Optical module

Abstract

The utility model relates to the technical field of optical communication, and provides an optical module, which comprises a circuit board, a digital signal processing chip, an optical receiving sub-assembly and an optical transmitting sub-assembly, the light receiving sub-assembly and the light emitting sub-assembly are both arranged on the back face of the circuit board, and the position, directly facing the back face of the circuit board, of the digital signal processing chip is located between the light receiving sub-assembly and the light emitting sub-assembly. According to the utility model, the digital signal processing chip is arranged between the light receiving sub-assembly and the light emitting sub-assembly, the distance between the digital signal processing chip and the light emitting sub-assembly is set as short as possible, and the distance satisfies the integral multiple of 1 / 4 wavelength of the transmission signal rate. The transmission performance is improved by arranging the golden fingers close enough; and meanwhile, the digital processing chip and the receiving sub-assembly are staggered, so that small thermal crosstalk is ensured.

Description

Technical Field

[0001] The utility model relates to the technical field of optical communication, in particular to an optical module. Background Art

[0002] In recent years, with the development of optical communications and data centers, the surge in network traffic has also led to an increase in the consumption of power resources. To solve the power consumption problem, the linear direct-drive pluggable optical module solution has significantly reduced the module power consumption index by eliminating the DSP (digital processing chip). At the same time, the digital processing chip on the switch needs stronger balancing and error correction capabilities due to the direct drive of the module end, which will also increase the power consumption of the device to a certain extent and cause performance degradation. Utility Model Content

[0003] The purpose of the utility model is to provide an optical module, which can at least solve some of the defects in the prior art.

[0004] To achieve the above-mentioned purpose, an embodiment of the utility model provides the following technical solution: an optical module, comprising a circuit board, and also comprising a digital signal processing chip, a light receiving subassembly and a light emitting subassembly, wherein the digital signal processing chip is electrically connected to the front side of the circuit board, the light receiving subassembly and the light emitting subassembly are both arranged on the back side of the circuit board, and the position of the digital signal processing chip facing the back side of the circuit board is between the light receiving subassembly and the light emitting subassembly.

[0005] Furthermore, the light receiving subassembly is arranged close to the gold fingers of the circuit board.

[0006] Furthermore, the light receiving subassembly and the light emitting subassembly are both provided with a protective cover.

[0007] Furthermore, the two protective cover plates are fixed on the circuit board by glue.

[0008] Furthermore, the optical receiving subassembly is provided with a receiving optical fiber fixing device, and the optical transmitting subassembly is provided with a transmitting optical fiber fixing device. The optical receiving subassembly is connected to the adapter via the optical fiber fixed on the receiving optical fiber fixing device, and the optical transmitting subassembly is connected to the adapter via the optical fiber fixed on the transmitting optical fiber fixing device.

[0009] Furthermore, a substrate is provided on the front side of the circuit board, a window is opened on the circuit board, and the light emitting subassembly is arranged on the substrate through the window.

[0010] Furthermore, the light emitting subassembly includes a thermoelectric cooler, a laser, a thermistor and a lens, and the laser, the thermistor and the lens are all arranged on the thermoelectric cooler.

[0011] Furthermore, the light emitting subassembly also includes an optical isolator.

[0012] Furthermore, the light receiving subassembly includes a lens, a detector and a transimpedance amplifier which are sequentially arranged along the light path direction, and the lens is arranged on a lens pad.

[0013] Furthermore, it also includes an upper cover and a base, and the upper cover and the base cooperate to form a shell in which the circuit board can be installed.

[0014] Compared with the prior art, the beneficial effects of the utility model are:

[0015] 1. By setting the digital signal processing chip between the optical receiving subassembly and the optical transmitting subassembly, the distance between the digital signal processing chip and the optical transmitting subassembly is set as short as possible and meets the integer multiple of 1 / 4 wavelength of the transmission signal rate. The advantage of this layout is that the linear direct drive of the receiving subassembly can be realized, and the transmission performance can be improved by setting it close enough to the gold finger; at the same time, by staggering the digital processing chip and the receiving subassembly, the thermal crosstalk is ensured to be small.

[0016] 2. The optical receiving subassembly is placed close to the metal fingers of the printed circuit board to reduce the signal transmission path and realize the receiving linear transmission function. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 An exploded diagram of an optical module provided by an embodiment of the utility model;

[0018] Figure 2 A schematic diagram of a front view of a circuit board and a protective cover of an optical module provided in an embodiment of the utility model;

[0019] Figure 3 A schematic diagram of a back view of a circuit board of an optical module provided by an embodiment of the utility model (the dotted box shows a digital signal processing chip on the front of the circuit board);

[0020] In the figure markings: 10-upper cover; 11-base; 12-pull ring; 21-circuit board; 22-digital processing chip; 23-substrate; 24-adapter; 25-blocking piece; 26-first protective cover plate; 27-second protective cover plate; 28-optical fiber assembly unit; 281-receiving optical fiber fixing device; 282-transmitting optical fiber fixing device; 283-optical fiber; 211-optical receiving subassembly; 212-optical transmitting subassembly. DETAILED DESCRIPTION

[0021] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0022] See also Figure 1 , Figure 2 and Figure 3 , an embodiment of the utility model provides an optical module, including a circuit board 21, a digital signal processing chip, an optical receiving subassembly 211 and an optical emitting subassembly 212, wherein the digital signal processing chip is electrically connected to the front side of the circuit board 21, the optical receiving subassembly 211 and the optical emitting subassembly 212 are both arranged on the back side of the circuit board 21, and the position of the digital signal processing chip facing the back side of the circuit board 21 is between the optical receiving subassembly 211 and the optical emitting subassembly 212. In this embodiment, by arranging the digital signal processing chip between the optical receiving subassembly 211 and the optical emitting subassembly 212, the distance between the digital signal processing chip and the optical emitting subassembly 212 is set as short as possible and meets the integer multiple of 1 / 4 wavelength of the transmission signal rate. The advantage of this layout is that linear direct drive of the receiving subassembly can be realized, and the transmission performance can be improved by setting it close enough to the gold finger; at the same time, by staggering the digital processing chip 22 and the receiving subassembly, thermal crosstalk is ensured to be small. Specifically, as Figure 3 As shown, the back of the circuit board 21 is shown, and the digital signal processing chip on the front is shown by a dotted frame. It can be seen that the position of the digital signal processing chip is between the optical receiving subassembly 211 and the optical transmitting subassembly 212. The digital signal processing chip in this embodiment, that is, DSP, is a common power consumption chip in existing optical modules, and its function will not be described here.

[0023] As an optimization solution of the embodiment of the utility model, please refer to Figure 1 , Figure 2 and Figure 3 , the light receiving subassembly 211 is arranged close to the gold finger of the circuit board 21. In this embodiment, Figure 3 As shown, the optical receiving subassembly 211 is arranged near the gold finger on the left side of the circuit board 21, which can reduce the signal transmission path and realize the receiving linear transmission function.

[0024] As an optimization solution of the embodiment of the utility model, please refer to Figure 1 , Figure 2 and Figure 3, the light receiving subassembly 211 and the light emitting subassembly 212 are both provided with a protective cover. In this embodiment, the light receiving subassembly 211 and the light emitting subassembly 212 are both protected by a protective cover, and the protective cover protecting the light receiving subassembly 211 is defined as a first protective cover 26, and the protective cover protecting the light emitting subassembly 212 is defined as a second protective cover 27. Preferably, the protective cover is fixed to the circuit board 21 by glue.

[0025] As an optimization solution of the embodiment of the utility model, please refer to Figure 1 , Figure 2 and Figure 3 The optical receiving subassembly 211 is provided with a receiving optical fiber fixing device, and the optical transmitting subassembly 212 is provided with a transmitting optical fiber fixing device. The optical receiving subassembly 211 is connected to the adapter 24 through the optical fiber fixed on the receiving optical fiber fixing device, and the optical transmitting subassembly 212 is connected to the adapter 24 through the optical fiber fixed on the transmitting optical fiber fixing device. In this embodiment, Figure 2 The optical fiber component unit 28 shown includes a receiving optical fiber fixture 281, a transmitting optical fiber fixture 282, and an optical fiber 283, wherein the receiving optical fiber fixture is used to fix the optical fiber at the optical receiving subassembly 211, and the transmitting optical fiber fixture is used to fix the optical fiber at the optical transmitting subassembly 212. There are multiple optical fibers, one end of some of the optical fibers is connected to the adapter 24, and the other end is connected to the optical transmitting subassembly 212, and one end of another part of the optical fibers is connected to the adapter 24, and the other end is connected to the optical receiving subassembly 211.

[0026] As an optimization solution of the embodiment of the utility model, please refer to Figure 1 , Figure 2 and Figure 3 , a substrate 23 is provided on the front of the circuit board 21, a window is provided on the circuit board 21, and the light emitting subassembly 212 is provided on the substrate 23 through the window. In this embodiment, a window is provided on the circuit board 21, a substrate 23 is provided at the window position, the substrate 23 is located on the front of the circuit board 21, the light emitting subassembly 212 is located on the back of the circuit board 21, and the light emitting subassembly 212 is provided on the substrate 23 in the window, so that heat can be transferred to the upper cover 10 for dissipation.

[0027] As an optimization solution of the embodiment of the utility model, please refer to Figure 1 , Figure 2 and Figure 3, the light emitting subassembly 212 includes a thermoelectric cooler, a laser, a thermistor and a lens, and the laser, the thermistor and the lens are all arranged on the thermoelectric cooler. In this embodiment, several components in the light emitting subassembly 212 are also common components in existing optical modules, wherein the thermoelectric cooler, i.e., TEC, is used for heat conduction and heat dissipation, the laser, thermistor and the lens are all arranged on the thermoelectric cooler, and then the thermoelectric cooler is arranged on the substrate 23, and the substrate 23 conducts the heat to the upper cover 10 for dissipation.

[0028] To further optimize the above solution, please refer to Figure 1 , Figure 2 and Figure 3 The light emitting subassembly 212 further includes an optical isolator. In this embodiment, the optical isolator is used to isolate light and is arranged on the optical path close to the lens, which is also an existing device.

[0029] As an optimization solution of the embodiment of the utility model, please refer to Figure 1 , Figure 2 and Figure 3 The optical receiving subassembly 211 includes a lens, a detector and a transimpedance amplifier arranged in sequence along the optical path, and the lens is arranged on a lens pad. In this embodiment, the lens, the detector and the transimpedance amplifier are common components in the optical receiving unit of the existing optical module, and their working principles are not described in detail here.

[0030] As an optimization solution of the embodiment of the utility model, please refer to Figure 1 , Figure 2 and Figure 3 , further comprising an upper cover 10 and a base 11, wherein the upper cover 10 and the base 11 cooperate to form a housing for mounting the circuit board 21. In this embodiment, the upper cover 10 and the base 11 form a housing for mounting the circuit board 21, and a heat dissipation structure is disposed on the upper cover 10, so that the digital processing chip 22 and the substrate 23 can contact the heat dissipation structure on the upper cover 10 to improve the heat dissipation efficiency. The heat dissipation structure can be an existing heat dissipation material, or it can be made of a heat dissipation material such as Figure 1 The heat dissipation channel formed by the multiple partitions shown above the upper cover 10.

[0031] As an optimization solution of the embodiment of the utility model, please refer to Figure 1 , Figure 2 and Figure 3 , and also includes a baffle 25, which has a slot for inserting the optical fiber 283. The baffle 25 is installed in the groove of the base 11 and is used to bundle the optical fiber 283 and play an electromagnetic shielding role.

[0032] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. An optical module, comprising a circuit board, characterized in that: It also includes a digital signal processing chip, a light receiving subassembly and a light emitting subassembly, wherein the digital signal processing chip is electrically connected to the front side of the circuit board, the light receiving subassembly and the light emitting subassembly are both arranged on the back side of the circuit board, and the position of the digital signal processing chip facing the back side of the circuit board is between the light receiving subassembly and the light emitting subassembly.

2. An optical module according to claim 1, characterized in that: The light receiving subassembly is arranged close to the gold finger of the circuit board.

3. An optical module according to claim 1, characterized in that: The light receiving subassembly and the light emitting subassembly are both provided with a protective cover plate.

4. An optical module as claimed in claim 3, characterized in that: The two protective cover plates are both fixed on the circuit board by glue.

5. The optical module according to claim 1, characterized in that: The optical receiving subassembly is provided with a receiving optical fiber fixing device, and the optical transmitting subassembly is provided with a transmitting optical fiber fixing device. The optical receiving subassembly is connected to the adapter via the optical fiber fixed on the receiving optical fiber fixing device, and the optical transmitting subassembly is connected to the adapter via the optical fiber fixed on the transmitting optical fiber fixing device.

6. An optical module according to claim 1, characterized in that: A base plate is arranged on the front side of the circuit board, a window is opened on the circuit board, and the light emitting subassembly is arranged on the base plate through the window.

7. An optical module according to claim 1, characterized in that: The light emitting subassembly comprises a thermoelectric cooler, a laser, a thermistor and a lens, wherein the laser, the thermistor and the lens are all arranged on the thermoelectric cooler.

8. An optical module as claimed in claim 7, characterized in that: The light emitting subassembly also includes an optical isolator.

9. An optical module as claimed in claim 1, characterized in that: The light receiving subassembly comprises a lens, a detector and a transimpedance amplifier which are arranged in sequence along the light path direction, and the lens is arranged on a lens pad.

10. The optical module according to claim 1, characterized in that: It also includes an upper cover and a base, and the upper cover and the base cooperate to form a shell body in which the circuit board can be mounted.

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