Packaging film structure, circuit board packaging structure and battery module

Abstract

The embodiment of the utility model discloses a packaging film structure, a circuit board packaging structure and a battery module. The packaging film structure comprises an insulating layer; the covering layer is provided with a connecting part and a wrapping part, the wrapping part surrounds the connecting part, the insulating layer is connected with the covering layer, and the insulating layer is located on the connecting part. According to the packaging film structure, the insulating layer and the covering layer are combined together to form the packaging film structure, so that flatness of the insulating layer can be guaranteed when the packaging film structure is attached to the circuit board structure, wrinkles of the insulating layer and the covering layer are avoided, and meanwhile abnormal sound generated after the insulating layer and the circuit board are attached can be avoided.

Description

Technical Field

[0001] The utility model relates to the technical field of battery packaging, in particular to a packaging film structure, a circuit board packaging structure and a battery module. Background Art

[0002] In order to insulate the battery protection board (Power Circuit Module, PCM for short), the existing insulation protection solution is to first bond Nomex (Nomex paper) used for insulation to PCM, and then attach PI (Polyimide) to Nomex. The main problem with this solution is that when Nomex is attached to the surface of PCM, the adhesive bonding area between some components on PCM and Nomex is too small, which is easy to fall off and make abnormal noises; at the same time, due to the inconsistent height of components, Nomex is prone to wrinkles after attachment, which causes the PI label attached to the surface of Nomex to also have an appearance wrinkle problem. Utility Model Content

[0003] The embodiments of the present application provide a packaging film structure, a circuit board packaging structure and a battery module to solve the technical problem in the prior art that noise is easily generated and wrinkles appear when insulating the protection plate.

[0004] In order to solve the above technical problems, the embodiments of the present application disclose the following technical solutions:

[0005] In a first aspect, a packaging film structure is provided, comprising:

[0006] Insulation layer;

[0007] The covering layer comprises a connecting portion and a covering portion, wherein the covering portion surrounds the connecting portion, the insulating layer is connected to the covering layer, and the insulating layer is located at the connecting portion.

[0008] In combination with the first aspect, the connection portion includes a first connection area, a second connection area and a third connection area, and the first connection area, the second connection area and the third connection area are sequentially connected along a first direction Z;

[0009] The insulating layer is located in the second connection area, and a first glue coating layer is provided between the insulating layer and the covering layer.

[0010] In combination with the first aspect, the covering portion includes a first covering area and a second covering area, and the first covering area and the second covering area are relatively connected to two sides of the third connection area along the second direction X;

[0011] The second direction X intersects with the first direction Z.

[0012] In combination with the first aspect, the covering portion includes a third covering area and a fourth covering area, and the third covering area and the fourth covering area are relatively connected to two sides of the first connecting area along the second direction X;

[0013] The second direction X intersects with the first direction Z.

[0014] In combination with the first aspect, the covering portion includes a fifth covering area and a sixth covering area, and the fifth covering area and the sixth covering area are connected to two sides of the connecting portion along the first direction Z;

[0015] Wherein, the fifth cladding region is connected to the first connection region, and the sixth cladding region is connected to the third connection region.

[0016] In a second aspect, a circuit board packaging structure is provided, comprising the packaging film structure as described in any one of the first aspects, and:

[0017] A circuit board, wherein the circuit board is provided with a first component and a second component, wherein along a thickness direction of the circuit board, the first component has a first height, the second component has a second height, and the first height is greater than the second height;

[0018] The insulating layer is connected to the first component; the covering layer is connected to a side of the insulating layer away from the circuit board;

[0019] The first component and the second component are located on the same side of the circuit board, and there is a gap between the insulating layer and the second component.

[0020] In a third aspect, a circuit board packaging structure is provided, comprising the packaging film structure as described in any one of the first aspects, and:

[0021] A circuit board, wherein the circuit board is provided with a first component and a second component, the first component and the second component are located on the same side of the circuit board, along the thickness direction of the circuit board, the first component has a first height, the second component has a second height, and the first height is greater than the second height;

[0022] The insulating layer is connected to a side of the circuit board away from the first component and the second component; the covering layer is connected to a side of the insulating layer away from the circuit board.

[0023] In combination with the third aspect, a second coating layer is provided between the insulating layer and the circuit board.

[0024] In a fourth aspect, a battery module is provided, comprising the packaging film structure as described in any one of the first aspects; and

[0025] At least two batteries, wherein the tabs of the batteries are arranged opposite to each other;

[0026] A circuit board, wherein the circuit board is provided with a first component and a second component, wherein the first component and the second component are located on the same side of the circuit board, wherein along the thickness direction of the circuit board, the first component has a first height, and the second component has a second height, wherein the first height is greater than the second height, and the circuit board is connected to the tab;

[0027] The insulating layer is connected to the first component, the covering layer is connected to a side of the insulating layer away from the circuit board, and the first connection area and the third connection area of ​​the connecting portion are connected to the battery.

[0028] In combination with the fourth aspect, the battery further includes a protective frame, a covering layer and a support plate, wherein the protective frame surrounds the peripheral side of the battery; the covering portion is bent to cover the protective frame and is connected to a side of the battery away from the connecting portion;

[0029] The covering layer is connected to a side of the battery away from the connecting portion;

[0030] The support plate is arranged on a side of the circuit board away from the insulating layer, and the support plate is connected to the protective frame;

[0031] Wherein, the support plate is also connected to the battery.

[0032] One of the above technical solutions has the following advantages or beneficial effects:

[0033] The present application provides a packaging film structure, comprising: an insulating layer; a covering layer, the covering layer having a connecting portion and a covering portion, the covering portion surrounding the connecting portion, the insulating layer connected to the covering layer, and the insulating layer located at the connecting portion. The present application combines the insulating layer and the covering layer together to form a packaging film structure, so that the packaging film structure can ensure the flatness of the insulating layer when it is attached to the circuit board structure, thereby avoiding wrinkles on the insulating layer and the covering layer, and also avoiding abnormal noise after the insulating layer is attached to the circuit board.

[0034] The present application also provides a circuit board packaging structure, including: a circuit board, the circuit board is provided with a first component and a second component, along the thickness direction of the circuit board, the first component has a first height, the second component has a second height, and the first height is greater than the second height; an insulating layer, the insulating layer is connected to the first component; a covering layer, the covering layer is connected to the side of the insulating layer away from the circuit board; wherein the first component and the second component are located on the same side of the circuit board, and there is a gap between the insulating layer and the second component. The first component on the circuit board of the present application is bonded to the insulating layer, while maintaining a gap with the second component, and the covering layer covers the insulating layer, so that the insulating layer can remain flat, avoiding wrinkles on the insulating layer and the covering layer, and also avoiding abnormal noise after the insulating layer is bonded to the circuit board.

[0035] The present application also provides a circuit board packaging structure, including: a circuit board, the circuit board is provided with a first component and a second component, the first component and the second component are located on the same side of the circuit board, along the thickness direction of the circuit board, the first component has a first height, the second component has a second height, and the first height is greater than the second height; an insulating layer, the insulating layer is connected to the side of the circuit board away from the first component and the second component; a covering layer, the covering layer is connected to the side of the insulating layer away from the circuit board. In the present application, the insulating layer can be completely attached to the other side of the circuit board and remain flat, and the covering layer is also flatly attached to the insulating layer, thereby eliminating wrinkles in the insulating layer and the covering layer, and avoiding abnormal noise after the insulating layer is attached to the circuit board.

[0036] The present application also provides a battery module, including a packaging film structure as provided in any one of the above embodiments; and at least two batteries, the tabs of the batteries are arranged opposite to each other; a circuit board, the circuit board is provided with a first component and a second component, the first component and the second component are located on the same side of the circuit board, along the thickness direction of the circuit board, the first component has a first height, the second component has a second height, the first height is greater than the second height, and the circuit board is connected to the tab; wherein, the insulating layer is connected to the first component, the covering layer is connected to the side of the insulating layer away from the circuit board, and the first connection area and the third connection area are connected to the battery. The present application packages the circuit board in the battery module through a packaging film structure, the first component on the circuit board is bonded to the insulating layer, the second component maintains a gap with the insulating layer, and the covering layer covers the insulating layer, so that the insulating layer can remain flat, avoiding wrinkles on the insulating layer and the covering layer, and also avoiding abnormal noise after the insulating layer is bonded to the circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] The technical solution and other beneficial effects of the present application will be made apparent by describing in detail the specific implementation methods of the present application in conjunction with the accompanying drawings.

[0038] Figure 1A schematic diagram of a packaging film structure provided in an embodiment of the present application;

[0039] Figure 2 A schematic diagram of a circuit board packaging structure provided by an embodiment of the present application;

[0040] Figure 3 A schematic diagram of a circuit board packaging structure provided by another embodiment of the present application;

[0041] Figure 4 A schematic diagram of the explosion structure of the battery module provided in an embodiment of the present application along the third direction Z.

[0042] The components of the attached drawings are identified as follows:

[0043] 100-circuit board, 110-first component, 120-second component, 200-insulating layer, 300-covering layer, 310-connecting part, 311-first connecting area, 312-second connecting area, 313-third connecting area, 320-coating part, 321-first coating area, 322-second coating area, 323-third coating area, 324-fourth coating area, 325-fifth coating area, 326-sixth coating area, 400-battery, 500-protective frame, 510-support plate, 600-covering layer, 700-first adhesive layer, 800-second adhesive layer. DETAILED DESCRIPTION

[0044] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. In the description of the present application, it is necessary to understand that the orientation or position relationship indicated by the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", etc. is based on the orientation or position relationship shown in the drawings, which is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation to the present application. In addition, the terms "first" and "second" are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, the features defined as "first" and "second" can explicitly or implicitly include one or more of the features. In the description of the present application, the meaning of "multiple" is two or more, unless otherwise clearly and specifically defined.

[0045] Laptops meet people's needs for mobile office, online education, gaming and entertainment in daily life, and are gradually developing towards intelligence, efficiency, and thinness. The thinness and lightness related to laptop batteries naturally become the focus of attention and improvement of battery packs. Due to the special properties of batteries, special attention should be paid to the anti-collision, waterproof, insulation and other aspects of PCM during battery design.

[0046] The relevant technicians of this application noticed that the insulation treatment of the battery is generally to attach Nomex to PCM. Due to the uneven height of the components on the PCM, the Nomex will inevitably be wrinkled after attachment. After the attachment is completed, PI tape is covered on the wrinkled Nomex, so that the PI also has the same wrinkles. The wrinkled Nomex and PI not only affect the appearance but also further cause abnormal noise of the battery.

[0047] The embodiment of the present application proposes a method of changing the Nomex originally attached to the components to be attached to the adhesive backing surface of PI, and the PI and Nomex are integrated into a packaging film structure, so that the attachment problem of Nomex is solved. In addition, after the Nomex is effectively fixed, it is possible to selectively control whether the contact surface between Nomex and PCM is adhesive: the adhesive type is suitable for attaching to the relatively flat surface of PCM to improve the adhesive tape attachment effect; the non-adhesive type is suitable for contacting irregular planes. On the one hand, it increases the strength of the adhesive tape in the uneven area and reduces wrinkles. At the same time, it has the same effect as the adhesive removal solution and reduces the incidence of abnormal noise.

[0048] Explanation of terms in this application:

[0049] Nomex paper, also known as Nomex paper, is a synthetic aromatic amide polymer insulating paper with high mechanical properties and flexibility, and can maintain its characteristics at higher temperatures.

[0050] PI (Polyimide) is a high-performance polymer material with excellent heat resistance, electrical insulation, mechanical properties and chemical stability.

[0051] The specific implementation methods of the present application are further described below through the examples:

[0052] like Figure 1As shown, the embodiment of the present application provides a packaging film structure, including: an insulating layer 200; a covering layer 300, the covering layer 300 has a connecting portion 310 and a covering portion 320, the covering portion 320 surrounds the connecting portion 310, the insulating layer 200 is connected to the covering layer 300, and the insulating layer 200 is located at the connecting portion 310. Specifically, the insulating layer 200 is made of Nomex, and the insulating layer 200 and the covering layer 300 made of Nomex are combined together to form a packaging film structure. Since the covering layer 300 can provide better adhesion, the packaging film structure can ensure the flatness of the insulating layer 200 when it is attached to the circuit board structure, thereby avoiding wrinkles in the insulating layer 200 and the covering layer 300. Furthermore, since Nomex is relatively soft, when the insulating layer 200 does not have glue, the insulating layer 200 can avoid the sticky noise generated when the circuit board area is pressed after being attached to the circuit board. The present application optimizes the structure of the adhesive tape by combining the insulating layer 200 and the covering layer 300, which helps to insulate and protect the circuit board and has a good effect in solving the problems of poor battery appearance and abnormal noise.

[0053] In some other embodiments of the present application, the insulating layer 200 may also be selected from other flexible materials with insulating effects; the covering layer 300 may also be selected from other materials that can be insulated and protected. The specific material can be selected according to actual conditions, and the embodiments of the present application will not make further restrictions or enumerations here.

[0054] like Figure 1 As shown, in the embodiment of the present application, the connection portion 310 includes a first connection area 311, a second connection area 312 and a third connection area 313, and the first connection area 311, the second connection area 312 and the third connection area 313 are sequentially connected along the first direction Z; the insulating layer 200 is located in the second connection area 312. Specifically, the first connection area 311 and the third connection area 313 are symmetrically connected to both sides of the second connection area 312. Since the circuit board is generally connected in the middle of two batteries, when the circuit board and the insulating layer 200 are attached, the second connection area 312 is used to fix and match the insulating layer 200, and the first connection area 311 and the third connection area 313 are both used to connect the batteries on both sides of the circuit board, thereby helping to fix the insulating layer 200.

[0055] In some other embodiments of the present application, according to the connection method or arrangement method of the battery and the circuit board, the connection part 310 may also include only two connection areas, or more connection areas, and the insulating layer 200 may be arranged in any connection area. The specific number of connection areas of the connection part 310 and the connection area to which the insulating layer 200 is connected can be selected or changed according to the structure of the circuit board and the structure of the battery, and the embodiments of the present application will not be listed in detail here.

[0056] like Figure 1 As shown, in the embodiment of the present application, the covering portion 320 includes a first covering area 321 and a second covering area 322, and the first covering area 321 and the second covering area 322 are relatively connected to the two sides of the third connection area 313 along the second direction X; wherein the second direction X intersects with the first direction Z. Specifically, when the battery is packaged, after the insulating layer 200 is bonded to the circuit board, the third connection area 313 is connected to the battery on one side of the circuit board. In order to improve the tightness of the battery after packaging, the first covering area 321 and the second covering area 322 are arranged on the opposite sides of the third connection area 313. The first covering area 321 and the second covering area 322 are used to bypass the side of the battery and bond to the other side of the battery after the third connection area 313 is connected to one of the surfaces of the battery, thereby protecting the side of the battery and improving the stability and sealing of the battery after packaging.

[0057] like Figure 1 As shown, in the embodiment of the present application, the covering portion 320 includes a third covering area 323 and a fourth covering area 324, and the third covering area 323 and the fourth covering area 324 are relatively connected to the two sides of the first connection area 311 along the second direction X; wherein the second direction X intersects with the first direction Z. Specifically, when the battery is packaged, after the insulating layer 200 is bonded to the circuit board, the first connection area 311 is connected to the battery on one side of the circuit board. In order to improve the tightness of the battery after packaging, the third covering area 323 and the fourth covering area 324 are arranged on the opposite sides of the first connection area 311. The third covering area 323 and the fourth covering area 324 are used to bypass the side of the battery and bond to the other side of the battery after the first connection area 311 is connected to one of the surfaces of the battery, thereby protecting the side of the battery and improving the stability and sealing of the battery after packaging.

[0058] like Figure 1 As shown, in the embodiment of the present application, the coating portion 320 includes a fifth coating area 325 and a sixth coating area 326, and the fifth coating area 325 and the sixth coating area 326 are connected to both sides of the connection portion 310 along the first direction Z; wherein the fifth coating area 325 is connected to the first connection area 311, and the sixth coating area 326 is connected to the third connection area 313. Specifically, when the battery is packaged, after the insulating layer 200 is attached to the circuit board, the first connection area 311 and the third connection area 313 are respectively connected to the batteries on both sides of the circuit board. In order to improve the tightness of the battery after packaging, the fifth coating area 325 and the sixth coating area 326 are respectively arranged on the opposite sides of the first connection area 311 and the third connection area 313. The fifth encapsulation area 325 and the sixth encapsulation area 326 are used to bypass the side of the battery and adhere to the other side of the battery after the first connection area 311 and the third connection area 313 are connected to one side of the battery, thereby protecting the side of the battery and improving the stability and sealing of the battery after packaging.

[0059] like Figure 1 As shown, in the embodiment of the present application, a first adhesive layer 700 is provided between the insulating layer 200 and the covering layer 300. Specifically, the first adhesive layer 700 is provided on the side where the covering layer 300 is connected to the insulating layer 200, and the insulating layer 200 is bonded to the side of the covering layer 300 coated with the first adhesive layer 700, so that the insulating layer 200 and the covering layer 300 are bonded to each other. Therefore, by fixing the insulating layer 200 to one side of the covering layer 300, the overall rigidity of the packaging film structure can be improved, thereby avoiding wrinkles on the insulating layer 200 after bonding with the circuit board, and further avoiding the adhesive noise generated when the circuit board is pressed after the insulating layer 200 is bonded with the circuit board.

[0060] like Figure 2 As shown, the embodiment of the present application also provides a circuit board packaging structure, including the packaging film structure provided in the above embodiment, and: a circuit board 100, the circuit board 100 is provided with a first component 110 and a second component 120, along the thickness direction of the circuit board 100, the first component 110 has a first height, the second component 120 has a second height, the first height is greater than the second height, wherein the thickness direction of the circuit board 100 is a third direction Y, and the third direction Y intersects with the first direction X; the insulating layer 200 is connected to the first component 110; the covering layer 300 is connected to the side of the insulating layer 200 away from the circuit board 100; wherein the first component 110 and the second component 120 are located on the same side of the circuit board 100, and there is a gap between the insulating layer 200 and the second component 120. Specifically, the insulating layer 200 and the covering layer 300 are combined to form an integrated packaging film structure. The circuit board 100 and the packaging film structure are combined to form the packaging structure of the circuit board 100. Since the heights of the components on the circuit board 100 are inconsistent, there are first components 110 that protrude more from the circuit board 100, and second components 120 that are shorter than the first components 110. When the insulating layer 200 is bonded to the circuit board 100, the insulating layer 200 is in contact with and connected to the first component 110, while maintaining a certain gap with the second component 120. Among them, the side where the insulating layer 200 is released from the circuit board 100 is not coated with any liquid such as glue to assist bonding. Therefore, adhesion between the insulating layer 200 and the second component 120 can be avoided, thereby reducing wrinkles on the packaging film structure and avoiding abnormal noise after the circuit board 100 is packaged. At the same time, after the insulating layer 200 is combined with the covering layer 300 in advance, the steps in the packaging process of the circuit board 100 can be reduced, thereby reducing the number of workstations, reducing the cost of packaging the circuit board 100, and improving the efficiency of packaging the circuit board 100, which has a positive impact on production.

[0061] like Figure 3As shown, the embodiment of the present application also provides a circuit board packaging structure, including the packaging film structure provided in the above embodiment, and: a circuit board 100, the circuit board 100 is provided with a first component 110 and a second component 120, the first component 110 and the second component 120 are located on the same side of the circuit board 100, along the thickness direction of the circuit board 100, the first component 110 has a first height, the second component 120 has a second height, the first height is greater than the second height, wherein the thickness direction of the circuit board 100 is a third direction Y, and the third direction Y intersects with the first direction X; the insulating layer 200 is connected to the side of the circuit board 100 away from the first component 110 and the second component 120; the covering layer 300 is connected to the side of the insulating layer 200 away from the circuit board 100. Specifically, the insulating layer 200 and the covering layer 300 are combined to form an integrated packaging film structure. The circuit board 100 and the packaging film structure are combined to form the packaging structure of the circuit board 100. In order to reduce wrinkles after the packaging film structure is attached to the circuit board 100 and to avoid abnormal noise after the circuit board 100 is packaged, the packaging film structure is connected to the side of the circuit board 100 away from the first component 110 and the second component 120. The side of the circuit board 100 where the components are arranged is defined as the front side, and the side away from the components is defined as the back side. Since there are only some solder joints left when welding components on the back side of the circuit board 100, the protrusion of the solder joints is small and is flatter than the front side of the circuit board 100. Therefore, connecting the packaging film structure to the back side of the circuit board 100 can not only ensure that the packaging film structure is flatter, but also the packaging film structure will not produce abnormal noise when pressed.

[0062] like Figure 3 As shown, in the embodiment of the present application, a second adhesive layer 800 is provided between the insulating layer 200 and the circuit board 100. Specifically, since the back side of the circuit board 100 is relatively flat, the second adhesive layer 800 can be applied between the insulating layer 200 and the back side of the circuit board 100, thereby improving the stability between the insulating layer 200 and the circuit board 100.

[0063] like Figure 1 and Figure 4As shown, an embodiment of the present application further provides a battery module, comprising a packaging film structure as provided in any of the above embodiments; and at least two batteries 400, wherein the tabs of the batteries 400 are arranged opposite to each other; a circuit board 100, wherein the circuit board 100 is provided with a first component 110 and a second component 120, wherein the first component 110 and the second component 120 are located on the same side of the circuit board 100, and along the thickness direction of the circuit board 100, the first component 110 has a first height, and the second component 120 has a second height, and the first height is greater than the second height, wherein the thickness direction of the circuit board 100 is a third direction Y, and the third direction Y is perpendicular to the first direction X and the second direction Z, and the circuit board 100 is connected to the tabs; wherein the insulating layer 200 is connected to the first component 110, the covering layer 300 is connected to the side of the insulating layer 200 away from the circuit board 100, and the first connection area 311 and the third connection area 313 are connected to the battery 400. Specifically, the tabs of the multiple batteries 400 are arranged relative to each other, which can facilitate the connection between the tabs of the batteries 400 and the solder joints on the circuit board 100, so that the batteries 400 can supply power to the circuit board 100. The components on the circuit board 100 are generally arranged on the front side of the circuit board 100, and only the solder joints when the components are soldered are retained on the back side, wherein the first component 110 protrudes more than the second component 120 relative to the circuit board 100. When connecting the packaging film structure to the circuit board 100, firstly, the insulating layer 200 is laminated to the front side of the circuit board 100, and it is ensured that the insulating layer 200 is in contact with the higher first component 110, while ensuring that a certain gap is maintained with the shorter second component 120; then, the first connection area 311 is laminated to the surface of one of the batteries 400, and the third connection area 313 is laminated to the surface of the other battery 400, and the first connection area 311 and the third connection area 313 are extended to both sides respectively, thereby stretching the second connection area 312, so as to ensure that the insulating layer 200 can be kept flat, avoid wrinkles when the insulating layer 200 is laminated to the circuit board 100, and avoid abnormal noise when the circuit board 100 is pressed.

[0064] like Figure 1 and Figure 4As shown, in the embodiment of the present application, a protective frame 500 is also included, and the protective frame 500 surrounds the peripheral side of the battery 400; the covering portion 320 is bent to cover the protective frame 500 and is connected to the side of the battery 400 away from the connecting portion 310. Specifically, the protective frame 500 is formed by splicing a plurality of strips end to end to form an enclosed cavity. The battery 400 is placed in the enclosed cavity, and the side of the battery 400 is in contact with the protective frame 500. The protective frame 500 mainly plays a protective role, which is used to prevent the side and four corners of the battery 400 from being damaged when impacted. The covering portion 320 can be rotated and bent relative to the connecting portion 310, and a glue layer is provided on one side of the covering portion 320. During assembly, the battery 400 is placed in the enclosed cavity formed by the protective frame 500, and then the circuit board 100 is placed between the batteries 400, and the pole ears of the battery 400 are welded to the circuit board 100. The packaging film structure is attached to the circuit board 100 and the battery 400, and the covering portion 320 is bent toward the other side of the battery 400 and adhered to the other side of the battery 400. The covering portion 320 wraps the protection frame 500 and the battery 400, which can improve the connection between the protection frame 500 and the battery 400, increase the stability of the battery 400, and improve the safety of the battery 400.

[0065] like Figure 1 and Figure 4 As shown, in the embodiment of the present application, a covering layer 600 is further included, and the covering layer 600 is connected to the side of the battery 400 away from the connecting portion 310. Specifically, the covering layer 600 is used to connect the contact portion between the covering portion 320 and the battery 400, thereby improving the sealing of the battery 400.

[0066] like Figure 1 and Figure 4 As shown, in the embodiment of the present application, a support plate 510 is also included. The support plate 510 is arranged on the side of the circuit board 100 away from the insulating layer 200, and the support plate 510 is connected to the protective frame 500; wherein, the support plate 510 is also connected to the battery 400. Specifically, the circuit board 100 and the tabs of the battery 400 are connected only by welding. Although they are packaged by the packaging film structure, the force between the circuit board 100 and the tabs of the battery 400 is too large. As the battery 400 swings up and down, there is a risk of breaking and falling off between the circuit board 100 and the tabs of the battery 400. Therefore, by arranging the support plate 510 in the protective frame 500 to support the circuit board 100, the stability of the circuit board 100 is improved, and the force between the tabs of the battery 400 and the circuit board 100 is reduced.

[0067] The above is a detailed introduction to a packaging film structure, a circuit board packaging structure and a battery module provided in the embodiments of the present application. Specific examples are used in this article to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the technical solutions and core ideas of the present application. Ordinary technicians in this field should understand that they can still modify the technical solutions recorded in the aforementioned embodiments, or replace some of the technical features therein with equivalents; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A packaging film structure, characterized in that: include: Insulating layer (200); The covering layer (300) comprises a connecting portion (310) and a covering portion (320), wherein the covering portion (320) surrounds the connecting portion (310), the insulating layer (200) is connected to the covering layer (300), and the insulating layer (200) is located at the connecting portion (310).

2. The packaging film structure according to claim 1, characterized in that: The connecting portion (310) comprises a first connecting area (311), a second connecting area (312) and a third connecting area (313), wherein the first connecting area (311), the second connecting area (312) and the third connecting area (313) are sequentially connected along a first direction (Z); The insulating layer (200) is located in the second connection area (312), and a first glue coating layer (700) is provided between the insulating layer (200) and the covering layer (300).

3. The packaging film structure according to claim 2, characterized in that: The covering portion (320) comprises a first covering area (321) and a second covering area (322), wherein the first covering area (321) and the second covering area (322) are relatively connected to two sides of the third connection area (313) along a second direction (X); Wherein, the second direction (X) intersects with the first direction (Z).

4. The packaging film structure according to claim 2, characterized in that: The covering portion (320) comprises a third covering area (323) and a fourth covering area (324), wherein the third covering area (323) and the fourth covering area (324) are relatively connected to two sides of the first connection area (311) along a second direction (X); Wherein, the second direction (X) intersects with the first direction (Z).

5. The packaging film structure according to claim 2, characterized in that: The covering portion (320) comprises a fifth covering region (325) and a sixth covering region (326), wherein the fifth covering region (325) and the sixth covering region (326) are connected to two sides of the connecting portion (310) along the first direction (Z); Wherein, the fifth coating region (325) is connected to the first connection region (311), and the sixth coating region (326) is connected to the third connection region (313).

6. A circuit board packaging structure, characterized in that: The invention comprises a packaging film structure as claimed in any one of claims 1 to 5, and: A circuit board (100), the circuit board (100) being provided with a first component (110) and a second component (120), wherein along a thickness direction of the circuit board (100), the first component (110) has a first height, the second component (120) has a second height, and the first height is greater than the second height; The insulating layer (200) is connected to the first component (110); the covering layer (300) is connected to a side of the insulating layer (200) away from the circuit board (100); The first component (110) and the second component (120) are located on the same side of the circuit board (100), and there is a gap between the insulating layer (200) and the second component (120).

7. A circuit board packaging structure, characterized in that: The invention comprises a packaging film structure as claimed in any one of claims 1 to 5, and: A circuit board (100), the circuit board (100) being provided with a first component (110) and a second component (120), the first component (110) and the second component (120) being located on the same side of the circuit board (100), and along a thickness direction of the circuit board (100), the first component (110) having a first height, the second component (120) having a second height, and the first height being greater than the second height; The insulating layer (200) is connected to a side of the circuit board (100) away from the first component (110) and the second component (120); and the covering layer (300) is connected to a side of the insulating layer (200) away from the circuit board (100).

8. The circuit board packaging structure according to claim 7, characterized in that: A second adhesive coating layer (800) is provided between the insulating layer (200) and the circuit board (100).

9. A battery module, characterized in that: comprising a packaging film structure as claimed in any one of claims 1 to 5; and At least two batteries (400), wherein the tabs of the batteries (400) are arranged opposite to each other; A circuit board (100), the circuit board (100) being provided with a first component (110) and a second component (120), the first component (110) and the second component (120) being located on the same side of the circuit board (100), along the thickness direction of the circuit board (100), the first component (110) having a first height, the second component (120) having a second height, the first height being greater than the second height, and the circuit board (100) being connected to the tab; The insulating layer (200) is connected to the first component (110), the covering layer (300) is connected to a side of the insulating layer (200) away from the circuit board (100), and the first connection area (311) and the third connection area (313) of the connecting portion (310) are both connected to the battery (400).

10. The battery module according to claim 9, characterized in that: It also includes a protective frame (500), a covering layer (600) and a support plate (510), wherein the protective frame (500) surrounds the peripheral side of the battery (400); the covering portion (320) is bent to cover the protective frame (500) and is connected to a side of the battery (400) away from the connecting portion (310); The covering layer (600) is connected to a side of the battery (400) away from the connecting portion (310); The support plate (510) is arranged on a side of the circuit board (100) away from the insulating layer (200), and the support plate (510) is connected to the protective frame (500); Wherein, the support plate (510) is also connected to the battery (400).

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