Electronic device and power system

Abstract

The utility model provides an electronic device and an electric power system, and relates to the field of electrical technology. In the electronic equipment, a first shell and a second shell are encircled to form a mounting cavity, at least one of the first shell and the second shell is a setting shell, and the setting shell is provided with a via hole; the setting structure comprises a first structure body and a second structure body which are connected, the cross sectional area of the setting structure on the second structure body is smaller than or equal to the cross sectional area of the via hole, and the cross sectional area of the connecting end face, connected with the second structure body, of the first structure body is larger than the cross sectional area of the via hole; the second structural body penetrates through the via hole from inside to outside, the end, away from the first structural body, of the second structural body is exposed, and the first structural body is attached to the set shell in the circumferential direction of the inner side of the via hole; wherein the setting structure comprises at least one of a heat production structure and a heat dissipation structure. According to the utility model, the requirements of heat dissipation performance and safety performance of the electronic equipment can be considered, and the electromagnetic leakage possibility can be reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of electricity, and in particular, to an electronic device and a power system. Background Art

[0002] Currently, in some electronic devices such as inverters, in order to obtain good heat dissipation performance, some structures are usually arranged outside the housing structure. For example, an inductance component with a large heat generation amount or a heat dissipation component for heat dissipation is arranged outside the housing structure, which is beneficial to ensuring the heat dissipation performance of the entire device.

[0003] However, in this case, these external structures need to be attached to the outer surface of the housing structure, which will cause a gap (the size of this gap is usually the wall thickness of the housing structure) between these external structures and the components inside the housing structure, and may affect the use performance of the device. For example, the pins of the inductance component usually need to pass through the through holes provided on the housing structure and be connected to the circuit board inside the housing structure. The conductive distance between the inductance component and the circuit board is relatively long, and the relatively long conductive distance may increase the resistance and the heat generation amount, thereby affecting the use performance of the device. Moreover, the heat conduction distance between the heat dissipation component and the component to be dissipated heat inside the housing structure, such as the power device on the circuit board, is relatively long, thus affecting the heat dissipation effect of the component to be dissipated heat, and further affecting the use performance of the device. Summary of the Utility Model

[0004] The utility model aims to solve to a certain extent the problem in the related art of how to improve the use performance of an electronic device.

[0005] To solve at least one aspect of the above problems to at least a certain extent, in a first aspect, the utility model provides an electronic device, including a first housing, a second housing and a set structure; an installation cavity is formed by enclosing the first housing and the second housing, at least one of the first housing and the second housing is a set housing, and the set housing is provided with a through hole; the set structure includes a first structure body and a second structure body connected to each other, the cross-sectional area of the second structure body of the set structure is less than or equal to the cross-sectional area of the through hole, and the cross-sectional area of the connection end surface of the first structure body connected to the second structure body is greater than the cross-sectional area of the through hole; the second structure body penetrates through the through hole from the inside to the outside, and one end of the second structure body far from the first structure body is exposed, and the first structure body is in circumferential contact with the set housing inside the through hole; wherein, the set structure includes at least one of a heat generation structure and a heat dissipation structure.

[0006] Optionally, the electronic device further includes a circuit board unit; when the setting structure includes the heat generating structure, the heat generating structure is electrically connected to the circuit board unit; when the setting structure includes the heat dissipating structure, the heat dissipating structure is thermally connected to the circuit board unit.

[0007] Optionally, the number of the setting structures is multiple, and at least one of the setting housings is provided with a plurality of the through holes.

[0008] Optionally, the number of the setting structures is multiple; wherein, at least one of the multiple setting structures includes the heat generating structure, and / or at least another one of the multiple setting structures includes the heat dissipating structure.

[0009] Optionally, the circuit board unit includes an integral circuit board, and at least two of the setting structures are correspondingly arranged on the integral circuit board;

[0010] Alternatively, the circuit board unit includes a plurality of sub-circuit boards, and at least two of the sub-circuit boards are respectively correspondingly provided with the setting structures.

[0011] Optionally, power devices are arranged in at least one area of the circuit board unit, and the heat dissipating structure is correspondingly arranged in the area where the power devices are located on the circuit board unit.

[0012] Optionally, power devices are correspondingly arranged in a plurality of the areas on the circuit board unit; the greater the total power of the power devices corresponding to the area, the greater the heat dissipation power of the corresponding heat dissipating structure.

[0013] Optionally, when the circuit board unit includes the integral circuit board, the integral circuit board is fixedly connected to the corresponding setting structure;

[0014] When the circuit board unit includes a plurality of the sub-circuit boards, the sub-circuit boards are fixedly connected to the corresponding setting structures.

[0015] Optionally, the first structural body is connected to the setting housing through a first connecting member, and the first connecting member passes through the first structural body in the hole depth direction of the through hole and is connected to the setting housing; a through hole structure or a blind hole structure for connecting with the first connecting member is provided on the setting housing.

[0016] Optionally, at least part of the installation cavity is formed by the setting housing and the setting housing has an opening, and the through hole is located in the part of the setting housing opposite to the opening;

[0017] And / or, a sealing structure is provided between the set housing and the first structure body. The sealing structure at least includes the sealing ring among the sealing ring, the first sealing groove and the second sealing groove. The first sealing groove is provided on the set housing for accommodating the sealing ring. The second sealing groove is provided on the connecting end surface of the first structure body connected to the second structure body, and the second sealing groove is used for accommodating the sealing ring;

[0018] And / or, the electronic device is an inverter.

[0019] In a second aspect, the present invention provides a power system including the electronic device as described in the first aspect above.

[0020] Compared with the related prior art, in the electronic device and the power system of the present invention, the cross-sectional area of the set structure on the second structure body is set to be less than or equal to the cross-sectional area of the through hole, and the cross-sectional area of the connecting end surface of the first structure body connected to the second structure body is set to be greater than the cross-sectional area of the through hole. When the second structure body of the set structure penetrates through the through hole from the inside to the outside, and the circumferential direction of the first structure body on the inner side of the through hole is in contact with the set housing, that is, when the set structure is connected and fixed to the set housing, the joint surface where the two are in contact will surround the through hole for one week. At this time, on the one hand, the second structure body of the set structure will be exposed to the external environment and can exchange heat with the external environment to meet the cooling requirements of the set structure; on the other hand, the set structure and the components inside the installation cavity can obtain a shorter distance. Specifically, the heat-generating structure, such as the inductor component and the circuit board unit, can obtain a shorter conductive distance, which can reduce the resistance and heat generation. The heat-dissipating structure, such as the radiator component and the circuit board unit, can obtain a shorter heat-conducting distance. Therefore, the set structure can obtain a shorter conductive and / or heat-conducting distance, which is beneficial to improving the working performance of the set structure and the use performance of the electronic device; on the other hand, the reliability of the set structure installed on the set housing is high, and the risk of the set structure falling off the set housing can be avoided; in addition, compared with the set structure installed on the outer side wall of the set housing, it makes the leakage path of electromagnetic leakage of the components inside the installation cavity more complex and increases the difficulty of electromagnetic leakage, so that the possibility of electromagnetic leakage can be reduced to a certain extent. Generally speaking, the present invention can take into account the requirements of the heat dissipation use performance and safety performance of the electronic device, and is beneficial to making the leakage path of electromagnetic leakage of the components inside the installation cavity more complex (when electromagnetic signals leak, they must be reflected and turned multiple times), and reducing the possibility of electromagnetic leakage. Description of the Drawings

[0021] Figure 1 It is a schematic structural diagram of the set structure installed on the first housing in the first embodiment of the present invention;

[0022] Figure 2Schematic diagram of the structure of the first housing with four through holes in the second embodiment of the present utility model;

[0023] Figure 3 Schematic diagram of the structure in which four set structures are respectively arranged in four through holes in the second embodiment of the present utility model;

[0024] Figure 4 Schematic diagram of the structure of the first radiator assembly in the embodiment of the present utility model;

[0025] Figure 5 Schematic diagram of the structure of the heat - generating structure in the embodiment of the present utility model;

[0026] Figure 6 Schematic diagram of the structure in which the set structure is installed on the second housing in the third embodiment of the present utility model;

[0027] Figure 7 Schematic diagram of the structure in which the first housing and the second housing are respectively installed with the set structure in the fourth embodiment of the present utility model.

[0028] Explanation of reference numerals:

[0029] 11 - First housing; 111 - Bottom plate; 12 - Second housing; 13 - Installation cavity; 14 - Through hole; 141 - First through hole; 142 - Second through hole; 143 - Third through hole; 144 - Fourth through hole; 15 - Open port; 2 - Set structure; 21 - Heat - generating structure; 211 - First inductance component; 22 - Heat - dissipating structure; 221 - First radiator assembly; 222 - Second radiator assembly; 223 - Third radiator assembly; 201 - First structural body; 202 - Second structural body; 3 - Circuit board unit; 31 - First sub - circuit board; 32 - Second sub - circuit board; 33 - Third sub - circuit board; 34 - Fourth sub - circuit board; 4 - First connecting piece; 5 - Sealing ring; 6 - Blind hole structure. Detailed implementation manners

[0030] To make the above - mentioned objects, features and advantages of the present utility model more obvious and understandable, the following detailed description of the specific embodiments of the present utility model will be given with reference to the accompanying drawings.

[0031] In the description of the present utility model, it should be noted that unless otherwise clearly specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a direct connection or an indirect connection through an intermediate medium. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific situations.

[0032] In the description of this specification, the descriptions referring to terms such as "embodiment", "one embodiment", "some embodiments", "exemplarily", and "one embodiment" mean that the specific features, structures, materials, or characteristics described in connection with the embodiment or embodiments are included in at least one embodiment or embodiment of the present utility model. In this specification, the schematic expressions of the above terms do not necessarily refer to the same embodiment or embodiment. Moreover, the specific features, structures, materials, or characteristics described can be combined in a suitable manner in any one or more embodiments or embodiments.

[0033] The terms "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include at least one of such features.

[0034] In the drawings, the Z-axis represents the vertical direction, that is, the up and down position, and the positive direction of the Z-axis (that is, the direction pointed by the arrow of the Z-axis) represents up, and the negative direction of the Z-axis represents down; in the drawings, the Y-axis represents the front and back position, and the positive direction of the Y-axis (that is, the direction pointed by the arrow of the Y-axis) represents the front side, and the negative direction of the Y-axis represents the back side; in the drawings, the X-axis represents the horizontal direction and is specified as the left and right position, and the positive direction of the X-axis (that is, the direction pointed by the arrow of the X-axis) represents the right side, and the negative direction of the X-axis represents the left side; at the same time, it should be noted that the above meanings represented by the Z-axis, Y-axis, and X-axis are only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the indicated device or element must have a specific orientation, be constructed and operated in a specific orientation, and thus cannot be understood as a limitation to the present utility model.

[0035] In some electronic devices such as inverters, in order to obtain good heat dissipation performance, usually some structures are arranged outside its housing structure. For example, the inductance components with large heat generation or the heat dissipation components for heat dissipation are arranged outside the housing structure, which is beneficial to ensuring the heat dissipation performance of the entire device.

[0036] However, in this case, these external structures need to fit the outer surface of the housing structure, which will result in a gap between these external structures and the devices inside the housing structure (the size of this gap is usually the wall thickness of the housing structure), and may affect the performance of the device. For example, the pins of the inductor component usually need to pass through the through holes provided on the housing structure and be connected to the circuit board inside the housing structure. The conductive distance between the inductor component and the circuit board is relatively long, and the long conductive distance may increase the resistance and heat generation, thereby affecting the performance of the device. The heat conduction distance between the heat dissipation component and the component to be dissipated heat inside the housing structure, such as the power device on the circuit board, is relatively long, thus affecting the heat dissipation effect of the component to be dissipated heat, and further affecting the performance of the device. In addition, after long-term use, these external structures also have the risk of falling off, posing a certain safety hazard.

[0037] In a first aspect, the present utility model provides an electronic device, including a first housing 11, a second housing 12 and a setting structure 2;

[0038] The first housing 11 and the second housing 12 enclose to form an installation cavity 13. At least one of the first housing 11 and the second housing 12 is a setting housing, and the setting housing is provided with a through hole 14; the setting structure 2 includes a first structure body 201 and a second structure body 202 connected to each other. The cross-sectional area of the second structure body 202 of the setting structure 2 is less than or equal to the cross-sectional area of the through hole 14, and the cross-sectional area of the connection end surface of the first structure body 201 connected to the second structure body 202 is greater than the cross-sectional area of the through hole 14; the second structure body 202 penetrates through the through hole 14 from the inside to the outside, and one end of the second structure body 202 far from the first structure body 201 is exposed, and the first structure body 201 is circumferentially attached to the setting housing inside the through hole 14; wherein, the setting structure 2 includes at least one of a heat generating structure 21 (refer to Figure 5 ) and a heat dissipation structure 22 (refer to Figure 4 the first radiator assembly 221 shown).

[0039] As Figure 1 shown, it shows the case where the first housing 11 is the setting housing, that is, the first housing 11 is provided with a through hole 14 and the first housing 11 is installed with the setting structure 2. The present utility model will be described hereinafter taking this case as an example.

[0040] As Figure 6 shown, it shows the case where the second housing 12 is the setting housing, that is, the second housing 12 is provided with a through hole 14 and the second housing 12 is installed with the setting structure 2.

[0041] As Figure 7As shown, it shows that the first housing 11 and the second housing 12 are set housings, that is, the first housing 11 and the second housing 12 are respectively provided with through holes 14, and the first housing 11 and the second housing 12 are respectively installed with a set structure 2.

[0042] The specific structures of the first structural body 201 and the second structural body 202 are not limited. The two mainly have differences in terms of cross-sectional area. The specific structures of the first structural body 201 and the second structural body 202 may be different according to the type of the set structure 2, and will not be elaborated here in detail.

[0043] The first structural body 201 and the second structural body 202 of the set structure 2 are distributed in the hole depth direction corresponding to the through hole 14. In this embodiment, the first housing 11 is defined as the lower housing, and the through hole 14 is provided on the bottom plate 111 of the lower housing. Thus, the first structural body 201 is located above the second structural body 202, the lower end of the first structural body 201 is connected to the upper end of the second structural body 202, and the lower end of the second structural body 202 is exposed to the external environment, so that the second structural body 202 can exchange heat with the external environment.

[0044] Specifically, in a plane parallel to the bottom plate 111, the outer contour shape of the first structural body 201, the outer contour shape of the second structural body 202, and the contour shape of the through hole 14 are the same. For example, they are all rectangular. The area of the end face of the first structural body 201 close to the second structural body 202 corresponding to the rectangle is larger than the area of the rectangle corresponding to the through hole 14, and the area of the rectangle corresponding to the second structural body 202 is less than or equal to the area of the rectangle corresponding to the through hole 14. When the end face of the first structural body 201 close to the second structural body 202 is attached to the bottom plate 111 of the first housing 11, the attached area formed by the two will be arranged around the through hole 14 for one week.

[0045] This specification takes an electronic device as an inverter as an example to illustrate the content of the present invention. At this time, the heat generating structure 21 can be an inductor component or the like, which can generate heat during operation. The temperature of the exposed part of the second structural body 202 of the set structure 2 will be higher than the temperature of the external environment. This exposed part can exchange heat with the external environment, avoiding the temperature of the heat generating structure 21 being too high and affecting its use performance, and thus ensuring the use performance of the electronic device. The heat dissipation structure 22 can be a radiator component or the like, which can transfer the heat generated by power devices and the like in the installation cavity 13 to the exposed part of the heat dissipation structure 22 and exchange heat with the external environment, thereby reducing the working stability of the power devices and the like in the installation cavity 13, ensuring the working performance of the power devices, and thus ensuring the use performance of the electronic device. However, it should be understood that without violating the design concept of the present invention, the electronic device can be used in other occasions. For example, the electronic device can be a device with a heat generating structure 21 or a device with a heat dissipation requirement, such as a power electronic device, and will not be elaborated in detail later.

[0046] The specific structures of the first housing 11 and the second housing 12 are not limited as long as they can enclose to form an installation cavity 13. Generally, the main part of the electronic device is installed in the installation cavity 13. For example, the circuit board unit 3 of the inverter is installed, and power devices are arranged on the circuit board unit 3. The first housing 11 or the second housing 12 can be a split structure or an integral structure, which will not be elaborated here.

[0047] In this way, the cross-sectional area of the setting structure 2 on the second structural body 202 is set to be less than or equal to the cross-sectional area of the through hole 14, and the cross-sectional area of the connection end surface of the first structural body 201 connected to the second structural body 202 is set to be greater than the cross-sectional area of the through hole 14. When the second structural body 202 of the setting structure 2 penetrates through the through hole 14 from the inside to the outside, and the first structural body 201 is in circumferential contact with the setting housing inside the through hole 14, that is, when the setting structure 2 is connected and fixed to the setting housing, the joint surface where the two are in contact will surround the through hole 14 for one week. At this time, on the one hand, the second structural body 202 of the setting structure 2 will be exposed to the external environment and can exchange heat with the external environment to meet the cooling requirements of the setting structure 2; on the other hand, the setting structure 2 and the components inside the installation cavity 13 can obtain a shorter distance. Specifically, a shorter conductive distance can be obtained between the heat-generating structure 21, such as an inductor component, and the circuit board unit 3, which can reduce the resistance and heat generation. A shorter heat conduction distance can be obtained between the heat dissipation structure 22, such as a radiator component, and the circuit board unit 3. Thus, the setting structure 2 can obtain a shorter conductive and / or heat conduction distance, which is beneficial to improving the working performance of the setting structure 2 and the use performance of the electronic device; on the other hand, the reliability of the setting structure 2 installed on the setting housing is high, and the risk of the setting structure 2 falling off the setting housing can be avoided; in addition, compared with the setting structure 2 being installed on the outer side wall of the setting housing, the leakage path of electromagnetic leakage of the components inside the installation cavity 13 is complicated, increasing the difficulty of electromagnetic leakage, and thus the possibility of electromagnetic leakage can be reduced to a certain extent. Generally speaking, the utility model can take into account the requirements of the heat dissipation use performance and safety performance of the electronic device, and is beneficial to complicating the leakage path of electromagnetic leakage of the components inside the installation cavity 13 (when electromagnetic signals leak, they must be reflected and turned several times), reducing the possibility of electromagnetic leakage.

[0048] As Figure 1 shown, optionally, the electronic device further includes a circuit board unit 3; when the setting structure 2 includes a heat-generating structure 21, the heat-generating structure 21 is electrically connected to the circuit board unit 3; when the setting structure 2 includes a heat dissipation structure 22, the heat dissipation structure 22 is thermally connected to the circuit board unit 3.

[0049] When the heat generating structure 21, such as an inductance component, is electrically connected to the circuit board unit 3, it usually abuts against the circuit board of the circuit board unit 3 at one end of the first structure 201 away from the second structure 202, and is electrically connected to the circuit board through pins. When the heat dissipation structure 22, such as a radiator component, is thermally connected to the circuit board unit 3, it usually abuts against the circuit board unit 3 at one end of the first structure 201 away from the second structure 202, for example, abuts against the circuit board or a power device on the circuit board, and the first structure 201 is fixedly connected to the circuit board. Of course, in other embodiments, thermal connection can be achieved by means of a thermal conduction structure, which can adopt related technologies and will not be elaborated here.

[0050] It should be understood that the setting structure 2 can be set to be one or more.

[0051] When the number of the setting structures 2 is one, the setting structure 2 includes at least one of the heat generating structure 21 and the heat dissipation structure 22.

[0052] At this time, exemplarily, the part of the heat generating structure 21 corresponding to the first structure 201 and the part of the heat dissipation structure 22 corresponding to the first structure 201 can be plate structures and are connected together to form a base. One end of the main body part of the heat generating structure 21, such as an inductance component, is embedded in the plate structure and is connected to the circuit board unit 3 through a lead. One end of the main body part of the heat dissipation structure 22, such as a radiator component, is embedded in the plate structure and is connected to the circuit board unit 3 through a thermal conduction structure or is directly attached to the circuit board unit 3 to achieve heat conduction.

[0053] As Figure 2 and Figure 3 shown, optionally, when the number of the setting structures 2 is multiple, at least one of the setting housings is provided with a plurality of through holes 14.

[0054] Exemplarily, the first housing 11 is provided with a plurality of through holes 14, and each through hole 14 is respectively used for the penetration of the corresponding setting structure 2.

[0055] That is, a plurality of setting structures 2 are respectively installed on the first housing 11, and the second structure 202 is externally exposed through the corresponding through holes 14, so as to facilitate the heat dissipation of the setting structure 2.

[0056] Optionally, the number of the setting structures 2 is multiple; among them, at least one of the multiple setting structures 2 includes the heat generating structure 21, and / or, at least another one of the multiple setting structures 2 includes the heat dissipation structure 22.

[0057] Exemplarily, all the setting structures 2 are heat generating structures 21.

[0058] Exemplarily, all the setting structures 2 are heat dissipation structures 22.

[0059] Exemplarily, part of all the setting structures 2 is a heat - generating structure 21, and the remaining part is a heat - dissipating structure 22.

[0060] In this embodiment, when the number of the setting structures 2 is multiple, the heat - generating structure 21 and the heat - dissipating structure 22 are usually located in different setting structures 2 to avoid interference between the two.

[0061] In the above - mentioned embodiment, optionally, the circuit - board unit 3 includes an integral circuit board, and one or more setting structures 2 are correspondingly arranged on the integral circuit board.

[0062] Exemplarily, the integral circuit board is correspondingly provided with the setting structures 2 in multiple regions, so as to meet the layout requirements of the setting structures 2. At this time, it is convenient for the rapid installation of the circuit - board unit 3.

[0063] As Figure 3 shown, different from the solution that the circuit - board unit 3 includes an integral circuit board, optionally, the circuit - board unit 3 includes multiple sub - circuit boards, and at least two sub - circuit boards are respectively correspondingly provided with the setting structures 2.

[0064] Specifically, corresponding electrical components can be arranged on the sub - circuit boards as needed, which is not limited. The sub - circuit boards can be connected by cables such as quick - plug cables to form the entire circuit - board unit 3.

[0065] In this way, avoiding the use of an integral circuit board, the corresponding circuit layout requirements can be met by multiple sub - circuit boards, which is convenient for the miniaturization and modular design of the circuit board.

[0066] Optionally, the circuit - board unit 3 is provided with power devices in at least one region, and the circuit - board unit 3 is correspondingly provided with a heat - dissipating structure 22 in the region where the power devices are located.

[0067] Specifically, when the circuit - board unit 3 includes an integral circuit board, one or more regions of the integral circuit board are provided with power devices, and the region corresponding to the power devices is correspondingly provided with the setting structure 2, and the setting structure 2 is a heat - dissipating structure 22.

[0068] When the circuit - board unit 3 includes multiple sub - circuit boards, one or more sub - circuit boards are provided with power devices, and the sub - circuit boards provided with power devices are all correspondingly provided with heat - dissipating structures 22.

[0069] In this way, the power devices in the circuit - board unit 3 can be cooled by the heat - dissipating structure 22 to ensure the working performance of the power devices, and thus ensure the use performance of the electronic device.

[0070] Furthermore, the circuit - board unit 3 is correspondingly provided with power devices in multiple regions; the greater the total power of the power devices, the greater the heat - dissipation power of the corresponding heat - dissipating structure 22.

[0071] As Figures 2 to 5 shown, taking the circuit board of the circuit board unit 3 including a plurality of sub-circuit boards as an example, the number of sub-circuit boards is four, namely the first sub-circuit board 31, the second sub-circuit board 32, the third sub-circuit board 33 and the fourth sub-circuit board 34. The first sub-circuit board 31, the second sub-circuit board 32 and the third sub-circuit board 33 are respectively provided with power devices such as IGBTs. The first radiator assembly 221, the second radiator assembly 222, the third radiator assembly 223 and the first inductor assembly 211 are respectively arranged corresponding to the first sub-circuit board 31, the second sub-circuit board 32, the third sub-circuit board 33 and the fourth sub-circuit board 34. The first radiator assembly 221, the second radiator assembly 222, the third radiator assembly 223 and the first inductor assembly 211 respectively pass through the first via hole 141, the second via hole 142, the third via hole 143 and the fourth via hole 144. The total power of the power devices on the first sub-circuit board 31 is greater than the total power of the power devices on the second sub-circuit board 32, and the total power of the power devices on the second sub-circuit board 32 is the same as the total power of the power devices on the third sub-circuit board 33. The heat dissipation power of the first radiator assembly 221 is greater than the heat dissipation power of the second radiator assembly 222, and the heat dissipation power of the second radiator assembly 222 is equal to the heat dissipation power of the third radiator assembly 223.

[0072] In this way, through the differential setting of the heat dissipation power of the heat dissipation structure 22, it is beneficial to reduce the difference in the working efficiency of the power devices in each area, such as on each sub-circuit board, ensure the utilization rate of the heat dissipation power of each heat dissipation structure 22, and keep each power device working normally.

[0073] In the above embodiment, optionally, when the circuit board unit 3 includes an integral circuit board, the integral circuit board is fixedly connected to the corresponding set structure 2;

[0074] When the circuit board unit 3 includes a plurality of sub-circuit boards, the sub-circuit boards are fixedly connected to the corresponding set structure 2.

[0075] Specifically, taking the circuit board unit 3 including a plurality of sub-circuit boards and the heat dissipation structure 22 being fixedly connected to the circuit board where the power device is located as an example for illustration.

[0076] Exemplarily, referring to Figure 4 , the power device is located on the lower side of the first sub-circuit board 31. The first radiator assembly 221 is attached to the power device and fixedly connected to the first sub-circuit board 31. Specifically, the upper end of the first radiator assembly 221 is attached to the power device and fixedly connected to the first sub-circuit board 31 where the power device is located through a connection structure.

[0077] Exemplarily, the power device is located on the upper side of the first sub-circuit board 31. The first heat sink assembly 221 is attached to and fixedly connected to the first sub-circuit board 31 where the power device is located. Specifically, the side of the first sub-circuit board 31 facing away from the power device is attached to the upper end surface of the first heat sink assembly 221, and the two are connected through a connection structure.

[0078] In this way, the circuit board and the components thereon can be connected to the setting structure 2 to fix their relative positions, ensuring the connection reliability between the two.

[0079] It should be understood that in some cases, after assembling the setting structure 2, the sub-circuit board, and the components on the sub-circuit board outside the housing structure, they can be integrally installed on the first housing 11. Or, after installing the setting structure 2 on the first housing 11, the sub-circuit board can be installed later. Details are not described here.

[0080] In the above embodiment, optionally, the first structural body 201 is snap-connected to the setting housing.

[0081] Taking the first housing 11 as the setting housing as an example, the first housing 11 is provided with a first snap-connection portion on the bottom plate 111, and the first structural body 201 is provided with a second snap-connection portion. When the lower surface of the first structural body 201 is attached to the upper surface of the bottom plate 111, the first snap-connection portion and the second snap-connection portion are snap-connected. The first snap-connection portion can be set as a tongue, and the columnar part of the tongue extends in the up-down direction. The second snap-connection portion is formed at the edge of the upper surface of the first structural body 201, or the second snap-connection portion is a snap hole formed on the first structural body 201. This solution is not shown in the figure.

[0082] As Figure 1 shown, in the above embodiment, optionally, the first structural body 201 is connected to the setting housing through the first connecting member 4.

[0083] Specifically, taking the first housing 11 as the setting housing as an example, the first connecting member 4 passes through one of the first structural body 201 and the bottom plate 111 of the first housing 11 and is connected to the other.

[0084] Further, the first connecting member 4 passes through the first structural body 201 in the hole depth direction of the through hole 14 and is connected to the setting housing; the setting housing is provided with a through hole structure or a blind hole structure 6 for connecting with the first connecting member 4.

[0085] Taking the first housing 11 as the setting housing as an example, the first connecting member 4 passes through the first structural body 201 in the hole depth direction of the through hole 14 and is connected to the first housing 11. The first connecting member 4 can be a threaded connecting member or a snap-connecting member. The first housing 11 is provided with a through hole structure or a blind hole structure 6 for connecting with the first connecting member 4 (refer to Figure 2) At this time, when performing the installation operation of the setting structure 2, the connection operation between the setting structure 2 and the first housing 11 can be carried out above, without the need to operate on the inner and outer sides of the bottom plate 111 respectively, which is convenient for quickly installing the setting structure 2.

[0086] In the above embodiment, optionally, the setting housing forms at least part of the installation cavity 13 and the setting housing has an opening 15, and the through hole 14 is located in the part of the setting housing opposite to the opening 15.

[0087] Taking the first housing 11 as the setting housing as an example, the first housing 11 forms at least part of the installation cavity 13 and has an opening 15, the through hole 14 is located in the part of the first housing 11 opposite to the opening 15, and the second housing 12 is arranged at the opening 15 and encloses the installation cavity 13 with the first housing 11.

[0088] Specifically, the opening 15 is used for inserting or removing the setting structure 2 and the circuit board unit 3. After the installation of the setting structure 2 and the circuit board unit 3 is realized, the installation of the second housing 12 is carried out, and the assembly of the entire electronic device can be realized.

[0089] For example, the opening 15 of the first housing 11 can be directed upward, and the setting structure 2, the circuit board unit 3 and the second housing 12 are installed in sequence from bottom to top. In this way, there is no need to perform installation operations on both sides of the first housing 11, and the installation operation can be completed only on the upper side. At this time, each connecting member such as the first connecting member 4 performs the connecting operation on the upper side, which will not be elaborated here.

[0090] Such as Figure 1 、 Figure 4 and Figure 5 As shown, in the above embodiment, optionally, a sealing structure is provided between the setting housing and the first structural body 201. The sealing structure at least includes the sealing ring 5 among the sealing ring 5, the first sealing groove and the second sealing groove. The first sealing groove is arranged on the setting housing for accommodating the sealing ring 5, and the second sealing groove is arranged on the connecting end surface of the first structural body 201 connected to the second structural body 202, and the second sealing groove is used for accommodating the sealing ring 5.

[0091] Taking the first housing 11 as the setting housing as an example, the first sealing groove is arranged on the first housing 11 for accommodating the sealing ring 5, and the second sealing groove is arranged on the end surface of the first structural body 201 facing the second structural body 202, and the second sealing groove is used for accommodating the sealing ring 5. Both the first sealing groove and the second sealing groove are used for positioning and partially accommodating the sealing ring 5.

[0092] In this way, the sealing performance at the connection between the first structure 201 and the specified housing can be ensured, and the possibility of electromagnetic leakage can be further reduced. Even without using a conductive sealant, good electromagnetic leakage prevention performance can be achieved.

[0093] Another embodiment of the present invention provides a power system, which includes the electronic device of the above embodiment.

[0094] For example, if the power system is a photovoltaic system, this power system has all the beneficial effects of this electronic device, and will not be elaborated here in detail.

[0095] Although the present invention is disclosed as above, the protection scope of the present invention is not limited thereto. Those skilled in the art can make various changes and modifications without departing from the spirit and scope of the present invention, and these changes and modifications will all fall within the protection scope of the present invention.

Claims

1. An electronic device, characterized in that: It comprises a first shell (11), a second shell (12) and a setting structure (2); The first shell (11) and the second shell (12) are combined to form an installation cavity (13); at least one of the first shell (11) and the second shell (12) is a setting shell, and the setting shell is provided with a through hole (14); the setting structure (2) comprises a first structure body (201) and a second structure body (202) connected to each other; the cross-sectional area of ​​the setting structure (2) at the second structure body (202) is less than or equal to the cross-sectional area of ​​the through hole (14); the cross-sectional area of ​​the first structure body (201) and the second structure body (202) are smaller than or equal to the cross-sectional area of ​​the through hole (14); The cross-sectional area of ​​the connecting end surface of the second structure (202) is larger than the cross-sectional area of ​​the via hole (14); the second structure (202) is inserted into the via hole (14) from the inside to the outside, and the end of the second structure (202) away from the first structure (201) is exposed, and the first structure (201) is in contact with the setting shell in the circumferential direction of the inner side of the via hole (14); wherein the setting structure (2) includes at least one of a heat generating structure (21) and a heat dissipation structure (22).

2. The electronic device according to claim 1, wherein: It also includes a circuit board unit (3); when the setting structure (2) includes the heat generating structure (21), the heat generating structure (21) is electrically connected to the circuit board unit (3); when the setting structure (2) includes the heat dissipation structure (22), the heat dissipation structure (22) is thermally connected to the circuit board unit (3).

3. The electronic device according to claim 2, characterized in that: The number of the setting structures (2) is plural, and at least one of the setting housings is provided with a plurality of the through holes (14).

4. The electronic device according to claim 2, characterized in that: The number of the setting structures (2) is multiple; wherein at least one of the multiple setting structures (2) includes the heat generating structure (21), and / or at least another one of the multiple setting structures (2) includes the heat dissipation structure (22).

5. The electronic device according to claim 2, characterized in that: The circuit board unit (3) comprises an integral circuit board, and the integral circuit board is correspondingly provided with at least two of the setting structures (2); Alternatively, the circuit board unit (3) comprises a plurality of sub-circuit boards, and at least two of the sub-circuit boards are respectively provided with the setting structure (2).

6. The electronic device according to claim 5, characterized in that: The circuit board unit (3) is provided with a power device in at least one area, and the circuit board unit (3) is provided with the heat dissipation structure (22) corresponding to the area where the power device is located.

7. The electronic device according to claim 6, characterized in that: The circuit board unit (3) is provided with the power devices corresponding to a plurality of the regions; the greater the total power of the power devices corresponding to the regions, the greater the heat dissipation power of the corresponding heat dissipation structure (22).

8. The electronic device according to claim 5, characterized in that: When the circuit board unit (3) includes the integrated circuit board, the integrated circuit board is fixedly connected to the corresponding setting structure (2); When the circuit board unit (3) includes a plurality of sub-circuit boards, the sub-circuit boards are fixedly connected to the corresponding setting structures (2).

9. The electronic device according to claim 1, wherein: The first structure (201) is connected to the setting shell via a first connecting piece (4); the first connecting piece (4) passes through the first structure (201) in the hole depth direction of the through hole (14) and is connected to the setting shell; the setting shell is provided with a through hole structure or a blind hole structure (6) for connecting to the first connecting piece (4).

10. The electronic device according to any one of claims 1 to 9, characterized in that: The setting housing is formed with at least a portion of the installation cavity (13) and the setting housing has an open opening (15), and the through hole (14) is located at a portion of the setting housing opposite to the open opening (15); And / or, a sealing structure is provided between the setting housing and the first structure (201), the sealing structure comprising at least a sealing ring (5), a first sealing groove and the sealing ring (5) in a second sealing groove, the first sealing groove being provided in the setting housing for accommodating the sealing ring (5), the second sealing groove being provided in a connection end surface of the first structure (201) connected to the second structure (202), the second sealing groove being used for accommodating the sealing ring (5); And / or, the electronic device is an inverter.

11. A power system, characterized in that: The electronic device comprises the electronic device as claimed in any one of claims 1 to 10.

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