PCB for optical module

By setting a first cover plate to isolate the light emitting module and the light receiving module on the PCB board of the optical module, the problems of signal interference and large space occupation in the prior art are solved, and the stability and space efficiency are improved.

CN222954158UActive Publication Date: 2025-06-06ZHE JIANG JIAN QIAO TONG XIN SHE BEI YOU XIAN GONG SI
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Patent Information

Application Number
CN202421396003.7
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-06-19
Publication Date
2025-06-06
Estimated Expiration
2034-06-19

AI Technical Summary

Technical Problem

In existing optical modules, the light emitting component TOSA and the light receiving component ROSA are prone to signal interference when they are set on the same PCB board and take up a large space.

Method used

By providing a first cover plate on the PCB board of the optical module, the light emitting module and the light receiving module are isolated, signal interference is avoided, and it is arranged on the same PCB board to reduce space occupation.

Benefits of technology

It effectively avoids signal interference between the light emitting module and the light receiving module, and reduces the space occupation of the optical module, while providing protection and waterproof and dustproof effects.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to the technical field of optical modules, in particular to a PCB (printed circuit board) for an optical module, which comprises an optical transmitting module, an optical receiving module and a first cover plate, and the optical transmitting module and the optical receiving module are respectively covered with the first cover plate; the first cover plate can isolate the light emitting module and the light receiving module; a first accommodating groove is formed in one side, facing the PCB, of the first cover plate; a second cover plate is arranged in the first accommodating groove and is used for covering the light emitting module or the light receiving module; according to the embodiment of the invention, the arrangement of the light emitting module and the light receiving module on the same PCB can be realized through the arrangement of the first cover plate, and the signal interference of the light emitting module and the light receiving module to each other can be avoided; the light emitting module and the light receiving module are arranged on the same PCB, so that the occupied space is also reduced; the first cover plate can protect the light emitting module and the light receiving module, the light emitting module and the light receiving module are prevented from being in contact with an external structure, meanwhile, the waterproof and dustproof effects can be achieved, and the working stability of the light emitting module and the light receiving module is improved.
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Description

Technical Field

[0001] The utility model relates to the technical field of optical modules, in particular to a PCB board for an optical module. Background Art

[0002] An optical module is generally provided with a light transmitting component TOSA and a light receiving component ROSA. In order to avoid the light transmitting component TOSA and the light receiving component ROSA from interfering with each other's signals when sending and receiving signals in the optical module, the light transmitting component TOSA and the light receiving component ROSA are usually arranged on different PCB boards respectively, but this will take up a large space in the optical module. Utility Model Content

[0003] In view of the above problems existing in the prior art, the utility model provides a PCB board for an optical module.

[0004] In order to solve the above technical problems, the utility model is solved by the following technical solutions:

[0005] A PCB board for an optical module, comprising an optical transmitting module, an optical receiving module and at least one first cover plate, wherein the optical transmitting module and the optical receiving module are both covered with the first cover plate;

[0006] In the installed state, the first cover plate can isolate the optical transmitting module from the optical receiving module to avoid signal interference between the optical transmitting module and the optical receiving module.

[0007] Preferably, the optical transmitting module and the optical receiving module are arranged on the same side of the PCB board.

[0008] Preferably, the optical transmitting module and the optical receiving module are respectively arranged on two sides of the PCB board.

[0009] Preferably, a first receiving groove is provided on a side of the first cover plate facing the PCB board;

[0010] In the installed state, the optical transmitting module and the optical receiving module are located in the first containing groove.

[0011] Preferably, at least one second cover plate is disposed in the first receiving groove, and the second cover plate is used to cover the optical transmitting module or the optical receiving module.

[0012] Preferably, a second receiving groove is provided on a side of the second cover plate facing the PCB board;

[0013] In the installed state, the optical transmitting module or the optical receiving module is located in the second receiving groove.

[0014] Preferably, the first cover plate is provided with a first through hole communicating with the first accommodating groove.

[0015] Preferably, the second cover plate is provided with a second through hole communicating with the second accommodating groove.

[0016] Preferably, the second cover plate is made of sheet metal.

[0017] Preferably, the first cover plate and the second cover plate, and the first cover plate and the PCB board are connected by bonding.

[0018] The utility model has at least the following beneficial effects:

[0019] 1. In this embodiment, the optical transmitting module and the optical receiving module can be preferably arranged on the same PCB board through the arrangement of the first cover plate, so that the optical transmitting module and the optical receiving module can avoid signal interference with each other when sending and receiving signals in the optical module; at the same time, arranging the optical transmitting module and the optical receiving module on the same PCB board can also reduce the occupied space accordingly.

[0020] 2. The first cover plate can protect the optical transmitting module and the optical receiving module, and can prevent direct contact with external structures while also being waterproof and dustproof, thereby improving the working stability of the optical transmitting module and the optical receiving module. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 A schematic diagram showing a PCB board with a first cover plate installed in some embodiments of the present application is shown;

[0022] Figure 2 A schematic diagram of a PCB board in some embodiments of the present application is shown;

[0023] Figure 3 A schematic diagram showing the first cover plate, the optical transmitting module and the optical receiving module after the PCB board is hidden in some embodiments of the present application;

[0024] Figure 4 A schematic diagram of the first cover plate in some embodiments of the present application is shown.

[0025] The parts indicated by the numbers in the accompanying drawings are as follows:

[0026] 100, PCB board; 110, optical transmitting module; 120, optical receiving module; 200, first cover plate; 210, first receiving groove; 220, first via hole; 300, second cover plate; 310, second receiving groove; 320, second via hole; 400, optical fiber. DETAILED DESCRIPTION

[0027] In order to further understand the content of the utility model, the utility model is described in detail in conjunction with the accompanying drawings and embodiments. It should be understood that the embodiments are only used to explain the utility model but not to limit it.

[0028] like Figure 1-4 As shown, this embodiment provides a PCB board for an optical module, and a light emitting module 110 and a light receiving module 120 are arranged on the PCB board 100 at the same time. In addition, a first cover plate 200 is also arranged. After the light emitting module 110 and the light receiving module 120 are installed on the PCB board 100, the first cover plate 200 is installed on the PCB board 100, so that the light emitting module 110 and the light receiving module 120 are both covered with the first cover plate 200. The first cover plate 200 can protect the light emitting module 110 and the light receiving module 120, and can also play a waterproof and dustproof effect while avoiding direct contact with external structures, thereby improving the working stability of the light emitting module 110 and the light receiving module 120.

[0029] Further, the number of the first cover plate 200 may be one or more, for example, the number of the first cover plate 200 may be equal to the sum of the number of the optical transmitting modules 110 and the optical receiving modules 120. When the number of the first cover plate 200 is one, the first cover plate 200 can be simultaneously covered on all the optical transmitting modules 110 and the optical receiving modules 120; when the number of the first cover plate 200 is equal to the sum of the number of the optical transmitting modules 110 and the optical receiving modules 120, the first cover plate 200 is only covered on one optical transmitting module 110 or the optical receiving module 120.

[0030] In particular, when the first cover plate 200 is provided on the optical transmitting module 110 and the optical receiving module 120, the first cover plate 200 can also isolate the optical transmitting module 110 and the optical receiving module 120, so that the optical transmitting module 110 and the optical receiving module 120 can operate independently and stably and avoid signal interference between each other.

[0031] It can be understood that this embodiment can better realize the arrangement of the optical transmitting module 110 and the optical receiving module 120 on the same PCB board 100 through the arrangement of the first cover plate 200, and can avoid the optical transmitting module 110 and the optical receiving module 120 interfering with each other's signals when sending and receiving signals within the optical module; at the same time, arranging the optical transmitting module 110 and the optical receiving module 120 on the same PCB board 100 can also reduce the occupied space accordingly.

[0032] In some embodiments, when the optical transmitting module 110 and the optical receiving module 120 are disposed on the same PCB board 100 , the optical transmitting module 110 and the optical receiving module 120 may be disposed on the same side of the PCB board 100 .

[0033] In some embodiments, when the optical transmitting module 110 and the optical receiving module 120 are disposed on the same PCB board 100 , the optical transmitting module 110 and the optical receiving module 120 may be disposed on two sides of the PCB board 100 , respectively.

[0034] In some embodiments, a first receiving groove 210 is disposed on the first cover plate 200 . Specifically, the first receiving groove 210 is disposed on a side of the first cover plate 200 facing the PCB board 100 .

[0035] Taking the number of the first cover plate 200 as one as an example, after the optical transmitting module 110 and the optical receiving module 120 are installed on the PCB board 100, the first cover plate 200 is covered on the optical transmitting module 110 and the optical receiving module 120. At this time, the optical transmitting module 110 and the optical receiving module 120 extend into the first accommodating groove 210, and finally the first cover plate 200 is fixed on the PCB board 100.

[0036] It should be noted that in order to realize the covering of the optical emitting module 110 and the optical receiving module 120 by the first cover plate 200; when the optical emitting module 110 and the optical receiving module 120 are arranged on the same side of the PCB board 100, the first cover plate 200 is also completely on the corresponding side of the PCB board 100, and when the optical emitting module 110 and the optical receiving module 120 are respectively arranged on both sides of the PCB board 100, the cross-section of the first cover plate 200 and the first accommodating groove 210 can be U-shaped, that is, the first cover plate 200 and the first accommodating groove 210 extend to both sides of the PCB board 100 respectively.

[0037] In particular, by setting the first accommodating groove 210, in the installed state, the optical transmitting module 110 and the optical receiving module 120 can be completely located in the first accommodating groove 210, which can better prevent the optical transmitting module 110 and the optical receiving module 120 from being affected by the external environment. Moreover, since the first cover plate 200 completely covers the outside of the optical transmitting module 110 and the optical receiving module 120, it can provide better waterproof and dustproof protection for the optical transmitting module 110 and the optical receiving module 120.

[0038] In some embodiments, a second cover plate 300 for covering the optical transmission module 110 or the optical receiving module 120 is provided in the first receiving groove 210. Specifically, after the optical transmission module 110 and the optical receiving module 120 are mounted on the PCB board 100, the first cover plate 200 is mounted on the PCB board 100. At this time, the optical transmission module 110 and / or the optical receiving module 120 will enter the first receiving groove 210 on the first cover plate 200. At the same time, since the second cover plate 300 is provided in the first receiving groove 210, the second cover plate 300 will cover the optical transmission module 110 or the optical receiving module 120 corresponding to its position.

[0039] It is worth mentioning that since the second cover plate 300 can only cover one of the optical transmitting module 110 and the optical receiving module 120, the optical transmitting module 110 and the optical receiving module 120 can be better isolated under the action of the second cover plate 300, so that the optical transmitting module 110 and the optical receiving module 120 can work independently and stably to avoid signal interference between each other.

[0040] Furthermore, the number of second cover plates 300 can also be set to be equal to the total number of optical transmitting modules 110 and optical receiving modules 120, so that after the first cover plate 200 is installed on the PCB board 100, multiple second cover plates 300 can cover all the optical transmitting modules 110 and optical receiving modules 120, thereby improving the isolation effect.

[0041] In some embodiments, a second receiving groove 310 is disposed on the second cover plate 300 . Specifically, the second receiving groove 310 is disposed on a side of the second cover plate 300 facing the PCB board 100 .

[0042] When the first cover plate 200 is installed on the PCB board 100 , the optical transmitting module 110 or the optical receiving module 120 will extend into the second receiving groove 310 , and finally the first cover plate 200 is fixed on the PCB board 100 .

[0043] In particular, by setting the second accommodating groove 310, in the installed state, the optical transmitting module 110 or the optical receiving module 120 can be completely in the second accommodating groove 310. Under the action of the first cover plate 200 and the second cover plate 300, the protection effect is better. At the same time, the optical transmitting module 110 or the optical receiving module 120 is independently set in the second accommodating groove 310, and the isolation effect is also better, avoiding signal interference between the optical transmitting module 110 and the optical receiving module 120.

[0044] In some embodiments, a first through hole 220 communicating with the first receiving groove 210 is disposed on the first cover plate 200 .

[0045] In some embodiments, a second through hole 320 communicating with the second receiving groove 310 is disposed on the second cover plate 300 .

[0046] When the first cover plate 200 and the second cover plate 300 are covered on the optical transmitting module 110 and the optical receiving module 120, the first via hole 220 and the second via hole 320 are arranged to better allow the optical fiber 400 to pass through, thereby realizing signal transmission between the optical transmitting module 110 and the optical receiving module 120 and external devices.

[0047] In some embodiments, the first cover plate 200 is made of plastic and the second cover plate 300 is made of sheet metal, so that when the second cover plate 300 is covered on the optical transmitting module 110 or the optical receiving module 120, it can better avoid signal interference between the optical transmitting module 110 and the optical receiving module 120, thereby improving the working stability of the optical module.

[0048] It can be understood that when the number of first cover plates 200 is equal to the sum of the number of optical transmitting modules 110 and optical receiving modules 120, the first cover plate 200 is only covered on one optical transmitting module 110 or optical receiving module 120, and the first cover plate 200 can also be made of sheet metal. In this case, the first cover plate 200 can also better avoid signal interference between the optical transmitting module 110 and the optical receiving module 120.

[0049] In some embodiments, the first cover plate 200 and the second cover plate 300 are fixedly connected by bonding, and the first cover plate 200 and the PCB board 100 are also fixedly connected by bonding.

[0050] Specifically, the first cover plate 200 and the second cover plate 300 are bonded together by silver glue and fixed together by high-temperature baking to improve the stability of the connection between the first cover plate 200 and the second cover plate 300.

[0051] In short, the above is only a preferred embodiment of the present utility model, and all equivalent changes and modifications made according to the scope of the patent application of the present utility model should fall within the scope of the present utility model patent.

Claims

1. A PCB board for an optical module, characterized in that: It comprises a light transmitting module, a light receiving module and at least one first cover plate, wherein the light transmitting module and the light receiving module are both covered with the first cover plate; In the installed state, the first cover plate can isolate the optical transmitting module and the optical receiving module to avoid signal interference between the optical transmitting module and the optical receiving module; A first receiving groove is provided on a side of the first cover plate facing the PCB board; In the installed state, the optical transmitting module and the optical receiving module are in the first receiving groove; At least one second cover plate is disposed in the first receiving groove, and the second cover plate is used to cover the light transmitting module or the light receiving module.

2. The PCB board for optical module according to claim 1, characterized in that: The optical transmitting module and the optical receiving module are arranged on the same side of the PCB board.

3. The PCB board for optical module according to claim 1, characterized in that: The optical transmitting module and the optical receiving module are respectively arranged on two sides of the PCB board.

4. The PCB board for optical module according to claim 1, characterized in that: A second receiving groove is provided on a side of the second cover plate facing the PCB board; In the installed state, the optical transmitting module or the optical receiving module is located in the second receiving groove.

5. The PCB board for optical module according to claim 1, characterized in that: The first cover plate is provided with a first through hole communicating with the first accommodating groove.

6. The PCB board for optical module according to claim 4, characterized in that: The second cover plate is provided with a second through hole communicating with the second receiving groove.

7. The PCB board for optical module according to claim 1, characterized in that: The second cover plate is made of sheet metal material.

8. The PCB board for optical module according to claim 7, characterized in that: The first cover plate and the second cover plate as well as the first cover plate and the PCB board are connected by bonding.