Memory module testing device

Abstract

The utility model relates to the technical field of testing equipment, in particular to a memory module testing device, which comprises a printed circuit board (PCB), a limiting piece, a double-end testing needle, a lining plate, a lining plate fixing piece, a gland and a pressing rod, and the lining plate and the limiting piece are provided with needle holes for the double-end testing needle to pass through. The double-end test pin is clamped between the lining plate and the limiting piece, pin heads at the two ends are exposed, one end of the double-end test pin is connected with a golden finger bonding pad of the memory module, and the other end of the double-end test pin is connected with a golden finger bonding pad of the PCB; the lining plate fixing piece is movably connected with the limiting piece, and the lining plate is fixed to move in the limited space. A spring ejector pin used for supporting the limiting piece is arranged between the limiting piece and the PCB piece, and a spring ejector pin hole allowing the spring ejector pin to pass through is formed in the PCB. And the pressing rod and the gland are used for compacting the memory module, so that the golden finger bonding pad of the memory module is tightly connected with the double-end test needle.

Description

Technical Field

[0001] The utility model relates to the technical field of storage test equipment, and particularly relates to a memory module test device. Background Art

[0002] Today, with the rapid development of computer technology, especially in the field of mobile computing, such as thin and light laptops, the requirements for system performance, power consumption, and scalability are increasing day by day. Although the traditional SO-DIMM (Small Outline Dual In-line Memory Module) memory module has been widely used in such devices, its installation method through a standard connector slot faces challenges in the design trend of pursuing higher integration and lower power consumption. Therefore, there is an urgent need in the market for an innovative memory solution to better meet the dual requirements of thin and light laptops for performance and efficiency.

[0003] In this context, LPCAMM2 (Low Power Direct Drive CAMM2 Module) emerged as a revolutionary low-power compressed additional memory module. The LPCAMM2 module abandons the memory slot design of the traditional SO-DIMM and instead adopts a more compact and efficient direct installation mechanism, that is, the gold finger pads of the memory module are in direct contact with the on-board test pins on the motherboard, achieving an installation method similar to that of the CPU. This design not only significantly reduces the volume and weight of the module, but also realizes a higher data transmission frequency and bandwidth by reducing the electrical loss on the signal transmission path, while reducing the overall power consumption.

[0004] It is particularly worth mentioning that the LPCAMM2 module adopts a mounting method fixed by positioning posts and screws. Compared with the traditional slot design, it provides a more stable connection, effectively preventing poor contact caused by vibration or accidental collision, and further improving the stability and reliability of the system. This feature makes the LPCAMM2 module an ideal choice for thin and light laptops to improve performance and scalability.

[0005] However, although the LPCAMM2 module shows great advantages in performance and stability, its unique installation mechanism also brings new challenges to the testing process in mass production. Specifically, since each module needs to be locked and disassembled by screws before and after testing, this repetitive operation not only greatly reduces the testing efficiency, increases the production cycle, but also may cause unnecessary physical damage to the motherboard during multiple disassembly and assembly processes, thus driving up the overall production cost. Therefore, how to optimize the testing process of the LPCAMM2 module and reduce the efficiency loss and cost increase caused by disassembling and assembling screws has become an urgent technical problem to be solved.

[0006] In view of the above background, the present invention aims to provide an innovative test device and method for LPCAMM2 memory modules, aiming to overcome the deficiencies in the existing test process through technical means, improve test efficiency, reduce production costs, and at the same time ensure the accuracy and reliability of test results, providing strong support for the wide application of LPCAMM2 modules. Utility Model Content

[0007] In order to overcome the deficiencies of the prior art, the present application provides a memory module test device, aiming to improve the test efficiency of memory modules, reduce production costs, and at the same time ensure the accuracy and reliability of test results, providing strong support for the wide application of LPCAMM2 modules.

[0008] The technical means adopted by the present utility model to solve its technical problems is: a memory module test device, the improvement of which includes: a PCB circuit board, a limiting member, a double-headed test pin, a lining board, a lining board fixing member, a pressing cover, and a pressing rod. Among them, the lining board and the limiting member are provided with pin holes through which the double-headed test pin can pass. The double-headed test pin is clamped between the lining board and the limiting member and exposes the needle tips at both ends. One end of the double-headed test pin is connected to the gold finger pad of the memory module, and the other end is connected to the gold finger pad of the PCB circuit board; the lining board fixing member is movably connected to the limiting member to fix the lining board to move within a limited space; a spring ejector pin for supporting the limiting member is arranged between the limiting member and the PCB circuit board, and a spring ejector pin hole through which the spring ejector pin can pass is arranged on the PCB circuit board; the pressing rod and the pressing cover are used to press the memory module tightly, so that the gold finger pad of the memory module is closely connected to the double-headed test pin.

[0009] In the above technical solution, the PCB circuit board is provided with screw holes and positioning holes corresponding to the memory modules one by one, as well as an embedded nut for fixing the limiting member and a spring ejector pin mounting hole.

[0010] In the above technical solution, the limiting member is in a concave structure, and the diameter of the pin hole on the limiting member is slightly larger than the diameter of the double-headed test pin; a countersunk screw hole is also arranged on the limiting member, corresponding to the screw hole of the memory module.

[0011] In the above technical solution, the pin hole on the lining board is in a shape of being smaller at the top and larger at the bottom; the lining board is provided with a lining board positioning post and a positioning hole for limiting.

[0012] In the above technical solution, the lining board fixing member and the limiting member are provided with threaded holes, and the lining board fixing member and the limiting member are movably connected by screws.

[0013] In the above technical solution, the gland consists of an upper cover and a hinge - type structural member. Both ends of the hinge - type structural member can rotate. One end is connected to the gland hole of the limiting member, and the other end is connected to the upper cover. The upper cover and the hinge - type structural member can rotate slightly.

[0014] In the above technical solution, the upper cover is made of metal material, and a heat - dissipating silica gel is provided on the inner side; screw holes for screws to pass through are provided at the head of the upper cover.

[0015] In the above technical solution, the pressing rod includes an operating handle and a pressing part. The pressing part is made of a metal material with a certain elasticity, and the side of the pressing part in contact with the gland is convex; after the pressing rod is pressed down to a specified height, it can be fixed in the buckle.

[0016] In the above technical solution, the testing device further includes a detachable dust - proof cover, and the dust - proof cover covers the memory module and the test pin area.

[0017] In the above technical solution, a buffer pad is provided between the pressing rod and the gland, and the buffer pad is made of a high - elasticity material.

[0018] The beneficial effects of the present utility model are as follows: It solves the problem of repeatedly disassembling and assembling screws in the LPCAMM2 memory module test, reduces the damage to the main board; improves the test efficiency, reduces the production cost, and at the same time ensures the accuracy and reliability of the test results, providing strong support for the wide application of the LPCAMM2 module. Description of the Drawings

[0019] Figure 1 It is a schematic structural diagram of the memory module testing device shown in the embodiment of the present utility model;

[0020] Figure 2 It is a schematic diagram of the memory module testing process shown in the embodiment of the present utility model;

[0021] Figure 3 It is a schematic diagram of the PCB circuit board shown in the embodiment of the present utility model;

[0022] Figure 4 It is a schematic diagram of the limiting member shown in the embodiment of the present utility model;

[0023] Figure 5 It is a schematic diagram of the lining board shown in the embodiment of the present utility model;

[0024] Figure 6 It is a schematic diagram of the gland shown in the embodiment of the present utility model;

[0025] Figure 7 It is a schematic diagram of the pressing rod shown in the embodiment of the present utility model. Detailed Embodiments

[0026] The present utility model will be further described below in conjunction with the accompanying drawings and embodiments.

[0027] The concept, specific structure and technical effects of the present utility model will be clearly and completely described below in conjunction with the embodiments and the accompanying drawings to fully understand the purpose, features and effects of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all embodiments. Based on the embodiments of the present utility model, other embodiments obtained by those skilled in the art without creative efforts all fall within the scope of protection of the present utility model. In addition, all the connection / linkage relationships involved in the patent do not simply refer to the direct connection of components, but refer to the formation of a more optimal connection structure by adding or reducing connection accessories according to the specific implementation situation. The various technical features in the creation of the present utility model can be interactively combined without conflicting with each other.

[0028] As Figure 1 shown, the present application provides a memory module testing device, including a PCB circuit board 1, a limiting member 2, a double-headed test pin 3, a backing plate 4, a backing plate fixing member 5, a pressure cover 6 and a pressure rod 7. Among them,

[0029] The backing plate 4 and the limiting member 2 are provided with pin holes through which the double-headed test pin 3 can pass. The double-headed test pin 3 is clamped between the backing plate 4 and the limiting member 2 and exposes the needle tips at both ends. One end of the double-headed test pin 3 is connected to the gold finger pad of the memory module, and the other end is connected to the gold finger pad of the PCB circuit board 1.

[0030] The backing plate fixing member 5 is movably connected to the limiting member 2 to fix the backing plate 4 to move within a limited space.

[0031] A spring ejector pin 11 for supporting the limiting member 2 is arranged between the limiting member 2 and the PCB circuit board 1, and the PCB circuit board 1 is provided with a spring ejector pin hole through which the spring ejector pin 11 can pass.

[0032] The pressure rod 7 and the pressure cover 6 are used to compact the memory module so that the gold finger pad of the memory module is tightly connected to the double-headed test pin 3.

[0033] As Figure 2 shown, after the pressure cover 6 and the pressure rod 7 are opened, the memory module A is placed in the testing device. After the pressure cover 6 is closed, the pressure rod 7 is pressed down. At this time, the on-board test pins of the main board B are in stable contact with the testing device. When performing a large number of subsequent tests, only the pressure cover 6 and the pressure rod 7 need to be opened to replace the memory module, without repeatedly disassembling and assembling screws, nor will it cause damage to the main board.

[0034] In a possible implementation manner, as Figure 3As shown, on the PCB circuit board 1, there are screw holes 12 and positioning holes 13 corresponding to the memory modules one by one, as well as embedded nuts 14 and spring pin mounting holes 15 for fixing the limiting member.

[0035] In a possible implementation, as Figure 4 shown, the limiting member 2 is in a concave structure shape, and the diameter of the pin hole on the limiting member 2 is slightly larger than the diameter of the double-headed test pin 3, for installing and orienting the double-headed test pin 3; there is also a countersunk screw hole 16 on the limiting member, corresponding to the screw hole 12 of the memory module.

[0036] In a possible implementation, as Figure 5 shown, the pin hole on the liner plate 4 is smaller at the top and larger at the bottom, and the double-headed test pin 3 is sealed in the pin hole, and only the needle tip can protrude through the small hole. If installing or replacing the test pin, just remove the liner plate. There are liner plate positioning posts (not shown in the figure) and positioning holes 17 for limiting on the liner plate 4. Through the precise limitation of the liner plate positioning posts and positioning holes 17, and the upward force exerted by the spring pin 11 on the PCB circuit board 1 on the liner plate 4, the liner plate 4 can precisely hold the LPCAMM2 memory module in contact with the double-headed test pin 3, or lift it up and release it.

[0037] In a possible implementation, as Figure 1 shown, there are threaded holes 18 on the liner plate fixing member 5 and the limiting member 2, and the liner plate fixing member 5 and the limiting member 2 are movably connected by screws to fix the liner plate 4 to move within a limited space.

[0038] In a possible implementation, as Figure 6 shown, the gland 6 is composed of an upper cover 19 and a hinge structure member 20. Both ends of the hinge structure member 20 can rotate. One end is connected to the gland hole of the limiting member 2, and the other end is connected to the upper cover 19. The upper cover 19 and the hinge structure member 20 can rotate slightly. When the gland 6 is pressed down and turned up, it can autonomously adjust its position by slightly rotating to avoid applying frictional force to the surface of the memory module and causing appearance damage.

[0039] Optionally, the upper cover 19 is made of a metal material, and a heat dissipation silica gel is provided on the inner side, which can increase the function of auxiliary heat dissipation; there is a screw hole at the head of the upper cover 19 for passing screws when closing to fasten with screws.

[0040] In a possible implementation, as Figure 7As shown, the pressing rod 7 includes an operating handle 20 and a pressing part 21. The pressing part 21 is made of a metal material with a certain elasticity, and the side of the pressing part 21 in contact with the pressing cover 6 is convex. After the pressing rod 7 is pressed down to a specified height, it can be fixed in the buckle. The LPCAMM2 memory module is connected to the main board B through the double-headed test pins 3 and the PCB circuit board 1, and the connection distance is less than 1 cm, ensuring high-frequency transmission to the greatest extent.

[0041] In a possible implementation, the test device further includes a detachable dust cover that covers the memory module and the test pin area. The dust cover covers the memory module and the test pin area to reduce the influence of dust and impurities on the test process and improve the accuracy and reliability of the test.

[0042] In a possible implementation, a buffer pad is provided between the pressing rod 7 and the pressing cover 6. The buffer pad is made of a highly elastic material to reduce the impact on the pressing cover 6 and the memory module when the pressing rod 7 is pressed down, protecting the test device and the memory module from damage.

[0043] The above is a specific description of the preferred embodiment of the present invention. However, the present invention is not limited to the above embodiments. Those skilled in the art can make various equivalent deformations or substitutions without departing from the spirit of the present invention, and these equivalent deformations or substitutions are all included in the scope defined by the claims of this application.

Claims

1. A memory module testing device, characterized in that: It includes a PCB circuit board, a limiter, a double-ended test needle, a lining plate, a lining plate fixing part, a pressure cover and a pressure rod, wherein: The lining plate and the stopper are provided with pinholes for the double-ended test needle to pass through, the double-ended test needle is clamped between the lining plate and the stopper and the needles at both ends are exposed, one end of the double-ended test needle is connected to the gold finger pad of the memory module, and the other end is connected to the gold finger pad of the PCB circuit board; The lining plate fixing member is movably connected to the limiting member to fix the lining plate to move within a limited space; A spring ejector pin for supporting the limiting member is arranged between the limiting member and the PCB circuit board, and a spring ejector pin hole for the spring ejector pin to pass through is arranged on the PCB circuit board; The pressing rod and the pressing cover are used to compact the memory module so that the gold finger pad of the memory module is tightly connected to the double-headed test pin.

2. The memory module testing device according to claim 1, characterized in that: The PCB circuit board is provided with screw holes and positioning holes corresponding to the memory modules one by one, as well as embedded nuts and spring ejector pin mounting holes for fixing the limiting member.

3. The memory module testing device according to claim 1, characterized in that: The limiting member is in the shape of a concave structure, and the diameter of the pinhole on the limiting member is slightly larger than the diameter of the double-headed test pin; the limiting member is also provided with a countersunk screw hole corresponding to the screw hole of the memory module.

4. The memory module testing device according to claim 1, characterized in that: The pinhole on the lining plate is small at the top and large at the bottom; the lining plate is provided with a lining plate positioning column and a positioning hole for limiting position.

5. The memory module testing device according to claim 1, characterized in that: The lining plate fixing part and the limiting part are provided with threaded holes, and the lining plate fixing part and the limiting part are movably connected with each other through screws.

6. The memory module testing device according to claim 1, characterized in that: The pressure cover is composed of an upper cover and a hinged structure. Both ends of the hinged structure can rotate, one end is connected to the pressure cover hole of the limiter, and the other end is connected to the upper cover. The upper cover and the hinged structure can rotate slightly.

7. The memory module testing device according to claim 6, characterized in that: The upper cover is made of metal, and heat dissipation silica gel is arranged on the inner side; the head of the upper cover is provided with screw holes for screws to pass through.

8. The memory module testing device according to claim 1, characterized in that: The pressure rod includes an operating handle and a pressing portion. The pressing portion is made of a metal material with a certain elastic force. The contact side of the pressing portion with the pressure cover is convex. The pressure rod can be fixed in the lock buckle after being pressed down to a specified height.

9. The memory module testing device according to claim 1, characterized in that: The testing device also includes a detachable dust cover, which covers the memory module and the testing pin area.

10. The memory module testing device according to claim 1, characterized in that: A buffer pad is arranged between the pressure rod and the pressure cover, and the buffer pad is made of a high-elastic material.

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