the pins 23 to 28, 1, 2, 9, 11 and 12 of the communication module IC1 are respectively connected to different IO ports of the main controller IC2; Pin 1 of driver IC3 is connected to power supply VCC, pin 4 is connected to ground, pin 5 is connected to pin 1 of interface OS1, pin 6 is connected to an IO port of main controller IC2, pins 7 and 8 are both connected to power supply VCC, pin 2 of interface OS1 is connected to ground, and pin 1 of interface OS1 is also connected to power supply VCC through resistor R3; Pin 1 of driver IC4 is connected to power supply VCC, pin 2 is connected to an IO port of the main controller, pin 3 is connected to pin 1 of interface OS2, pin 4 is connected to ground, pin 5 is connected to OS3 port of interface OS3 / OR1, pin 6 is connected to an IO port of main controller IC2, and pins 7 and 8 are both connected to power supply VCC; Pin 2 of the OR1 port is connected to the ground wire, and pin 3 is connected to an IO port of the main controller IC2 through resistor R10. The IO port is connected to the VBUS power supply, which is obtained by dividing the power supply VCC output by the low-voltage power supply module. Pin 4 of the OR1 port is connected to an IO port of the main controller IC2.

4. A GM150 half-bridge test device as claimed in claim 3, characterized in that: The model of the communication module IC1 is CP2102, the model of the main controller IC2 is 10M08SAM153C8G FPGA controller, and the models of the driver IC3 and the driver IC4 are both DS75451 dual peripheral drivers.

5. A GM150 half-bridge test device as claimed in claim 2, characterized in that: The models of the interface OS1, the interface OS2 and the OS3 port in the interface OS3 / OR1 are all T-1521Z, and the model of the OR1 port in the interface OS3 / OR1 is R-2521Z; the model of the reactor L1 is YKDG-100 / 9 0.69KV 100A 9mH.

6. A GM150 half-bridge test device as claimed in claim 1, characterized in that: The model of the device under test is GM150 IGBT-Powercard, the models of the IGBT module Q1 and the IGBT module Q2 are both A5E00337012 / FZ1200R33KF2C_B3_S2, and the IGBT module Q1 and the IGBT module Q2 constitute the upper and lower bridge arms of the device under test.

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