Heat dissipation structure and internet gateway

Abstract

The utility model relates to the technical field of information communication, in particular to a heat dissipation structure and an internet gateway. The antenna comprises a shell, an end cover, a protective frame, a circuit board, an antenna, a socket module and a heat dissipation structure, the shell is of a hollow structure with one end open, and the other end of the shell is provided with an installation groove used for installing the heat dissipation structure. A through hole b communicated with the interior of the shell is formed in the bottom of the mounting groove; the end cover is detachably connected with the shell and used for sealing the opening of the shell. The circuit board is installed in the shell, and an electrical control assembly is arranged on the circuit board; the antenna and the socket module are both installed on the outer end face of the shell and electrically connected with the circuit board. When the heat dissipation structure and the shell are installed in a matched mode, the conduction part is located in the shell, and the heat insulation part tightly presses the bottom face of the installation groove. And the cold end of the semiconductor refrigeration module extends into the hollow conduction part. The Internet gateway structure provided by the utility model is good in heat dissipation effect, and can prevent external dust and impurities from entering the Internet gateway structure to influence the use performance of the Internet gateway structure.

Description

Technical Field

[0001] The utility model relates to the technical field of information communication, and particularly relates to a heat dissipation structure and an Internet gateway. Background Art

[0002] With the development of network technology and modern communication technology, the mobile Internet industry has brought new development opportunities and challenges to mobile operators. The Internet gateway is used to achieve a wide range of connections centered on people and based on devices, including the interconnection of devices within the local area network and wide area network, and at the same time support the management of devices and content centered on people. For example, an Internet gateway circuit disclosed in the authorized announcement number CN213957869U, the Internet gateway structure with the above Internet gateway circuit will inevitably generate a large amount of heat energy during operation. If the Internet gateway is not effectively cooled, its performance will be affected, and in severe cases, it will be damaged; the patent application with the authorized announcement number CN207283581U discloses an Internet of Things and Internet gateway device, which mainly uses heat sinks and fans to dissipate the heat energy generated during the operation of the gateway device; however, during the heat dissipation process using a fan, it is easy to blow dust impurities in the external environment into the gateway, and the accumulation of dust impurities in the gateway will cause short circuits of the circuit board, etc., affecting its normal use. Summary of the Utility Model

[0003] The purpose of the utility model is to solve the problems in the background art and propose a heat dissipation structure and an Internet gateway.

[0004] The technical solution of the utility model: A heat dissipation structure includes

[0005] A thermoelectric cooling module;

[0006] A heat dissipation part a; it is provided with mounting holes a; there are multiple mounting holes a;

[0007] A heat insulation part; it is provided with mounting holes b; there are multiple mounting holes b;

[0008] A conduction part; it is a hollow structure with one end open, and the open end of the conduction part is connected to the heat insulation part; a through hole a for the cold end of the thermoelectric cooling module to extend into is provided on the end surface where the heat insulation part is connected to the conduction part;

[0009] A heat dissipation part b; its end surface is attached to and connected to the heat dissipation part a;

[0010] A heat dissipation part c; there are multiple of them; the heat dissipation parts c, the through hole a and the thermoelectric cooling module correspond one by one, and the multiple heat dissipation parts c are all connected to the end of the heat dissipation part b far from the heat dissipation part a, and the other end of each heat dissipation part c is provided with a groove for accommodating the hot end of the thermoelectric cooling module.

[0011] Preferably, when the heat dissipation part c and the semiconductor refrigeration module are in an installed state, a heat insulation layer for isolating the hot end and the cold end of the semiconductor refrigeration module is provided on the end face of the heat dissipation part c.

[0012] Preferably, an elastic sealing layer is provided on the end face where the heat insulation part is connected to the conduction part.

[0013] Preferably, a hollow chamber is provided inside the heat dissipation part a; a capillary evaporation area is provided on the inner wall of the hollow chamber; a plurality of partition plates are arranged side by side in the hollow chamber, the height value of the partition plates is less than the height value of the hollow chamber, and a coolant is stored in the hollow chamber.

[0014] The present utility model also discloses an Internet gateway, which has the above-mentioned heat dissipation structure, and further includes

[0015] A housing; it is a hollow structure with one end open, and an installation groove for installing the heat dissipation structure is provided at the other end of the housing; a through hole b communicating with the inside of the housing is provided at the bottom of the installation groove; when the heat dissipation structure and the housing are assembled, the conduction part is located inside the housing, and the heat insulation part presses against the bottom surface of the installation groove;

[0016] An end cover; it is detachably connected to the housing to seal the opening of the housing;

[0017] A circuit board; it is installed inside the housing, and an electrical control component is provided on the circuit board;

[0018] A socket module; it is installed on the outer end face of the housing, and the socket module is electrically connected to the circuit board;

[0019] An antenna; it is installed on the outer end face of the housing, and the antenna is electrically connected to the circuit board.

[0020] Preferably, ventilation holes are provided in the housing at the installation groove.

[0021] Preferably, a protective frame is further included; the antenna is rotatably connected to the housing;

[0022] The projection shape of the protective frame is U-shaped, and the protective frame is connected to the outer end face of the housing; the projection of the antenna is located in the space surrounded by the protective frame and the housing.

[0023] Compared with the prior art, the above technical solutions of the present utility model have the following beneficial technical effects:

[0024] The Internet gateway structure provided by the present utility model forms a sealed structure through the housing and the end cover to prevent external impurities, dust, etc. from entering the housing and affecting the use of the internal electrical components; the heat dissipation mechanism provided can effectively dissipate heat from the inside of the sealed housing to ensure the normal and efficient operation of the Internet gateway. Description of the Drawings

[0025] Figure 1 and Figure 2These are all perspective views of an Internet gateway proposed by the present utility model.

[0026] Figure 3 This is a perspective view of a heat dissipation structure proposed by the present utility model.

[0027] Figure 4 and Figure 5 are all Figure 3 exploded views of.

[0028] Reference numerals: 1, housing; 101, mounting groove; 102, ventilation hole; 2, end cover; 3, protective frame; 4, antenna; 5, set screw a; 6, socket module; 7, heat dissipation structure; 71, heat dissipation part a; 711, mounting hole a; 72, heat insulation part; 721, mounting hole b; 73, conduction part; 74, heat dissipation part b; 75, heat dissipation part c; 751, heat insulation layer; 76, thermoelectric cooling module. Detailed implementation manners

[0029] Embodiment 1

[0030] As Figure 1-2 shown, an Internet gateway proposed by the present utility model includes a housing 1, an end cover 2, a protective frame 3, a circuit board, an antenna 4, a socket module 6, and a heat dissipation structure 7;

[0031] The housing 1 is a hollow structure with one end open, and the other end of the housing 1 is provided with a mounting groove 101 for mounting the heat dissipation structure 7; a through hole b communicating with the inside of the housing 1 is provided at the bottom of the mounting groove 101; ventilation holes 102 are provided on the housing 1 for the mounting groove 101, so that the air in the mounting groove 101 can circulate to dissipate heat from each heat dissipation part in the heat dissipation structure 7.

[0032] The end cover 2 is detachably connected to the housing 1 to seal the opening of the housing 1;

[0033] In an optional embodiment, the end cover 2 is provided with assembly holes; threaded posts are provided inside the housing 1; the threaded posts and the assembly holes correspond one by one. When the end cover 2 and the housing 1 are in a mating installation state, the set screw a 5 passes through the assembly hole and is screwed into the threaded post to form a fixing structure, so that the end cover 2 presses against the end face of the housing 1; a sealing layer is provided on the end face where the housing 1 and the end cover 2 are pressed.

[0034] The circuit board is installed inside the housing 1, and an electrical control component is provided on the circuit board; the electrical control component is an existing technology, such as the electrical components described in the publication number CN207283581U, or various electrical components that can be selected by those skilled in the art according to the existing technology to realize the functions of the gateway;

[0035] The socket module 6 is installed on the outer end face of the housing 1, and the socket module 6 is electrically connected to the circuit board; the socket module 6 is communicatively connected to the electrical control component, and various sockets such as network cable sockets and power sockets are integrated on the socket module 6.

[0036] The antenna 4 is installed on the outer end face of the housing 1, and the antenna 4 is electrically connected to the circuit board; the antenna 4 is rotatably connected to the housing 1; the projection shape of the protective frame 3 is U-shaped, and the protective frame 3 is connected to the outer end face of the housing 1; the projection of the antenna 4 is located in the space surrounded by the protective frame 3 and the housing 1; when the antenna 4 is not in use, the antenna 4 is rotated to the inside of the protective frame 3 to protect the antenna 4.

[0037] Embodiment 2

[0038] As Figure 1-5 shown, a heat dissipation structure proposed by the present utility model, compared with Embodiment 1, this embodiment also discloses in detail the specific structure of the heat dissipation structure 7; the heat dissipation structure 7 includes a heat dissipation part a71, a heat insulation part 72, a conduction part 73, a heat dissipation part b74, a heat dissipation part c75 and a semiconductor refrigeration module 76;

[0039] The heat dissipation part a71 is provided with mounting holes a711; there are multiple mounting holes a711; the multiple mounting holes a711 are evenly distributed on the heat dissipation part a71, and the number of the mounting holes a711 is set to four; a hollow chamber is provided inside the heat dissipation part a71; a capillary evaporation area is provided on the inner wall of the hollow chamber; a plurality of partition plates are arranged side by side in the hollow chamber, the height value of the partition plate is less than the height value of the hollow chamber, and a coolant is stored in the hollow chamber; wherein, the partition plate is located on the side close to the heat insulation part 72; the partition plate, the heat dissipation part a71, the heat dissipation part b74 and the heat dissipation part c75 are all made of heat-conducting materials;

[0040] The heat generated at the hot end of the semiconductor refrigeration module 76 is transferred to the heat dissipation part a71 through the heat dissipation part c75 and the heat dissipation part b74, so as to evaporate the coolant in the capillary evaporation area into gas and then condense it into liquid again on the heat dissipation part a71 to achieve the effect of dissipating heat from the heat dissipation part a71 and further dissipating heat from the hot end of the semiconductor refrigeration module 76.

[0041] The heat insulation part 72 is provided with mounting holes b721; there are multiple mounting holes b721; the multiple mounting holes b721 are evenly distributed on the heat insulation part 72, and the number of the mounting holes b721 is set to four;

[0042] The conduction part 73 is a hollow structure with one end open, and the end of the conduction part 73 with the opening is connected to the heat insulation part 72; a through hole a for the cold end of the semiconductor refrigeration module 76 to extend into is provided on the end face of the heat insulation part 72 connected to the conduction part 73; the cold end of the semiconductor refrigeration module 76 is refrigerated so that the conduction part 73 located inside the housing 1 has a low temperature and dissipates heat from the inside of the housing 1.

[0043] The end face of the heat dissipation part b74 is attached to the heat dissipation part a71, and a detachable connection to the heat dissipation part a71 is selected, but not limited to, the way of bolt cooperation.

[0044] There are multiple heat dissipation parts c75; the heat dissipation parts c75, the through hole a, and the semiconductor refrigeration module 76 correspond to each other one by one. A plurality of heat dissipation parts c are all connected to one end of the heat dissipation part b74 away from the heat dissipation part a71. The other end of each heat dissipation part c75 is provided with a groove for accommodating the hot end of the semiconductor refrigeration module 76; in the installation state of the heat dissipation part c75 and the semiconductor refrigeration module 76, a heat insulation layer 751 for isolating the hot end and the cold end of the semiconductor refrigeration module 76 is provided on the end face of the heat dissipation part c75.

[0045] In the installation state where the heat dissipation structure 7 and the housing 1 are cooperatively installed, the conduction part 73 is located inside the housing 1, and the heat insulation part 72 presses the bottom surface of the installation groove 101; the cold end of the semiconductor refrigeration module 76 extends into the hollow conduction part 73, and an elastic sealing layer is provided on the end face of the heat insulation part 72 connected to the conduction part 73.

[0046] In an optional embodiment, a threaded blind hole is provided on the bottom surface of the installation groove 101; bolts are used to cooperate with the installation hole a711 and the installation hole b721 to detachably install the heat dissipation structure 7 in the installation groove 101.

[0047] The embodiments of the present invention have been described in detail above in conjunction with the accompanying drawings. However, the present invention is not limited to this. Within the scope of knowledge possessed by those skilled in the art to which the present invention pertains, various changes can be made without departing from the gist of the present invention.

Claims

1. A heat dissipation structure, characterized in that: include Semiconductor refrigeration module (76); The heat dissipation part a (71) is provided with a mounting hole a (711); a plurality of mounting holes a (711) are provided; The heat insulating portion (72) is provided with a mounting hole b (721); a plurality of mounting holes b (721) are provided; The conducting part (73) is a hollow structure with one end open, and the conducting part (73) is provided with an open end connected to the heat insulating part (72); a through hole a for the cold end of the semiconductor refrigeration module (76) to extend into is provided on the end surface where the heat insulating part (72) and the conducting part (73) are connected; The heat dissipation portion b (74) has an end surface which is in contact with the heat dissipation portion a (71) and is connected to the heat dissipation portion a (71); The heat dissipation part c (75) is provided with a plurality of heat dissipation parts c (75), through holes a and semiconductor refrigeration modules (76) corresponding to each other, the plurality of heat dissipation parts c are connected to one end of the heat dissipation part b (74) away from the heat dissipation part a (71), and the other end of each heat dissipation part c (75) is provided with a groove for accommodating the hot end of the semiconductor refrigeration module (76).

2. A heat dissipation structure according to claim 1, characterized in that: When the heat dissipation part c (75) and the semiconductor refrigeration module (76) are installed, a heat insulation layer (751) for isolating the hot end and the cold end of the semiconductor refrigeration module (76) is provided on the end surface of the heat dissipation part c (75).

3. A heat dissipation structure according to claim 1, characterized in that: An elastic sealing layer is provided on the end surface where the heat insulating part (72) and the conducting part (73) are connected.

4. The heat dissipation structure according to claim 1, characterized in that: A hollow chamber is provided inside the heat dissipation part a (71); a capillary evaporation zone is provided on the inner wall of the hollow chamber; a plurality of partitions are arranged side by side in the hollow chamber, the height of the partitions is smaller than the height of the hollow chamber, and coolant is stored in the hollow chamber.

5. An Internet gateway, comprising the heat dissipation structure (7) according to any one of claims 1 to 4, characterized in that: Also includes A shell (1); the shell is a hollow structure with one end open, and the other end of the shell (1) is provided with a mounting groove (101) for mounting the heat dissipation structure (7); the bottom of the mounting groove (101) is provided with a through hole b communicating with the interior of the shell (1); when the heat dissipation structure (7) and the shell (1) are in a matched mounting state, the conduction part (73) is located inside the shell (1), and the heat insulation part (72) presses against the bottom surface of the mounting groove (101); An end cover (2) which is detachably connected to the housing (1) and is used to seal the opening of the housing (1); A circuit board is installed in the housing (1), and an electrical control component is provided on the circuit board; A socket module (6) is mounted on the outer end surface of the housing (1), and the socket module (6) is electrically connected to the circuit board; The antenna (4) is mounted on the outer end surface of the housing (1), and the antenna (4) is electrically connected to the circuit board.

6. An Internet gateway according to claim 5, characterized in that: The mounting groove (101) is provided with a ventilation hole (102) on the housing (1).

7. An Internet gateway according to claim 5, characterized in that: It also includes a protective frame (3); an antenna (4) rotatably connected to the housing (1); The projection shape of the protection frame (3) is a U-shape, and the protection frame (3) is connected to the outer end surface of the shell (1); the projection of the antenna (4) is located in the space enclosed by the protection frame (3) and the shell (1).

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