Wafer transmission equipment

Abstract

The utility model discloses a wafer transmission device, comprising a material rack comprising at least one table body for bearing a wafer box; the positioning structure is arranged on the table body and is suitable for positioning the wafer box in a first horizontal direction and a second horizontal direction perpendicular to the first horizontal direction; the abutting mechanism comprises a truss arranged on the table body, a base fixedly connected with the truss, an overturning assembly rotationally connected with the base and at least one abutting bolt in threaded connection with the overturning assembly, and the overturning assembly is suitable for being overturned towards the direction of the wafer box to be in an abutting state; the pressing bolt is pressed against the top surface of the wafer box; and when the overturning assembly is in the abutting state, the axial direction of the abutting bolt is consistent with the vertical direction. By adopting the structure, the reliability of the wafer box in the vertical direction can be improved, and the universality is high.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor processing, in particular to a wafer transmission device. Background Art

[0002] Wafer transfer equipment is usually mounted at the front end of the processing equipment to transfer wafers to the processing equipment. Wafers are generally placed in special wafer boxes and are placed in layers in the wafer boxes. The wafer transfer equipment includes a rack, on which a positioning structure composed of a number of positioning blocks is provided. The wafer box is carried on the rack and positioned in the horizontal direction by the positioning structure. However, the wafer box positioned by the positioning structure has low reliability in the vertical direction and may be separated from the rack, which may easily cause damage to the wafer box or abnormal operation of the transfer equipment.

[0003] Therefore, it is necessary to improve the prior art to overcome the above defects in the prior art. Utility Model Content

[0004] The utility model aims to provide a wafer transmission device to improve the installation reliability of a wafer box.

[0005] The purpose of the utility model is achieved through the following technical solutions: a wafer transmission device, comprising:

[0006] A material rack, comprising at least one platform for carrying a wafer box;

[0007] a positioning structure, disposed on the platform and adapted to position the wafer box in a first horizontal direction and in a second horizontal direction perpendicular to the first horizontal direction;

[0008] The pressing mechanism comprises a truss arranged on the platform, a base fixedly connected to the truss, a flip assembly rotatably connected to the base, and at least one pressing bolt threadedly connected to the flip assembly, wherein the flip assembly is adapted to flip toward the wafer box to a pressing state so that the pressing bolt presses against the top surface of the wafer box;

[0009] Wherein, when the flip assembly is in the pressed state, the axial direction of the pressing bolt is consistent with the vertical direction.

[0010] Furthermore, the flip assembly is located above the wafer box, and includes:

[0011] A turning block, rotatably connected to the base;

[0012] A mounting block, fixedly connected to the flip block;

[0013] Wherein, the mounting block has a first mounting surface, and the pressing bolt is threadedly connected to the first mounting surface.

[0014] Furthermore, when the flip assembly is in a pressed state, the first mounting surface faces and is parallel to the top surface of the wafer box, and the mounting block is suitable for adjusting its position relative to the flip block along a direction perpendicular to the first mounting surface.

[0015] Furthermore, the mounting block has a second mounting surface, the flip assembly includes a handle fixed on the second mounting surface, and when the flip assembly is in a pressed state, the second mounting surface faces away from the placement and loading side of the wafer box.

[0016] Furthermore, the pressure bolt is suitable for being pressed against the wafer box under the action of gravity of the flip assembly; and / or, a magnetic attraction structure is provided between the flip assembly and the truss, and the pressure bolt is suitable for being pressed against the wafer box under the action of magnetism.

[0017] Furthermore, the flip assembly is suitable for flipping to an unlocked state in a direction away from the wafer box and pressing against the truss, and when the flip assembly is in the unlocked state, the wafer box is suitable for taking out or putting into the table along the vertical direction.

[0018] Furthermore, when the flip assembly is in the unlocked state, the flip assembly is suitable for being pressed against the truss under the action of gravity; and / or, a magnetic structure is provided between the flip assembly and the truss, and the flip assembly and the truss are suitable for being pressed against each other under the action of magnetism.

[0019] Furthermore, the positioning structure includes:

[0020] A first positioning block, arranged on the platform;

[0021] A second positioning block is provided on the platform and is relatively arranged along the first horizontal direction;

[0022] a third positioning block, disposed on the platform and arranged opposite to the first positioning block and / or the second positioning block along the second horizontal direction;

[0023] Among them, the wafer box includes a first wafer box and a second wafer box with different specifications, the first positioning block, the second positioning block and the third positioning block are suitable for cooperating to form a first area and a second area, the first area can position the first wafer box in the first horizontal direction and the second horizontal direction, and the second area can position the second wafer box in the first horizontal direction and the second horizontal direction.

[0024] Further, the first positioning block and the second positioning block are suitable for cooperating to position the rear of the wafer box in the first horizontal direction, the third positioning block is suitable for positioning the front of the wafer box in the first horizontal direction, and the first positioning block, the second positioning block and the third positioning block are suitable for cooperating to position the front and rear of the wafer box in the second horizontal direction.

[0025] Furthermore, the wafer transfer equipment further comprises:

[0026] A handling robot, adapted to pick up and place wafers on a pick-up and place side of the wafer box;

[0027] An edge finder, located within the travel range of the handling robot;

[0028] Wherein, the transport robot is suitable for transporting the wafers in the wafer box to the edge finder.

[0029] Compared with the prior art, the utility model has the following beneficial effects: the utility model provides a pressing mechanism, and when the wafer box is placed on the material rack, the flip assembly is suitable for flipping toward the direction of the wafer box to a pressing state, so that the pressing bolt presses against the top surface of the wafer box, thereby improving the reliability of the wafer box in the vertical direction and preventing the wafer box from detaching from the table. The operation is convenient, the structure is simple, and the cost is low. In addition, when the flip assembly is in the pressing state, the axial direction of the pressing bolt is consistent with the vertical direction, so that when replacing wafer boxes of different specifications and heights, the pressing bolt can be adaptively replaced or rotated as needed to adjust the axial position of the adjuster to ensure that the pressing bolt reliably presses the wafer box, thereby improving the versatility of the pressing mechanism. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1 It is a structural schematic diagram of the wafer transmission equipment of the utility model.

[0031] Figure 2 It is a schematic diagram of the installation of the platform body and the wafer box in the utility model.

[0032] Figure 3 It is a structural schematic diagram of the platform body in the utility model.

[0033] Figure 4 It is a partial exploded structural schematic diagram of the pressing mechanism in the utility model.

[0034] Figure 5 It is an installation schematic diagram of the positioning structure in the utility model.

[0035] Figure 6 It is a structural schematic diagram of a wafer box in the utility model.

[0036] Figure 7 yes Figure 6Schematic diagram of the structure in another direction.

[0037] Description of reference numerals:

[0038] 100, rack; 110, table; 200, wafer box; 210, wafer; 220, first inner side; 230, rear side; 240, second inner side; 250, front side; 300, positioning structure; 310, first positioning block; 311, first positioning groove; 3111, first positioning wall; 3112, second positioning wall; 312, second strip hole; 313, first block; 320, second positioning block; 321, second positioning groove; 330, third positioning Block; 331, positioning block body; 3311, third positioning wall; 332, protrusion; 400, pressing mechanism; 410, truss; 420, base; 430, flip assembly; 431, flip block; 432, mounting block; 4321, first mounting surface; 4322, second mounting surface; 4323, first strip hole; 440, pressing bolt; 450, cam follower; 460, ball plunger; 470, handle; 500, handling robot; 600, edge finder. DETAILED DESCRIPTION

[0039] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are described in detail below in conjunction with the accompanying drawings. It is to be understood that the specific embodiments described herein are only used to explain the present application, rather than to limit the present application. It should also be noted that, for ease of description, only some structures related to the present application are shown in the accompanying drawings, rather than all structures. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of this application.

[0040] The terms "including" and "having" and any variations thereof in this application are intended to cover non-exclusive inclusions. For example, a process, method, system, product or device comprising a series of steps or units is not limited to the listed steps or units, but may optionally include steps or units not listed, or may optionally include other steps or units inherent to these processes, methods, products or devices.

[0041] Reference to "embodiments" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0042] See also Figure 1 and Figure 2 As shown, a wafer transfer device corresponding to a preferred embodiment of the utility model includes: a material rack 100, including at least one table 110 for carrying a wafer box 200; a positioning structure 300, which is arranged on the table 110 and is suitable for positioning the wafer box 200 in a first horizontal direction and a second horizontal direction perpendicular to the first horizontal direction; a pressing mechanism 400, including a truss 410 arranged on the table 110, a base 420 fixedly connected to the truss 410, a flip assembly 430 rotatably connected to the base 420, and at least one pressing bolt 440 threadedly connected to the flip assembly 430, the flip assembly 430 is suitable for flipping toward the direction of the wafer box 200 to a pressing state, so that the pressing bolt 440 presses against the top surface of the wafer box 200; wherein, when the flip assembly 430 is in the pressing state, the axial direction of the pressing bolt 440 is consistent with the vertical direction.

[0043] The utility model provides a pressing mechanism 400. When the wafer box 200 is placed on the material rack 100, the flip assembly 430 is suitable for flipping toward the wafer box 200 to a pressing state, so that the pressing bolt 440 presses against the top surface of the wafer box 200, thereby improving the reliability of the wafer box 200 in the vertical direction and preventing the wafer box 200 from separating from the table 110. The utility model has convenient operation, simple structure and low cost. In addition, when the flip assembly 430 is in the pressing state, the axial direction of the pressing bolt 440 is consistent with the vertical direction, so that when replacing wafer boxes 200 of different specifications and heights, the pressing bolt 440 can be adaptively replaced or rotated as needed to adjust the axial position of the adjuster to ensure that the pressing bolt 440 reliably presses the wafer box 200, thereby improving the versatility of the pressing mechanism 400.

[0044] Further, refer to Figure 3 and Figure 4 As shown, the truss 410 is located at the access side of the wafer box 200, and has a clearance space to avoid the access side of the wafer box 200, so as not to affect the wafer 210 to be taken out or put into the wafer box 200. The flip assembly 430 is set on the crossbeam of the truss 410 and is located above the wafer box 200.

[0045] The flip assembly 430 includes a flip block 431 and a mounting block 432 . The flip block 431 is rotatably connected to the base 420 , and the mounting block 432 is fixedly connected to the flip block 431 .

[0046] Specifically, there are two bases 420 arranged opposite to each other, and the flip block 431 has a first mounting end and a second mounting end opposite to the first mounting end, the first mounting end is accommodated between the two bases 420, and the mounting block 432 is arranged at the second mounting end. A cam follower 450 is connected between one of the bases 420 and one side of the first mounting end, and a cam follower 450 is also connected between the other base 420 and the other side of the first mounting end, so as to realize the flipping movement of the flip block 431 relative to the base 420.

[0047] Preferably, a ball plunger 460 is provided on each base 420 , and the ball plungers 460 on the two bases 420 are arranged opposite to each other, and the flip block 431 is pressed tightly between the two ball plungers 460 , thereby improving the reliability of the flip block 431 after installation.

[0048] Furthermore, the mounting block 432 has a first mounting surface 4321, and the pressing bolts 440 are threadedly connected to the first mounting surface 4321. In this embodiment, there are two pressing bolts 440, which are arranged on both sides of the mounting block 432, and the distribution direction of the pressing bolts 440 is consistent with the distribution direction of the base 420.

[0049] When the flip assembly 430 is in a tightened state, the first mounting surface 4321 is oriented toward and parallel to the top surface of the wafer box 200, and the mounting block 432 is suitable for adjusting its position relative to the flip block 431 along a direction perpendicular to the first mounting surface 4321, thereby adjusting the position of the pressing bolt 440 in the vertical direction, thereby further improving the adaptability of the flip assembly 430.

[0050] Specifically, the mounting block 432 also has a second mounting surface 4322, the second mounting surface 4322 is perpendicular to the first mounting surface 4321, a first strip hole 4323 is opened through the second mounting surface 4322, the length direction of the first strip hole 4323 is perpendicular to the first mounting surface 4321, and a connecting hole corresponding to the first strip hole 4323 is provided on the flip block 431, and a threaded part is connected between the first strip hole 4323 and the connecting hole to fix the mounting block 432 and the flip block 431.

[0051] Furthermore, the flip assembly 430 includes a handle 470 fixed on the second mounting surface 4322 . When the flip assembly 430 is in a pressed state, the second mounting surface 4322 faces away from the placement and picking side of the wafer box 200 , so that the operator can easily hold the handle 470 to flip the flip assembly 430 .

[0052] Furthermore, the flip block 431 and / or the mounting block 432 may be made of a material with a relatively high density to increase its own weight, so that the pressing bolt 440 is suitable for pressing against the wafer box 200 under the gravity of the flip assembly 430. And / or, a magnetic attraction structure (not shown) may also be provided between the flip assembly 430 and the truss 410, and the pressing bolt 440 is suitable for pressing against the wafer box 200 under the action of the magnetic attraction.

[0053] The flip assembly 430 is adapted to flip to an unlocked state in a direction away from the wafer box 200 and press against the truss 410, and when the flip assembly 430 is in the unlocked state, the wafer box 200 is adapted to be taken out or put into the table 110 in a vertical direction. When the flip assembly 430 is in the unlocked state, the flip assembly 430 is adapted to be held against the truss 410 under the action of gravity; and / or, a magnetic attraction structure is also provided between the flip assembly 430 and the truss 410, and the flip assembly 430 and the truss 410 are adapted to be pressed against each other under the action of magnetic attraction.

[0054] When the wafer box 200 needs to be loaded, the flip assembly 430 is flipped to the unlocked state, and then the wafer box 200 is placed on the table 110 and positioned on the positioning structure 300; then the flip assembly 430 is flipped to the tightening state, at which time the pressing bolt 440 is pressed against the top surface of the wafer box 200; and when replacing wafer boxes 200 of other sizes, the pressing bolt 440 and / or the mounting block 432 can be adjusted to ensure that wafer boxes 200 of different heights can be effectively tightened.

[0055] Further, refer to Figure 3 , Figures 5 to 7 As shown, the positioning structure 300 includes a first positioning block 310, a second positioning block 320 and a third positioning block 330 arranged on the stage 110. The first positioning block 310 and the second positioning block 320 are arranged relatively along the first horizontal direction, and the first positioning block 310 and / or the second positioning block 320 and the third positioning block 330 are arranged relatively along the second horizontal direction. In this embodiment, the first horizontal direction specifically refers to the width direction of the wafer box 200, and the second horizontal direction specifically refers to the depth direction of the wafer box 200.

[0056] The wafer box 200 includes a first wafer box and a second wafer box of different specifications. The first positioning block 310, the second positioning block 320 and the third positioning block 330 are suitable for cooperating to form a first area and a second area. The first area can position the first wafer box in the first horizontal direction and the second horizontal direction, and the second area can position the second wafer box in the first horizontal direction and the second horizontal direction.

[0057] The first positioning block 310 and the second positioning block 320 are suitable for cooperating to position the rear of the wafer box 200 in the first horizontal direction, and the third positioning block 330 is suitable for positioning the front of the wafer box 200 in the first horizontal direction. The first positioning block 310, the second positioning block 320 and the third positioning block 330 are suitable for cooperating to position the front and rear of the wafer box 200 in the second horizontal direction.

[0058] Specifically, the first positioning block 310 is recessed with an L-shaped first positioning groove 311 from the side facing away from the second positioning block 320, and the second positioning block 320 is recessed with an L-shaped second positioning groove 321 from the side facing away from the first positioning block 310. The first positioning groove 311 and the second positioning groove 321 are suitable for cooperating in positioning the rear of the wafer box 200.

[0059] The first positioning groove 311 and the second positioning groove 321 have the same structure. Taking the first positioning groove 311 as an example, the first positioning groove 311 includes a first positioning wall 3111 perpendicular to the first horizontal direction and a second positioning wall 3112 perpendicular to the second horizontal direction. The two first positioning walls 3111 are suitable for cooperating in positioning the rear of the wafer box 200 in the first horizontal direction, and the two second positioning walls 3112 are suitable for cooperating in positioning the rear of the wafer box 200 in the second horizontal direction.

[0060] A notch is formed at the rear end of the wafer box 200 along the vertical direction from the bottom surface to form two first inner side surfaces 220 perpendicular to the first horizontal direction and two rear side surfaces 230 perpendicular to the second horizontal direction. The two first inner side surfaces 220 are respectively in contact with different first positioning walls 3111 to achieve positioning of the rear end of the wafer box 200 in the first horizontal direction, and the two rear side surfaces 230 are respectively in contact with different second positioning walls 3112 to achieve positioning of the rear end of the wafer box 200 in the second horizontal direction.

[0061] There are two first positioning grooves 311, which are arranged side by side along the second horizontal direction, and the two have different degrees of depression. There are two second positioning grooves 321, which are arranged side by side along the second horizontal direction, and the two have different degrees of depression. The two second positioning grooves 321 correspond to different first positioning grooves 311, respectively, one of the first positioning grooves 311 and the second positioning groove 321 is adapted to the first wafer box, and the other first positioning groove 311 and the second positioning groove 321 is adapted to the second wafer box.

[0062] Preferably, the first positioning block 310 and the second positioning block 320 are both provided with a second strip hole 312 extending through the vertical direction, and the platform 110 is provided with a connecting hole corresponding to the second strip hole 312, and a screw is connected between the two. The length direction of the second strip hole 312 is inclined to the first horizontal direction and the second horizontal direction, so that the first positioning block 310 and the second positioning block 320 can adjust their positions in the first horizontal direction and the second horizontal direction at the same time, further improving the adaptability, so as to cooperate with the third positioning block 330 to accurately position wafer boxes 200 of more sizes.

[0063] Preferably, the first positioning block 310 is composed of two mutually independent first blocks 313, each of which is provided with a first positioning groove 311; and / or the second positioning block 320 is composed of two mutually independent second blocks, each of which is provided with a second positioning groove 321. By adopting the above structure, the adjustment of the first positioning block 310 and / or the second positioning block 320 is more targeted, and the convenience of adjustment is improved.

[0064] Further, the third positioning block 330 includes a positioning block body 331 and a bump group. The positioning block body 331 has a third positioning wall 3311 facing the first positioning block 310 and the second positioning block 320, the third positioning wall 3311 is perpendicular to the second horizontal direction, and the third positioning wall 3311 is suitable for positioning the front of the wafer box 200 in the second horizontal direction. The bump group includes two bumps 332 arranged on both sides of the third positioning wall 3311, and the two bumps 332 are suitable for positioning the front of the wafer box 200 in the first horizontal direction.

[0065] Specifically, a notch is formed in the front end of the wafer box 200 from the bottom along the vertical direction to form two second inner side surfaces 240 perpendicular to the first horizontal direction and two front side surfaces 250 perpendicular to the second horizontal direction. The two second inner side surfaces 240 of the wafer box 200 are respectively in contact with the side surfaces of different protrusions 332 to achieve the positioning of the front end of the wafer box 200 in the first horizontal direction, and the two front side surfaces 250 are in contact with the third positioning wall 3311 to achieve the positioning of the front end of the wafer box 200 in the second horizontal direction.

[0066] In this embodiment, the number of the bump groups is two, so that the third positioning block 330 can be adapted to the first wafer box and the second wafer box at the same time.

[0067] Furthermore, a detection structure may be provided on the stage 110 and / or the truss 410 to detect whether the wafer box 200 is placed abnormally, and to detect the number of wafers 210 and whether there are inclined wafers or overlapping wafers. The detection structure includes a detection sensor, a visual camera, and the like.

[0068] Furthermore, the wafer transfer equipment also includes a handling robot 500 and an edge finder 600. The handling robot 500 is suitable for picking up and placing the wafer 210 on the pick-up and placement side of the wafer box 200. The edge finder 600 is located within the travel range of the handling robot 500. The handling robot 500 is suitable for moving the wafer 210 moved from the wafer box 200 to the edge finder 600 to position the wafer 210, and then the handling robot 500 moves the wafer 210 to the corresponding processing equipment for processing; after the wafer 210 is processed, the handling robot 500 transports the wafer 210 back to the wafer box 200, and when all the wafers 210 in the wafer box 200 have been processed, the operator removes the wafer box 200 from the table 110 and replaces it with a new wafer box 200.

[0069] The above description is only an implementation method of the present application, and does not limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the description and drawings of this application, or directly or indirectly used in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. A wafer transfer device, characterized in that: include: A material rack (100) comprises at least one platform (110) for carrying a wafer box (200); A positioning structure (300) is disposed on the platform (110) and is suitable for positioning the wafer box (200) in a first horizontal direction and in a second horizontal direction perpendicular to the first horizontal direction; A pressing mechanism (400) comprises a truss (410) arranged on the platform (110), a base (420) fixedly connected to the truss (410), a flip assembly (430) rotatably connected to the base (420), and at least one pressing bolt (440) threadedly connected to the flip assembly (430), wherein the flip assembly (430) is adapted to flip toward the wafer box (200) to a pressing state so that the pressing bolt (440) presses against the top surface of the wafer box (200); Wherein, when the flip assembly (430) is in the pressed state, the axial direction of the pressing bolt (440) is consistent with the vertical direction.

2. The wafer transfer device according to claim 1, characterized in that: The flip assembly (430) is located above the wafer box (200), and comprises: A turning block (431) is rotatably connected to the base (420); A mounting block (432) fixedly connected to the flip block (431); Wherein, the mounting block (432) has a first mounting surface (4321), and the pressure bolt (440) is threadedly connected to the first mounting surface (4321).

3. The wafer transfer device according to claim 2, characterized in that: When the flip assembly (430) is in a pressed state, the first mounting surface (4321) faces and is parallel to the top surface of the wafer box (200), and the mounting block (432) is suitable for adjusting its position relative to the flip block (431) along a direction perpendicular to the first mounting surface (4321).

4. The wafer transfer device according to claim 2, characterized in that: The mounting block (432) has a second mounting surface (4322), and the flip assembly (430) includes a handle (470) fixed on the second mounting surface (4322). When the flip assembly (430) is in a pressed state, the second mounting surface (4322) faces away from the placement and picking side of the wafer box (200).

5. The wafer transfer device according to claim 1, characterized in that: The pressing bolt (440) is suitable for being pressed against the wafer box (200) under the action of gravity of the flip assembly (430); and / or, a magnetic attraction structure is provided between the flip assembly (430) and the truss (410), and the pressing bolt (440) is suitable for being pressed against the wafer box (200) under the action of magnetism.

6. The wafer transfer device according to claim 1, characterized in that: The flip assembly (430) is suitable for flipping to an unlocked state in a direction away from the wafer box (200) and pressing against the truss (410), and when the flip assembly (430) is in the unlocked state, the wafer box (200) is suitable for taking out or putting into the platform (110) in a vertical direction.

7. The wafer transfer device according to claim 6, characterized in that: When the flip assembly (430) is in the unlocked state, the flip assembly (430) is suitable for being pressed against the truss (410) under the action of gravity; and / or, a magnetic attraction structure is provided between the flip assembly (430) and the truss (410), and the flip assembly (430) and the truss (410) are suitable for being pressed against each other under the action of magnetic attraction.

8. The wafer transfer device according to claim 1, characterized in that: The positioning structure (300) comprises: A first positioning block (310) is arranged on the platform (110); A second positioning block (320) is disposed on the platform (110) and is relatively arranged along the first horizontal direction; A third positioning block (330) is disposed on the platform (110) and is arranged opposite to the first positioning block (310) and / or the second positioning block (320) along the second horizontal direction; Wherein, the wafer box (200) includes a first wafer box and a second wafer box of different specifications, the first positioning block (310), the second positioning block (320) and the third positioning block (330) are suitable for cooperating to form a first area and a second area, the first area can position the first wafer box in the first horizontal direction and the second horizontal direction, and the second area can position the second wafer box in the first horizontal direction and the second horizontal direction.

9. The wafer transfer device according to claim 8, characterized in that: The first positioning block (310) and the second positioning block (320) are suitable for cooperating to position the rear of the wafer box (200) in the first horizontal direction, the third positioning block (330) is suitable for positioning the front of the wafer box (200) in the first horizontal direction, and the first positioning block (310), the second positioning block (320) and the third positioning block (330) are suitable for cooperating to position the front and rear of the wafer box (200) in the second horizontal direction.

10. The wafer transfer device according to any one of claims 1 to 9, characterized in that: The wafer transfer equipment further comprises: A transport robot (500) adapted to pick up and place wafers (210) at a pick-up and place side of the wafer box (200); An edge finder (600) is located within the travel range of the transport robot (500); The transport robot (500) is suitable for transporting the wafer (210) of the wafer box (200) to the edge finder (600).

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