Coplanar waveguide transition structure and radio frequency transmission system

Abstract

The utility model discloses a coplanar waveguide transition structure. A top-layer connector comprises a base and a probe. The base is provided with an interface corresponding to the shape of the radio frequency connector, and the probe extends to the first conductive layer from the interface; the first conductive layer is provided with a bonding pad corresponding to the probe and a transmission line extending from the bonding pad, and the bonding pad is in contact with the probe; a reference avoiding hole is formed in an area, corresponding to the bonding pad, of the second conductive layer, so that a hollow structure without a conductive material of the second conductive layer is formed below the bonding pad; the area, corresponding to the bonding pad, of the third conductive layer is a solid area, so that a reference layer corresponding to the bonding pad is formed on the third conductive layer, a reference layer corresponding to the transmission line is formed on the second conductive layer, and the bonding pad is matched in impedance. Impedance matching is carried out through interlayer reference of the bonding pad, so that discontinuity of impedance at the bonding pad is reduced, it is guaranteed that signals cannot be sharply deteriorated in the transmission process from the radio frequency connector to a circuit board, and the signal transmission quality is guaranteed.

Description

Technical Field

[0001] The utility model relates to the technical field of microwave radio frequency, in particular to a coplanar waveguide transition structure and a radio frequency transmission system. Background Art

[0002] With the development of microwave radio frequency design technology, quasi-TEM (Transverse Electromagnetic mode) mode planar transmission lines such as microstrip lines, coplanar waveguides and striplines are more and more commonly used in radio frequency transmission systems. As a transmission carrier, a printed circuit board (PCB) usually needs to be connected to an external radio frequency connector. Since a radio frequency connector is usually a coaxial structure in TEM mode, when a signal propagates at the connection of the two structures, there will be impedance discontinuity at the connection surface, resulting in a sharp deterioration of the transmission performance in the millimeter wave band. Therefore, how to provide a transition structure with a simple structure and capable of impedance matching is an urgent problem to be solved by those skilled in the art. Summary of the Utility Model

[0003] The purpose of the utility model is to provide a coplanar waveguide transition structure, which realizes the impedance matching between a radio frequency connector and a printed circuit board only by using a simple structure; another purpose of the utility model is to provide a radio frequency transmission system, which realizes the impedance matching between a radio frequency connector and a printed circuit board only by using a simple structure.

[0004] To solve the above technical problems, the utility model provides a coplanar waveguide transition structure, which includes a top connector and a circuit board structure; the circuit board structure includes a first conductive layer, a first dielectric layer, a second conductive layer, a second dielectric layer and a third conductive layer which are sequentially stacked from the side facing the top connector to the side facing away from the top connector;

[0005] The top connector is fixedly connected to the circuit board structure and is arranged on the surface of the first conductive layer. The top connector includes a base and a probe; the base is provided with an interface corresponding to the morphology of the radio frequency connector, and the probe extends from the interface to the first conductive layer;

[0006] The first conductive layer is provided with a pad corresponding to the probe and a transmission line extending from the pad. The pad is in contact with the probe; a reference avoidance hole is arranged in the area of the second conductive layer corresponding to the pad to form a hollow structure without the conductive material of the second conductive layer below the pad; the area of the third conductive layer corresponding to the pad is a solid area to form a reference layer corresponding to the pad in the third conductive layer and a reference layer corresponding to the transmission line in the second conductive layer, so as to match the impedance of the pad.

[0007] Optionally, a wiring channel is provided on the surface of the lower base facing the circuit board, the transmission line is arranged along the wiring channel, and the probe extends from the interface to the wiring channel.

[0008] Optionally, the base includes a lower base and an upper base. The upper base is located on the surface of the lower base facing away from the circuit board structure and corresponds to the morphology of the RF connector; the probe extends from inside the upper base to the wiring channel.

[0009] Optionally, an impedance transformer is provided between the pad and the transmission line in the first conductive layer.

[0010] Optionally, the impedance transformer is a capacitive impedance transformer, and the width of the impedance transformer is greater than the width of the transmission line.

[0011] Optionally, the reference avoidance hole is circular.

[0012] Optionally, the first conductive layer further includes:

[0013] A gap surrounding the pad and the transmission line, and a first ground layer is formed outside the gap.

[0014] Optionally, the second conductive layer forms a second ground layer outside the reference avoidance hole, the third conductive layer forms a third ground layer, the circuit board structure is provided with a shielding hole, the shielding hole surrounds the pad and the transmission line along the circumference, the shielding hole penetrates through the first dielectric layer and the second dielectric layer, and is connected to the first ground layer, the second ground layer and the third ground layer.

[0015] Optionally, the top connector and the circuit board structure are provided with corresponding screw holes to fixedly connect the top connector and the circuit board structure through bolts.

[0016] The present invention also provides a radio frequency transmission system, including the coplanar waveguide transition structure as described in any one of the above.

[0017] Optionally, the radio frequency transmission system is a phased array antenna.

[0018] Optionally, the radio frequency transmission system is a transmitting antenna, a receiving antenna or a transceiver antenna.

[0019] A coplanar waveguide transition structure provided by the present utility model includes a top connector and a circuit board structure; the circuit board structure includes a first conductive layer, a first dielectric layer, a second conductive layer, a second dielectric layer, and a third conductive layer that are stacked in sequence from the side facing the top connector to the side facing away from the top connector; the top connector is fixedly connected to the circuit board structure and is disposed on the surface of the first conductive layer, and the top connector includes a base and a probe; the base is provided with an interface corresponding to the morphology of the RF connector, and the probe extends from the interface to the first conductive layer; the first conductive layer is provided with a pad corresponding to the probe and a transmission line extending from the pad, and the pad is in contact with the probe; a reference avoidance hole is provided in the area of the second conductive layer corresponding to the pad to form a hollow structure without the conductive material of the second conductive layer below the pad; the area of the third conductive layer corresponding to the pad is a solid area to form a reference layer corresponding to the pad on the third conductive layer and a reference layer corresponding to the transmission line on the second conductive layer, so as to match the impedance of the pad.

[0020] By setting the reference layer of the transmission line on the second conductive layer and the reference layer of the pad on the third conductive layer, impedance matching is performed through the interlayer reference of the pad, thereby reducing the impedance discontinuity at the pad and ensuring that the signal does not deteriorate sharply during the transmission process from the RF connector to the circuit board, and ensuring the signal transmission quality.

[0021] The present utility model also provides a radio frequency transmission system, which also has the above beneficial effects and will not be elaborated herein. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the technical solutions of the embodiments of the present utility model or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments of the present utility model. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0023] Figure 1 It is a schematic structural diagram of the top connector in a coplanar waveguide transition structure provided by an embodiment of the present utility model;

[0024] Figure 2 It is a schematic structural diagram of the first conductive layer in a coplanar waveguide transition structure provided by an embodiment of the present utility model;

[0025] Figure 3 It is a schematic structural diagram of the first dielectric layer in a coplanar waveguide transition structure provided by an embodiment of the present utility model;

[0026] Figure 4 It is a schematic structural diagram of the second conductive layer in a coplanar waveguide transition structure provided by an embodiment of the present utility model;

[0027] Figure 5 Schematic diagram of the structure of the second dielectric layer in a coplanar waveguide transition structure provided by an embodiment of the present utility model;

[0028] Figure 6 Schematic diagram of the structure of the third conductive layer in a coplanar waveguide transition structure provided by an embodiment of the present utility model.

[0029] In the figure: 1. top connector, 10. upper base, 11. lower base, 12. routing channel, 13. probe;

[0030] 2. first conductive layer, 20. first ground layer, 21. pad, 22. impedance transformer, 23. transmission line;

[0031] 3. first dielectric layer, 30. first dielectric substrate;

[0032] 4. second conductive layer, 40. second ground layer, 42. reference avoidance hole;

[0033] 5. second dielectric layer, 50. second dielectric substrate;

[0034] 6. third conductive layer, 60. third ground layer;

[0035] 24 / 31 / 41 / 51 / 61. ground hole, 14 / 25 / 32 / 43 / 52 / 62. fixing screw hole, Specific implementation manner

[0036] The core of the present utility model is to provide a coplanar waveguide transition structure. In the prior art, since a radio frequency connector is usually a coaxial structure in TEM mode, when a signal is transmitted through the connection structure between the radio frequency connector and the PCB board, there will be impedance discontinuity at the connection surface, resulting in a sharp deterioration of the transmission performance in the millimeter wave band.

[0037] A coplanar waveguide transition structure provided by the present utility model includes a top connector and a circuit board structure. The circuit board structure includes a first conductive layer, a first dielectric layer, a second conductive layer, a second dielectric layer, and a third conductive layer stacked in sequence from the side facing the top connector to the side facing away from the top connector. The top connector is fixedly connected to the circuit board structure and disposed on the surface of the first conductive layer. The top connector includes a base and a probe. The base is provided with an interface corresponding to the morphology of the RF connector, and the probe extends from the interface to the first conductive layer. The first conductive layer is provided with a pad corresponding to the probe and a transmission line extending from the pad, and the pad is in contact with the probe. The area of the second conductive layer corresponding to the pad is provided with a reference avoidance hole to form a hollow structure without the conductive material of the second conductive layer below the pad. The area of the third conductive layer corresponding to the pad is a solid area to form a reference layer corresponding to the pad in the third conductive layer and a reference layer corresponding to the transmission line in the second conductive layer, so as to match the impedance of the pad.

[0038] By setting the reference layer of the transmission line in the second conductive layer and the reference layer of the pad in the third conductive layer, impedance matching is performed through the interlayer reference of the pad, thereby reducing the impedance discontinuity at the pad and ensuring that the signal does not deteriorate sharply during the transmission process from the RF connector to the circuit board, and ensuring the signal transmission quality.

[0039] In order to enable those skilled in the art to better understand the solution of the present utility model, the following further detailed description of the present utility model will be given in conjunction with the accompanying drawings and specific embodiments. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present utility model.

[0040] Embodiment 1

[0041] Please refer to Figures 1 to 6 , Figure 1 which is a schematic structural diagram of the top connector in a coplanar waveguide transition structure provided by an embodiment of the present utility model; Figure 2 which is a schematic structural diagram of the first conductive layer in a coplanar waveguide transition structure provided by an embodiment of the present utility model; Figure 3 which is a schematic structural diagram of the first dielectric layer in a coplanar waveguide transition structure provided by an embodiment of the present utility model; Figure 4 which is a schematic structural diagram of the second conductive layer in a coplanar waveguide transition structure provided by an embodiment of the present utility model; Figure 5 which is a schematic structural diagram of the second dielectric layer in a coplanar waveguide transition structure provided by an embodiment of the present utility model; Figure 6 which is a schematic structural diagram of the third conductive layer in a coplanar waveguide transition structure provided by an embodiment of the present utility model.

[0042] See Figures 1 to 6 In the embodiment of the present utility model, the coplanar waveguide transition structure includes a top connector 1 and a circuit board structure. The circuit board structure includes a first conductive layer 2, a first dielectric layer 3, a second conductive layer 4, a second dielectric layer 5, and a third conductive layer 6 that are stacked in sequence from the side facing the top connector 1 to the side facing away from the top connector 1. The top connector 1 is fixedly connected to the circuit board structure and disposed on the surface of the first conductive layer 2. The top connector 1 includes a base and a probe. The base is provided with an interface corresponding to the morphology of the RF connector, and the probe extends from the interface to the first conductive layer 2. The first conductive layer 2 is provided with a pad 21 corresponding to the probe, and a transmission line 23 extending from the pad 21. The pad 21 is in contact with the probe. The area of the second conductive layer 4 corresponding to the pad 21 is provided with a reference avoidance hole 42 to form a hollow structure without the conductive material of the second conductive layer 4 below the pad 21. The area of the third conductive layer 6 corresponding to the pad 21 is a solid area to form a reference layer corresponding to the pad 21 in the third conductive layer 6 and a reference layer corresponding to the transmission line 23 in the second conductive layer 4, so that the impedance of the pad 21 is matched.

[0043] See Figure 1 The above-mentioned top connector 1 is a structure connected to the RF connector in the transition structure. This top connector 1 usually needs to be located on one side surface of the circuit board structure. In this embodiment, the top connector 1 includes a base and a probe 13. The base is the main structure of the top connector 1, and the probe 13 is used to lead out the signal in the RF connector. Specifically, the base has an interface corresponding to the morphology of the RF connector. The RF connector can be specifically connected to the top connector 1 by plugging in this interface. In the top connector 1, the probe 13 extends from the interface to the first conductive layer 2 of the circuit board structure and contacts the pad 21 in the first conductive layer 2 to transmit the signal to the transmission line 23 provided in the first conductive layer 2.

[0044] Specifically, in this embodiment, the lower base 11 is provided with a routing channel 12 on the surface facing the circuit board. The transmission line 23 is disposed along the routing channel 12, and the probe 13 extends from the interface to the routing channel 12. This routing channel 12 usually needs to be disposed along the extension direction of the transmission line 23 and surround the transmission line 23, so that the transmission line 23 is disposed in this routing channel 12, avoiding the top connector 1 directly contacting or squeezing the transmission line 23 and thus interfering with the signal transmitted in the transmission line 23.

[0045] In this embodiment, the base includes a lower base 11 and an upper base 10. The upper base 10 is located on the surface of the lower base 11 facing away from the circuit board structure and corresponds to the morphology of the RF connector. The probe 13 extends from the inside of the upper base 10 to the routing channel 12. That is, in this embodiment, the entire base is generally divided into two parts. One is the lower base 11 of the main body bearing structure, and the other is the upper base 10 that protrudes from the lower base 11 and serves as the direct connection interface with the RF connector. The morphology and size of the upper base 10 need to correspond to the morphology and size of the RF connector. The specific content needs to be determined according to the actual situation and will not be specifically limited here.

[0046] In this embodiment, the upper base 10 and the routing channel 12 are located on two opposite sides of the lower base 11. The upper base 10 and the routing channel 12 can be arranged oppositely to ensure that the probe 13 extending from the inside of the upper base 10 to the routing channel 12 can be in a straight line without bending, so as to ensure the quality of signal transmission.

[0047] In this embodiment, the circuit board structure includes at least three conductive layers and at least a dielectric layer located between adjacent conductive layers, for a total of five layers. That is, the circuit board structure includes at least a first conductive layer 2, a first dielectric layer 3, a second conductive layer 4, a second dielectric layer 5, and a third conductive layer 6 stacked in sequence from the side facing the top connector 1 to the side facing away from the top connector 1. The material of the above-mentioned conductive layer is usually metal. Of course, in this embodiment, other conductive materials can also be used to form the conductive layer. The specific content can be set according to the actual situation and will not be specifically limited here. Correspondingly, the material of the above-mentioned dielectric layer is also not specifically limited in this embodiment and depends on the specific situation.

[0048] See Figure 2 , the above-mentioned first conductive layer 2 is the conductive layer closest to the top connector 1, which is provided with a pad 21 corresponding to the probe 13 and a transmission line 23 extending from the pad 21. The pad 21 will be in contact with the probe 13, that is, the probe 13 will extend from the upper base 10 to the pad 21 and be in contact with the pad 21. The above-mentioned probe 13 is usually an elastic probe 13 to avoid damaging the pad 21 during the connection process. A transmission line 23 will extend outward from the above-mentioned pad 21. The signal input from the RF connector will pass through the above-mentioned probe 13 and pad 21 in sequence, and finally be transmitted to the circuit board through the transmission line 23.

[0049] Generally, in this embodiment, the first conductive layer 2 further includes: a gap surrounding the pad 21 and the transmission line 23, and a first ground layer 20 is formed outside the gap. That is, in order to avoid interference of the above-mentioned pad 21 and transmission line 23 by other structures, a ground layer is formed outside the pad 21 and the transmission line 23 to shield signals. The ground layer formed in the first conductive layer 2 is the first ground layer 20. A gap is formed between the first ground layer 20 and the pad 21 and the transmission line 23. This gap surrounds the interconnected pad 21 and transmission line 23 in the first conductive layer 2, and the outside of this gap is the above-mentioned first ground layer 20.

[0050] See Figure 3 and Figure 4 , the above-mentioned first dielectric layer 3 is an insulating dielectric between the first conductive layer 2 and the second conductive layer 4. The first dielectric layer 3 has a first dielectric substrate 30. The second conductive layer 4 is provided with a reference avoidance hole 42. The reference avoidance hole 42 is equivalent to a blank area in the second conductive layer 4, and it needs to be set in the area corresponding to the pad 21 to ensure that the second conductive layer 4 can form a hollow structure without the conductive material of the second conductive layer 4 below the pad 21. In the second conductive layer 4, the reference avoidance hole 42 is only set corresponding to the pad 21, so that the second conductive layer 4 forms a reference layer corresponding to the transmission line 23 but does not form a reference layer corresponding to the pad 21. In this embodiment, the second conductive layer 4 forms a second ground layer 40 outside the reference avoidance hole 42, and the second ground layer 40 serves as the reference layer of the above-mentioned transmission line 23.

[0051] See Figure 5 and Figure 6 , the above-mentioned second dielectric layer 5 is an insulating dielectric between the second conductive layer 4 and the third conductive layer 6. The second dielectric layer 5 has a second dielectric substrate 50. The area of the third conductive layer 6 corresponding to the pad 21 is a solid area, that is, a third ground layer 60 is formed in the third conductive layer 6, and the third ground layer 60 serves as the reference layer of the pad 21. At this time, the interconnected transmission line 23 and the pad 21 are referenced by ground layers of different layers, thereby forming a separated reference structure. This separated reference structure will form a preset impedance at the pad 21 to achieve impedance matching. Since the impedance matching commonly used at present is to form an impedance of 50Ω, in this embodiment, specifically, the impedance of the pad 21 can be made close to 50Ω based on the above-mentioned separated reference structure, thereby reducing the impedance discontinuity here and improving the quality of signal transmission.

[0052] Further, in this embodiment, in the first conductive layer 2, an impedance transformer 22 is provided between the pad 21 and the transmission line 23. The function of this impedance transformer 22 is to improve the discontinuity between the TEM-mode coaxial structure of the RF connector and the quasi-TEM-mode grounded coplanar waveguide structure of the circuit board, so as to perform impedance matching between the pad 21 and the transmission line 23. This impedance transformer 22 can specifically be an inductive impedance transformer 22 or a capacitive impedance transformer 22. Preferably, in this embodiment, the impedance transformer 22 can be set as a capacitive impedance transformer 22. At this time, the width of the impedance transformer 22 is greater than the width of the transmission line 23. At this time, in this embodiment, the transmission structure in the first conductive layer 2 is the pad 21, the capacitive impedance transformer 22, and the transmission line 23 connected in sequence. And this pad 21 has the largest width, followed by the capacitive impedance transformer 22 connected thereto having a medium-width line width, and finally the transmission line 23 connected to the capacitive impedance transformer 22 has the narrowest line width. By using a capacitive impedance transformer 22 with a relatively wide width, the manufacturing difficulty of this structure can be reduced, and at the same time, the reliability of this structure can be increased.

[0053] In this embodiment, the above-mentioned reference avoidance hole 42 is generally circular. The size of this circle needs to be not less than, usually slightly larger than, the size of the pad 21, and is concentrically arranged with the pad 21, that is, the center of the circle of the pad 21 and the center of the circle of the reference avoidance hole 42 are located at the same position in the thickness direction. Of course, in this embodiment, the reference avoidance hole 42 can also be other structures, as long as it is ensured that there is no conductive material of the second conductive layer 4 under the pad 21, and the third conductive layer 6 can be used as the reference layer of the pad 21.

[0054] In this embodiment, the circuit board structure can be provided with shielding holes. The shielding holes surround the pad 21 and the transmission line 23 in the circumferential direction, and the shielding holes penetrate through the first dielectric layer 3 and the second dielectric layer 5 and are connected to the first ground layer 20, the second ground layer 40, and the third ground layer 60.

[0055] The shielding hole structure is mainly to avoid interference from other signals to the signal transmission. Therefore, the shielding hole needs to surround the pad 21 and the transmission line 23 circumferentially. And in order to play a shielding role, the shielding hole needs to penetrate through the first dielectric layer 3 and the second dielectric layer 5, and achieve electrical connection with the first ground layer 20, the second ground layer 40 and the third ground layer 60. Therefore, the shielding hole will form a ground hole 24 in the first conductive layer 2, a ground hole 31 in the first dielectric layer 3, a ground hole 41 in the second conductive layer 4, a ground hole 51 in the second dielectric layer 5, and a ground hole 61 in the third conductive layer 6. The above ground holes 24, 31, 41, 51, 61 need to be aligned with each other to form a shielding hole. The entire shielding hole will be filled with a conductive material such as metal, etc. to form a metallized ground hole. For the ground hole 24 located in the first conductive layer 2, it is usually arranged outside the gap, so that the ground hole 24 surrounds the pad 21 and the transmission line 23 circumferentially.

[0056] In this embodiment, the top connector 1 and the circuit board structure are provided with corresponding screw holes to fixedly connect the top connector 1 and the circuit board structure by bolts. That is, in this embodiment, the top connector 1 and the circuit board structure can be fixedly connected by a non-welding and bolt-fixing method. Therefore, there is a fixing screw hole 14 in the top connector 1, a fixing screw hole 25 is formed in the first conductive layer 2, a fixing screw hole 32 is formed in the first dielectric layer 3, a fixing screw hole 43 is formed in the second conductive layer 4, a fixing screw hole 52 is formed in the second dielectric layer 5, and a fixing screw hole 62 is formed in the third conductive layer 6. The above fixing screw holes 14, 25, 32, 43, 52, 62 need to be aligned with each other to form a screw hole, and based on this screw hole, the top connector 1 and the circuit board structure can be fixedly connected by bolts.

[0057] A coplanar waveguide transition structure provided by this embodiment reduces the impedance discontinuity at the pad 21 by setting a layer reference structure for the pad 21, and improves the discontinuity between the TEM-mode coaxial structure and the quasi-TEM-mode grounded coplanar waveguide structure by adding a capacitive impedance transformer 22 in the first conductive layer 2 to improve the signal transmission quality. The top connector 1 and the circuit board structure are fixed by bolts rather than welding. This connection method has better consistency and will not cause instability in the signal transmission between the two due to fluctuations in the solder volume. Connecting the top connector 1 and the circuit board structure by welding makes this coplanar waveguide transition structure have good transmission characteristics at high frequencies. In addition, this coplanar waveguide transition structure is simple and compact, and the capacitive impedance transformer 22 has low requirements for processing accuracy and is easy to implement in engineering.

[0058] Embodiment Two

[0059] The following introduces a radio frequency transmission system provided by an embodiment of the present utility model. The radio frequency transmission system described below can be correspondingly referred to the coplanar waveguide transition structure described above.

[0060] In this embodiment, the radio frequency transmission system includes a coplanar waveguide transition structure provided by any one of the above-mentioned utility model embodiments. The specific structure of the coplanar waveguide transition structure has been described in detail in the above-mentioned utility model embodiments and will not be elaborated here. For the remaining structures of the radio frequency transmission system, such as the transceiver antenna and other structures, reference can be made to the prior art and will not be elaborated here.

[0061] Since the radio frequency transmission system provided by this embodiment specifically uses the coplanar waveguide transition structure provided by the above embodiment, this radio frequency transmission system has a more stable and higher transmission quality signal. In this embodiment, the radio frequency transmission system can be a phased array antenna, and this radio frequency transmission system can also be a specific transmitting antenna, receiving antenna or transceiver antenna. That is, in this embodiment, the radio frequency transmission system includes but is not limited to phased array antennas, such as phased array antenna transmitting antennas, phased array antenna receiving antennas or phased array antenna transceiver antennas.

[0062] The various embodiments in this specification are described in a progressive manner. The key point of each embodiment is to illustrate the differences from other embodiments. The same or similar parts among the various embodiments can be referred to each other.

[0063] Finally, it should also be noted that in this article, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the term "comprising", "including" or any other variant thereof is intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements not only includes those elements, but also includes other elements not expressly listed, or further includes elements inherent to such process, method, article or device. Without further limitation, an element defined by the statement "including a..." does not exclude the existence of additional identical elements in the process, method, article or device including the said element.

[0064] The above has introduced in detail a coplanar waveguide transition structure and a radio frequency transmission system provided by the present utility model. Specific examples are used in this article to elaborate on the principle and implementation manner of the present utility model. The description of the above embodiments is only used to help understand the method and its core idea of the present utility model. It should be noted that for those of ordinary skill in the art of this technology, without departing from the principle of the present utility model, several improvements and modifications can be made to the present utility model, and these improvements and modifications also fall within the protection scope of the claims of the present utility model.

Claims

1. A coplanar waveguide transition structure, characterized in that: It comprises a top-layer connector (1) and a circuit board structure; the circuit board structure comprises a first conductive layer (2), a first dielectric layer (3), a second conductive layer (4), a second dielectric layer (5) and a third conductive layer (6) which are stacked in sequence from a side facing the top-layer connector (1) to a side facing away from the top-layer connector (1); The top-layer connector (1) is fixedly connected to the circuit board structure and is arranged on the surface of the first conductive layer (2), and the top-layer connector (1) comprises a base and a probe (13); the base is provided with an interface corresponding to the morphology of the radio frequency connector, and the probe (13) extends from the interface to the first conductive layer (2); The first conductive layer (2) is provided with a pad (21) corresponding to the probe (13), and a transmission line (23) extending from the pad (21), and the pad (21) is in contact with the probe (13); the second conductive layer (4) is provided with a reference avoidance hole (42) in a region corresponding to the pad (21) so as to form a hollow structure without conductive material of the second conductive layer (4) below the pad (21); the region of the third conductive layer (6) corresponding to the pad (21) is a solid region so as to form a reference layer corresponding to the pad (21) on the third conductive layer (6), and to form a reference layer corresponding to the transmission line (23) on the second conductive layer (4), so as to achieve impedance matching of the pad (21).

2. The coplanar waveguide transition structure according to claim 1, characterized in that: A wiring channel (12) is provided on a surface of the base facing the circuit board, the transmission line (23) is arranged along the wiring channel (12), and the probe (13) extends from the interface to the wiring channel (12).

3. The coplanar waveguide transition structure according to claim 2, characterized in that: The base comprises a lower base (11) and an upper base (10); the upper base (10) is located on a surface of the lower base (11) facing away from the circuit board structure and corresponds to the morphology of the radio frequency connector; the probe (13) extends from the inside of the upper base (10) to the wiring channel (12).

4. The coplanar waveguide transition structure according to claim 1, characterized in that: In the first conductive layer (2), an impedance transformer (22) is provided between the pad (21) and the transmission line (23).

5. The coplanar waveguide transition structure according to claim 4, characterized in that: The impedance converter (22) is a capacitive impedance converter, and the width of the impedance converter (22) is greater than the width of the transmission line (23).

6. The coplanar waveguide transition structure according to claim 1, characterized in that: The reference avoidance hole (42) is circular.

7. The coplanar waveguide transition structure according to claim 1, characterized in that: The first conductive layer (2) further comprises: A gap surrounds the pad (21) and the transmission line (23), and a first ground layer (20) is formed outside the gap.

8. The coplanar waveguide transition structure according to claim 7, characterized in that: The second conductive layer (4) is located outside the reference avoidance hole (42) to form a second stratum (40), the third conductive layer (6) forms a third stratum (60), the circuit board structure is provided with a shielding hole, the shielding hole circumferentially surrounds the pad (21) and the transmission line (23), the shielding hole passes through the first dielectric layer (3) and the second dielectric layer (5), and is connected to the first stratum (20), the second stratum (40) and the third stratum (60).

9. The coplanar waveguide transition structure according to claim 1, characterized in that: The top-layer connector (1) and the circuit board structure are provided with corresponding screw holes so as to fix the top-layer connector (1) and the circuit board structure with bolts.

10. A radio frequency transmission system, characterized in that: The invention comprises a coplanar waveguide transition structure as claimed in any one of claims 1 to 9.

11. The radio frequency transmission system according to claim 10, characterized in that: The radio frequency transmission system is a phased array antenna.

12. The radio frequency transmission system according to claim 10 or 11, characterized in that: The radio frequency transmission system is a transmitting antenna, a receiving antenna or a transceiver antenna.

Images