Bearing part and bearing device
By designing multi-point support carriers, the problems of black edges, black angles and bending when coating silicon wafers of silicon based heterojunction batteries are solved, achieving a more uniform coating effect and better coating quality.
Patent Information
- Application Number
- CN202421829344.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-31
- Publication Date
- 2025-06-03
- Estimated Expiration
- 2034-07-31
AI Technical Summary
When the silicon wafer of silicon-based heterojunction battery is coated, black edges or black angles are prone to occur, and the silicon wafer is prone to bend when the size of the silicon wafer is large, resulting in uneven coating and poor coating effect.
A carrier is designed, including a base plate and multiple bearing blocks. The bearing blocks are arranged at the outer periphery of the base plate. Multiple bearing blocks support the silicon wafer through multiple bearing blocks to reduce the contact area between the silicon wafer and the bearing member, avoid the appearance of black edges or black angles, and improve the support effect of the silicon wafer and prevent bending.
Through multi-point support, the silicon wafer is not prone to bending, and black edges or black corners are not prone to occur at the contact point, the coating effect is more uniform and the coating quality is improved.
Smart Images
Figure CN222941159U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the technical field of solar cells, and in particular to a carrier and a carrier device. Background Art
[0002] Silicon-based heterojunction battery technology has developed rapidly, with the highest laboratory efficiency reaching 26.81%, and mass production has begun to take shape, with a mass production efficiency of ≥25.5%. The core of silicon-based heterojunction battery technology lies in the passivation of intrinsic amorphous silicon and the preparation of microcrystalline / wide bandgap doped microcrystalline silicon films. However, when the silicon wafers for preparing silicon-based heterojunction batteries are carried by carriers for coating operations, black edges or black corners are likely to appear on the silicon wafers; and when the silicon wafers are large in size, the silicon wafers are prone to bending, resulting in uneven coating and poor coating effects. Utility Model Content
[0003] Based on this, it is necessary to provide a carrier to address the problem that black edges or black corners are easily formed on silicon wafers when coating silicon wafers of silicon-based heterojunction batteries; and when the silicon wafers are large in size, the silicon wafers are easy to bend, resulting in uneven coating and poor coating effect.
[0004] A bearing component, comprising:
[0005] Base plate;
[0006] A bearing block, wherein the number of the bearing blocks is multiple, the multiple bearing blocks are arranged at intervals on the outer periphery of the bottom plate, and the multiple bearing blocks are respectively connected to the bottom plate;
[0007] Wherein, a bearing surface is configured on a side of the bearing block facing away from the bottom plate.
[0008] In some embodiments, the angle α between the bearing surface and the horizontal plane satisfies the condition:
[0009] 1°≤α≤90°.
[0010] In some embodiments, the height h1 of the bearing surface from the bottom plate satisfies the condition:
[0011] 0.5mm≤h1≤1.5mm.
[0012] In some of the embodiments, the carrier is further configured with an enclosure structure, and the enclosure structure is arranged at the periphery of the bottom plate;
[0013] The enclosure structure is constructed with an enclosure slope, and the enclosure slope is arranged from the inside of the bottom plate to the outside and is inclined upward.
[0014] In some of these embodiments, the retaining slope includes a first clamping slope, and one end of the first clamping slope is connected to the bearing surface;
[0015] The included angle θ between the first clamping slope and the bearing surface satisfies the condition:
[0016] 90° ≤ θ ≤ 180°.
[0017] In some of these embodiments, the height h2 of the first clamping slope in the first direction is less than the height h1 of the bearing surface in the first direction;
[0018] Wherein, the first direction is the direction from the bearing surface to the bottom plate.
[0019] In some of these embodiments, the distance h3 between the end of the retaining structure away from the bottom plate and the bottom plate satisfies the condition:
[0020] 1 mm ≤ h3 ≤ 3 mm.
[0021] In some of these embodiments, ventilation holes penetrating the bottom plate are further formed on the bottom plate.
[0022] This application also provides a carrying device, which includes the carrier described in any one of the above embodiments, and a plurality of the carriers are arranged at intervals with each other.
[0023] In some of these embodiments, the distance d between two adjacent carriers satisfies the condition:
[0024] 1 mm ≤ d ≤ 4 mm.
[0025] When carrying the silicon wafers for preparing solar cells by the above-mentioned carriers and carrying device and performing a coating operation on the silicon wafers, since a plurality of carrying blocks are arranged on the outer periphery of the bottom plate, the supporting effect of the silicon wafers by the plurality of carrying blocks is relatively good, so that the silicon wafers are not likely to be bent; at the same time, it can also make the contact area between the silicon wafers and the carriers smaller, and it is not easy to occur black edges or black corners at the contact positions between the silicon wafers and the carriers, so that the coating on the silicon wafers is relatively uniform and the coating effect is better. BRIEF DESCRIPTION OF THE DRAWINGS
[0026] Figure 1 It is a schematic diagram of a carrier provided by some embodiments of this application.
[0027] Figure 2 For some of the embodiments Figure 1 The cross-sectional view taken along line A-A shown in.
[0028] Figure 3 For some of the embodiments Figure 2 The partial enlarged view at position C shown in.
[0029] Figure 4 For some other embodiments of Figure 2 The partial enlarged view at C shown.
[0030] Figure 5 For some other embodiments of Figure 1 The sectional view taken along line A-A shown.
[0031] Figure 6 For still some other embodiments of Figure 1 The sectional view taken along line A-A shown.
[0032] Figure 7 For Figure 1 The sectional view taken along line B-B shown.
[0033] Figure 8 For Figure 1 The partial enlarged view at D shown.
[0034] Figure 9 For a plurality of Figure 1 The schematic diagram of a bearing device composed of the bearing members shown.
[0035] Figure 10 For Figure 9 The partial enlarged view at E shown.
[0036] Reference numerals: 100 - bottom plate; 110 - ventilation hole; 200 - bearing block; 210 - bearing surface; 300 - enclosure structure; 310 - enclosure inclined surface; 311 - first clamping inclined surface; 320 - chamfer; 1000 - bearing member. Detailed embodiments
[0037] To make the above objects, features and advantages of the present application more apparent and understandable, the following will describe the detailed embodiments of the present application in conjunction with the accompanying drawings. Many specific details are set forth in the following description in order to fully understand the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without departing from the connotation of the present application. Therefore, the present application is not limited by the specific embodiments disclosed below.
[0038] In the description of the present application, it should be understood that if there are terms such as "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., the orientation or positional relationship indicated by these terms is based on the orientation or positional relationship shown in the drawings. These are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation to the present application.
[0039] In addition, if there are terms such as "first" and "second", these terms are only used for descriptive purposes and should not be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include at least one such feature. In the description of the present application, if there is a term "plurality", the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise specifically and clearly defined.
[0040] In the present application, unless otherwise clearly specified and limited, if there are terms such as "mounted", "connected", "coupled", "fixed", etc., these terms should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or integrated; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two elements or the interaction relationship between two elements, unless otherwise clearly limited. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific circumstances.
[0041] In the present application, unless otherwise clearly specified and limited, if there is a description such as a first feature being "on" or "under" a second feature, the meaning can be that the first and second features are in direct contact, or the first and second features are indirectly in contact through an intermediate medium. Moreover, the first feature being "above", "over" and "on top of" the second feature can mean that the first feature is directly above or obliquely above the second feature, or merely indicates that the first feature has a higher horizontal height than the second feature. The first feature being "under", "beneath" and "underneath" the second feature can be that the first feature is directly below or obliquely below the second feature, or merely indicates that the first feature has a lower horizontal height than the second feature.
[0042] It should be noted that if an element is referred to as "fixed to" or "disposed on" another element, it can be directly on the other element or there may be an intermediate element. If an element is considered to be "connected" to another element, it can be directly connected to the other element or there may be an intermediate element at the same time. If present, the terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used in this application are only for illustrative purposes and do not represent the only implementation.
[0043] The silicon-based heterojunction cell technology has developed rapidly. The highest laboratory efficiency has reached 26.81%, and mass production has initially taken shape, with a mass production efficiency of ≥25.5%. The core of the silicon-based heterojunction cell technology lies in the passivation of intrinsic amorphous silicon and the preparation of microcrystalline / wide-bandgap doped microcrystalline silicon thin films. However, when carrying a silicon wafer for preparing a silicon-based heterojunction cell by a carrier to coat the silicon wafer, the phenomenon of black edges or black corners is likely to occur on the silicon wafer; and when the size of the silicon wafer is large, the silicon wafer is likely to bend, resulting in uneven coating and poor coating effect. Based on the above problems, this application provides a carrier.
[0044] Refer to Figures 1 - 4 , Figure 1 which shows a schematic diagram of a carrier 1000 provided in some embodiments of this application. Figure 2 which shows a cross-sectional view taken along A-A shown in some of the embodiments Figure 1 of this application. Figure 3 which shows a partial enlarged view at C shown in some of the embodiments Figure 2 of this application. Figure 4 which shows a partial enlarged view at C shown in some other embodiments Figure 2 of this application.
[0045] A carrier 1000 provided in an embodiment of this application includes a bottom plate 100 and a plurality of carrier blocks 200. The number of the carrier blocks 200 is multiple, and the multiple carrier blocks 200 are spaced apart on the outer periphery of the bottom plate 100 and are respectively connected to the bottom plate 100; wherein, a bearing surface 210 is formed on a side of the carrier block 200 facing away from the bottom plate 100.
[0046] When carrying a silicon wafer (not shown in the figure) for preparing a solar cell by the above-mentioned carrier 1000 and coating the silicon wafer, since a plurality of carrier blocks 200 are provided on the outer periphery of the bottom plate 100, the supporting effect of the silicon wafer by the plurality of carrier blocks 200 is good, so that the silicon wafer is not likely to bend; at the same time, it can also make the contact area between the silicon wafer and the carrier 1000 small, and it is not easy to occur black edges or black corners at the contact between the silicon wafer and the carrier 1000, so that the coating on the silicon wafer is more uniform and the coating effect is better.
[0047] It should be noted that, compared with the existing edge-mounted fully enclosed carrier 1000, the contact area between the silicon wafer and the carrier 1000 provided in this application is smaller, and it is not easy to have the phenomenon of black edges or black corners. At the same time, compared with the four-corner support type carrier 1000, when carrying larger-sized silicon wafers (G12 half wafers or larger-sized half wafers or full wafers), the support effect is better, and the silicon wafer is not easy to bend, so that the coating is more uniform and the coating effect is better. The carrier 1000 provided in this application solves the problem of black edges or black corners caused by the large contact area between the silicon wafer and the carrier 1000 during edge-mounted full enclosure support; it also solves the problem of poor support for rectangular silicon wafers during four-corner support. At the same time, it also reduces the influence of the shadow effect on the film thickness of the silicon wafer edge coating being less than the film thickness of the silicon wafer middle coating; it reduces the situation where the PL brightness of the battery cell edge is relatively low due to the contact between the silicon wafer edge and the carrier 1000.
[0048] The carrier 1000 provided in the embodiment of this application uses multi-point support of the bearing block 200 to replace the traditional full-edge support of the edge-mounted full package type.
[0049] In some of the embodiments, when the side length of the bottom plate 100 is greater than 110 mm, the number of bearing blocks 200 on that side is greater than 1. This effectively ensures the carrying effect of the carrier 1000 on the silicon wafer at that side and reduces the possibility of the silicon wafer bending. Please refer to Figure 1 , in one specific embodiment, when the carrier 1000 is a rectangular structure, and the long side of the rectangular structure is greater than 110 mm and less than 220 mm, and the short side is less than 110 mm, two bearing blocks 200 are provided on each long side of the carrier 1000, and one bearing block 200 is provided on the short side. When two bearing blocks 200 are provided on the long side of the carrier 1000, the two bearing blocks 200 are respectively provided at the quarter and three-quarter positions of the long side of the carrier 1000; the bearing block 200 on the short side is provided at the half position of the short side of the carrier 1000, so that the distribution of the bearing force received by the silicon wafer is more balanced.
[0050] In some of these specific embodiments, the carrier block 200 has a rectangular structure, and the long side of the carrier block 200 extends along the side length of the bottom plate 100. The long side of the carrier block 200 has a value in the range greater than or equal to 0.5 mm and less than or equal to 2 cm, and the short side of the carrier block 200 has a value in the range greater than or equal to 0.5 mm and less than or equal to 5 mm, so that the carrier block 200 can better carry and lift the silicon wafer, reducing the coating impact on the silicon wafer. In one specific embodiment, the long side of the carrier block 200 is 1 cm and the short side is 3 mm. It should be noted that there are no special restrictions on the specific length and width of the carrier block 200, and it can be adjusted adaptively according to the size of the silicon wafer and the number of carrier blocks 200.
[0051] The following specifically describes the structure of the carrier 1000. Please refer to Figures 5 - 8 , Figure 5 which shows another some embodiments of Figure 1 the cross-sectional view taken along A-A shown in Figure 6 which shows still some embodiments of Figure 1 the cross-sectional view taken along A-A shown in Figure 7 which shows Figure 1 the cross-sectional view taken along B-B shown in Figure 8 which shows Figure 1 the partial enlarged view of D shown in
[0052] Please refer to Figure 4 , in some of these embodiments, the angle α between the bearing surface 210 and the horizontal plane satisfies the condition: 1° ≤ α ≤ 90°. By setting the angle α between the bearing surface 210 and the horizontal plane to be in the range greater than 1° and less than or equal to 90°, the bearing surface 210 is set as a ramp structure, reducing the abrasion area when the silicon wafer contacts the bearing surface 210, so that the excellent rate of the silicon wafer after coating is relatively high. In one specific embodiment, the angle α between the bearing surface 210 and the horizontal plane is 1°. In another specific embodiment, the angle α between the bearing surface 210 and the horizontal plane is Figure 4 90° shown in Figure 4 . In still another specific embodiment, the angle α between the bearing surface 210 and the horizontal plane is
[0053] Please refer to Figure 3 and Figure 4, in some embodiments, the height h1 of the bearing surface 210 from the bottom plate 100 satisfies the condition: 0.5 mm ≤ h1 ≤ 1.5 mm. By setting the height h1 of the bearing surface 210 from the bottom plate 100 within the range of greater than or equal to 0.5 mm and less than or equal to 1.5 mm, the distance between the silicon wafer and the bottom plate 100 is better, effectively ensuring that the silicon wafer is not easily in contact with the bottom plate 100 while reducing the overall height dimension of the carrier 1000, facilitating the movement and coating operation of the carrier 1000. In one specific embodiment, h1 is 0.5 mm. In another specific embodiment, h1 is 1.5 mm. In still another specific embodiment, h1 is 1.1 mm.
[0054] Please refer to Figure 1 and Figure 7 , in some embodiments, the carrier 1000 is further configured with a surrounding structure 300, and the surrounding structure 300 is disposed at the outer periphery of the bottom plate 100; the surrounding structure 300 is configured with a surrounding inclined surface 310, and the surrounding inclined surface 310 is inclined upward from the inside of the bottom plate 100 towards the outside. When coating multiple silicon wafers through multiple carriers 1000, the evaporation sputtering during the coating process can be blocked by the surrounding inclined surface 310, reducing the coating sputtering influence of the silicon wafers on other carriers 1000 on each silicon wafer on the carrier 1000, making the coating effect of the silicon wafer better.
[0055] Please refer to Figures 2 - 6 , in some embodiments, the surrounding inclined surface 310 includes a first clamping inclined surface 311, and one end of the first clamping inclined surface 311 is connected to the bearing surface 210; the included angle θ between the first clamping inclined surface 311 and the bearing surface 210 satisfies the condition: 90° ≤ θ ≤ 180°. By setting the included angle θ between the first clamping inclined surface 311 and the bearing surface 210 within the range of greater than or equal to 90° and less than or equal to 180°, the first clamping inclined surface 311 will not block the film layer evaporation above the silicon wafer during the coating process, effectively ensuring the coating effect of the silicon wafer. In one specific embodiment, θ is Figure 3 135° as shown. In another specific embodiment, θ is Figure 4 165° as shown. Of course, in other embodiments, θ can also be Figure 5 150° as shown and Figure 6 130° or 145° as shown, etc., and no special limitation is made thereto.
[0056] Please refer to Figure 3 and Figure 4, in some embodiments, the height h2 of the first clamping inclined surface 311 in the first direction is less than the height h1 of the bearing surface 210 in the first direction; wherein, the first direction is the direction from the bearing surface 210 to the bottom plate 100; specifically, the first direction is the xx' direction in Figure 3 and Figure 4 . By setting the height h2 of the first clamping inclined surface 311 in the first direction to be less than the height h1 of the bearing surface 210 in the first direction, during the film coating operation of the silicon wafer, the first clamping inclined surface 311 is not likely to block the vaporized film material small molecules generated during the evaporation process, reducing the phenomenon of black edges or black corners appearing at the edges of the silicon wafer.
[0057] Please refer to Figure 3 and Figure 4 , in some embodiments, the distance h3 between the end of the enclosure structure 300 away from the bottom plate 100 and the bottom plate 100 satisfies the condition: 1mm ≤ h3 ≤ 3mm. By setting the distance h3 between the end of the enclosure structure 300 away from the bottom plate 100 and the bottom plate 100 within the range of greater than or equal to 1mm and less than or equal to 3mm, while effectively ensuring the film coating sputtering problem between multiple carriers 1000, black edges or black corners are not likely to appear at the edges of the silicon wafer. In one specific embodiment, h3 is 1mm. In another specific embodiment, h3 is 3mm. In still another specific embodiment, h3 is 2mm.
[0058] Please refer to Figure 8 , in some embodiments, chamfers 320 are further provided at the four corners of the enclosure structure 300, so that during the use of the entire carrier 1000, it is not likely to scratch the user and is safer.
[0059] Please refer to Figure 1 , in some embodiments, vent holes 110 penetrating through the bottom plate 100 are further constructed on the bottom plate 100. By providing the vent holes 110 on the bottom plate 100, during the film coating process of the silicon wafer, the temperatures on the upper and lower surfaces of the silicon wafer are more balanced, and the silicon wafer is not likely to warp due to uneven heating. In some embodiments, the number of vent holes 110 is multiple, and the multiple vent holes 110 are spaced apart on the bottom plate 100. Please refer to Figure 1 , in one specific embodiment, the number of vent holes 110 is four. Of course, in other embodiments, the number of vent holes 110 can also be two, three, etc., and no special limitation is made thereto, and it can be adaptively increased or decreased according to the size of the silicon wafer.
[0060] Please refer to Figure 9 , Figure 9 shows multiple Figure 1Schematic diagram of the carrier device composed of the carrier 1000 shown. The carrier device provided in this application includes a plurality of carriers 1000 described in any of the above embodiments, and the plurality of carriers 1000 are spaced apart from each other. By forming a carrier device with a plurality of carriers 1000, it is possible to perform coating operations on a plurality of wafers simultaneously, with relatively high efficiency.
[0061] Please refer to Figure 10 , Figure 10 which shows Figure 9 Partial enlarged view of the E shown. In some of these embodiments, the distance d between two adjacent carriers 1000 satisfies the condition: 1 mm ≤ d ≤ 4 mm. By setting the distance d between two adjacent carriers 1000 within the range of greater than or equal to 1 mm and less than or equal to 4 mm, while ensuring the distance between the carriers 1000, the number density per unit area of the carriers 1000 is taken into account, so that the coating effect of the wafers on each carrier 1000 is better and the coating efficiency is relatively high. In one specific embodiment, d is 1 mm. In another specific embodiment, d is 4 mm. In still another specific embodiment, d is 3.2 mm.
[0062] The technical features of the above embodiments can be combined arbitrarily. For the sake of brevity of description, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, it should be considered as within the scope described in this specification.
[0063] The above embodiments only represent several implementation manners of this application. The description is relatively specific and detailed, but it should not be construed as a limitation on the scope of the patent application. It should be noted that for those of ordinary skill in the art, without departing from the concept of this application, several deformations and improvements can still be made, and these all belong to the protection scope of this application. Therefore, the protection scope of this application patent shall be subject to the appended claims.
Claims
1. A bearing member, characterized in that: The bearing member comprises: Bottom plate (100); A bearing block (200), wherein the number of the bearing blocks (200) is plural, the plurality of bearing blocks (200) are arranged at intervals on the outer periphery of the bottom plate (100), and the plurality of bearing blocks (200) are respectively connected to the bottom plate (100); Wherein, a bearing surface (210) is formed on a side of the bearing block (200) facing away from the bottom plate (100).
2. The carrier according to claim 1, characterized in that The angle α between the bearing surface (210) and the horizontal plane satisfies the condition: 1°≤α≤90°。 3. The carrier according to claim 1, characterized in that: The height h1 of the bearing surface (210) from the bottom plate (100) satisfies the following conditions: 0.5mm≤h1≤1.5mm.
4. The carrier according to claim 1, characterized in that The bearing member is further configured with an enclosure structure (300), wherein the enclosure structure (300) is arranged at the outer periphery of the bottom plate (100); The enclosure structure (300) is configured with an enclosure slope (310), and the enclosure slope (310) is arranged from the inside of the bottom plate (100) toward the outside and is inclined upward.
5. The carrier according to claim 4, characterized in that: The enclosure inclined surface (310) comprises a first clamping inclined surface (311), and one end of the first clamping inclined surface (311) is connected to the bearing surface (210); The angle θ between the first engaging inclined surface (311) and the bearing surface (210) satisfies the condition: 90°≤θ≤180°.
6. The carrier according to claim 5, characterized in that A height h2 of the first engaging inclined surface (311) along the first direction is smaller than a height h1 of the bearing surface (210) along the first direction; Wherein, the first direction is the direction in which the bearing surface (210) points towards the bottom plate (100).
7. The carrier according to claim 4, characterized in that: The distance h3 between the end of the enclosure structure (300) away from the bottom plate (100) and the bottom plate (100) satisfies the condition: 1mm≤h3≤3mm.
8. The carrier according to any one of claims 1 to 7, characterized in that: The bottom plate (100) is also provided with a vent hole (110) penetrating the bottom plate (100).
9. A carrying device, characterized in that: The invention comprises a plurality of carriers (1000) according to any one of claims 1 to 8, and the plurality of carriers (1000) are arranged at intervals from each other.
10. The carrying device according to claim 9, characterized in that: The distance d between two adjacent carriers (1000) satisfies the condition: 1mm≤d≤4mm.