Wafer cleaning and drying device
By designing a wafer processing device that combines cleaning and drying functions, the problem of cleaning and drying as two independent equipment in the prior art is solved, and efficient and low-cost wafer processing is achieved.
Patent Information
- Application Number
- CN202421245109.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-31
- Publication Date
- 2025-06-06
- Estimated Expiration
- 2034-05-31
AI Technical Summary
In the prior art, wafer cleaning and drying are usually carried out by two separate devices, increasing costs and reducing efficiency.
A wafer cleaning and drying device is designed, combining the cleaning mechanism and the drying mechanism, and the sliding rails of the ultrasonic cleaning tank and the oven are moved to achieve unified cleaning and drying operations.
Through dual use of one thing, wafer processing efficiency is improved, equipment costs are reduced, and operational processes are simplified.
Smart Images
Figure CN222944081U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of semiconductor processing, in particular to a wafer cleaning and drying device. Background Art
[0002] Wafer semiconductors refer to semiconductor devices that are processed on wafers and eventually made into various integrated circuits, transistors, optoelectronic devices, etc. Wafers need to be cleaned during the processing and dried after cleaning. During the processing, cleaning and drying are often performed by two separate devices, which not only increases costs but also reduces efficiency. Utility Model Content
[0003] The utility model aims to provide a wafer cleaning and drying device in view of the defects and shortcomings of the prior art.
[0004] To achieve the above-mentioned purpose, the technical solution adopted by the utility model is: a wafer cleaning and drying device, comprising a base, a cleaning mechanism and a drying mechanism are arranged on the base, and its innovation lies in: the cleaning mechanism comprises a cleaning tank, an ultrasonic transducer is arranged on the side wall of the cleaning tank, the ultrasonic transducer is externally connected to an ultrasonic generator, a rotating shaft is arranged at the opening of the cleaning tank, a section of the rotating shaft extends to the outside of the cleaning tank, and a driven wheel is arranged, a motor is also arranged on the base, a driving wheel is arranged on the output shaft of the motor, the driving wheel and the driven wheel are connected by a belt for transmission, a plurality of sleeves are fixedly arranged on the rotating shaft, a plurality of connecting rods are arranged on the sleeves, and a carrier is arranged on the top of the connecting rod; the drying mechanism comprises a workbench located on the base, the surface of the workbench is flush with the upper surface of the cleaning tank, and a slide rail is arranged between the two, an oven is slidably arranged on the slide rail, the oven opening faces downward, and a plurality of hot air blowers are arranged on the top, the ventilation pipe of the hot air blower extends to the inside of the oven, an inlet and outlet are arranged on the side of the oven, and a box door is hingedly arranged on the inlet and outlet.
[0005] Furthermore, the carrier includes a supporting plate and a cover plate, which are hinged and fixed by snaps. The supporting plate is provided with a placement hole, and a plurality of limiting plates are provided on the inner wall of the placement hole. A through hole is provided on the cover plate at a position corresponding to the placement hole, and a rubber column is provided at a corresponding position of the limiting plate.
[0006] Furthermore, the opening sizes of the cleaning tank and the oven are consistent.
[0007] Furthermore, the oven is moved manually or automatically.
[0008] Furthermore, when an automatic method is adopted, a motor or a telescopic cylinder can be used.
[0009] After adopting the above structure, the utility model has the following beneficial effects:
[0010] The utility model provides a cleaning mechanism and a drying mechanism, which are combined with each other to achieve dual purposes, thereby improving processing efficiency and reducing equipment costs. BRIEF DESCRIPTION OF THE DRAWINGS
[0011] Figure 1 It is a schematic diagram of the structure of the utility model;
[0012] Figure 2 It is a top view of the carrier in the utility model.
[0013] Description of reference numerals:
[0014] 1 base, 2 cleaning mechanism, 21 cleaning tank, 22 ultrasonic transducer, 23 rotating shaft, 24 driven wheel, 25 motor, 26 driving wheel, 27 bushing, 28 connecting rod, 29 carrier, 291 supporting plate, 292 cover plate, 293 placement hole, 294 limit plate, 295 through hole, 296 rubber column, 3 drying mechanism, 31 workbench, 32 slide rail, 33 oven, 34 hot air blower, 35 inlet and outlet, 36 box door. DETAILED DESCRIPTION
[0015] The utility model is further described below in conjunction with the accompanying drawings.
[0016] In order to make the purpose, technical solution and advantages of the utility model more clear, the utility model is further described in detail below in conjunction with the accompanying drawings and specific implementation methods. It should be understood that the specific implementation methods described here are only used to explain the utility model and are not used to limit the utility model.
[0017] See also Figure 1A wafer cleaning and drying device includes a base 1, a cleaning mechanism 2 and a drying mechanism 3 are arranged on the base 1, the cleaning mechanism 2 includes a cleaning tank 21, an ultrasonic transducer 22 is arranged on the side wall of the cleaning tank 21, the ultrasonic transducer is externally connected to an ultrasonic generator, a rotating shaft 23 is arranged at the opening of the cleaning tank 21, a section of the rotating shaft 23 extends to the outside of the cleaning tank, and a driven wheel 24 is arranged, a motor 25 is also arranged on the base 1, a driving wheel 26 is arranged on the output shaft of the motor 25, and a belt is used to drive the driving wheel 26 and the driven wheel 24. A plurality of sleeves 27 are fixedly arranged on the rotating shaft 23, a plurality of connecting rods 28 are arranged on the sleeves, and a carrier 29 is arranged on the top of the connecting rod; the drying mechanism 3 includes a workbench 31 located on the base, the surface of the workbench 31 is flush with the upper surface of the cleaning tank 21, and a slide rail 32 is arranged between the two, an oven 33 is slidably arranged on the slide rail 32, the oven 33 is opened downward, and a plurality of hot air blowers 34 are arranged on the top, the ventilation pipes of the hot air blowers 34 extend to the inside of the oven, an inlet and outlet 35 are arranged on the side of the oven 33, and a box door 36 is hingedly arranged on the inlet and outlet 35. Specifically, after the wafer is placed on the carrier 29, the oven 33 is moved to the top of the cleaning tank 21 through the slide rail 32 to cover the cleaning tank, and then the motor 25, the driving wheel 26, the belt and the driven wheel 24 drive the shaft 23 to rotate, and rotate 180° to immerse the wafer in the cleaning liquid, and turn on the ultrasonic transducer 22 and the ultrasonic generator to clean the wafer; after the cleaning is completed, the wafer is rotated 180° by the motor to separate the wafer from the cleaning liquid and locate at the highest point. At this time, the hot air blower 34 is turned on to dry the wafer. After the drying is completed, the oven is reset and the wafer can be taken out; the cleaning mechanism 2 and the drying mechanism 3 are combined with each other, and one object serves two purposes, thereby improving the processing efficiency and reducing the equipment cost.
[0018] See also Figure 2 The carrier 29 includes a supporting plate 291 and a cover plate 292, which are hinged and fixed by buckles. A placement hole 293 is provided on the supporting plate 291, and a plurality of limit plates 294 are provided on the inner wall of the placement hole 293. A through hole 295 is provided on the cover plate 292 at a position corresponding to the placement hole, and a rubber column 296 is provided at a corresponding position of the limit plate 294. The wafer is placed in the placement hole 293 and supported by the limit plate 294, and then the cover plate 292 is covered, and at the same time, the rubber column 296 is pressed against the wafer to fix the wafer; the placement hole 293 and the through hole 295 are used for cleaning liquid to clean the front and back sides of the wafer.
[0019] In this embodiment, the opening sizes of the cleaning tank 21 and the oven 33 are consistent, so as to ensure that the oven 33 can match the cleaning tank 21 after being moved into place.
[0020] In this embodiment, the oven 33 is moved manually or automatically, which can be selected according to customer needs.
[0021] In this embodiment, when the automatic mode is adopted, a motor or a telescopic cylinder can be used. The oven 33 is pushed by a motor and a screw rod, or by a telescopic cylinder, which includes an electric telescopic rod, a gas cylinder or an oil cylinder, preferably an electric telescopic rod.
[0022] The above description is only used to illustrate the technical solution of the utility model rather than to limit it. Other modifications or equivalent substitutions made to the technical solution of the utility model by ordinary technicians in this field should be included in the scope of the claims of the utility model as long as they do not depart from the spirit and scope of the technical solution of the utility model.
Claims
1. A wafer cleaning and drying device, comprising a base, on which a cleaning mechanism and a drying mechanism are arranged, characterized in that: The cleaning mechanism comprises a cleaning tank, an ultrasonic transducer is arranged on the side wall of the cleaning tank, the ultrasonic transducer is externally connected to an ultrasonic generator, a rotating shaft is arranged at the opening of the cleaning tank, a section of the rotating shaft extends to the outside of the cleaning tank, and a driven wheel is arranged, a motor is also arranged on the base, a driving wheel is arranged on the output shaft of the motor, the driving wheel and the driven wheel are connected by a belt for transmission, a plurality of sleeves are fixedly arranged on the rotating shaft, a plurality of connecting rods are arranged on the sleeves, and a carrier is arranged on the top of the connecting rod; the drying mechanism comprises a workbench located on the base, the surface of the workbench is flush with the upper surface of the cleaning tank, and a slide rail is arranged between the two, an oven is slidably arranged on the slide rail, the oven opening faces downward, and a plurality of hot air blowers are arranged on the top, the ventilation duct of the hot air blower extends to the inside of the oven, an inlet and outlet are arranged on the side of the oven, and a box door is hingedly arranged on the inlet and outlet.
2. The wafer cleaning and drying device according to claim 1, characterized in that: The carrier includes a supporting plate and a cover plate, which are hinged and fixed by buckles. A placement hole is provided on the supporting plate, and a plurality of limiting plates are provided on the inner wall of the placement hole. A through hole is provided on the cover plate at a position corresponding to the placement hole, and a rubber column is provided at a corresponding position of the limiting plate.
3. The wafer cleaning and drying device according to claim 1, characterized in that: The opening sizes of the cleaning tank and the oven are consistent.
4. The wafer cleaning and drying device according to claim 1, characterized in that: The oven is moved manually or automatically.
5. The wafer cleaning and drying device according to claim 4, characterized in that: When the automatic method is adopted, a motor or a telescopic cylinder is used.