Synchronous pressing device for multiple adhesive tapes of flexible circuit board

Abstract

The utility model discloses a flexible circuit board multi-adhesive-tape synchronous pressing device which is installed on an equipment base and comprises a carrier, a motion module and a pressure applying part. A pressing station is arranged on the upper surface of the equipment base, the carrier is located in the pressing station, and a plurality of carrier surface parts are arranged on the surface of the carrier; the movement module is fixedly mounted on the upper surface of the equipment base, and the pressure applying part is located over the pressing station and fixedly connected with the movable end of the movement module; according to the utility model, through the matching of the carrier surface part and the pressure heads, the adhesive tape laminating operation on areas with different height differences on the surface of a product is realized, specifically, the carrier is placed at a laminating station, and then the product and the adhesive tape on the carrier surface part can be pressed by the pressure applying parts with the plurality of pressure heads, so that the product and the adhesive tape on the carrier surface part can be laminated, and the product and the adhesive tape can be laminated. Once the pressing head is in contact with the product, the concave part drives the adhesive tape to be attached to the surface of the product and the surface of the convex area at the same time by containing the surface convex area of the corresponding product.

Description

Technical Field

[0001] The utility model relates to the technical field of flexible circuit board production, in particular to a device for synchronously pressing multiple adhesive tapes on a flexible circuit board. Background Art

[0002] Flexible circuit boards are a type of circuit boards. The use of flexible circuit boards can make circuits more miniaturized and flexible. One of the advantages of flexible circuit boards is their flexibility, which satisfies our conditions for shaping them. If we want to shape the product, we need to have the conditions to fix the shape after shaping. Pasting tape is one of the methods we often use to fix the shape. Flexible circuit boards usually need to be attached with multiple pieces of tape. After the tape is attached, in order to ensure its stability on the flexible circuit board, it needs to be pressed at a certain pressure and temperature. The existing pressing method has at least the following problems:

[0003] 1. The existing pressing method is mostly single-piece pressing, which will undoubtedly waste a lot of time and the production efficiency cannot be guaranteed;

[0004] 2. When studying the automatic pressure-maintaining technology of multiple tapes, since the tape is attached to the surface of the PCB in a block structure, and parts are welded on the PCB, this means that there is a higher part surface on the PCB, that is, there is a height difference between the two. After that, the product may have raised areas (i.e. parts, etc.) in some places where tape is needed. When attaching the tape, due to the height difference, it is impossible to adhere to two surfaces of different heights at the same time, resulting in the phenomenon that the tape is attached to the parts and has no or little contact with the surface of the PCB. Utility Model Content

[0005] The utility model aims to provide a device for synchronously pressing multiple adhesive tapes on a flexible circuit board, aiming to solve the problem in the above background technology that it is not easy to simultaneously adhere two surfaces of different heights due to the existence of height difference.

[0006] To achieve the above-mentioned object, the first aspect of the utility model proposes a synchronous laminating device for multiple adhesive tapes of a flexible circuit board, the laminating device is installed on a device base for laminating adhesive tapes on a product, and the laminating device comprises: a carrier, a motion module and a pressure-applying component;

[0007] The upper surface of the equipment base has a pressing station, the carrier is located in the pressing station, and the carrier surface has a plurality of carrying portions for carrying products;

[0008] The motion module is fixedly mounted on the upper surface of the equipment base, and the pressure-applying component is located directly above the pressing station and is fixedly connected to the movable end of the motion module;

[0009] Each of the pressure-applying components has a plurality of pressure heads at its end, each of the pressure heads is respectively arranged corresponding to each of the loading surface portions, and the pressure-applying components can push the pressure heads to apply pressure to the tape covering the surface of the product;

[0010] At least part of the load-bearing portion or the pressure head surface has a recessed portion, and the recessed portion is matched with the raised area on the product surface;

[0011] When the pressure head applies pressure to the corresponding product, the recessed portion accommodates the raised area on the surface of the corresponding product to drive the adhesive tape to adhere to the surface of the product and the raised area at the same time.

[0012] Furthermore, the recessed portion is a groove.

[0013] Furthermore, the top projection area of ​​the pressure head is smaller than the top projection area of ​​the loading portion.

[0014] Furthermore, the motion module includes two fixing frames fixedly connected to the surface of the device base, each of the fixing frames is installed with a lifting mechanism, and the movable end of the lifting mechanism is fixedly connected to the pressure component.

[0015] Furthermore, the pressure-applying component includes a mounting block fixedly connected to the movable end of the lifting mechanism, and a plurality of detachably connected counterweight blocks are arranged on the mounting block, and each of the pressure heads is correspondingly arranged at one end of each counterweight block close to the product; when the pressure head applies pressure to the corresponding product, the pressure on the corresponding product is changed by replacing counterweight blocks of different weights.

[0016] Furthermore, a lifting mechanism is provided at the bottom of the carrier, and the lifting mechanism can push the carrier to rise to a set height and then reset.

[0017] Furthermore, the lifting mechanism includes a bottom support plate located at the pressing station, and a plurality of fixed guide blocks and a plurality of lifting units are installed on the surface of the bottom support plate. A guide block fixedly connected to the carrier is slidably provided on each of the fixed guide blocks, and the movable ends of all the lifting units are connected to the carrier to support the carrier to lift and lower.

[0018] Furthermore, the carrier surface has a receiving groove for receiving the carrying portion.

[0019] Furthermore, the loading surface portion is optionally configured as a structure with a heating function to heat the product and the tape.

[0020] Furthermore, a belt is provided on the surface of the equipment base for transporting the carrier to the pressing station.

[0021] Due to the application of the above scheme, the utility model has the following advantages and effects compared with the prior art:

[0022] The utility model can realize the tape bonding operation on the areas with different height differences on the surface of the product through the cooperation between the carrier surface and the pressure head. Specifically, the carrier is directly placed on the pressing station, and then the pressure-applying component can bring multiple pressure heads to press the product and the tape on the carrier surface. Once the pressure head contacts the product, the recessed portion drives the tape to bond with the product surface and the surface of the convex area at the same time by accommodating the surface convex area of ​​the corresponding product. Even if there is a height difference, two surfaces with different heights can be bonded at the same time. At the same time, multiple pressure heads can apply pressure to multiple products at the same time, which is highly efficient. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Attached Figure 1 The overall structural diagram provided by the utility model;

[0024] Attached Figure 2 A schematic diagram of the pressure head structure provided by the utility model;

[0025] Attached Figure 3 A schematic diagram of the structure of the carrier provided by the utility model;

[0026] Attached Figure 4 A schematic diagram of the fixed guide block structure provided by the utility model;

[0027] Attached Figure 5 A schematic diagram of the lifting unit structure provided by the utility model;

[0028] Attached Figure 6 A schematic diagram of the belt structure provided by the utility model;

[0029] Attached Figure 7 A schematic diagram of the structure of the receiving tank provided by the utility model;

[0030] Attached Figure 8 A schematic diagram of a longitudinal cross-section structure when the pressure head provided by the utility model is pressed on the load-bearing surface;

[0031] Attached Fig. 9 It is a schematic diagram of the main longitudinal section structure when the pressure head provided by the utility model is pressed on the load-bearing surface;

[0032] Attached Fig.10 A schematic diagram of a first embodiment of a pressure-applying component provided by the utility model;

[0033] Attached Fig.11 This is a schematic diagram of a second embodiment of the pressure-applying component provided by the utility model.

[0034] In the above figures: 1. carrier; 2. motion module; 3. load-bearing portion; 4. groove; 5. fixing frame; 6. pressure component; 7. pressure head; 8. lifting mechanism; 9. bottom support plate; 10. fixed guide block; 11. lifting unit; 12. guide block; 13. lifting mechanism; 14. mounting block; 15. counterweight block; 16. belt; 17. receiving groove. DETAILED DESCRIPTION

[0035] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present application, so the present application is not limited by the specific embodiments disclosed below.

[0036] The terms used herein are only for describing specific embodiments and are not intended to be limiting of the present invention. Singular forms such as "a", "this", "here", "this" and "the" as used herein also include plural forms.

[0037] The terms “first”, “second”, etc. used in this document do not specifically refer to an order or sequence, nor are they used to limit the present case. They are only used to distinguish components or operations described with the same technical terms.

[0038] As used herein, “connected” or “positioned” may refer to two or more components or devices being in direct physical contact with each other, or being in indirect physical contact with each other, or may refer to two or more components or devices operating or moving with each other.

[0039] The terms “include,” “including,” “have,” etc. used in this document are open-ended terms, meaning including but not limited to.

[0040] The terms used in this document generally have the ordinary meaning of each term used in this field, in the context of the case and in the specific context, unless otherwise noted. Certain terms used to describe the present invention will be discussed below or elsewhere in this specification to provide additional guidance to those skilled in the art in describing the present invention.

[0041] Embodiment 1, Embodiment 1 of the present utility model proposes a device for synchronously pressing multiple adhesive tapes on a flexible circuit board, the pressing device is installed on a device base for pressing adhesive tapes on a product, and the pressing device includes: a carrier 1, a motion module 2 and a pressure component 6;

[0042] The upper surface of the equipment base has a pressing station, and the carrier 1 is located in the pressing station. The surface of the carrier 1 has multiple carrying parts 3 for carrying products; (generally, the carrier placement method at the pressing station can be selected by conveying and placing with a belt or guide rail or other structure, or can be placed manually).

[0043] The motion module 2 is fixedly mounted on the upper surface of the equipment base, and the pressure component 6 is located directly above the pressing station and is fixedly connected to the movable end of the motion module 2;

[0044] Each pressure member 6 has a plurality of pressure heads 7 at its end, each pressure head 7 is respectively arranged corresponding to each loading surface 3, and the pressure member 6 can push the pressure head 7 to apply pressure to the tape covering the surface of the product;

[0045] At least part of the surface of the loading surface 3 or the pressing head 7 has a recessed portion, and the recessed portion is matched with the raised area on the surface of the product; (generally, the recessed portion may be provided on one of the loading surface 3 or the pressing head 7, and when in use, it is only necessary to make the raised area of ​​the product face the recessed portion).

[0046] When the pressure head 7 applies pressure to the corresponding product, the concave portion accommodates the convex area on the surface of the corresponding product to drive the adhesive tape to adhere to the surface of the product and the surface of the convex area at the same time.

[0047] Figure 8 and Fig. 9 P stands for product (product includes PCB board and parts).

[0048] The utility model can realize the tape bonding operation on areas with different height differences on the product surface through the cooperation between the carrier surface 3 and the pressure head 7. Specifically, the carrier 1 is directly placed on the pressing station, and then the pressure-applying component 6 with multiple pressure heads 7 can apply pressure to the product and the tape on the carrier surface 3. Once the pressure head 7 contacts the product, the recessed portion drives the tape to bond with the product surface and the surface of the convex area at the same time by accommodating the surface convex area of ​​the corresponding product. Even if there is a height difference, two surfaces of different heights can be bonded at the same time. At the same time, multiple pressure heads 7 can apply pressure to multiple products at the same time, which is more efficient.

[0049] It should be noted that the structure of the pressure head 7 can be set according to actual needs. The product is a structure composed of a PCB board and parts, and the pressure head 7 can be set according to the product.

[0050] In some specific embodiments, the recessed portion is a groove 4 .

[0051] Generally, the recessed portion can be an annular structure or a groove 4, but the annular structure will make the surface of the loading portion 3 or the pressure head 7 convex, which makes it difficult to place the product, so the groove 4 is selected.

[0052] In some specific embodiments, the top projection area of ​​the pressure head 7 is smaller than the top projection area of ​​the loading portion 3. This is set because it is necessary to ensure that the tape is fully attached. Therefore, when maintaining pressure, it is necessary to ensure that the size of the pressure head 7 is larger than the size of the tape and smaller than the size of the loading portion 3.

[0053] The structure of the loading portion 3 can be selected to match the product.

[0054] In some specific embodiments, the motion module 2 includes two fixing frames 5 fixedly connected to the surface of the device base, and a lifting mechanism 13 is installed on each fixing frame 5 . The movable end of the lifting mechanism 13 is fixedly connected to the pressure component 6 .

[0055] The fixed frame 5 is used to fix the lifting mechanism 13, and at the same time ensure that the lifting mechanism 13 is always above the pressing station. When the lifting mechanism 13 is always above the pressing station, it can ensure that the pressure component 6 is always above the pressing station. The specific structure of the lifting mechanism 13 can be selected from cylinders, screw lifting mechanisms, electric push rods and other structures. No specific limitation is made here, as long as it can move the pressure component 6 up and down.

[0056] In some specific embodiments, the pressure-applying component 6 includes a mounting block 14 fixedly connected to the movable end of the lifting mechanism 13, and a plurality of detachably connected counterweight blocks 15 are provided on the mounting block 14, and each pressure head 7 is correspondingly arranged at one end of each counterweight block 15 close to the product; when the pressure head 7 applies pressure toward the corresponding product, the pressure on the corresponding product is changed by replacing the counterweight blocks 15 with different weights.

[0057] Multiple pressure heads 7 maintain the pressure of the product at the same time, saving work hours. The pressure of the pressure head 7 is controlled by the counterweight block 15. At the same time, the counterweight block 15 is guided by a linear slide rail to avoid the counterweight block 15 from getting stuck and ensure the stability of the pressure. At the same time, by replacing the counterweight blocks 15 of different weights to change the pressure on the corresponding product, different pressures of different tapes can be controlled on the same axis.

[0058] Specifically, the pressure-applying component 6 includes two embodiments, wherein: Fig.10 A in the middle represents the partition of the counterweight 15, so that the larger pressure head 7 connected to the counterweight 15 has higher stability, that is, Fig.10 The first embodiment of the pressure member 6 is shown in FIG. Fig.11 This is the second embodiment. The main difference between the two embodiments is that the specifications of the connected pressure heads 7 are different and the products they target are also different.

[0059] In some specific embodiments, a lifting mechanism 8 is provided at the bottom of the carrier 1 , and the lifting mechanism 8 can push the carrier 1 to a set height and then reset it.

[0060] Due to the soft nature of FPC products, the bottom of the product must be supported by a flat surface during pressure holding to ensure that the product will not be crushed during pressure holding. Therefore, the lifting mechanism 8 is lifted during pressure holding to drive the load-bearing portion 3 to support the pressure holding portion. After the pressure holding ends and the product falls, it flows out.

[0061] In some specific embodiments, the lifting mechanism 8 includes a bottom support plate 9 located at the pressing station, and a plurality of fixed guide blocks 10 and a plurality of lifting units 11 are installed on the surface of the bottom support plate 9. A guide block 12 fixedly connected to the carrier 1 is slidably provided on each fixed guide block 10, and the movable ends of all the lifting units 11 are connected to the carrier 1 to support the carrier 1 to rise and fall.

[0062] The lifting unit 11 can be a cylinder, which can push the carrier 1 to rise. When the carrier 1 rises, it will slide along the fixed guide block 10 with the guide block 12, so that there will be no problem with the height and position of the carrier 1 when it is raised.

[0063] In some specific embodiments, the surface of the carrier 1 has a receiving groove 17 for receiving the carrying portion 3 .

[0064] This arrangement is to make the loading surface portion 3 replaceable.

[0065] In some specific embodiments, the carrier portion 3 is selected to be configured as a structure with a heating function, so as to heat the product and the tape.

[0066] Flexible circuit boards need to be attached with a variety of tapes. Some tapes need to be heated to activate the viscosity of the tapes during lamination, while some tapes do not need to be heated for lamination. If the tapes of the product are pressed one by one, it will cause low production capacity and require a lot of manpower. Therefore, the product is now arranged in multiple pieces. For the tapes that need to be heated, a heating block is installed at the corresponding position on the carrier surface 3. For those that do not need to be heated, a processed part of the same height is used for support, so as to achieve simultaneous lamination of the tapes, save working hours, reduce the turnover of flexible circuit boards, and reduce the damage rate.

[0067] In some specific embodiments, a belt 16 is provided on the surface of the base of the device to transport the carrier 1 to the pressing station.

[0068] The working principle of the utility model is:

[0069] The flexible circuit board is evenly distributed in the carrier 1, and the carrier 1 flows into the pressing station through the belt 16. The lifting mechanism 8 lifts the carrier 1, and the two lifting mechanisms 13 distributed on the left and right drive the corresponding pressure components 6 to descend to press the corresponding tape, that is, the pressure component 6 brings multiple pressure heads 7 to press the product and the tape on the carrier portion 3. Once the pressure head 7 contacts the product, the recessed portion drives the tape to fit the product surface and the surface of the convex area at the same time by accommodating the surface convex area of ​​the corresponding product. Even if there is a height difference, two surfaces of different heights can be adhered at the same time. At the same time, multiple pressure heads 7 can press multiple products at the same time, which is highly efficient. When the pressing reaches the set time, the two lifting mechanisms 13 drive the corresponding pressure components 6 to rise, and the lifting mechanism 8 descends and separates from the flexible circuit board. At this time, the carrier 1 equipped with the flexible circuit board just falls on the belt 16, and the belt 16 blocks the descent, and the carrier 1 flows out to complete the pressing of the tape.

[0070] The above embodiments are only for illustrating the technical concept and features of the utility model, and their purpose is to enable people familiar with the technology to understand the content of the utility model and implement it accordingly, and they cannot be used to limit the protection scope of the utility model. Any equivalent changes or modifications made according to the spirit of the utility model should be included in the protection scope of the utility model.

Claims

1. A device for synchronously pressing multiple adhesive tapes on a flexible circuit board, the pressing device being mounted on a device base for pressing adhesive tapes on a product, characterized in that: The pressing device comprises: a carrier (1), a motion module (2) and a pressing component (6); The upper surface of the equipment base has a pressing station, the carrier (1) is located in the pressing station, and the surface of the carrier (1) has a plurality of carrying portions (3) for carrying products; The motion module (2) is fixedly mounted on the upper surface of the equipment base, and the pressure-applying component (6) is located directly above the pressing station and is fixedly connected to the movable end of the motion module (2); The end of each of the pressure-applying components (6) has a plurality of pressure heads (7), each of the pressure heads (7) is respectively arranged corresponding to each of the loading surface portions (3), and the pressure-applying components (6) are capable of pushing the pressure heads (7) to apply pressure to the adhesive tape covering the surface of the product; At least part of the surface of the loading portion (3) or the pressure head (7) has a recessed portion, and the recessed portion is arranged to match the raised area on the surface of the product; When the pressure head (7) applies pressure to the corresponding product, the recessed portion accommodates the raised area on the surface of the corresponding product to drive the adhesive tape to adhere to the surface of the product and the surface of the raised area at the same time.

2. The device for synchronously pressing multiple adhesive tapes for flexible circuit boards according to claim 1, characterized in that: The recessed portion is a groove (4).

3. The device for synchronously pressing multiple adhesive tapes for flexible circuit boards according to claim 1, characterized in that: The top-view projection area of ​​the pressure head (7) is smaller than the top-view projection area of ​​the load-bearing portion (3).

4. The device for synchronously pressing multiple adhesive tapes for flexible circuit boards according to claim 1, characterized in that: The motion module (2) comprises two fixing frames (5) fixedly connected to the surface of the device base, each of the fixing frames (5) being mounted with a lifting mechanism (13), and the movable end of the lifting mechanism (13) being fixedly connected to the pressure component (6).

5. The device for synchronously pressing multiple adhesive tapes for flexible circuit boards according to claim 4, characterized in that: The pressure-applying component (6) comprises a mounting block (14) fixedly connected to the movable end of the lifting mechanism (13), a plurality of detachably connected counterweight blocks (15) being arranged on the mounting block (14), and each of the pressure heads (7) being correspondingly arranged at one end of each counterweight block (15) close to the product; When the pressure head (7) applies pressure to the corresponding product, the pressure applied to the corresponding product is changed by replacing the counterweight blocks (15) with different weights.

6. The device for synchronously pressing multiple adhesive tapes for flexible circuit boards according to claim 1, characterized in that: A lifting mechanism (8) is provided at the bottom of the carrier (1), and the lifting mechanism (8) can push the carrier (1) to rise to a set height and then reset.

7. The device for synchronously pressing multiple adhesive tapes for flexible circuit boards according to claim 6, characterized in that: The lifting mechanism (8) comprises a bottom support plate (9) located at a pressing station, a plurality of fixed guide blocks (10) and a plurality of lifting units (11) being mounted on the surface of the bottom support plate (9), each of the fixed guide blocks (10) being slidably provided with a guide block (12) fixedly connected to the carrier (1), and the movable ends of all the lifting units (11) being connected to the carrier (1) for lifting and lowering the carrier (1).

8. The device for synchronously pressing multiple adhesive tapes for flexible circuit boards according to claim 1, characterized in that: The surface of the carrier (1) has a receiving groove (17) for receiving the carrying portion (3).

9. The device for synchronously pressing multiple adhesive tapes for flexible circuit boards according to claim 1, characterized in that: The loading portion (3) is optionally configured as a structure with a heating function, so as to heat the product and the adhesive tape.

10. The device for synchronously pressing multiple adhesive tapes for flexible circuit boards according to claim 1, characterized in that: A belt (16) is provided on the surface of the equipment base for conveying the carrier (1) to the pressing station.

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