AMB and packaging frame welding clamp

Abstract

The utility model belongs to the technical field of semiconductor packaging, and relates to an AMB and packaging frame welding clamp which comprises a carrier plate, a frame limiting groove is formed in the upper end face of the carrier plate, an AMB mounting groove is formed in the frame limiting groove, a limiting plate is arranged in the mounting groove, a plurality of electronic element limiting holes are formed in the limiting plate, a cover plate is connected to the carrier plate, and the cover plate is connected with a clamping plate. A positioning column is arranged on the carrier plate, a positioning hole is formed in the cover plate, a spring cover cap is arranged in the middle of the cover plate, an AMB pressing needle is connected into the spring cover cap, the bottom end of the AMB pressing needle penetrates through the cover plate, a pressing point limiting plate is connected to the cover plate, an elastic pressing point assembly is arranged on the pressing point limiting plate, and the AMB pressing needle penetrates through the elastic pressing point assembly. The cover plate is provided with a through hole for the elastic pressure point assembly to extend into the AMB mounting groove. The AMB plate can be pressed through the spring cap and the AMB pressing needle arranged in the spring cap, and each electronic element on the AMB plate can be pressed through the elastic pressing point assembly, so that the AMB plate is prevented from warping.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor packaging, in particular to a welding fixture for AMB and packaging frame. Background Art

[0002] The current welding process between the AMB ceramic copper clad laminate and the package frame is as follows: a solid solder sheet is used between the frame pin and the AMB board surface, and the solder sheet is molten through reflow soldering, which acts as a binder to bond the terminal to the AMB ceramic copper clad laminate. The AMB ceramic copper clad laminate is prone to warping during the reflow soldering process, and a new reflow soldering fixture is needed to solve the above problem.

[0003] Patent No. CN202320189711.2 discloses a reflow soldering fixture, which is intended to solve the problem that the existing substrate is prone to warping or deformation during the reflow soldering process. To this end, the reflow soldering fixture of the utility model includes a cover body and a base, and a bearing groove is provided on the base, and the bearing groove is configured to accommodate a partial area of ​​the substrate and the lead frame. A pressure block is provided on the cover body, and the pressure block includes a first contact portion and a plurality of second contact portions. The first contact portion is configured to press the substrate when the cover body and the base are connected in place, and the second contact portion is configured to press a partial area of ​​the lead frame when the cover body and the base are connected in place. The utility model clamps and fixes the substrate by the cover body and the base, and can prevent the substrate from warping or deformation during the reflow soldering process through the first contact portion and the second contact portion. While the packaging frame is being welded, other electronic components such as chips and clips are also welded on the AMB ceramic copper clad board simultaneously. The pressing block cannot position these electronic components and they are prone to displacement during movement. In addition, the pressure bearing capacity of each electronic component is different and they cannot be pressed down by a pressing block. Therefore, the utility model proposes a welding fixture for AMB and packaging frame. Utility Model Content

[0004] The main purpose of the utility model is to provide an AMB and packaging frame welding fixture, which can press the AMB board and some electronic components thereon respectively to prevent the AMB board from warping.

[0005] The utility model achieves the above-mentioned purpose through the following technical scheme: a welding fixture for AMB and packaging frame, comprising a carrier plate, an upper end surface of the carrier plate is provided with a frame limiting groove, an AMB mounting groove for placing the AMB board is provided in the frame limiting groove, a limiting plate is provided in the mounting groove, a plurality of electronic component limiting holes are provided on the limiting plate, a cover plate is connected to the carrier plate, a positioning column is provided on the carrier plate, a positioning hole is provided on the cover plate, a spring cover cap is provided in the middle position of the cover plate, an AMB pressure pin is connected in the spring cover cap, the bottom end of the AMB pressure pin passes through the cover plate, a pressure point limiting plate is connected to the cover plate, an elastic pressure point assembly is provided on the pressure point limiting plate, and a through hole is provided on the cover plate for the elastic pressure point assembly to extend into the AMB mounting groove.

[0006] Preferably, the pressure point limit plate is connected to the cover plate through a shoulder screw, and the pressure point limit plate is provided with a through hole for the shoulder screw to pass through. A first spring is sleeved on the shoulder screw, and the bottom end of the first spring rests on the upper end surface of the pressure point limit plate.

[0007] Preferably, the elastic pressure point assembly includes a plurality of T-shaped pressure blocks for pressing the pins of the frame, the vertical portion of the T-shaped pressure block faces upward and passes through the pressure point limit plate, the top end of the T-shaped pressure block is threadedly connected to a limiting nut, a second spring is sleeved on the vertical portion of the T-shaped pressure block, the top end of the second spring is against the lower end surface of the pressure point limit plate, a plurality of Clip pressure pins are also provided between the pressure point limit plate and the cover plate, the Clip pressure pins are segmented pressure pins that are thick in the middle and thin at both ends, stepped through holes are coaxially provided on a pair of opposite surfaces of the pressure point limit plate and the cover plate, the two ends of the stepped through holes with large apertures are close to each other, and the middle section of the Clip pressure pin is located inside one end of the stepped through hole with large aperture.

[0008] Preferably, a plurality of limit plate pressure pins are provided on both sides of the pressure point limit plate.

[0009] Preferably, an insert is provided at the bottom of the carrier plate, and the height difference of the upper end surface of the insert from the center to the periphery is 0.2mm±0.05mm.

[0010] The beneficial effects of the technical solution of the utility model are as follows: the electronic components to be welded can be positioned through the limit plate and the electronic component positioning holes arranged on the limit plate to prevent the electronic components from shifting; the AMB board can be pressed through the spring cap and the AMB pressure needle arranged in the spring cap, and the electronic components on the AMB board can be pressed through the pressure point limit plate and the elastic pressure point assembly arranged on the pressure point limit plate, thereby preventing the AMB board from warping. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Figure 1This is a layout diagram of the AMB and packaging frame welding fixture in the embodiment when working.

[0012] Figure 2 It is a schematic diagram of the cover structure.

[0013] Figure 3 This is a schematic diagram of the Clip pressure needle structure.

[0014] Figure 4 It is a schematic diagram of the carrier board structure.

[0015] Figure 5 It is a schematic diagram of the structure on the back of the carrier board.

[0016] The numbers in the figure indicate: 1. Carrier board; 2. Frame limit groove; 3. AMB installation groove; 4. AMB board; 5. Limit plate; 6. Electronic component limit hole; 7. Gate baffle; 8. Cover plate; 9. Spring cover cap; 10. AMB pressure pin; 11. Pressure point limit plate; 12. Shoulder screw; 13. First spring; 14. T-shaped pressure block; 15. Limit nut; 16. Second spring; 17. Package frame; 18. Clip pressure pin; 19. Step through hole; 20. Limit plate pressure pin; 21. Insert. DETAILED DESCRIPTION

[0017] The utility model is further described in detail below in conjunction with specific embodiments.

[0018] Example:

[0019] like Figures 1 to 5As shown, the utility model is an AMB and packaging frame welding fixture, including a carrier plate 1, the upper end surface of the carrier plate 1 is provided with a frame limiting groove 2, the frame limiting groove 2 is provided with an AMB mounting groove 3 for placing an AMB board 4, the mounting groove is provided with a limiting plate 5, the limiting plate 5 is provided with a plurality of electronic component limiting holes 6, the limiting plate 5 is provided with a chip gate avoidance hole, the chip gate avoidance hole is provided with a gate baffle 7 above, for protecting the chip gate, the carrier plate 1 is connected with a cover plate 8, the The cover plate 8 and the carrier plate 1 are fixed by fastening bolts, the carrier plate 1 is provided with a positioning column, the cover plate 8 is provided with a positioning hole, a spring cover cap 9 is provided in the middle position of the cover plate 8, an AMB pressure needle 10 is connected to the spring cover cap 9, the bottom end of the AMB pressure needle 10 passes through the cover plate 8, a pressure point limiting plate 11 is connected to the cover plate 8, an elastic pressure point assembly is provided on the pressure point limiting plate 11, and a through hole for the elastic pressure point assembly to extend into the AMB mounting groove 3 is provided on the cover plate 8. Remove the cover plate 8, put the AMB board 4 with the chip welded into the AMB installation groove 3, put the packaging frame 17 into the frame limit groove 2, the packaging frame 17 is provided with welding pins that contact the solder points on the AMB board 4, put the limit plate 5 on the AMB board 4, put the Clip and other electronic components into the corresponding electronic component limit holes 6 on the limit plate 5, cover the cover plate 8 on the carrier 1 and fix it, the AMB pressure needle 10 presses the AMB board 4 under the elastic force of the spring in the spring cap 9, the elastic pressure point assembly is used to press the various electronic components to be welded on the AMB board 4, and the assembled fixture flows into the reflow soldering furnace for welding. The fixture can position the Clip and various electronic components to be welded through the limit plate 5 to prevent the electronic components from being offset during the movement and affecting the welding effect. The electronic components are pressed by the elastic pressure point assembly to prevent the electronic components from being damaged due to excessive pressure.

[0020] The pressure point limit plate 11 is connected to the cover plate 8 through a shoulder screw 12. The pressure point limit plate 11 is provided with a through hole for the shoulder screw 12 to pass through. A first spring 13 is sleeved on the shoulder screw 12. The bottom end of the first spring 13 rests on the upper end surface of the pressure point limit plate 11. The elastic force provided by the first spring 13 presses the pressure point limit plate 11 onto the cover plate 8.

[0021] The elastic pressure point assembly includes a plurality of T-shaped pressure blocks 14 for pressing the pins of the frame, the vertical portion of the T-shaped pressure block 14 faces upward and passes through the pressure point limit plate 11, the top of the T-shaped pressure block 14 is threadedly connected to a limit nut 15, a second spring 16 is sleeved on the vertical portion of the T-shaped pressure block 14, the top of the second spring 16 is against the lower end surface of the pressure point limit plate 11, the bottom end of the T-shaped pressure block 14 presses the pins of the packaging frame 17, and the second spring 16 is compressed to play a buffering role to prevent excessive pressure. Large; a plurality of Clip pressure pins 18 are also arranged between the pressure point limit plate 11 and the cover plate 8, and the Clip pressure pin 18 is a segmented pressure pin with a thick middle and thin ends. A stepped through hole 19 is coaxially arranged on a pair of opposite surfaces of the pressure point limit plate 11 and the cover plate 8, and one end with a large aperture of two stepped through holes 19 is close to each other, and the middle section of the Clip pressure pin 18 is located in one end with a large aperture of the stepped through hole 19, so that the Clip pressure pin 18 can move up and down, and the Clip pressure pin 18 presses the Clip by its own weight to prevent excessive pressure.

[0022] A plurality of limit plate pressure pins 20 are disposed on both sides of the pressure point limit plate 11 .

[0023] An insert 21 is provided at the bottom of the carrier board 1 , and the height difference of the upper end surface of the insert 21 from the center to the periphery is 0.2 mm±0.05 mm, which is used for warping compensation of the AMB board 4 .

[0024] The above are only some embodiments of the present invention. For those skilled in the art, several modifications and improvements can be made without departing from the inventive concept of the present invention, which all belong to the protection scope of the present invention.

Claims

1. A welding fixture for AMB and packaging frame, characterized in that: It includes a carrier plate, the upper end surface of the carrier plate is provided with a frame limiting groove, the frame limiting groove is provided with an AMB mounting groove for placing the AMB board, the mounting groove is provided with a limiting plate, the limiting plate is provided with a plurality of electronic component limiting holes, the carrier plate is connected with a cover plate, the carrier plate is provided with a positioning column, the cover plate is provided with a positioning hole, the middle position of the cover plate is provided with a spring cap, the spring cap is connected with an AMB pressure pin, the bottom end of the AMB pressure pin passes through the cover plate, the cover plate is connected with a pressure point limiting plate, the pressure point limiting plate is provided with an elastic pressure point assembly, and the cover plate is provided with a through hole for the elastic pressure point assembly to extend into the AMB mounting groove.

2. The AMB and packaging frame welding fixture according to claim 1, characterized in that: The pressure point limit plate is connected to the cover plate through a shoulder screw. The pressure point limit plate is provided with a through hole for the shoulder screw to pass through. The shoulder screw is sleeved with a first spring, and the bottom end of the first spring rests on the upper end surface of the pressure point limit plate.

3. The AMB and packaging frame welding fixture according to claim 1, characterized in that: The elastic pressure point assembly includes a plurality of T-shaped pressure blocks for pressing the pins of the frame, the vertical part of the T-shaped pressure block faces upward and passes through the pressure point limit plate, the top end of the T-shaped pressure block is threadedly connected to a limit nut, a second spring is sleeved on the vertical part of the T-shaped pressure block, the top end of the second spring is against the lower end surface of the pressure point limit plate, a plurality of Clip pressure pins are also provided between the pressure point limit plate and the cover plate, the Clip pressure pins are segmented pressure pins with a thick middle and thin ends, stepped through holes are coaxially provided on a pair of opposite surfaces of the pressure point limit plate and the cover plate, the two ends of the stepped through holes with large apertures are close to each other, and the middle section of the Clip pressure pin is located inside one end of the stepped through hole with large aperture.

4. The AMB and packaging frame welding fixture according to claim 1, characterized in that: An insert is provided at the bottom of the carrier plate, and the height difference of the upper end surface of the insert from the center to the periphery is 0.2mm±0.05mm.

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