Board planting machine for removing circuit board from jig and carrying out transposition planting

Abstract

The utility model discloses a board planting machine for removing a circuit board from a jig and performing transposition planting, which comprises a rack, a first board conveying device, a second board conveying device, a first carrying device, a second carrying device and a turn-over translation device are arranged on the rack, the turn-over translation device is arranged between the first carrying device and the second carrying device, and the first carrying device and the second carrying device are arranged on the rack. Comprising a turn-over assembly and a translation assembly, the turn-over assembly is used for turning over a cover plate, a circuit board or a carrier plate placed on a bearing plate of the turn-over assembly and transferring the cover plate, the circuit board or the carrier plate to the translation assembly, a supporting frame supports a first carrying device and a second carrying device above a first conveying device and a second conveying device, and the conveying direction is parallel to the X-axis direction. According to the utility model, through the carrying device, the conveying device and the turn-over translation device, the circuit board can be transferred out between the carrier plate and the cover plate, and then the circuit board can be subjected to multi-mode transposition implantation.

Description

Technical Field

[0001] The utility model belongs to the technical field of equipment for circuit board production, and in particular relates to a board implanter for removing a circuit board from a fixture and implanting it in a transposed position. Background Art

[0002] In the circuit board production process, it is sometimes necessary to place the circuit board on a jig for the next step of operation. An existing jig includes a carrier plate and a cover plate. The circuit board needs to be implanted into the carrier plate and then covered with the cover plate, that is, it is clamped between the carrier plate and the cover plate. After completing one process, it is sometimes necessary to transfer the circuit board clamped between the carrier plate and the cover plate and re-implant it on another carrier plate, or implant it on a flipped carrier plate. According to actual needs, the circuit board or the cover plate may also need to be flipped over for the next process, so the re-implantation of the circuit board may have multiple modes. Most existing equipment operates according to one mode and is not compatible with other modes. Summary of the invention

[0003] In view of the problems existing in the prior art, the main purpose of the utility model is to provide a circuit board implanter which can transfer the circuit board from the fixture and implant it in a multi-mode position.

[0004] In order to achieve the above-mentioned main purpose, the utility model provides a plate planting machine including a frame, on which a first conveying device, a second conveying device, a first handling device, a second handling device and a flipping and translating device are arranged; the first handling device includes a first X-axis moving module, a first Y-axis moving module, a first Z-axis moving module and a first grasping mechanism, the first grasping mechanism can move along the X-axis, Y-axis and Z-axis directions, the second handling device includes a second X-axis moving module and a second Y-axis moving module, a second Z-axis moving module and a second grasping mechanism, the second grasping mechanism can move along the X-axis, Y-axis and Z-axis directions; the frame includes a supporting frame, which supports the first handling device and the second handling device above the first conveying device and the second conveying device, wherein the first Y-axis moving module and the second Y-axis moving module are arranged on the supporting frame, and the conveying directions of the first conveying device and the second conveying device are parallel to the X-axis direction The flipping and translating device is arranged between the first conveying device and the second conveying device, and comprises a flipping assembly and a translating assembly, and the flipping assembly comprises a receiving plate, a supporting member and a rotating driving member, and the rotating driving member drives the receiving plate to rotate, and the translating assembly can be moved to the bottom of the receiving plate, and transfers the cover plate, circuit board or carrier plate from the receiving plate to the translating assembly; the first conveying device has a first carrier plate placement position and a first cover plate placement position, and the first transporting device transports the cover plate, circuit board or carrier plate between the first conveying device and the flipping and translating device, or between the first carrier plate placement position and the first cover plate placement position; the second conveying device has a second carrier plate placement position and a second cover plate placement position, and the second transporting device transports the cover plate, circuit board or carrier plate between the second conveying device and the flipping and translating device, or between the second carrier plate placement position and the second cover plate placement position.

[0005] It can be seen from the above scheme that by setting up two conveying devices, each conveying device has two placement positions, so that the carrier plate and the cover plate can be placed separately, and the cover plate, circuit board or carrier plate that does not need to be turned over can be directly placed on the translation assembly for transfer, and the cover plate, circuit board or carrier plate that needs to be turned over can be turned over by the flipping assembly and then transferred to the translation assembly for transfer, so that the circuit board can be removed from between the cover plate and the carrier plate and multi-mode transposition implanted, and the two conveying devices can perform conveying operations at the same time, thereby improving production efficiency.

[0006] According to a specific implementation of the utility model, the translation assembly can reciprocate in a direction parallel to the conveying direction. The moving direction of the translation assembly is parallel to the conveying direction, which can save space and achieve a compact layout.

[0007] According to a specific implementation of the utility model, the flip assembly includes a moving drive mechanism, and the receiving plate can be driven to move in a vertical direction.

[0008] It can be seen from the above scheme that the receiving plate can move in the vertical direction, and when the translation assembly moves to the bottom of the receiving plate, it is convenient to transfer the circuit board, cover plate or carrier plate on the receiving plate to the translation assembly.

[0009] According to a specific embodiment of the utility model, the first gripping mechanism is rotatably disposed on the first Z-axis moving module and includes a first vacuum generator and a first suction cup, and the second gripping mechanism is rotatably disposed on the second Z-axis moving module and includes a second vacuum generator and a second suction cup. The cover plate, circuit board or carrier plate is gripped by the vacuum generator and the suction cup.

[0010] According to a specific embodiment of the utility model, the plate implanter further comprises a suction cup quick replacement device, through which the suction cups of the first conveying device and the second conveying device can be quickly replaced.

[0011] According to a specific embodiment of the utility model, a first feeding mechanism is provided at the upstream position of the first conveying device, and a first receiving mechanism is provided at the downstream position; a second feeding mechanism is provided at the upstream position of the second conveying device, and a second receiving mechanism is provided at the downstream position. By providing the feeding mechanism and the receiving mechanism, the loading and receiving of the carrier plate can be automated.

[0012] According to a specific embodiment of the utility model, the first conveying device and the second conveying device have conveying tracks with adjustable spacing. By adjusting the conveying tracks, the plate implanting machine can be applied to various types of carrier plates.

[0013] According to a specific embodiment of the utility model, the first transport device is provided with a first detection camera, and the second transport device is provided with a second detection camera. By providing the first detection camera and the second detection camera, the cover plate, the circuit board and the carrier plate can be accurately positioned, and the implantation position of the steel plate and the circuit board on the carrier plate can be accurately positioned.

[0014] According to a specific embodiment of the present utility model, the first conveying device or the second conveying device is provided with a cleaning component. The carrier plate is cleaned by providing the cleaning component.

[0015] According to a specific embodiment of the utility model, the support frame is provided with a Y-axis sliding track, and the first X-axis moving module and the second X-axis moving module slide on the same Y-axis sliding track. By making the first transport device and the second transport device share a set of Y-axis sliding tracks, the structure of the plate implanting machine can be simplified.

[0016] In order to more clearly illustrate the above-mentioned objectives, technical solutions and advantages of the present invention, the present invention is further described in detail below in conjunction with the accompanying drawings and specific implementation methods. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a three-dimensional structural schematic diagram of an embodiment of the utility model;

[0018] Figure 2 This is a schematic diagram of the three-dimensional structure of the embodiment of the utility model after removing the casing;

[0019] Figure 3 It is a schematic diagram of the top view of the structure of the embodiment of the utility model after the casing is removed;

[0020] Figure 4 It is a schematic diagram of the structure of the flipping and translation device in the embodiment of the utility model;

[0021] Figure 5 It is a schematic diagram of the arrangement of various positions in the embodiment of the utility model. DETAILED DESCRIPTION

[0022] In the following description, many specific details are set forth to facilitate a full understanding of the present invention, but it is easy for those skilled in the art to understand that the present invention can also be implemented in other ways different from those described herein. Therefore, other possible implementation methods that can be known by those skilled in the art based on the embodiments described in this application all belong to the protection scope of this application.

[0023] like Figures 1 to 3 As shown, the plate implanting machine 100 has a casing 10, a frame 11 is provided inside the casing, a working surface is arranged on the frame 11, and a first conveying device 51 and a second conveying device 52 which are parallel to each other can be arranged above the working surface. The first conveying device 51 can be provided with a first loading mechanism and a first receiving mechanism located outside the casing 10, and the second conveying device 52 can be provided with a second loading mechanism and a second receiving mechanism located outside the casing 10. The carrier plate with the cover plate and the circuit board enters the conveying device through the loading mechanism, and the product after the transfer and implantation of the circuit board is completed can be collected by the receiving mechanism. A negative pressure cleaning component can be arranged above the first conveying device 51 and / or the second conveying device 52 to clean the carrier plate. The first conveying device 51 and the second conveying device 52 have conveying tracks with adjustable spacing, so that the plate implanting machine can be suitable for various types of carrier plates.

[0024] The first transport device 21 and the second transport device 22 are arranged on the support frame 111 of the frame 11 and are located above the working surface. The first transport device 21 includes a first Y-axis moving module 211, a first X-axis moving module 212, and a first Z-axis moving module 213, and the first grabbing mechanism is arranged below the first Z-axis moving module 213. The second transport device 22 includes a second Y-axis moving module 221, a second X-axis moving module 222, and a second Z-axis moving module 223, and the second grabbing mechanism is arranged below the second Z-axis moving module 223. The first Y-axis moving module 211 of the first transport device 21 and the second Y-axis moving module of the circuit board moving device are both arranged on the support frame 111, and can drive the first X-axis moving module and the second X-axis moving module to reciprocate along the same track along the Y-axis direction. The first X-axis moving module 212 can drive the first Z-axis moving module 213 to reciprocate along the X-axis direction, and the first Z-axis moving module 213 can drive the first grabbing mechanism to reciprocate along the Z-axis direction, i.e., the vertical direction. The second X-axis moving module 222 can drive the second Z-axis moving module 223 to reciprocate along the X-axis direction, and the second Z-axis moving module 223 can drive the second grabbing mechanism to reciprocate along the Z-axis direction.

[0025] The first gripping mechanism is rotatably disposed on the first Z-axis moving module 213 and includes a first vacuum generator and a first suction cup. The second gripping mechanism is rotatably disposed on the second Z-axis moving module 223 and includes a second vacuum generator and a second suction cup. The first Z-axis moving module 213 may be provided with a first detection camera, and the second Z-axis moving module 223 may be provided with a second detection camera. Both the first suction cup and the second suction cup may be quickly replaced by a suction cup quick replacement device, wherein the suction cup may adopt an automatic quick replacement module to realize automatic switching of air circuits and circuits, and the suction cup quick replacement device may include a three-dimensional motion manipulator.

[0026] The X-axis and the Y-axis are perpendicular to each other and are both horizontal, and the X-axis direction is parallel to the conveying direction of the conveying device. In this embodiment, the first conveying device 21 and the second conveying device 22 are arranged in parallel along the X-axis direction and share a Y-axis moving track, and the X-axis moving module and the Z-axis moving module can be moved by screw drive.

[0027] A turning and translation device is also provided between the first conveying device 51 and the second conveying device 52. Figure 4As shown, the flipping and translating device includes a translation component 31 and a flipping component 41. The translation component can move between a translation position and a flipping position. The flipping component 41 includes a receiving plate 411, a supporting member, a rotation driving member and a moving driving member. The rotation driving member can drive the receiving plate 411 to rotate, and the moving driving member can drive the receiving plate to move in a vertical direction. The circuit board, the cover plate and the carrier plate can be placed on the receiving plate 411 by the first handling device 21 or the second handling device 22, and adsorbed on the surface of the receiving plate 411, and then the rotating driving member rotates the receiving plate 180 degrees, so that the product on it is flipped. The translation component 31 moves from its initial translation position to the bottom of the receiving plate 411 in a direction parallel to the conveying direction, and the product on the receiving plate is transferred to the translation component 31, and then the translation component 31 returns to its translation position.

[0028] Figure 5 The positional relationship between various positions on the working surface is shown. It can be seen that the arrangement of various positions in this embodiment is compact and the space utilization rate is high.

[0029] The specific operation process of this embodiment is described below by taking two examples of circuit board transfer and implantation.

[0030] In the first case, the circuit board and cover plate implanted on the A side of the carrier plate are transferred to the B side of the carrier plate, which may include multiple modes of flipping or not flipping the circuit board or cover plate. The first loading mechanism transfers the carrier plate with the A side facing up and the cover plate and circuit board to the first carrier plate placement position via the first conveying device 51. The first transporting device 21 is started, grabs the cover plate and places it in the translation position of the flipping and translating device. The second transporting device 22 grabs the cover plate from the translation position and places it in the second cover plate placement position of the second transporting device 52. Then the first transporting device 21 transfers the circuit board on the carrier plate to the receiving plate 411 of the flipping assembly 41 of the flipping and translating device. After flipping, it is moved to the flat plate by the translation assembly 31. The first conveying device 21 transfers the carrier plate to the flipping position (it can be directly transferred to the translation position when the circuit board does not need to be turned over), and the second conveying device 22 transfers the circuit board to the second cover plate placement position of the second conveying device 52; the first conveying device 21 transfers the carrier plate to the flipping position, flips the receiving plate and transfers the carrier plate to the translation position, at which time the B surface of the carrier plate faces upward, and the second conveying device 22 transfers the carrier plate from the translation position to the second carrier plate placement position, and then implants the circuit board and the cover plate into the carrier plate respectively, and conveys them to the second receiving mechanism via the second conveying device 52. Then, the first loading mechanism conveys the next carrier plate with the A surface facing upward and with the cover plate and the circuit board to the first conveying device 21, and conveys it to the first carrier plate placement position.

[0031] In the second case, the circuit board and cover plate implanted in carrier plate A are transferred and implanted in carrier plate B, which may include multiple modes of flipping or not flipping over the circuit board or cover plate. The first loading mechanism brings the carrier plate with the cover plate and circuit board into the first carrier plate placement position via the first conveying device 51, the first handling device 21 is started, grabs the cover plate and places it in the first cover plate placement position, and then the first handling device 21 transfers the circuit board to the flipping position, and then transfers the cover plate from the first cover plate placement position to carrier plate A located at the first carrier plate placement position. The carrier plate A with the transferred circuit board and the cover plate can be transported to the receiving mechanism with the first conveying device 51; after the receiving plate with the circuit board is flipped over, the circuit board is transferred to the translation assembly 31, and the translation assembly 31 moves the circuit board The circuit board moves to the translation position (it can be directly transferred to the translation position when the circuit board does not need to be turned over); the second loading mechanism brings the B carrier plate with the cover plate but not the circuit board into the second carrier plate placement position via the second conveying device 52, and the second handling device 22 grabs the cover plate on the B carrier plate and places it at the second cover plate placement position; the second handling device 22 transfers the circuit board to the B carrier plate located at the second carrier plate placement position, and then transfers the cover plate from the second cover plate placement position to the second carrier plate placement position. The implantation of the circuit board and the cover plate on the B carrier plate is completed, and the second conveying device 22 transports it to the receiving mechanism.

[0032] When the handling device transfers the circuit board, the cover plate and the carrier plate, the detection camera is used for positioning so that the circuit board and the cover plate can be accurately positioned on the carrier plate.

[0033] Although the present invention is disclosed as above with preferred embodiments, it is not intended to limit the scope of the present invention. Any person skilled in the art can make some improvements without departing from the scope of the present invention, that is, any changes or improvements made according to the present invention should be covered by the protection scope of the present invention.

Claims

1. A board implanter for removing a circuit board from a fixture and implanting it in a transposed position, the board implanter comprising a frame, on which a first conveying device, a second conveying device, a first handling device, a second handling device and a flipping and translating device are arranged; the first handling device comprises a first X-axis moving module, a first Y-axis moving module, a first Z-axis moving module and a first grasping mechanism, the first grasping mechanism can move along the X-axis, Y-axis and Z-axis directions, the second handling device comprises a second X-axis moving module, a second Y-axis moving module, a second Z-axis moving module and a second grasping mechanism, the second grasping mechanism can move along the X-axis, Y-axis and Z-axis directions; characterized in that: The frame includes a support frame, and the support frame supports the first transport device and the second transport device above the first conveying device and the second conveying device, wherein the first Y-axis moving module and the second Y-axis moving module are arranged on the support frame, and the conveying directions of the first conveying device and the second conveying device are parallel to the X-axis direction; The flipping and translating device is arranged between the first conveying device and the second conveying device, and comprises a flipping assembly and a translating assembly. The flipping assembly comprises a receiving plate, a supporting member and a rotating driving member. The rotating driving member drives the receiving plate to rotate. The translating assembly can be moved to the bottom of the receiving plate and transfer the cover plate, the circuit board or the carrier plate from the receiving plate to the translating assembly. The first conveying device has a first carrier plate placement position and a first cover plate placement position, and the first transporting device transports the cover plate, circuit board or carrier plate between the first conveying device and the flipping and translating device, or between the first carrier plate placement position and the first cover plate placement position; The second conveying device has a second carrier plate placement position and a second cover plate placement position, and the second transporting device transports the cover plate, circuit board or carrier plate between the second conveying device and the flipping and translating device, or between the second carrier plate placement position and the second cover plate placement position.

2. The board implanter for removing a circuit board from a fixture and implanting it in a different position according to claim 1, characterized in that: The translation assembly can reciprocate in a direction parallel to the conveying direction.

3. The board implanter for removing a circuit board from a fixture and implanting it in a different position according to claim 2, characterized in that: The turning assembly comprises a moving driving mechanism, and the received plate can be driven to move in a vertical direction.

4. The board implanter for removing a circuit board from a jig and implanting it in a different position according to claim 1, characterized in that: The first gripping mechanism is rotatably disposed on the first Z-axis movable module and includes a first vacuum generator and a first suction cup. The second gripping mechanism is rotatably disposed on the second Z-axis movable module and includes a second vacuum generator and a second suction cup.

5. The board implanter for removing a circuit board from a fixture and implanting it in a different position according to claim 4, characterized in that: The plate planting machine also includes a suction cup quick replacement device.

6. The board implanter for removing a circuit board from a fixture and implanting it in a different position according to claim 1, characterized in that: The first conveying device is provided with a first feeding mechanism at an upstream position, and a first receiving mechanism at a downstream position; the second conveying device is provided with a second feeding mechanism at an upstream position, and a second receiving mechanism at a downstream position.

7. The board implanter for removing a circuit board from a fixture and implanting it in a different position according to claim 1, characterized in that: The first conveying device and the second conveying device both have conveying tracks with adjustable spacing.

8. The board implanting machine for removing a circuit board from a fixture and implanting it in a different position according to any one of claims 1 to 7, characterized in that: The first transport device is provided with a first detection camera, and the second transport device is provided with a second detection camera.

9. The board implanting machine for removing a circuit board from a fixture and implanting it in a different position according to any one of claims 1 to 7, characterized in that: The first conveying device or the second conveying device is provided with a cleaning component.

10. The board implanting machine for removing a circuit board from a fixture and implanting it in a different position according to any one of claims 1 to 7, characterized in that: The support frame is provided with a Y-axis sliding track, and the first X-axis moving module and the second X-axis moving module slide on the same Y-axis sliding track.

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