Decoupling capacitor via hole design structure applied to circuit board

Abstract

The utility model discloses a decoupling capacitor via hole design structure applied to a circuit board, and relates to the technical field of circuit boards, the decoupling capacitor via hole design structure applied to the circuit board comprises a circuit board main body and a capacitor device, the rear end of the circuit board main body is provided with a plurality of circuit board connecting holes, a plurality of accommodating holes are circularly distributed in the inner top walls of the plurality of circuit board connecting holes, a plurality of capacitance power supply welding pads are uniformly distributed on the front surface of the circuit board main body, power supply holes are formed in the centers of the front surfaces of the plurality of capacitance power supply welding pads, a plurality of capacitance grounding welding pads are uniformly distributed on the front surface of the circuit board main body, and power supply holes are formed in the centers of the front surfaces of the plurality of capacitance power supply welding pads. Through the arrangement of the through holes, the containing holes and the circuit board connecting holes, the contact area of soldering tin and the circuit board connecting holes can be increased, the soldering tin is not prone to falling off from the circuit board body, and the use reliability of products is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit boards, in particular to a decoupling capacitor via design structure applied to circuit boards. Background Art

[0002] Decoupling capacitors are capacitors installed at the power supply end of components in the circuit. This capacitor can provide a more stable power supply, and can also reduce the noise of the components coupled to the power supply end, which can indirectly reduce the impact of the noise of other components on other components. In electronic circuits, decoupling capacitors and bypass capacitors both play an anti-interference role. The names are different depending on the position of the capacitor. For the same circuit, the bypass capacitor takes the high-frequency noise in the input signal as the object of filtering and the high-frequency clutter carried by the previous stage, while the decoupling capacitor, also called the decoupling capacitor, takes the interference of the output signal as the object of filtering. Decoupling capacitors are used in places where AC is not required in the amplifier circuit to eliminate self-excitation and make the amplifier work stably.

[0003] The current layout of a single capacitor on a circuit board uses a capacitor element including a power pad and a ground pad, and adds a power hole and a ground hole to the power and ground pads respectively. When assembling, they are connected to both ends of the capacitor element. Because the circuit board needs to use a large number of decoupling capacitors when suppressing the power impedance, each capacitor has at least two vias. Each additional capacitor needs to add two more vias, which easily leads to insufficient circuit board layout area. In order to improve the power impedance, many decoupling capacitors are often needed, making the circuit board layout design less flexible and easily causing waste of board space utilization. Utility Model Content

[0004] The utility model provides a decoupling capacitor via design structure applied to a circuit board to solve the problems in the background technology.

[0005] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a decoupling capacitor via design structure applied to a circuit board, comprising a circuit board main body and a capacitor device, wherein a plurality of circuit board connection holes are arranged at the rear end of the circuit board main body, the inner top walls of the plurality of circuit board connection holes are circularly distributed with a plurality of accommodating holes, the inner top walls of the plurality of circuit board connection holes are centrally provided with through holes, a plurality of capacitor power supply pads are evenly distributed on the front side of the circuit board main body, a power supply hole is opened at the center of the front side of the plurality of capacitor power supply pads, a plurality of capacitor grounding pads are evenly distributed on the front side of the circuit board main body, a grounding hole is opened at the center of the front side of the plurality of capacitor grounding pads.

[0006] Furthermore, there are multiple capacitor devices, and the rear ends of the multiple capacitor devices near the left and right sides are respectively connected to the front sides of the capacitor power pad and the capacitor ground pad.

[0007] Furthermore, the plurality of capacitor power supply pads and the capacitor grounding pads are installed in a staggered manner, and the plurality of capacitor power supply pads and the capacitor grounding pads are respectively connected through a plurality of capacitor components.

[0008] Furthermore, the plurality of circuit board connection holes are respectively connected to the plurality of power holes and the grounding holes.

[0009] Furthermore, the plurality of accommodating holes are blind holes or through hole structures.

[0010] Compared with the prior art, the utility model provides a decoupling capacitor via design structure applied to a circuit board, which has the following beneficial effects:

[0011] 1. The decoupling capacitor via design structure applied to the circuit board can reduce the local area of ​​the capacitor and increase the number of capacitors used by setting capacitor pads, capacitor power pads, accommodating holes and grounding holes, thereby achieving the purpose of reducing power supply impedance and improving circuit stability.

[0012] 2. The decoupling capacitor via design structure applied to the circuit board can increase the contact area between the solder and the circuit board connection hole by setting the through hole, the receiving hole and the circuit board connection hole, thereby promoting the volatilization of water and organic matter generated during soldering, which helps to prevent the occurrence of adverse conditions such as delamination bubbles or bursting of the copper sheet, making it difficult for the solder to fall off the circuit board body, thereby improving the reliability and safety of the circuit board body during welding. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 It is a schematic diagram of the connection structure of the circuit board body, the capacitor power pad and the capacitor ground pad of the utility model;

[0014] Figure 2 This is a structural diagram of the connection between the circuit board body, capacitor power pad, capacitor ground pad and capacitor device of the utility model;

[0015] Figure 3 This is a diagram of the internal structure of the circuit board connection hole of the utility model.

[0016] In the figure: 1. Capacitor power pad; 2. Circuit board body; 3. Capacitor ground pad; 4. Capacitor device; 5. Circuit board connection hole; 6. Through hole; 7. Accommodating hole; 8. Power hole; 9. Ground hole. DETAILED DESCRIPTION

[0017] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0018] See also Figure 1-3 The utility model discloses a decoupling capacitor via design structure applied to a circuit board, including a circuit board body 2 and a capacitor device 4, a plurality of circuit board connection holes 5 are arranged at the rear end of the circuit board body 2, the inner top walls of the plurality of circuit board connection holes 5 are all circularly distributed with a plurality of accommodating holes 7, a through hole 6 is opened at the center of the inner top walls of the plurality of circuit board connection holes 5, a plurality of capacitor power pads 1 are evenly distributed on the front of the circuit board body 2, a power hole 8 is opened at the center of the front of the plurality of capacitor power pads 1, a plurality of capacitor grounding pads 3 are evenly distributed on the front of the circuit board body 2, a grounding hole 9 is opened at the center of the front of the plurality of capacitor grounding pads 3.

[0019] Specifically, there are multiple capacitor devices 4, and the rear ends of the multiple capacitor devices 4 near the left and right sides are respectively connected to the front sides of the capacitor power pad 1 and the capacitor ground pad 3.

[0020] In this embodiment, subsequent use is convenient.

[0021] Specifically, a plurality of capacitor power supply pads 1 and capacitor grounding pads 3 are installed in a staggered manner, and the plurality of capacitor power supply pads 1 and capacitor grounding pads 3 are connected via a plurality of capacitor components 4 , respectively.

[0022] In this embodiment, it is convenient to connect with the capacitor device 4 later.

[0023] Specifically, the plurality of circuit board connection holes 5 are respectively connected to the plurality of power holes 8 and the grounding holes 9 .

[0024] In this embodiment, it is convenient to subsequently connect the capacitor power pad 1 and the capacitor ground pad 3 to the circuit board body 2 .

[0025] Specifically, the plurality of receiving holes 7 are blind holes or through holes.

[0026] In this embodiment, the processing of the product is facilitated.

[0027] When in use, adjust the arrangement of the capacitors, with four capacitor pads as a group, arranged symmetrically in pairs, and each power hole 8 and ground hole 9 are placed in the middle of the power and ground pads of the four capacitors, and the ground hole 9 and the pads of the power hole 8 are connected together to conduct them, so that they can be shared with the power hole 8 through the ground hole 9, reducing the local area of ​​the capacitor device 4, increasing the number of capacitor devices 4 used, and achieving the purpose of reducing the power supply impedance. At the same time, the stability of the circuit can also be improved. It should be noted that when making adjustments, it is necessary to ensure that the position and layout of the capacitor meet the design requirements, and follow the correct welding specifications and operating procedures to avoid damaging the components or affecting the circuit performance. In addition, it is also necessary to avoid interference or influence on other components. The circuit board connection hole 5 and the circuit board connection hole 5 can accommodate more solder, so that the contact area between the solder and the circuit board connection hole 5 is increased, and the solder is not easy to fall off from the circuit board body 2, thereby improving the reliability of product use.

[0028] In summary, the decoupling capacitor via design structure applied to the circuit board can reduce the local area of ​​the capacitor and increase the number of capacitors used by setting the capacitor pad, the capacitor power pad 1, the accommodating hole 7 and the grounding hole 9, so as to achieve the purpose of reducing the power supply impedance, and at the same time improve the stability of the circuit. By setting the through hole 6, the accommodating hole 7 and the circuit board connection hole 5, the contact area between the solder and the circuit board connection hole 5 can be increased, thereby promoting the volatilization of moisture and organic matter generated during soldering, which helps to prevent the occurrence of adverse conditions such as stratification bubbles or bursting of the copper sheet, making it difficult for the solder to fall off the circuit board body 2, thereby improving the reliability and safety of the circuit board body during welding.

[0029] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A decoupling capacitor via design structure applied to a circuit board, comprising a circuit board body (2) and a capacitor device (4), characterized in that: The rear end of the circuit board body (2) is provided with a plurality of circuit board connection holes (5); the inner top walls of the plurality of circuit board connection holes (5) are all provided with a plurality of accommodating holes (7) distributed in a circular shape; the inner top walls of the plurality of circuit board connection holes (5) are all provided with through holes (6) at the center; the front of the circuit board body (2) is evenly distributed with a plurality of capacitor power supply pads (1); the front center of the plurality of capacitor power supply pads (1) is provided with a power supply hole (8); the front of the circuit board body (2) is evenly distributed with a plurality of capacitor grounding pads (3); the front center of the plurality of capacitor grounding pads (3) is provided with a grounding hole (9).

2. According to claim 1, a decoupling capacitor via design structure applied to a circuit board is characterized in that: There are a plurality of capacitor devices (4), and the rear ends of the plurality of capacitor devices (4) close to the left and right sides are respectively connected to the front sides of the capacitor power pad (1) and the capacitor ground pad (3).

3. The decoupling capacitor via design structure applied to a circuit board according to claim 1, characterized in that: The plurality of capacitor power supply pads (1) and capacitor grounding pads (3) are installed in a staggered manner, and the plurality of capacitor power supply pads (1) and capacitor grounding pads (3) are respectively connected via a plurality of capacitor components (4).

4. The decoupling capacitor via design structure applied to a circuit board according to claim 1, characterized in that: The plurality of circuit board connection holes (5) are respectively connected to the plurality of power supply holes (8) and the grounding hole (9).

5. The decoupling capacitor via design structure applied to a circuit board according to claim 1, characterized in that: The plurality of accommodating holes (7) are blind holes or through-hole structures.

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