Voltage temperature acquisition structure

Abstract

The utility model discloses a voltage and temperature acquisition structure, which belongs to the technical field of battery cells, and is characterized in that a plurality of rows of connectors are fixed on an FPC (flexible printed circuit) board, the FPC connector is connected with a group of enameled wires, and the other end of each enameled wire is fixedly connected with a voltage acquisition component or a temperature signal sensing component; the voltage acquisition assembly is provided with a voltage acquisition nickel sheet. According to the utility model, the overall damage caused by abnormal local current of the battery can be effectively avoided, the service life of the voltage and temperature acquisition structure is greatly prolonged, and the production cost is saved.

Description

Technical Field

[0001] The utility model relates to the technical field of battery cells, in particular to a voltage and temperature acquisition structure. Background Technique

[0002] In the current processing and production of battery cells, the acquisition of 48V low-voltage power battery cells and temperature mainly uses the FPC device with etched fuses. When using the FPC device with etched fuses, the fuse will melt after the current between the cells exceeds a certain value. However, the width of this kind of fuse cannot be finely etched. If short-circuit protection is achieved by reducing the over-current magnitude, it is difficult to achieve instantaneous melting, and it is also difficult to accurately protect the sampling circuit. Therefore, the protection performance is poor.

[0003] In addition, during the production process, it is difficult to guarantee the performance of the etched fuses, and the production widths of the fuses cannot be consistent. As a result, the position where the fuse melts first may not be the same as the actual position where the fault occurs, and accurate short-circuit protection cannot be achieved. For example, a voltage FPC device with an etched fuse shown in the comparative document CN211744858U cannot achieve the purpose of accurate short-circuit protection. Summary of the Utility Model

[0004] Aiming at the problem of inability to achieve accurate short-circuit protection in the prior art, the utility model provides a voltage and temperature acquisition structure, aiming to solve the problems that the low-voltage power battery cell and temperature acquisition system in the above background technology cannot be accurately protected, resulting in high production and maintenance costs. Thus, a voltage and temperature acquisition FPC device that can accurately locate the faulty circuit, is easy and fast to maintain, and is beneficial to saving production costs is provided.

[0005] To solve the above problems, the utility model provides a voltage and temperature acquisition structure, which includes an FPC board, and is provided with multiple rows of FPC connectors. A plurality of voltage acquisition components and temperature signal sensing components are arranged on the FPC board around the FPC connectors. A part of the FPC connectors is connected to the voltage acquisition components through patch fuses, and another part is connected to the temperature signal sensing components; the voltage acquisition components include voltage acquisition nickel sheets and enameled wires.

[0006] Among them, in the voltage acquisition components, the voltage acquisition nickel sheets are connected to the enameled wires. The enameled wires are bent at an angle on the FPC board and then connected to the FPC connectors, which has the function of buffering and absorbing energy.

[0007] Preferably, a plurality of surface mount fuses are provided on the FPC board. The number of surface mount fuses is consistent with the number of voltage acquisition nickel sheets, and the positions are juxtaposed with the corresponding voltage acquisition nickel sheets. The distance between the two is adjusted appropriately according to actual needs. Each surface mount fuse corresponds to an FPC connector. The surface mount fuses are arranged neatly side by side, with equal distances between them, and their two ends are respectively connected to the FPC connector and the enameled wire lead-out end.

[0008] Preferably, the temperature signal sensing component is internally provided with an NTC thermistor. The resistance value of the NTC thermistor changes little with temperature fluctuations and responds quickly to various temperature changes. It is prepared from a ceramic material formed by fully mixing oxides of Mn-Co-Ni. In this solution, the NTC thermistor is used as a high-sensitivity and high-precision temperature sensor.

[0009] Preferably, the voltage acquisition component is connected to the FPC board by soldering. There is insulating glue at the soldering part of the voltage acquisition component to prevent the voltage acquisition component from leaking electricity and damaging the PCB board or other components.

[0010] Preferably, the temperature signal sensing component is arranged at both ends of the FPC board, and the NTC thermistor is soldered at the temperature signal acquisition position of the temperature signal sensing component.

[0011] Preferably, the enameled wire and the FPC board are cured with insulating glue to ensure insulation between the enameled wires, aiming to improve the safety of the device.

[0012] Preferably, the FPC connector is connected to the FPC board by soldering.

[0013] Compared with the prior art, the above design scheme of the present utility model has the following advantages: The surface mount fuses used in the design have the same shape and specifications. Compared with the etched fuses whose width is difficult to guarantee, the position where it first melts is the same as the position where the fault occurs, and it can play an accurate protection role. A bending flexible energy absorption device is designed at the lead-out end where the voltage acquisition component is connected to the enameled wire, further improving the energy absorption and buffering performance, and can effectively buffer vibrations in various application scenarios and changes in the module size during use. The present utility model proposes a circuit protection device, which can effectively avoid the overall damage caused by abnormal local current of the battery, greatly improve the service life of the voltage and temperature acquisition device, and save production costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 is a structural schematic diagram of the present utility model.

[0015] Figure 2 is a schematic diagram of the voltage acquisition component of the present utility model.

[0016] Brief Description of the Drawings: 1. Voltage acquisition component, 2. FPC board, 3. Temperature signal sensor, 4. FPC connector, 5. SMD fuse, 6. Enameled wire, 7. NTC thermistor, 8. Voltage acquisition nickel sheet. Detailed Embodiments

[0017] The technical solutions in the embodiments of the present utility model will be fully described below. The described embodiments are only a part of the embodiments of the present utility model, rather than all embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present utility model without creative efforts shall fall within the protection scope of the present utility model.

[0018] Embodiment 1:

[0019] As shown in the attached Figure 1 description, a voltage and temperature acquisition structure includes an FPC board 2, which is characterized in that multiple rows of FPC connectors 4 are provided. A plurality of voltage acquisition components 1 and temperature signal sensing components 3 are provided on the FPC board around the FPC connectors. A part of the FPC connectors is connected to the voltage acquisition components through SMD fuses, and the other part is connected to the temperature signal sensing components; the voltage acquisition components include voltage acquisition nickel sheets 8 and enameled wires 6. The FPC board is provided with several SMD fuses 5, and the number of SMD fuses is the same as the number of voltage acquisition nickel sheets. Each SMD fuse corresponds to an FPC connector; both ends of the SMD fuse are respectively connected to the FPC connector and the lead-out end of the enameled wire. The temperature signal sensing component 3 is internally provided with an NTC thermistor 7. The voltage acquisition components are connected to the FPC board by soldering, and there is insulating glue at the soldering part of the voltage acquisition components. The temperature signal sensing components are arranged at both ends and the middle of the FPC board, and the NTC thermistor is soldered in the middle of the temperature signal sensing component. The enameled wire and the FPC board are cured by insulating glue to ensure insulation between the enameled wires. The FPC connector is connected to the FPC board by soldering.

[0020] The above FPC connector 4, voltage acquisition nickel sheet 8, and temperature signal sensing component 3 are all integrated on the FPC board 2. The voltage acquisition nickel sheet 8 and the temperature signal sensing component 3 are both connected to the FPC board 2 by soldering. Insulating glue is applied at the soldering joints of the voltage acquisition nickel sheet 8 and the temperature signal sensing component 3 with the FPC board 2 to ensure the safety of the device.

[0021] The bottom end of the FPC connector 4 is connected to the FPC board 2. The surface mount fuses 5 are arranged on both sides of the FPC connector 4 at the same distance, ensuring that each surface mount fuse 5 has a port of the FPC connector 4 as an interface. The surface mount fuse device can effectively prevent the influence of large current on the temperature and voltage acquisition device, improving the stability of the system. The FPC connector 4 is connected to the enameled wire 6 through the surface mount fuse 5, and the end of the enameled wire 6 is connected to the voltage acquisition component 1, finally forming a voltage acquisition and circulation circuit. There is also an FPC connector 4 that is not paired with the surface mount fuse 5 and is directly connected to the enameled wire 6. The end of the enameled wire is connected to the temperature signal sensing component 3, forming a temperature sensing signal path.

[0022] A layer of insulating glue is printed and coated in the gap between the enameled wires of the FPC board 4 to ensure the insulation between the enameled wires, and then it is cured. A single-sided adhesive insulating film is laminated on the surface of the cured insulating glue.

[0023] As shown in the attached Figure 1 description, in the present utility model, the circuit is wrapped by insulating materials. Therefore, there is an insulating layer outside the wire layer, providing protection such as insulation, dust prevention, waterproofing, temperature resistance, and acid and alkali resistance for the wire layer. The contacts for collecting temperature data or voltage are the places where the two sets of independent acquisition components are in contact with the insulating material, and the width should not be too large. When using this device to measure data, the fingers should not pinch the insulating part at this place, causing the insulating part and the metal contact to form an angle due to their own weight, damaging the FPC board 2.

[0024] In this embodiment, the wire diameter of the enameled wire can be adjusted arbitrarily according to actual needs. The temperature signal sensing component 3 is pre-processed and formed. The structure is an FPC conduction line, and its end is connected to a temperature sensor. An NTC thermistor 7 is arranged inside the temperature sensor. The NTC thermistor 7 has the characteristic of temperature compensation. Some devices in the circuit may be affected by temperature changes and affect the output result. The NTC thermistor 7 corrects the output of the electronic devices in the temperature signal sensing component 3 by measuring the temperature change value of this part, suppressing the possible errors.

[0025] As shown in the attached Figure 2 description, after the voltage acquisition nickel sheet 8 terminal is connected to the enameled wire 6, a bending buffer arc is set. The setting of the bending buffer arc improves the reliability and use stability of the product structure. Preferably, a PI flexible insulating film is used to cover the voltage acquisition component 1. The thinnest thickness of the PI flexible insulating film is 0.05 mm. The overall thickness of the enameled wire 6 with insulating glue is 1.11 mm to 2 mm. This thickness does not include the thickness of the lead-out position and the sampling position components. The copper wire diameter of the enameled wire 6 is 1 mm.

[0026] In this embodiment, multiple branches extend from the FPC board 2. The voltage acquisition components 1 are distributed on the long side of the FPC board 2, with a quantity of 15. The ends of 13 of the voltage acquisition components 1 are connected to an enameled wire 6, and the other end of this enameled wire 6 is connected to the FPC connector 4 to form a voltage acquisition path.

[0027] In this embodiment, an elongated end extends from each of the two short sides of the FPC board 2. This elongated end needs to ensure sufficient length for arranging the enameled wire 6 and also sufficient width for arranging the temperature signal sensing component 3.

[0028] In this embodiment, three sets of temperature signal sensing components 3 are arranged on the FPC board 2. One set is arranged on each of the two extended elongated ends of the FPC board 2, and one set is arranged in the middle of the FPC board 2. The three sets of temperature sensing components respectively measure the temperature changes in the upper, middle, and lower sections of the FPC board 2.

[0029] In this embodiment, the functional part of the temperature signal sensing component 3 mainly includes an NTC thermistor 7. A layer of PI flexible insulating film is attached to the outside of the NTC thermistor 7. A nickel sheet terminal is externally arranged for the NTC thermistor 7, and this nickel sheet terminal is connected to the temperature signal acquisition position of the temperature signal sensing component.

[0030] In this embodiment, the temperature signal sensing component 3 is connected to two enameled wires 6, and the other ends of the two enameled wires are connected to the FPC connector 4 to form a temperature signal sensing loop.

[0031] In this embodiment, the FPC connectors 4 are arranged in two concentrated columns. Patch fuses 5 are welded on both sides of some of the FPC connectors 4 to form patch fuse pads, and the number of welded patch fuses is the same as that of the voltage acquisition components 1.

[0032] Embodiment Two:

[0033] This embodiment provides a voltage and temperature acquisition structure, including the voltage and temperature acquisition structure described in Embodiment One.

[0034] As Figure 1 shown, this embodiment illustrates a voltage and temperature acquisition structure. A voltage and temperature acquisition structure includes an FPC board 2, and is characterized in that multiple rows of FPC connectors 4 are provided. Multiple voltage acquisition components 1 and temperature signal sensing components 3 are arranged on the FPC board around the FPC connectors. A part of the FPC connectors is connected to the voltage acquisition components through patch fuses, and another part is connected to the temperature signal sensing components; the voltage acquisition components include voltage acquisition nickel sheets 8 and enameled wires 6.

[0035] The above FPC connector 4, voltage collection nickel sheet 8, and temperature signal sensor component 3 are all concentrated on the FPC board 2. The voltage collection nickel sheet 8 and the temperature signal sensor component 3 are connected to the FPC board 2 by soldering. Insulating glue is applied to the welding place between the voltage collection nickel sheet 8 and the temperature signal sensor component 3 and the FPC board 2 to ensure the safety of the device.

[0036] The base of the FPC connector 4 is connected to the FPC board 2, and chip fuses 5 with consistent specifications and meeting the use requirements are welded on both sides. Each chip fuse 5 corresponds to a port of the FPC connector 4, which has the advantages of effectively preventing the influence of large current on the temperature and voltage acquisition device and improving the stability of the temperature and voltage acquisition work; in the voltage acquisition circuit, the FPC connector 4 is connected to the enameled wire 6 through the chip fuse 5 as an intermediary, and the other end of the enameled wire 6 is connected to the voltage acquisition component 1, finally forming a voltage acquisition flow circuit; in the temperature signal sensing circuit, the FPC connector 4 is directly connected to the enameled wire 6, and the end of the enameled wire 6 is connected to the temperature signal sensing component 3, finally forming a temperature signal sensing circuit.

[0037] A layer of insulating glue is printed and coated in the gaps between the enameled wires 6 of the FPC board 4 to ensure insulation between the enameled wires 6, and then cured; a layer of single-sided adhesive insulating film is laminated on the surface of the cured insulating glue.

[0038] Preferably, the insulating film is made of PI flexible insulating film, so that the overall thickness of the system is thin and light; relying on the conductivity of the enameled wire 6 between the two layers of insulating film, a strong filtering current capacity can be achieved.

[0039] As described above, in the utility model, the line is wrapped by insulating material to form a line layer, and the outside of the line layer is an insulating layer, which provides insulation, dustproof, waterproof, heat-resistant, acid-resistant and alkali-resistant protection for the line layer; the contacts for collecting temperature data or voltage are the places where two independent collection systems are connected to the insulating material, and the width should not be too large; when using the device to measure data, fingers should not pinch the insulating part at this place, causing the insulating part and the metal contact to form an angle due to their own weight, thereby damaging the FPC board 2.

[0040] In this embodiment, the wire diameter of the enameled wire 6 can be adjusted arbitrarily according to actual needs; the temperature signal sensing component 3 is processed and formed in advance; the structure is an FPC conductive line, the end of which is connected to the temperature sensor, and an NTC thermistor 7 is arranged in the temperature sensor. The NTC thermistor 7 has the characteristic of temperature compensation. Some devices in the circuit may affect the output result due to temperature changes. The NTC thermistor 7 corrects the output of the electronic device in the temperature signal sensing component 3 by measuring this part of the temperature change value, thereby suppressing possible errors.

[0041] After the 8-terminal nickel sheet for voltage acquisition is connected to the enameled wire 6, a bending buffer arc is set. The setting of the bending buffer arc improves the reliability of the product structure and the stability of use; preferably, the voltage acquisition component 1 is covered with a PI flexible insulating film, and the thinnest thickness of the PI flexible insulating film is 0.05 mm. The overall thickness of the enameled wire 6 with insulating glue is 0.98 mm - 1.21 mm, and this thickness does not include the thickness of the components at the lead-out position and the sampling position; the copper wire diameter of the enameled wire 6 is 1 mm.

[0042] In this embodiment, multiple branches extend from the FPC board 2. The voltage acquisition components 1 are distributed on the long side of the FPC board 2, and the number is 15. The ends of 13 voltage acquisition components 1 are connected to an enameled wire 6, and the other end of this enameled wire 6 is connected to the FPC connector 4 to form a voltage acquisition path.

[0043] In this embodiment, each of the two short sides of the FPC board 2 extends an elongated end. This elongated end needs to ensure sufficient length for arranging the enameled wire 6, and at the same time, it also needs to ensure sufficient width for arranging the temperature signal sensing system.

[0044] In this embodiment, three sets of temperature signal sensing components are arranged on the FPC board 2. One set is arranged on each of the two extended elongated ends of the FPC board 2, and one set is arranged in the middle of the FPC board 2. The three sets of temperature sensing components respectively measure the temperature changes in the upper, middle, and lower sections of the FPC board 2.

[0045] In this embodiment, the temperature signal acquisition component 3 includes a PI flexible insulating film, copper foil, an NTC thermistor 7, and a nickel sheet terminal. The temperature signal acquisition component is an FPC conduction line. The copper foil and the surface-mounted thermistor are embedded between two layers of PI flexible insulating films, and a nickel sheet terminal is press-connected and wrapped outside the thermistor. The lead-out position of the nickel sheet terminal is welded at the temperature signal acquisition position. This component has a simple structure and high reliability.

[0046] In this embodiment, the temperature signal sensing component 3 is connected to two enameled wires 6, and the other ends of the two enameled wires 6 are connected to the FPC connector 4 to form a temperature signal sensing loop.

[0047] In this embodiment, the FPC connectors 4 are arranged in two columns in a concentrated manner. Surface-mounted fuses 5 are welded on both sides of some FPC connectors 4 to form surface-mounted fuse pads, and the number of welded surface-mounted fuses is the same as that of the voltage acquisition components 1.

[0048] The temperature acquisition FPC device with surface-mounted fuses described in this embodiment, since it includes the temperature acquisition FPC device with surface-mounted fuses described in Embodiment 1, all the advantages of Embodiment 1 are also possessed by this embodiment.

[0049] Obviously, the above embodiments are merely examples for clear illustration and are not limitations on the implementation manners. For those of ordinary skill in the art, other different forms of changes or modifications can be made based on the above description. It is not necessary and impossible to enumerate all implementation manners here. And the obvious changes or modifications derived therefrom are still within the protection scope of this utility model creation.

Claims

1. A voltage and temperature acquisition structure, comprising an FPC board (2), characterized in that A plurality of rows of FPC connectors (4) are provided, and a plurality of voltage collection components (1) and temperature signal sensing components (3) are provided on the FPC board (2) around the FPC connector (4); a portion of the FPC connector (4) is connected to the voltage collection component (1) via a surface mount fuse, and another portion is connected to the temperature signal sensing component (3); The voltage collection component (1) comprises a voltage collection nickel sheet (8) and an enameled wire (6).

2. The voltage and temperature acquisition structure according to claim 1 is characterized in that: The voltage collection nickel sheet (8) and the enameled wire (6) are connected to each other, and the enameled wire is connected to the FPC connector (4) after being bent on the FPC board (2).

3. The voltage and temperature acquisition structure according to claim 2 is characterized in that: The number of the chip fuses (5) is consistent with the number of the voltage collection nickel sheets (8); Two ends of the chip fuse (5) are respectively connected to the FPC connector (4) and the lead-out end of the enameled wire (6).

4. The voltage and temperature acquisition structure according to claim 1 is characterized in that: An NTC thermistor (7) is arranged inside the temperature signal sensor component (3).

5. The voltage and temperature acquisition structure according to any one of claims 1 to 4, characterized in that: The voltage collection component (1) is connected to the FPC board by soldering, and insulating glue is provided at the welding position of the voltage collection component (1).

6. The voltage and temperature acquisition structure according to claim 4 is characterized in that: The temperature signal sensor assembly (3) is arranged at both ends and the middle of the FPC board (2), and the NTC thermistor (7) is welded in the middle of the temperature signal sensor assembly (3).

7. The voltage and temperature acquisition structure according to any one of claims 1 to 4, characterized in that: The enameled wire (6) and the FPC board (2) are cured by insulating glue.

8. The voltage and temperature acquisition structure according to any one of claims 1 to 4, characterized in that: The FPC connector (4) is connected to the FPC board (2) by welding.

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