LED lamp panel and backlight module

Abstract

The utility model relates to the technical field of display equipment, in particular to a light-emitting diode (LED) lamp panel and a backlight module, which comprise a substrate, a light-emitting chip is electrically connected on the substrate, the LED lamp panel further comprises a glue film layer which is arranged on the substrate on the same side with the light-emitting chip, and a graphic structure is arranged on the surface of the glue film layer. According to the adhesive film layer provided by the utility model, the substrate is covered with the adhesive film layer before the light-emitting chip is packaged, the adhesive film layer is provided with the graphic structure, and light rays can be reflected and refracted once or multiple times when passing through an interface where the graphic structure is in contact with air, so that the LED lamp panel emits light uniformly.

Description

[Technical field]

[0001] The utility model relates to the technical field of display equipment, in particular to an LED light board and a backlight module. [Background technology]

[0002] Mini LED backlight panels for ultra-thin and small-sized display applications currently mainly use a packaging method that covers the entire surface with glue, which is usually achieved through dispensing or molding processes. Once the entire surface is covered with glue, it is difficult to perform further optical processing on the surface of the backlight panel. Usually, in order to ensure the uniformity and optical performance of the light output, only some simple process treatments can be performed on the surface after coating, such as adding a reflective layer or other optical modifications. However, optical processing after coating can only perform limited optical adjustments. Although it can enhance the reflection or transmission performance, it cannot solve the problem of light uniformity inside the backlight panel, and it also increases the complexity and cost of the manufacturing process. [Utility Model Content]

[0003] In order to solve the problem of limited optical processing after existing glue coating, the utility model provides an LED light board and a backlight module.

[0004] The utility model solves the technical problem by providing an LED light board, comprising a substrate, to which a light-emitting chip is electrically connected. The LED light board also comprises an adhesive film layer arranged on the same side of the substrate as the light-emitting chip, and a graphic structure is arranged on the surface of the adhesive film layer.

[0005] Preferably, the graphic structures are arranged in an array on the surface of the adhesive film layer, the adhesive film layer is provided with openings corresponding to the light-emitting chips, and a packaging structure covering the light-emitting chips is arranged in the openings.

[0006] Preferably, the graphic structure has a protruding portion away from one side of the substrate, and a side wall of the protruding portion forms an inclination angle with the plane where the substrate is located.

[0007] Preferably, the shape of the protrusion includes at least one of a cylindrical shape, a prism shape and a conical shape.

[0008] Preferably, the length of the protrusion is in the range of 1-50 μm.

[0009] Preferably, a bubble structure is embedded in the adhesive film layer.

[0010] Preferably, the thickness of the adhesive film layer is 50-500 μm.

[0011] Preferably, the packaging structure comprises at least two stacked refractive layers and a reflective layer arranged on a side of the refractive layer away from the light emitting chip, and the refractive index of the at least two refractive layers decreases from a layer close to the light emitting chip to a layer away from the light emitting chip.

[0012] Preferably, the packaging structure comprises at least one transparent layer provided with fluorescent powder, and the fluorescent powder converts the blue light emitted by the light-emitting chip into white light.

[0013] The utility model also provides a backlight module, which comprises a bracket and an LED light board as described above and arranged on the bracket.

[0014] Compared with the prior art, the LED light board and backlight module provided by the utility model have the following advantages:

[0015] 1. In the LED light board provided in the embodiment of the utility model, the film layer is composed of graphic structures of various properties or different characteristics. Before the light-emitting chip is packaged, the film layer with the graphic structure is pre-covered on the surface of the substrate in a composite manner to form an overall film layer structure. Microscopically, due to the different refractive indices of the film layer and the air, light will be reflected and refracted once or multiple times when passing through the interface where the graphic structure contacts the air, thereby achieving the effect of uniform light.

[0016] 2. The LED light board provided in the embodiment of the utility model optimizes the utilization and transmission efficiency of light by arranging the graphic structure in an array. The position and shape of each graphic structure unit are precisely designed to ensure that as much light as possible can be effectively output from the surface of the LED light board. The light-emitting chip is exposed through the opening. The packaging structure protects the light-emitting chip exposed through the opening from damage by the external environment. The openings corresponding to the light-emitting chip are precisely opened on the film layer to ensure the precise positioning and alignment of the packaging structure in subsequent processes. The packaging structure improves the light emission efficiency.

[0017] 3. The LED light board provided in the embodiment of the utility model has an inclination angle that can change the incident angle and reflection path of the light, increase the number of optical processing times that occur on the outer surface of the film layer, make more light refract out of the film layer, enhance the optical effect on the film layer, and the appropriate inclination angle effectively controls reflection and refraction, so that the light emitted from the light-emitting chip to the backlight side is evenly distributed.

[0018] 4. The LED light board provided in the embodiment of the utility model has a protrusion with a length range of 1-50μm on the film layer of the LED light board. The protrusion is a tiny structure with a size much smaller than that of the light-emitting chip. It can produce more reflection angles and refraction angles, better adjust the incident angle and reflection path of light, and accurately control the uniform light effect through the tiny structure to eliminate the original dark spots of the LED light board.

[0019] 5. The LED light board provided in the embodiment of the present invention, in the packaging structure of the general conventional LED light board, will remove the bubbles in each packaging layer as much as possible to avoid the influence of light emission. The LED light board provided in the present embodiment has a bubble structure embedded in the film layer. The bubble structure is used to create interfaces with different refractive indices in the film layer, so that the light is more reflected or refracted inside the film layer, making the light emission uniform.

[0020] 6. In the LED light board provided in the embodiment of the utility model, the adhesive film layer serves as a covering layer, which completely covers the substrate and protects the light-emitting chip in the opening; the packaging structure protects the light-emitting chip exposed through the opening, extends the service life of the light-emitting chip, and improves its stability and reliability under harsh conditions; the multi-layer packaging structure of different materials effectively controls the reflection, transmission and refraction of light, minimizes the loss of light inside the packaging structure; the refractive index of the packaging structure decreases from the side close to the light-emitting chip to the side away from the light-emitting chip, improves the light propagation path and scattering characteristics, and reduces the color deviation caused by internal reflection and refraction; the reflective layer on the top layer can redirect the scattered light to the front, avoid light loss and waste, improve light utilization and efficiency, and eliminate the bright spot above the chip, thereby making the LED light board emit light evenly.

[0021] 7. The LED light board provided in the embodiment of the utility model, the phosphor can convert a single wavelength of blue light into white light within a wider wavelength range. By accurately selecting the type and concentration of the phosphor, the color temperature and color index of the white light emitted by the LED light board can be adjusted to make it more suitable for different application requirements. The phosphor can also improve the output efficiency of light, achieve more consistent white light color output, reduce color unevenness, and enhance user experience.

[0022] 8. The backlight module provided in the embodiment of the utility model has the same beneficial effects as the above-mentioned LED light board, which will not be described in detail here.

Brief Description of the Drawings

[0023] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0024] Figure 1 It is a cross-sectional schematic diagram of the LED lamp board provided by the first embodiment of the utility model.

[0025] Figure 2It is a top view of the LED light board provided by the first embodiment of the utility model.

[0026] Figure 3 It is a cross-sectional schematic diagram of an LED lamp board provided in the second embodiment of the present utility model.

[0027] Figure 4 This is a schematic diagram of the light path change of the LED light board provided in the second embodiment of the utility model.

[0028] Figure 5 It is a top view of the LED lamp board provided by the second embodiment of the utility model.

[0029] Figure 6 It is a block diagram of a backlight module provided by the third embodiment of the utility model.

[0030] Description of the accompanying drawings:

[0031] 100, LED light board; 200, LED light board; 300, backlight module;

[0032] 1. Substrate; 2. Light-emitting chip; 3. Adhesive film layer; 4. Packaging structure;

[0033] 31. Graphic structure; 32. Opening; 33. Protrusion; 34. Bubble structure; 41. Refractive layer; 42. Reflective layer; 43. Transparent layer;

[0034] 301. Bracket. [Specific implementation method]

[0035] In order to make the purpose, technical solution and advantages of the utility model more clear, the utility model is further described in detail below with reference to the accompanying drawings and implementation examples. It should be understood that the specific embodiments described here are only used to explain the utility model and are not used to limit the utility model.

[0036] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only.

[0037] In the present invention, the terms "upper", "lower", "left", "right", "front", "back", "top", "bottom", "inside", "outside", "middle", "vertical", "horizontal", "lateral", "longitudinal" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings. These terms are mainly used to better describe the present invention and its embodiments, and are not used to limit the indicated devices, elements or components to have a specific orientation, or to be constructed and operated in a specific orientation.

[0038] In addition, some of the above terms may be used to express other meanings in addition to indicating orientation or positional relationship. For example, the term "on" may also be used to express a certain dependency or connection relationship in some cases. For those skilled in the art, the specific meanings of these terms in this utility model can be understood according to specific circumstances.

[0039] In addition, the terms "installed", "set", "provided with", "connected", and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral structure; it can be a mechanical connection, or an electrical connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be an internal connection between two devices, elements, or components. For those of ordinary skill in the art, the specific meanings of the above terms in this utility model can be understood according to specific circumstances.

[0040] See also Figure 1 The utility model provides an LED light board 100, including a substrate 1, to which a light-emitting chip 2 is electrically connected. The LED light board 100 also includes a film layer 3 arranged on the same side as the light-emitting chip 2 on the substrate 1, and a graphic structure 31 is arranged on the surface of the film layer 3.

[0041] It can be understood that, at a microscopic level, the refractive index of the adhesive film layer 3 is different from that of air, and light will be reflected and refracted once or multiple times when passing through the interface between the pattern structure 31 and air, and the adhesive film layer 3 plays a role in making the light uniform.

[0042] Specifically, in the prior art, most optical processing is performed after the entire surface is coated with glue, that is, after the light-emitting chip 2 is packaged. The main processes are dispensing or molding. However, in actual production, the dispensing efficiency is low and the uniformity is difficult to control; molding also requires special high-precision molds, which is costly.

[0043] Furthermore, an opening 32 is formed on the adhesive film layer 3 corresponding to the light emitting chip 2 , and a packaging structure 4 covering the light emitting chip 2 is disposed in the opening 32 .

[0044] It can be understood that the light emitting chip 2 is exposed through the opening 32, and the packaging structure 4 protects the light emitting chip 2 exposed through the opening 32 from damage by the external environment, while optimizing the light emitted by the light emitting chip 2 to improve the utilization rate of light.

[0045] The utility model proposes an LED lamp board 100, before the light emitting chip 2 is packaged, a film layer 3 with a graphic structure 31 is attached to a substrate 1, the uneven characteristics of the graphic structure 31 achieves a uniform light effect, there is a conductive circuit on the substrate 1, the conductive circuit is laid on the surface of the substrate 1, the film layer 3 achieves a uniform light effect while protecting the conductive circuit arranged on the substrate 1, an opening 32 is arranged on the film layer 3 at a position corresponding to the light emitting chip 2, the light emitting chip 2 is exposed in the opening 32, pins connected to the conductive circuit are arranged in the opening 32, the pins are electrically connected to the light emitting chip 2 to achieve the light emission of the light emitting chip 2.

[0046] Furthermore, the pattern structures 31 are arranged on the surface of the adhesive film layer 3 in an array arrangement.

[0047] Specifically, the graphic structure 31 can be arranged in a matrix array, that is, regular rows and columns form a regular matrix grid, which evenly and widely covers the surface of the film layer 3, which helps to gather and guide light and optimize the divergence angle and directionality of light.

[0048] Preferably, the graphic structure 31 can also be arranged in a honeycomb array or staggered trapezoidal manner, or can be evenly and symmetrically distributed at angles around the light-emitting chip 2 as the center point to achieve a more targeted aggregation design. In this embodiment, the specific arrangement of the graphic structure is not limited, as long as it can guide the light to optimize the divergence angle of the light.

[0049] It can be understood that the graphic structure 31 can change the propagation direction, scattering angle and beam shape of the light, so as to optimize the distribution of light, improve the uniformity of light or adjust the irradiation angle of light. The graphic structure 31 can be lens-shaped, concave-convex or prism-shaped, which can concentrate the light to the backlight side, reduce the loss of light directed to the outside of the substrate 1, enhance the overall uniformity of light, and improve the visual effect.

[0050] For further information, see Figure 2 , a bubble structure 34 is embedded in the film layer 3 .

[0051] In the packaging layer structure of a general conventional LED light board 100, in order to avoid the influence of light emission, the bubbles in each packaging layer are exhausted as much as possible. In the present embodiment, a LED light board 100 is provided with a bubble structure 34 embedded in the film layer 3. The bubble structure 34 can create an interface of materials with different refractive indices, effectively scatter light, reduce the concentration effect of light, enhance optical performance, and improve visual experience.

[0052] Specifically, during the packaging process of the adhesive film layer 3 , a foaming process is used to generate the bubble structure 34 .

[0053] Furthermore, the packaging structure 4 includes at least two stacked refractive layers 41 and a reflective layer 42 arranged on the side of the refractive layer 41 away from the light emitting chip 2 , and the refractive index of the at least two refractive layers 41 decreases from the layer close to the light emitting chip 2 to the layer away from the light emitting chip 2 .

[0054] It can be understood that the refractive index of the refractive layers 41 at different levels from the light emitting chip 2 end to the air end gradually decreases, thereby improving the light extraction efficiency and thus improving the brightness of the light panel.

[0055] For example, if the first refractive layer 41 has n 1 , the refractive index of the second layer is n 2 , and n1>n2, the light will experience a decrease in refractive index when entering the second layer from the first layer. According to Snell's law n1*sinφ1=n2*sinφ2, when the light enters the second refractive layer 41 from the first refractive layer 41, the propagation direction of the light will deviate from the normal, and the refraction angle φ2 will increase. Therefore, more light can be refracted out of the first refractive layer 41 and enter the second refractive layer 41, making the light more evenly distributed.

[0056] Specifically, the refractive index of each refractive layer 41 in the packaging structure 4 is greater than that of air.

[0057] Furthermore, the purpose of the reflective layer 42 arranged on the side of the refractive layer 41 away from the light-emitting chip 2 is to disperse the light that has not been effectively utilized after passing through the refractive layer 41. Through reflection, the light can pass through the refractive layer 41 again, thereby being effectively guided to the outside, significantly improving the overall light utilization efficiency, increasing the brightness of the LED light board 100, and improving the light distribution.

[0058] Furthermore, the thickness of the adhesive film layer 3 is in the range of 50-500 μm.

[0059] Specifically, the packaging structure 4 encapsulates the light-emitting chip 2 set in the opening 32. In the Mini LED lamp board 100, the thickness of the light-emitting chip 2 is generally between 20 and 50 μm, and the packaging structure 4 encapsulated on the light-emitting chip 2 is generally between 30 and 1000 μm in thickness according to different refractive layers 41 and reflective layers 42. The adhesive film layer 3 is pre-set on the substrate 1, and the thickness of the adhesive film layer 3 cannot exceed the sum of the thicknesses of the light-emitting chip 2 and the packaging structure 4.

[0060] Preferably, diffusion powder may be provided in the adhesive film layer 3, and the diffusion powder evens out the light, eliminates light spots and shadows produced by direct light, and improves the diffusion of light.

[0061] For further information, see Figure 1 and Figure 4 The packaging structure 4 includes at least one transparent layer 43 provided with phosphor, and the phosphor converts the blue light emitted by the light-emitting chip 2 into white light.

[0062] Understandably, the light emitted by the blue LED chip is a single blue light. Through phosphor conversion, the blue light can be converted into white light, improving the color temperature and color rendering to meet the needs of backlighting or lighting.

[0063] Preferably, the transparent layer 43 may be one of the at least two refractive layers 41 , or may be independently provided as a conversion layer in the packaging structure 4 .

[0064] Furthermore, the material of the adhesive film layer 3 is one or a mixture of silicone, epoxy resin, thermoplastic plastic or thermoplastic resin.

[0065] It can be understood that these materials have good light transmittance, which helps to ensure that the light from the light-emitting chip 2 can effectively pass through the film layer 3, improve the overall light efficiency, and provide good physical protection for the light-emitting chip 2 to prevent damage to the chip from external physical impact and humidity.

[0066] For further information, see Figure 3-Figure 5 The second embodiment of the present invention provides an LED light board 200 , and the LED light board 200 is different from the LED light board 100 provided in the first embodiment only in that the LED light board 200 is not provided with an opening 32 corresponding to the light-emitting chip 2 .

[0067] Specifically, the entire surface of the adhesive film layer 3 directly covers the substrate 1 to encapsulate the light-emitting chip 2 .

[0068] Furthermore, the pattern structure 31 has a protrusion 33 away from the substrate 1 , and a side wall of the protrusion 33 forms an inclination angle with the plane where the substrate 1 is located.

[0069] It can be understood that the raised portion 33 reduces the loss of light directed toward the outside of the substrate 1, and the side walls of the raised portion 33 inclined relative to the plane where the substrate 1 is located can cause the light to be reflected and refracted multiple times, thereby controlling the incident angle and scattering characteristics of the light, thereby enhancing the diffusion effect of the light. The light is scattered and evenly distributed more effectively, reducing glare and visual discomfort.

[0070] Specifically, compared with the light emitting surface arranged parallel to the substrate 1, the raised portion 33 reduces the emission angle of the emitted light by setting a side wall inclined to the substrate 1, so that the light is fully utilized to improve the optical utilization rate. The inclination angle of the side wall to the plane of the substrate 1 ranges from 30° to 80°. Preferably, the angle is 45°. In the present utility model, the inclination angle is not specifically limited, as long as it can play a role in reducing the emission angle.

[0071] Furthermore, the shape of the protrusion 33 includes at least one of a cylindrical shape, a prism shape, and a cone shape. These geometric shapes effectively control and optimize the reflection and refraction of light and focus the light on a specific area.

[0072] Furthermore, the shape of the protrusion 33 can also be hemispherical, parabolic, sawtooth, etc. The shape of the protrusion 33 is not specifically limited in the present invention, as long as the protrusion 33 of the corresponding shape has a side wall inclined to the plane of the substrate 1 to provide more output angles for the output light.

[0073] Furthermore, the length of the protrusion 33 is in the range of 1-50 μm.

[0074] Specifically, in the Mini LED light board 100 for ultra-thin small and medium-sized display applications, the length of the light-emitting chip 2 is usually between 0.2 mm and 1 mm, and the projection length of the protrusion 33 on the plane of the substrate 1 ranges from 1 to 50 μm. The protrusion 33, as a tiny structure, is much smaller than the size of the light-emitting chip 2, creating more reflection angles and refraction angles for the outgoing light.

[0075] See also Figure 6 The third embodiment of the utility model further provides a backlight module 300, including a bracket 301 and an LED light board 100 as in the first embodiment arranged on the bracket 301, which has the same beneficial effects as the LED light board 100 and will not be described in detail herein.

[0076] Compared with the prior art, the LED light board and backlight module provided by the utility model have the following advantages:

[0077] 1. In the LED light board provided in the embodiment of the utility model, the film layer is composed of graphic structures of various properties or different characteristics. Before the light-emitting chip is packaged, the film layer with the graphic structure is pre-covered on the surface of the substrate in a composite manner to form an overall film layer structure. Microscopically, due to the different refractive indices of the film layer and the air, light will be reflected and refracted once or multiple times when passing through the interface where the graphic structure contacts the air, thereby achieving the effect of uniform light.

[0078] 2. The LED light board provided in the embodiment of the utility model optimizes the utilization and transmission efficiency of light by arranging the graphic structure in an array. The position and shape of each graphic structure unit are precisely designed to ensure that as much light as possible can be effectively output from the surface of the LED light board. The light-emitting chip is exposed through the opening. The packaging structure protects the light-emitting chip exposed through the opening from damage by the external environment. The openings corresponding to the light-emitting chip are precisely opened on the film layer to ensure the precise positioning and alignment of the packaging structure in subsequent processes. The packaging structure improves the light emission efficiency.

[0079] 3. The LED light board provided in the embodiment of the utility model has an inclination angle that can change the incident angle and reflection path of the light, increase the number of optical processing times that occur on the outer surface of the film layer, make more light refract out of the film layer, enhance the optical effect on the film layer, and the appropriate inclination angle effectively controls reflection and refraction, so that the light emitted from the light-emitting chip to the backlight side is evenly distributed.

[0080] 4. The LED light board provided in the embodiment of the utility model has a protrusion with a length range of 1-50μm on the film layer of the LED light board. The protrusion is a tiny structure with a size much smaller than that of the light-emitting chip. It can produce more reflection angles and refraction angles, better adjust the incident angle and reflection path of light, and accurately control the uniform light effect through the tiny structure to eliminate the original dark spots of the LED light board.

[0081] 5. The LED light board provided in the embodiment of the present invention, in the packaging structure of the general conventional LED light board, will remove the bubbles in each packaging layer as much as possible to avoid the influence of light emission. The LED light board provided in the present embodiment has a bubble structure embedded in the film layer. The bubble structure is used to create interfaces with different refractive indices in the film layer, so that the light is more reflected or refracted inside the film layer, making the light emission uniform.

[0082] 6. In the LED light board provided in the embodiment of the utility model, the adhesive film layer serves as a covering layer, which completely covers the substrate and protects the light-emitting chip in the opening; the packaging structure protects the light-emitting chip exposed through the opening, extends the service life of the light-emitting chip, and improves its stability and reliability under harsh conditions; the multi-layer packaging structure of different materials effectively controls the reflection, transmission and refraction of light, minimizes the loss of light inside the packaging structure; the refractive index of the packaging structure decreases from the side close to the light-emitting chip to the side away from the light-emitting chip, improves the light propagation path and scattering characteristics, and reduces the color deviation caused by internal reflection and refraction; the reflective layer on the top layer can redirect the scattered light to the front, avoid light loss and waste, improve light utilization and efficiency, and eliminate the bright spot above the chip, thereby making the LED light board emit light evenly.

[0083] 7. The LED light board provided in the embodiment of the utility model, the phosphor can convert a single wavelength of blue light into white light within a wider wavelength range. By accurately selecting the type and concentration of the phosphor, the color temperature and color index of the white light emitted by the LED light board can be adjusted to make it more suitable for different application requirements. The phosphor can also improve the output efficiency of light, achieve more consistent white light color output, reduce color unevenness, and enhance user experience.

[0084] 8. The backlight module provided in the embodiment of the utility model has the same beneficial effects as the above-mentioned LED light board, which will not be described in detail here.

[0085] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the principles of the present invention should be included in the protection scope of the present invention.

Claims

1. An LED light board, characterized in that: The LED light board comprises a substrate, on which a light-emitting chip is electrically connected. The LED light board also comprises an adhesive film layer arranged on the same side of the substrate as the light-emitting chip, and a graphic structure is arranged on the surface of the adhesive film layer.

2. The LED light board according to claim 1, characterized in that: The graphic structures are arranged in an array on the surface of the adhesive film layer. The adhesive film layer is provided with openings corresponding to the light-emitting chips. The openings are provided with packaging structures covering the light-emitting chips.

3. The LED light board according to claim 1, characterized in that: The graphic structure has a protruding portion away from one side of the substrate, and a side wall of the protruding portion forms an inclination angle with the plane where the substrate is located.

4. The LED light board according to claim 3, characterized in that: The shape of the protrusion includes at least one of a cylindrical shape, a prism shape, and a cone shape.

5. The LED light board as claimed in claim 3, characterized in that: The length of the protrusion is in the range of 1 μm to 50 μm.

6. The LED light board according to claim 1, characterized in that: A bubble structure is embedded in the adhesive film layer.

7. The LED light board according to claim 1, characterized in that: The thickness of the adhesive film layer is 50 μm-500 μm.

8. The LED light board according to claim 2, characterized in that: The packaging structure includes at least two stacked refractive layers and a reflective layer arranged on a side of the refractive layer away from the light-emitting chip. The refractive index of the at least two refractive layers decreases from a layer close to the light-emitting chip to a layer away from the light-emitting chip.

9. The LED light board according to claim 2, characterized in that: The packaging structure comprises at least one transparent layer provided with fluorescent powder, and the fluorescent powder converts the blue light emitted by the light-emitting chip into white light.

10. A backlight module, characterized in that: The backlight module comprises a bracket and an LED light board as described in any one of claims 1 to 9 arranged on the bracket.

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