Heat dissipation assembly and air conditioner
By designing a heat dissipation component containing heat pipes and flange structures, the problem of low heat dissipation efficiency of the air-conditioning frequency conversion module under high temperature conditions is solved, and more efficient heat dissipation and stronger refrigeration performance are achieved.
Patent Information
- Application Number
- CN202421605895.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-09
- Publication Date
- 2025-06-06
- Estimated Expiration
- 2034-07-09
AI Technical Summary
The air-conditioning frequency conversion module has low heat dissipation efficiency under high temperature conditions, resulting in poor air-conditioning refrigeration capacity and affecting the stable operation of the system.
A heat dissipation assembly is designed, including a base, a heat pipe and a fin set. The embedded part of the heat pipe is embedded in the grooves of the base, which uses ultra-high thermal conductivity to improve the heat diffusion ability of the base, and increases the heat transfer path and heat dissipation area through flange structure and flat design.
It significantly improves the heat dissipation efficiency, improves the hot spot effect, enhances the heat dissipation performance of the air conditioner frequency conversion module, and improves the cooling performance of the air conditioner in high temperature environments.
Smart Images
Figure CN222951585U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of heat dissipation, in particular to a heat dissipation component and an air conditioner. Background Art
[0002] Air conditioners mainly use variable frequency modules to dynamically adjust the speed of the compressor, so that the air conditioner can achieve the optimal energy efficiency ratio and achieve economic energy saving. However, since the heat generated by the variable frequency module is positively correlated with the operating frequency of the compressor, when the variable frequency module does not dissipate heat well, long-term high-frequency operation can easily lead to serious heat accumulation in the variable frequency module, affecting the reliability of the air conditioning system. Therefore, improving the heat dissipation capacity of the air conditioner variable frequency module is crucial for the stable operation of the air conditioner.
[0003] Air conditioners generally use aluminum fin heat sinks to dissipate heat from the inverter module, but the heat sink has poor temperature balancing ability and the heat dissipation efficiency of the fins is low, making it difficult to meet the heat dissipation requirements of the inverter module under high temperature conditions. When the air conditioner is cooling in a high temperature environment, in order to prevent the inverter module from burning due to heat accumulation, the heat dissipation burden of the inverter module can only be reduced by reducing the operating frequency, which greatly limits the cooling performance of the air conditioner under high temperature conditions. It can be seen that the heat dissipation problem of the inverter module has become one of the bottlenecks restricting the development of air conditioning technology. Utility Model Content
[0004] The purpose of the utility model is to provide a heat dissipation component and an air conditioner, aiming to solve the problem of low heat dissipation efficiency of the frequency conversion module and poor refrigeration capacity of the air conditioner under high temperature working conditions.
[0005] In order to achieve the above purpose, the utility model adopts the following technical solutions:
[0006] A heat dissipation component comprises a base, a heat pipe and a fin group, the base comprising a heat absorbing surface and a mounting surface arranged opposite to the heat absorbing surface, the heat absorbing surface is directly attached to the heating element, and a groove is arranged on the mounting surface; the fin group is provided with a receiving groove and a penetration hole, and one end of the fin group close to the mounting surface has a flange structure, and the flange structure is tightly matched with the mounting surface; the heat pipe comprises an embedded portion, a penetration portion and a connecting portion, the embedded portion is arranged in the groove of the mounting surface, the penetration portion is arranged in the penetration hole of the fin group, and the connecting portion is arranged in the receiving groove of the fin group; the embedded portion has a semicircular arc surface and a flat surface connecting both ends of the arc surface, the embedded portion is in a D-shaped tube shape as a whole, the flat surface of the embedded portion is flush with the mounting surface of the base, and is tightly matched with the flange structure of the fin group.
[0007] Based on the above scheme, the utility model can greatly improve the thermal diffusion capacity of the base by embedding the embedded part of the heat pipe into the groove of the mounting surface, utilize the ultra-high thermal conductivity of the heat pipe, improve the hot spot effect caused by the concentrated distribution of heat sources, and improve the heat dissipation efficiency.
[0008] Based on the above scheme, the fin group is tightly matched with the mounting surface by setting a flange structure, and part of the heat can be directly diffused from the base to the fin group through the flange structure, thereby increasing the heat transfer path from the base to the external environment, and heat can be dissipated from the heat dissipation component more quickly, thereby improving the heat dissipation performance of the heat dissipation component.
[0009] Based on the above scheme, the utility model arranges a flat surface on the embedded part so that it is flush with the mounting surface and closely matches the flange structure. On the one hand, it avoids the need to open a gap in the flange structure to make room to accommodate the embedded part, thereby simplifying the design and manufacturing processes of the fin group. On the other hand, the flange structure and the base are thermally connected through a heat pipe, which makes full use of the strong thermal conductivity of the heat pipe and improves the heat diffusion rate between the base and the fin group.
[0010] In a preferred solution, the heat absorbing surface is provided with a plurality of boss structures adapted to the frequency conversion module to correspond to a plurality of heating elements located at different heights.
[0011] Based on the above scheme, a boss structure is arranged on the heat absorbing surface so that the heat absorbing surface is in close contact with multiple heating elements located at different heights. The heat of the heating elements is directly transferred to the heat absorbing surface, thereby reducing the contact thermal resistance of the heat transfer path and enhancing the overall heat dissipation effect of the heat dissipation assembly.
[0012] In a preferred embodiment, the fin group includes a plurality of stacked heat dissipation fins, the heat dissipation fins are arranged at intervals along the length direction of the base, and the gaps between adjacent heat dissipation fins are equal.
[0013] Based on the above scheme, the heat dissipation fins are arranged at intervals along the length direction of the base, so that the number of the heat dissipation fins can be greater than the number when arranged along the width direction, and the area of a single heat dissipation fin is smaller, thereby improving the temperature uniformity of the single heat dissipation fin and thus improving the heat dissipation efficiency of the fin group.
[0014] Based on the above scheme, a heat dissipation channel is formed between adjacent heat dissipation fins. The heat dissipation fins are arranged at intervals along the length direction of the base, so that the length of the heat dissipation channel can be shorter than the length when arranged along the width direction, which is beneficial to reducing the flow resistance of the airflow through the heat dissipation channel and enhancing the convective heat exchange effect.
[0015] In a preferred solution, the heat dissipation fins are arranged perpendicular to the mounting surface of the base.
[0016] In a preferred solution, one end of the fin group away from the mounting surface has a locking structure to fix all the heat dissipating fins together to form a fin group.
[0017] Based on the above solution, the locking structure fixes the heat dissipating fins so that all the heat dissipating fins do not move relative to each other, thus avoiding blockage of the heat dissipating flow channel due to deformation and bending of the fins, thereby improving the reliability of the fin group.
[0018] In a preferred solution, the embedding portion and the penetration portion of the heat pipe are thermally connected via a connecting portion.
[0019] In a preferred solution, the side wall of the groove is a semicircular arc surface, and the arc surface of the embedded part is tightly matched with the side wall of the groove.
[0020] Based on the above solution, the arcuate sidewall of the groove fits tightly with the arcuate surface of the embedded part, which speeds up the heat transfer rate from the base to the heat pipe, reduces the contact thermal resistance, and improves the heat dissipation performance.
[0021] In a preferred solution, the penetration portion of the heat pipe is in the shape of a circular tube, the penetration portion of the heat pipe passes through the fin group, and is tightly matched with the penetration hole of the fin group.
[0022] Based on the above scheme, the embedded part and the penetrating part of the heat pipe are thermally connected to the base and the fin group respectively. Since the heat pipe has ultra-high thermal conductivity, heat can be quickly diffused from the base to the fin group through the heat pipe, and then carried away from the heat dissipation component by the heat dissipation channel, thereby realizing efficient heat dissipation of the entire heat dissipation component.
[0023] In a preferred solution, the connection portion of the heat pipe is wrapped inside the fin group, and the outer edge of the connection portion is flush with the side surface of the fin group.
[0024] The utility model also provides an air conditioner, comprising the above-mentioned heat dissipation component.
[0025] In general, the utility model has the following advantages:
[0026] The utility model provides a heat dissipation component and an air conditioner, wherein the embedded portion of the heat pipe is embedded in the groove of the mounting surface, thereby improving the heat diffusion capacity of the base itself, improving the hot spot effect, and closely fitting the arc surface of the embedded portion with the side wall of the groove, reducing the heat transfer temperature difference between the two, and achieving a good heat dissipation effect; secondly, a flat surface flush with the mounting surface is provided on the embedded portion, and the flat surface closely matches the flange structure, which, on the one hand, avoids the need to open a notch on the flange structure, simplifies the design process and manufacturing process of the fin group, and on the other hand, enables the flange structure and the base to be thermally connected through the heat pipe, fully The high thermal conductivity of the heat pipe is utilized to improve the heat diffusion rate between the base and the fin group; in addition, the heat dissipation fins are arranged at intervals along the length direction of the base, so that the number of the heat dissipation fins can be increased, and the area of a single heat dissipation fin can be smaller, thereby improving the temperature uniformity of the single heat dissipation fin. A relatively high fin efficiency can be achieved by using a smaller number of heat pipes, thereby reducing the manufacturing cost, and the heat dissipation flow path between adjacent heat dissipation fins is shorter, which is conducive to reducing the flow resistance of the airflow when passing through the heat dissipation flow path, increasing the airflow velocity, enhancing the convective heat exchange efficiency, and thereby enhancing the heat dissipation effect of the air conditioning inverter module. BRIEF DESCRIPTION OF THE DRAWINGS
[0027] Figure 1 It is a structural schematic diagram of the heat dissipation assembly of an embodiment of the utility model;
[0028] Figure 2 This is an assembly relationship diagram of the base, heat pipe and fin assembly of the embodiment of the utility model;
[0029] Figure 3 It is a structural schematic diagram of the heat absorbing surface of the base of the embodiment of the utility model;
[0030] Figure 4 It is a structural schematic diagram of the base mounting surface of an embodiment of the utility model;
[0031] Figure 5 It is a schematic diagram of the structure of the heat pipe of an embodiment of the utility model;
[0032] In the figure:
[0033] 1-base; 11-heat absorbing surface; 12-mounting surface; 121-groove; 13-boss; 14-avoidance groove; 15-threaded hole; 16-positioning hole; 17-step; 2-fin group; 21-accommodating groove; 22-piercing hole; 23-flange; 24-lock; 3-heat pipe; 31-embedded part; 32-piercing part; 33-connecting part. DETAILED DESCRIPTION
[0034] The utility model will be further described in detail below.
[0035] like Figure 1-Figure 5As shown, this embodiment provides a heat dissipation assembly, including a base 1, a heat pipe 3 and a fin group 2.
[0036] The base 1 has a heat absorbing surface 11 and a mounting surface 12 disposed opposite to the heat absorbing surface 11. The heat absorbing surface 11 is directly attached to the heating element, and a groove 121 is disposed on the mounting surface 12. The fin group 2 has a receiving groove 21 and a through hole 22. The end of the fin group 2 close to the mounting surface 12 has a flange 23 structure, and the flange 23 structure is tightly matched with the mounting surface 12. The heat pipe 3 has an embedded portion 31, a through portion 32 and a connecting portion 33. The embedded portion 31 is disposed in the groove 121 of the mounting surface 12, the through portion 32 is disposed in the through hole 22 of the fin group 2, and the connecting portion 33 is disposed in the receiving groove 21 of the fin group 2. The embedded portion 31 has a semicircular arc surface and a flat surface connecting the two ends of the arc surface. The embedded portion 31 is in a D-shaped tubular shape as a whole. The flat surface of the embedded portion 31 is flush with the mounting surface 12 of the base 1 and is tightly matched with the flange 23 structure of the fin group 2. Thus, a thermal connection can be formed between the base 1, the heat pipe 3 and the fin group 2, and the heat can be conducted to any component of the heat dissipation assembly through any path and dissipated outward, thereby enhancing the thermal conductivity of the heat dissipation assembly.
[0037] By adopting the above embodiment, by setting the embedded portion 31 of the heat pipe 3 in the groove 121, on the one hand, the heat conduction distance between the heat pipe 3 and the heating element is reduced, and the heat can be quickly transferred from the heat absorption surface 11 to the heat pipe 3, thereby reducing the thermal resistance of heat conduction. On the other hand, the ultra-high thermal conductivity of the heat pipe 3 is utilized to enhance the thermal conductivity of the base 1 in the planar direction, making up for the disadvantages of poor heat diffusion and heat storage capacity due to the thin thickness of the base 1, and improving the hot spot effect caused by the concentrated distribution of the heat source, thereby improving the heat dissipation efficiency.
[0038] Furthermore, by adopting the above-mentioned embodiment, a flat surface is provided on the embedding portion 31 of the heat pipe 3 so that it is flush with the mounting surface 12, thereby filling the gap of the mounting surface 12 at the groove 121, so that the flange 23 structure of the fin group 2 is closely matched with the flat surface and the mounting surface 12, and there is no need to specially provide an additional notch on the fin group 2 to avoid interference due to the protrusion of the embedding portion 31. Compared with the heat dissipation components of the prior art, this embodiment simplifies the difficulty and cost of manufacturing and processing the fin group 2, increases the heat dissipation area of the fin group 2, and enhances the heat dissipation performance.
[0039] In addition, the extension path of the embedded portion 31 of the heat pipe 3 on the base 1 is determined by the distribution of the heating elements. All heating elements are projected onto the mounting surface 12 of the base 1, and the extension path of the embedded portion 31 passes through as many projection surfaces as possible, so that the distance between the heating element and the embedded portion 31 is the shortest, so as to reduce the thermal resistance of thermal conduction. When the number of heat pipes 3 is 2 or more, the extension path must also make the heat distributed to each heat pipe 3 equal or similar, so as to avoid the heat being concentrated on a certain heat pipe and causing dry burning.
[0040] Preferably, the heat absorbing surface 11 is provided with a plurality of bosses 13 structures adapted to the frequency conversion module to fit a plurality of heating elements at different heights, and the specific number of bosses 13 needs to be determined according to the number of different horizontal heights of the heating elements on the frequency conversion module. In this embodiment, there is a heating element whose height is different from that of the other heating elements, so a boss 13 structure is provided for the heating element, so that the heat absorbing surface 11 can be closely fitted with all the heating elements, and the heat of the heating elements is directly transferred to the heat absorbing surface 11, thereby reducing the contact thermal resistance of the heat transfer path and enhancing the overall heat dissipation effect of the heat dissipation component.
[0041] In addition, the portion of the heat absorbing surface 11 that contacts the heating element is coated with thermal conductive silicone grease to eliminate the air gap between the heat absorbing surface 11 and the heating element and reduce the contact thermal resistance.
[0042] Preferably, the fin group 2 includes a plurality of stacked heat dissipation fins, the heat dissipation fins are arranged at intervals along the length direction of the base 1, the gaps between adjacent heat dissipation fins are equal, and heat dissipation channels are formed between adjacent heat dissipation fins.
[0043] By adopting the above embodiment, by arranging the heat dissipation fins at intervals along the length direction of the base 1, on the one hand, the number of heat dissipation fins can be increased compared with the number when arranged along the width direction, so that the area of a single heat dissipation fin is smaller while the total area of the fin group 2 remains unchanged, thereby improving the temperature uniformity of the heat dissipation fins; on the other hand, the length of the heat dissipation channel can be made shorter than the length when arranged along the width direction, which is beneficial to reducing the flow resistance of the airflow when passing through the heat dissipation channel and enhancing the convective heat exchange effect. The advantages of both aspects work simultaneously, greatly improving the heat dissipation efficiency of the fin group 2.
[0044] The specific number of fins and the size of the gap between adjacent fins need to be determined according to the air flow velocity in the installation environment and the length of the base 1. In this embodiment, the fin group 2 has a total of 68 heat dissipating fins, and the gap between adjacent heat dissipating fins is 2.1 mm.
[0045] Preferably, the heat dissipation fins are arranged perpendicular to the mounting surface 12 of the base 1 .
[0046] Preferably, the length of the flange 23 is equal to the gap between adjacent heat dissipation fins.
[0047] By adopting the above embodiment, the fin group 2 can form a complete plane at one end of the fin group 2 close to the mounting surface 12 by setting a flange 23 structure with a length equal to the gap between adjacent heat dissipating fins. The flange 23 structure is closely matched with the mounting surface 12, thereby increasing the contact area between the fin group 2 and the base 1. Part of the heat can be directly diffused from the base 1 to the fin group 2 through the flange 23 structure, thereby increasing the heat transfer path from the base 1 to the external environment, and the heat can be dissipated from the heat dissipation component more quickly, thereby improving the heat dissipation performance of the heat dissipation component.
[0048] Preferably, the end of the fin group 2 away from the mounting surface 12 has a lock 24 structure, which fixes all the heat dissipating fins together to form the fin group 2. The lock 24 structure fixes the heat dissipating fins so that all the heat dissipating fins do not move relative to each other, thereby avoiding blockage of the heat dissipating flow channel due to deformation and bending of the fins, thereby improving the reliability of the fin group 2.
[0049] The embedded part 31 of the heat pipe 3 is connected to the penetration part 32 by heat conduction through the connection part 33. After the embedded part 31 absorbs heat on the substrate 1, the liquid working medium inside the heat pipe 3 is evaporated into steam by heat, and the steam flows to the penetration part 32 through the connection part 33 under the action of the pressure difference, and after releasing the heat, the steam condenses into liquid, and then flows back to the embedded part 31 under the capillary force of the liquid absorption core inside the heat pipe 3, completing the phase change cycle. Through the phase change cycle of the working medium, the heat pipe 3 can efficiently transfer the heat of the embedded part 31 to the penetration part 32 through the connection part 33, thereby achieving ultra-high thermal conductivity and reducing the working temperature of the heating element.
[0050] Preferably, the side wall of the groove 121 is a semicircular arc surface, and the arc surface of the embedded portion 31 is tightly matched with the side wall of the groove 121 .
[0051] With the above embodiment, the arcuate sidewall of the groove 121 completely wraps the arcuate surface of the embedding portion 31 without leaving any gap, which can reduce the contact thermal resistance between the base 1 and the heat pipe 3 and enhance the heat dissipation performance.
[0052] Preferably, the penetration portion 32 of the heat pipe 3 is in a round tube shape, the penetration portion 32 passes through the fin group 2 , and is tightly matched with the penetration hole 22 of the fin group 2 .
[0053] By adopting the above embodiment, the embedded part 31 and the penetration part 32 of the heat pipe 3 are thermally connected to the base 1 and the fin group 2 respectively. After the base 1 absorbs the heat of the heating element, the heat can be quickly diffused from the base 1 to the fin group 2 through the heat pipe 3 by utilizing the efficient phase change heat transfer technology of the heat pipe 3, and then carried away from the heat dissipation component by the heat dissipation channel, thereby realizing efficient heat dissipation of the entire heat dissipation component.
[0054] In addition, the base 1, the heat pipe 3 and the fin group 2 are thermally connected by welding. The use of welding technology in the tight fit between the three can further reduce the contact thermal resistance and improve the reliability of the heat dissipation component.
[0055] Preferably, the connection portion 33 of the heat pipe 3 is wrapped inside the fin group 2 , and the outer edge of the connection portion 33 is flush with the side surface of the fin group 2 .
[0056] This embodiment also provides an air conditioner including the above-mentioned heat dissipation component.
[0057] In order to fix the heat dissipation component and the frequency conversion module, the heat dissipation component substrate 1 is provided with a plurality of threaded holes 15 and positioning holes 16, and the heat dissipation component and the heating element can be fixed by threaded connection. In addition, the heat absorption surface 11 of the substrate 1 is also provided with an avoidance groove 14 to avoid the pins of the heating element to prevent short circuit.
[0058] In this embodiment, the heat absorbing surface 11 is further provided with step structures 17 at both ends in the length direction, so as to cooperate with the installation of the frequency conversion module support frame to avoid interference.
[0059] In summary, the heat dissipation assembly and air conditioner provided in this embodiment utilize the efficient phase change heat transfer technology of the heat pipe 3 to quickly extract heat from the frequency conversion module, and increase the heat dissipation area of the fin group 2 by setting a flat surface of the embedded portion 31, and optimize the arrangement direction of the heat dissipation fins, thereby improving the heat dissipation efficiency, reducing the use of materials for the heat pipe 3, and reducing the manufacturing cost, thereby achieving rapid cooling and efficient heat dissipation of the frequency conversion module.
[0060] The above embodiments are preferred implementation modes of the present invention, but the implementation modes of the present invention are not limited by the above embodiments. Any other changes, modifications, substitutions, combinations, and simplifications that do not deviate from the spirit and principle of the present invention should be equivalent replacement methods and are included in the protection scope of the present invention.
Claims
1. A heat dissipation assembly, comprising a base, a heat pipe and a fin assembly, characterized in that: The base has a heat absorbing surface and a mounting surface arranged opposite to the heat absorbing surface, the heat absorbing surface is directly attached to the heating element, and a groove is arranged on the mounting surface; The fin group is provided with a receiving groove and a through hole, and one end of the fin group close to the mounting surface is provided with a flange structure, and the flange structure is closely matched with the mounting surface; The heat pipe comprises an embedding portion, a penetration portion and a connecting portion, wherein the embedding portion is arranged in the groove of the mounting surface, the penetration portion is arranged in the penetration hole of the fin group, and the connecting portion is arranged in the receiving groove of the fin group; The embedded part has a semicircular arc surface and a flat surface connecting the two ends of the arc surface. The embedded part is in a D-shaped tube shape as a whole. The flat surface of the embedded part is flush with the mounting surface of the base and fits tightly with the flange structure of the fin group.
2. The heat dissipation assembly according to claim 1, characterized in that: The heat absorbing surface is provided with a plurality of boss structures adapted to the frequency conversion module to correspond to and fit a plurality of heating elements located at different heights.
3. The heat dissipation assembly according to claim 1, characterized in that: The fin group includes a plurality of stacked heat dissipation fins, the heat dissipation fins are arranged at intervals along the length direction of the base, and the gaps between adjacent heat dissipation fins are equal.
4. The heat dissipation assembly according to claim 3, characterized in that: The heat dissipation fins are arranged perpendicular to the mounting surface of the base.
5. The heat dissipation assembly according to claim 3, characterized in that: One end of the fin group away from the mounting surface has a locking structure, and the locking structure is used to fix a plurality of heat dissipation fins together to form a fin group.
6. The heat dissipation assembly according to claim 1, characterized in that: The embedding portion and the penetration portion of the heat pipe are thermally connected via a connecting portion.
7. The heat dissipation assembly according to claim 1, characterized in that: The side wall of the groove is a semicircular arc surface, and the arc surface of the embedded part is tightly matched with the side wall of the groove.
8. The heat dissipation assembly according to claim 1, characterized in that: The penetration portion of the heat pipe is in a circular tube shape, and the penetration portion of the heat pipe passes through the fin group.
9. The heat dissipation assembly according to claim 1, characterized in that: The connection portion of the heat pipe is wrapped inside the fin group, and the outer edge of the connection portion is flush with the side surface of the fin group.
10. An air conditioner, characterized in that: A heat dissipation component comprising any one of claims 1 to 9.