Resin gluing device for semiconductor component packaging

Abstract

The utility model provides a resin gluing device for semiconductor component packaging, and relates to the technical field of resin gluing. The resin gluing device for semiconductor component packaging comprises a platform, a mounting frame is mounted on the upper portion of the platform, a feeding mechanism and a spraying mechanism are mounted on the mounting frame, the feeding mechanism is located above the spraying mechanism, a mounting groove is formed in the upper portion of the platform, a transverse lead screw is rotationally connected to the inner wall of the mounting groove, and a transverse lead screw is rotationally connected to the inner wall of the transverse lead screw. The outer side of the transverse lead screw is sleeved with a transverse adjusting plate in a threaded mode. According to the resin gluing device for semiconductor component packaging, by arranging the transverse lead screw and the transverse adjusting plate, the transverse position of the substrate can be adjusted on the basis of stably fixing the substrate, so that the position of the substrate is conveniently adjusted, and spraying of resin glue is facilitated; therefore, the resin gluing device for packaging the semiconductor component can be adapted to substrates with different dispensing positions and different sizes, so that the applicability and the practicability of the resin gluing device for packaging the semiconductor component are effectively improved.

Description

Technical Field

[0001] The utility model relates to a resin gluing device for semiconductor component packaging, specifically a resin gluing device for semiconductor component packaging, belonging to the technical field of resin gluing. Background Technique

[0002] Epoxy resin glue generally refers to an adhesive made mainly of epoxy resin. Epoxy resin glue generally also needs to be added with an epoxy resin curing agent to cure it. Epoxy resin glue can be classified according to its main composition, professional use, construction conditions, packaging, and form. The classification of epoxy resin has not been unified yet. Generally, it is classified according to strength, heat resistance grade, and characteristics. There are 16 main varieties of epoxy resin, including general-purpose glue, structural glue, heat-resistant glue, low-temperature-resistant glue, underwater and wet surface glue, conductive glue, optical glue, spot welding glue, epoxy resin glue film, foaming glue, strain glue, soft material bonding glue, sealant, special glue, cured glue, civil engineering glue, etc.

[0003] After a large number of searches, it is found that: in the Chinese utility model patent column: the publication number 202022612550.2 discloses a resin spraying device based on semiconductor component packaging, which relates to a semiconductor field, including a storage chamber and a fixing frame. A first motor is fixedly installed on the top of the storage chamber. A connecting rod is arranged at the output end of the first motor, and a stirring blade is arranged on the surface of the connecting rod. A support column is fixedly connected to one side of the storage chamber. A one-way control valve is arranged at one side of the bottom of the storage chamber. A box body is arranged at the bottom of the storage chamber, and a heating rod is arranged inside the box body.

[0004] This device uses the cooperation of a second motor and a threaded rod to drive the fixing plate to press down and clamp the substrate in sequence. Although this method can stably fix the substrate, it cannot adjust its fixed position according to the dispensing position and the change of the substrate shape, so as to facilitate the dispensing of the dispensing needle. Therefore, the applicability and practicability of the resin gluing device for semiconductor component packaging are reduced. Content of the Utility Model

[0005] (1) Technical Problems to be Solved

[0006] The purpose of the present utility model is to provide a resin gluing device for semiconductor component packaging in order to solve the above problems, so as to solve the problem of low practicability of the existing resin gluing device for semiconductor component packaging.

[0007] (2) Technical Solutions

[0008] The utility model is realized through the following technical scheme: a resin coating device for semiconductor component packaging comprises a platform, a mounting frame is installed on the upper part of the platform, a feeding mechanism and a spraying mechanism are installed on the mounting frame, the feeding mechanism is located above the spraying mechanism, a mounting groove is opened on the upper part of the platform, a transverse screw rod is rotatably connected to the inner wall of the mounting groove, a transverse adjustment plate is provided on the outer thread sleeve of the transverse screw rod, the transverse adjustment plate is slidably connected to the inner wall of the mounting groove, a longitudinal adjustment mechanism is arranged on the upper part of the transverse adjustment plate, a clamping mechanism is arranged on the upper part of the longitudinal adjustment mechanism, and the spraying mechanism is located above the clamping mechanism of the mounting groove.

[0009] Preferably, the longitudinal adjustment mechanism includes a longitudinal adjustment plate and a longitudinal screw rod, the longitudinal adjustment plate is threadedly sleeved on the outside of the longitudinal screw rod, both ends of the longitudinal screw rod are rotatably connected to sliders, the vertical cross-section of the slider is an I-shaped structure, and the inner walls on both sides of the mounting groove are formed with sliding grooves slidably connected to the slider, the vertical cavity of the sliding groove is an I-shaped cavity, the longitudinal screw rod and the transverse screw rod are horizontally and vertically arranged with each other, a longitudinal groove is opened on the upper part of the transverse adjustment plate, and the longitudinal adjustment plate is slidably connected in the longitudinal groove cavity.

[0010] Preferably, a hexagonal rod is rotatably connected to the sliding inner wall, a ring is slidably sleeved on the outer side of the hexagonal rod, the slider on the right is rotatably sleeved on the outer side of the ring, and two bevel gears meshing with each other are rotatably connected to the slider on the left, the two bevel gears are fixedly sleeved on the end of the longitudinal screw rod and the end of the ring respectively, the two bevel gears are arranged perpendicular to each other, and the hexagonal rod and the transverse screw rod are parallel to each other.

[0011] Preferably, the clamping mechanism includes a lifting plate, a resistance plate and two clamping plates arranged in sequence from bottom to top, and connecting rods distributed in a linear array are fixedly connected between the clamping plate and the lifting plate, and the connecting rods are slidably connected in a through opening opened in the upper part of the resistance plate, and a lifting groove is opened in the upper part of the longitudinal adjustment plate, the resistance plate is installed at the groove of the lifting groove, and the lifting plate is slidably connected in the cavity of the lifting groove.

[0012] Preferably, a first motor is installed on the bottom wall inside the lifting groove, and the first motor is located on one side of the longitudinal screw rod. The first motor used in this application is a purchased part, which is selected according to the power and size requirements. This application will not go into details. The first motor is electrically connected to the power supply, and a threaded rod is rotatably connected to the bottom of the contact plate. The bottom end of the threaded rod is fixedly connected to the movable end of the upper part of the first motor, and the lifting plate is threadedly sleeved on the outside of the threaded rod through the threaded hole.

[0013] Preferably, the feeding mechanism includes a hopper, a booster pump, and a main pipe installed on the mounting frame. A first conduit is fixedly connected and communicated between the bottom end of the hopper and the feeding end of the booster pump. A second conduit is fixedly connected and communicated between the discharging end of the booster pump and the upper part of the main pipe. A hydraulic rod is fixedly connected to the bottom of the main pipe, and a movable end at the bottom of the hydraulic rod is fixedly connected to a connecting plate. A linear array of glue spraying nozzles is installed on the connecting plate, and a telescopic pipe is fixedly connected and communicated between the glue spraying nozzle and the main pipe.

[0014] Preferably, a second motor is installed on the mounting frame. The second motor used in this application is a purchased part, which is selected according to the requirements of power and size, and will not be elaborated in this application. The second motor is electrically connected to the power supply. A gear is fixedly connected to the movable end of the second motor. A rotating rod is rotatably connected to the mounting frame. A stirring rod is fixedly connected to the bottom end of the rotating rod and is arranged in a circumferential array inside the hopper. A toothed ring meshed with the gear is fixedly sleeved on the top end of the rotating rod. A heating rod is installed on the mounting frame, and the rotating rod is rotatably sleeved outside the heating rod. The stirring rod is made of heat-conducting material, and the end of the stirring rod is in contact with the outside of the heating rod.

[0015] The utility model provides a resin glue coating device for semiconductor device packaging, and the beneficial effects thereof are as follows:

[0016] 1. For the resin glue coating device for semiconductor device packaging, by setting the horizontal lead screw and the horizontal adjusting plate, the horizontal position of the substrate can be adjusted on the basis of stably fixing the substrate, so as to facilitate the adjustment of the substrate position for the spraying of resin glue, so that the resin glue coating device for semiconductor device packaging can be adapted to different dispensing positions and substrates of different sizes, thereby effectively improving the applicability and practicability of the resin glue coating device for semiconductor device packaging.

[0017] 2. For the resin glue coating device for semiconductor device packaging, by setting the vertical lead screw and the vertical adjusting plate, the vertical position of the substrate can be conveniently adjusted, thereby further improving the applicability and practicability of the resin glue coating device for semiconductor device packaging.

[0018] 3. For the resin glue coating device for semiconductor device packaging, by installing a rotating rod and a stirring rod in the hopper and installing a heating rod in the rotating rod, the resin glue in the hopper can be kept in a viscous state, avoiding solidification caused by too long storage time and low temperature environment, resulting in blockage, thereby improving the applicability of the device. At the same time, the overall heating range and efficiency of the resin glue are increased, thus avoiding the problems of small heating range and poor heating effect of the heating rod. Description of the Drawings

[0019] Figure 1 is a three-dimensional schematic diagram of the whole of the utility model;

[0020] Figure 2 This is a schematic cross-sectional structure diagram of the whole utility model;

[0021] Figure 3 This is a schematic cross-sectional structure diagram of the longitudinal adjustment plate of the utility model;

[0022] Figure 4 This is a schematic three-dimensional diagram of the cooperation between the transverse adjustment plate and the longitudinal adjustment plate of the utility model;

[0023] Figure 5 This is a schematic three-dimensional diagram of the cooperation between the longitudinal lead screw and the hexagonal rod of the utility model.

[0024]

Description of Main Component Symbols

[0025] 1. Platform; 2. Mounting frame; 3. Hopper; 4. Transverse lead screw; 5. Transverse adjustment plate; 6. Longitudinal adjustment plate; 7. Longitudinal lead screw; 8. Slide block; 9. Hexagonal rod; 10. Bevel gear; 11. Contact plate; 12. Clamping plate; 13. Lifting plate; 14. First motor; 15. Threaded rod; 16. Second motor; 17. Rotating rod; 18. Booster pump; 19. Main flow pipe; 20. Connecting plate; 21. Telescopic pipe; 22. Heating rod. Specific Embodiment

[0026] The embodiment of the utility model provides a resin gluing device for semiconductor component packaging.

[0027] Please refer to Figures 1 to 5 , which includes a platform 1. An installation frame 2 is installed on the upper part of the platform 1. A feeding mechanism and a spraying mechanism are installed on the installation frame 2. The feeding mechanism is located above the spraying mechanism. An installation groove is opened on the upper part of the platform 1. A transverse lead screw 4 is rotatably connected to the inner wall of the installation groove. A transverse adjustment plate 5 is threadedly sleeved on the outer side of the transverse lead screw 4. The transverse adjustment plate 5 is slidably connected to the inner wall of the installation groove. A longitudinal adjustment mechanism is arranged on the upper part of the transverse adjustment plate 5. A clamping mechanism is arranged on the upper part of the longitudinal adjustment mechanism. The spraying mechanism is located above the clamping mechanism in the installation groove;

[0028] Use the clamping mechanism to install the substrate on the upper part of the longitudinal adjustment mechanism, and then adjust the transverse position of the transverse adjustment plate 5 according to the needs of the gluing position. By rotating the transverse lead screw 4, the transverse lead screw 4 drives the transverse adjustment plate 5 to slide horizontally on the inner wall of the installation groove, thereby adjusting the transverse position of the substrate.

[0029] Please refer to Figure 4The longitudinal adjustment mechanism includes a longitudinal adjustment plate 6 and a longitudinal screw rod 7. The longitudinal adjustment plate 6 is threadedly sleeved on the outside of the longitudinal screw rod 7. Both ends of the longitudinal screw rod 7 are rotatably connected with sliders 8. The vertical cross-section of the slider 8 is an I-shaped structure. The inner walls on both sides of the installation groove are formed with slide grooves slidably connected to the slider 8. The vertical cavity of the slide groove is an I-shaped cavity. The longitudinal screw rod 7 and the transverse screw rod 4 are horizontally and vertically arranged with each other. A longitudinal groove is opened on the upper part of the transverse adjustment plate 5, and the longitudinal adjustment plate 6 is slidably connected in the longitudinal groove cavity;

[0030] By rotating the longitudinal screw rod 7, the longitudinal screw rod 7 drives the longitudinal adjustment plate 6 to slide horizontally and longitudinally on the transverse adjustment plate 5, so as to facilitate the adjustment of the longitudinal position of the glue coating.

[0031] See also Figure 4 , a hexagonal rod 9 is rotatably connected to the inner wall of the slide, a collar is slidably sleeved on the outer side of the hexagonal rod 9, the right slider 8 is rotatably sleeved on the outer side of the collar, and two bevel gears 10 meshing with each other are rotatably connected to the left slider 8, the two bevel gears 10 are respectively fixedly sleeved on the ends of the longitudinal screw rod 7 and the ends of the collar, the two bevel gears 10 are arranged perpendicular to each other, and the hexagonal rod 9 and the transverse screw rod 4 are parallel to each other;

[0032] By rotating the hexagonal rod 9, the hexagonal rod 9 drives the slider 8 to rotate by using the collar, and at the same time the hexagonal rod 9 drives one of the bevel gears 10 to rotate, and the bevel gear 10 drives the longitudinal screw rod 7 to rotate by using another bevel gear 10;

[0033] When the transverse adjustment plate 5 is moved, the longitudinal adjustment plate 6 slides on the hexagonal rod 9 via the slider 8 .

[0034] See also Figure 3 and Figure 4 The clamping mechanism includes a lifting plate 13, a contact plate 11 and two clamping plates 12 arranged in sequence from bottom to top. A connecting rod distributed in a linear array is fixedly connected between the clamping plate 12 and the lifting plate 13. The connecting rod is slidably connected in a through opening opened in the upper part of the contact plate 11. A lifting groove is opened in the upper part of the longitudinal adjustment plate 6. The contact plate 11 is installed at the groove of the lifting groove, and the lifting plate 13 is slidably connected in the cavity of the lifting groove.

[0035] See also Figure 3 A first motor 14 is installed on the bottom wall inside the lifting slot. The first motor 14 is located on one side of the longitudinal screw rod 7. The first motor 14 used in this application is a purchased part, which is selected according to the power and size requirements. This application will not go into details. The first motor 14 is electrically connected to the power supply. A threaded rod 15 is rotatably connected to the bottom of the contact plate 11. The bottom end of the threaded rod 15 is fixedly connected to the movable end of the upper part of the first motor 14. The lifting plate 13 is threadedly sleeved on the outer side of the threaded rod 15 through the threaded hole opened.

[0036] Place the substrate on the upper part of the contact plate 11, and then start the first motor 14 to drive the threaded rod 15 to rotate. The threaded rod 15 drives the lifting plate 13 to move up and down, so as to use the lifting plate 13 to drive the clamping plate 12 to clamp the substrate from the upper edge of the substrate.

[0037] Please refer to Figure 2 , the feeding mechanism includes a hopper 3, a booster pump 18 and a main pipe 19 installed on the mounting frame 2. A first conduit is fixedly connected between the bottom end of the hopper 3 and the feeding end of the booster pump 18. A second conduit is fixedly connected between the discharging end of the booster pump 18 and the upper part of the main pipe 19. A hydraulic rod is fixedly connected to the bottom of the main pipe 19. The movable end of the bottom of the hydraulic rod is fixedly connected to a connecting plate 20. Glue spraying nozzles distributed in a linear array are installed on the connecting plate 20. A telescopic pipe 21 is fixedly connected between the glue spraying nozzle and the main pipe 19;

[0038] Put the resin glue into the hopper 3. An opening and closing solenoid valve is installed at the discharge port at the bottom of the hopper 3. Use the booster pump 18 to send the resin glue along the main pipe 19 into each telescopic pipe 21, and then discharge it to the upper part of the substrate by each glue spraying nozzle.

[0039] Please refer to Figure 1 and Figure 2 , a second motor 16 is installed on the mounting frame 2. The second motor 16 used in this application is a purchased part, which is selected according to the requirements of power and size. This application will not go into details. And the second motor 16 is electrically connected to the power supply. The movable end of the second motor 16 is fixedly connected with a gear. A rotating rod 17 is rotatably connected to the mounting frame 2. The bottom end of the rotating rod 17 is fixedly connected with stirring rods distributed in a circumferential array. The stirring rods are located inside the hopper 3. A toothed ring meshed with the gear is fixedly sleeved on the top end of the rotating rod 17. A heating rod 22 is installed on the mounting frame 2. The rotating rod 17 is rotatably sleeved on the outside of the heating rod 22. The stirring rod is made of heat-conducting material, and the end of the stirring rod is in contact with the outside of the heating rod 22;

[0040] Drive the gear to rotate through the second motor 16. The gear drives the rotating rod 17 to rotate by using the toothed ring. The rotating rod 17 uses the stirring rod to stir the resin glue in the hopper 3. During the stirring process, heat the inside of the rotating rod 17 by using the heating rod 22 and conduct the heat to the stirring rod, and then use the stirring rod to heat the resin glue inside the hopper 3, so as to facilitate the flow and transportation of the resin glue.

[0041] The foregoing has shown and described the basic principles, main features, and advantages of the present utility model. Those skilled in the art should understand that the present utility model is not limited by the above embodiments. The above embodiments and the descriptions in the specification only illustrate the principles of the present utility model. Without departing from the spirit and scope of the present utility model, the present utility model will have various changes and improvements, and all these changes and improvements fall within the scope of the present utility model claimed. The scope of protection claimed for the present utility model is defined by the appended claims and their equivalents.

Claims

1. A resin coating device for semiconductor component packaging, comprising a platform (1), a mounting frame (2) mounted on the upper part of the platform (1), a feeding mechanism and a spraying mechanism mounted on the mounting frame (2), characterized in that: The platform (1) is provided with a mounting groove on the upper part, a transverse screw rod (4) is rotatably connected to the inner wall of the mounting groove, a transverse adjustment plate (5) is threadedly sleeved on the outer side of the transverse screw rod (4), the transverse adjustment plate (5) is slidably connected to the inner wall of the mounting groove, a longitudinal adjustment mechanism is provided on the upper part of the transverse adjustment plate (5), and a clamping mechanism is provided on the upper part of the longitudinal adjustment mechanism.

2. The resin coating device for semiconductor component packaging according to claim 1, characterized in that: The longitudinal adjustment mechanism comprises a longitudinal adjustment plate (6) and a longitudinal screw rod (7). The longitudinal adjustment plate (6) is threadedly sleeved on the outer side of the longitudinal screw rod (7). Both ends of the longitudinal screw rod (7) are rotatably connected to sliders (8). Sliding grooves slidably connected to the sliders (8) are formed on the inner walls of both sides of the installation groove.

3. The resin coating device for semiconductor component packaging according to claim 2, characterized in that: A hexagonal rod (9) is rotatably connected to the inner wall of the slide, a collar is slidably sleeved on the outer side of the hexagonal rod (9), the right slider (8) is rotatably sleeved on the outer side of the collar, and two bevel gears (10) meshing with each other are rotatably connected to the left slider (8), and the two bevel gears (10) are fixedly sleeved on the end of the longitudinal screw rod (7) and the end of the collar, respectively.

4. The resin coating device for semiconductor component packaging according to claim 3, characterized in that: The clamping mechanism comprises a lifting plate (13), a contact plate (11) and two clamping plates (12) which are arranged in sequence from bottom to top; a connecting rod distributed in a linear array is fixedly connected between the clamping plate (12) and the lifting plate (13); the connecting rod is slidably connected in a through opening opened on the upper part of the contact plate (11); a lifting groove is opened on the upper part of the longitudinal adjustment plate (6); the contact plate (11) is installed at the groove of the lifting groove; and the lifting plate (13) is slidably connected in the cavity of the lifting groove.

5. The resin coating device for semiconductor component packaging according to claim 4, characterized in that: A first motor (14) is installed on the bottom wall inside the lifting groove, a threaded rod (15) is rotatably connected to the bottom of the contact plate (11), the bottom end of the threaded rod (15) is fixedly connected to the movable end of the upper part of the first motor (14), and the lifting plate (13) is threadedly sleeved on the outer side of the threaded rod (15) through a threaded hole.

6. The resin coating device for semiconductor component packaging according to claim 1, characterized in that: The feeding mechanism comprises a hopper (3), a booster pump (18) and a main flow pipe (19) mounted on a mounting frame (2); a first conduit is fixedly connected between the bottom end of the hopper (3) and the feed end of the booster pump (18); a second conduit is fixedly connected between the discharge end of the booster pump (18) and the upper part of the main flow pipe (19); a hydraulic rod is fixedly connected to the bottom of the main flow pipe (19); a connecting plate (20) is fixedly connected to the movable end of the bottom of the hydraulic rod; a gluing nozzle distributed in a linear array is mounted on the connecting plate (20); and a telescopic tube (21) is fixedly connected between the gluing nozzle and the main flow pipe (19).

7. The resin coating device for semiconductor component packaging according to claim 6, characterized in that: A second motor (16) is mounted on the mounting frame (2), a gear is fixedly connected to the movable end of the second motor (16), a rotating rod (17) is rotatably connected to the mounting frame (2), a stirring rod distributed in a circumferential array is fixedly connected to the bottom end of the rotating rod (17), the stirring rod is located inside the hopper (3), a gear ring is fixedly sleeved on the top end of the rotating rod (17) and meshed with the gear, a heating rod (22) is mounted on the mounting frame (2), the rotating rod (17) is rotatably sleeved on the outside of the heating rod (22), the stirring rod is made of heat-conducting material, and the end of the stirring rod is in contact with the outside of the heating rod (22).

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