Laser identification detection equipment for finished IC (integrated circuit) support plate

Abstract

The utility model relates to the technical field of IC (integrated circuit) support plate production, in particular to laser identification detection equipment for a finished IC support plate. The laser marking machine comprises a material taking assembly, a feeding roller line assembly, a feeding assembly, a main runner assembly, a visual positioning assembly, a laser marking assembly, a visual line sweeping assembly, a double-face overturning assembly, a discharging assembly and a discharging roller line assembly, the material taking assembly is in butt joint with the feeding roller line assembly, and the feeding assembly stretches across the feeding end of the feeding roller line assembly and the feeding end of the main runner assembly; the visual positioning assembly, the laser marking assembly and the visual line sweeping assembly are sequentially arranged above the main runner assembly, the double-face overturning assembly is in butt joint with the discharging end of the main runner assembly, and the discharging assembly stretches across the position between the discharging end of the main runner assembly and the discharging roller line assembly. According to the equipment, manual non-contact is realized, the labor is reduced, the yield is improved, and full-automatic production of the IC support plate is realized.

Description

Technical Field

[0001] The utility model relates to the technical field of IC carrier board production, and particularly relates to a laser marking detection device for finished IC carrier boards. Background Art

[0002] IC carrier boards are important semiconductor electronic components and are the supports for semiconductor chips. They are widely used in the semiconductor field. Since the finished IC carrier board parts are in the latter stage of the manufacturing process, their product value is higher, and scratches and scrapping will affect the quality yield. The traditional manufacturing process uses manual loading, which is prone to scratches and scrapping. In addition, manual operation is prone to inaccurate placement when placing IC carrier boards, and it is easy to place them obliquely or incorrectly, resulting in position deviation, making it difficult to weld subsequent electronic components, thus affecting the finished product quality of the IC carrier board. Summary of the Utility Model

[0003] The utility model provides a laser marking detection device for finished IC carrier boards, aiming to solve the deficiencies caused by manual operation in the existing IC carrier board production.

[0004] The utility model provides a laser marking detection device for finished IC carrier boards, including a material taking component, an infeed roller line component, a loading component, a main runner component, a vision positioning component, a laser marking component, a vision line scan component, a double-sided flipping component, a discharging component, and an outfeed roller line component. The material taking component is connected to the infeed roller line component, the loading component spans between the infeed end of the infeed roller line component and the main runner component, the vision positioning component, the laser marking component, and the vision line scan component are sequentially arranged above the main runner component, the double-sided flipping component is connected to the outfeed end of the main runner component, and the discharging component spans between the outfeed end of the main runner component and the outfeed roller line component.

[0005] As a further improvement of the utility model, the material taking component includes a material taking support plate, a material taking module, material taking suction cups, a material taking lifting cylinder, and a pressing cylinder. The material taking module is connected to the infeed roller line component, the material taking lifting cylinder is slidably connected to the material taking module, the material taking support plate is connected to the material taking lifting cylinder, the pressing cylinder is connected to one end of the material taking support plate, a plurality of material taking suction cups are arranged on the material taking support plate, the material taking support plate is connected to an external IC carrier board feeding device, and after the material taking support plate adsorbs the IC carrier board through the material taking suction cups, the pressing cylinder presses one end of the IC carrier board.

[0006] As a further improvement of the present utility model, the feeding roller line assembly includes a feeding bracket, a feeding magnetic wheel, a feeding motor, a feeding support cylinder, a feeding adjustment rail, and a feeding adjustment screw rod. The picking component is connected to the front end of the feeding bracket. Two rows of magnetic wheel mounting plates are movably connected to the feeding bracket through the feeding adjustment rail. The feeding adjustment screw rod connects the two rows of magnetic wheel mounting plates. A plurality of feeding magnetic wheels are movably connected to each row of magnetic wheel mounting plates. The feeding motor is connected to the feeding bracket and drives the feeding magnetic wheels. The feeding support cylinder is connected to the rear end of the feeding bracket.

[0007] As a further improvement of the present utility model, the loading component includes a loading fixed frame, a loading X-axis module, a loading Y-axis module, a loading barcode reader, a loading suction cup, and a loading lifting cylinder. The loading fixed frame straddles the feeding roller line assembly and the loading end of the main flow path assembly. The loading Y-axis module is connected to the loading fixed frame. The loading X-axis module is slidably connected to the loading Y-axis module. The loading barcode reader is slidably connected to the loading X-axis module. The loading lifting cylinder is connected to the mounting base plate of the loading X-axis module. The loading suction cup is connected to the loading lifting cylinder.

[0008] As a further improvement of the present utility model, the main flow path assembly includes a main flow path base, a main flow path linear motor, a platform lifting motor, a platform mounting frame, a platform fixture, and a pressing plate cylinder. The main flow path linear motor is connected to the main flow path base. The platform lifting motor is slidably connected to the main flow path linear motor. The platform lifting motor is connected to and drives the platform mounting frame to lift. The platform fixture is connected to the platform mounting frame. The platform fixture is provided with vacuum suction holes. The pressing plate cylinder is connected to the platform mounting frame. When an IC carrier board is placed on the platform fixture, the pressing plate cylinder presses the IC carrier board.

[0009] As a further improvement of the present utility model, the vision positioning component includes a vision positioning fixed frame, a vision positioning moving module, and a vision positioning camera. The vision positioning fixed frame straddles the main flow path assembly. The vision positioning moving module is connected to the vision positioning fixed frame. The vision positioning camera is slidably connected to the vision positioning moving module and is aligned with the main flow path assembly;

[0010] The vision line scan component includes a line scan fixed frame, a line scan camera, and a line scan light source. The line scan fixed frame straddles the main flow path assembly. The line scan camera and the line scan light source are connected to the line scan fixed frame. The line scan camera and the line scan light source are both aligned with the main flow path assembly.

[0011] As a further improvement of the present utility model, the laser marking assembly includes a laser marking fixing frame, a laser light source, a beam expander, a beam splitter, and a galvanometer scanner. The laser marking fixing frame is connected to one side of the main flow channel assembly. The laser light source, the beam expander, the beam splitter, and the galvanometer scanner are all connected inside the laser marking fixing frame. The laser light source, the beam expander, the beam splitter, and the galvanometer scanner are arranged in sequence according to the laser light path. The light output port of the galvanometer scanner is aligned with the main flow channel assembly.

[0012] As a further improvement of the present utility model, the double-sided flipping assembly includes a flipping fixing frame, a flipping lifting cylinder, a flipping transverse cylinder, a rotating motor, and a flipping suction cup. The flipping fixing frame is connected to the discharging end of the main flow channel assembly. The flipping transverse cylinder is connected to the flipping fixing frame. The flipping lifting cylinder is slidably connected to the flipping transverse cylinder. The rotating motor is connected to the flipping lifting cylinder. The output end of the rotating motor is connected with a rotating bracket. The flipping suction cup is connected to the rotating bracket.

[0013] As a further improvement of the present utility model, the discharging assembly includes a discharging fixing frame, a discharging Y-axis module, a discharging Z-axis module, and a discharging suction cup. The discharging fixing frame straddles the discharging end of the main flow channel assembly and the discharging roller line assembly. The discharging Y-axis module is connected to the discharging fixing frame. The discharging Z-axis module is slidably connected to the discharging Y-axis module. The discharging suction cup is slidably connected to the discharging Z-axis module.

[0014] As a further improvement of the present utility model, the discharging roller line assembly includes a discharging bracket, discharging magnetic wheels, a discharging motor, a discharging support cylinder, a discharging adjustment linear guide, and a discharging adjustment screw rod. The picking assembly is connected to the front end of the discharging bracket. Two rows of magnetic wheel mounting plates are movably connected to the discharging bracket through the discharging adjustment linear guide. The discharging adjustment screw rod connects the two rows of magnetic wheel mounting plates. A plurality of discharging magnetic wheels are movably connected to each row of magnetic wheel mounting plates. The discharging motor is connected to the discharging bracket and drives the discharging magnetic wheels. The discharging support cylinder is connected to the front end of the discharging bracket.

[0015] The beneficial effects of the present utility model are as follows: It solves the problems of laser waste marking and visual marking detection for the finished IC carrier board, especially for the IC carrier board with high requirements for the tin ball process. After the marking is completed, the IC carrier board can be directly flowed out online and enter the next process. It realizes non-contact by artificial, reduces the labor, improves the yield, and realizes fully automated production. Description of the Drawings

[0016] Figure 1 is a structural diagram of the machine housing and internal components in the equipment of the present utility model;

[0017] Figure 2 is a structural diagram of the internal components in the equipment of the present utility model;

[0018] Figure 3 It is the structure diagram of the material taking component in the device of the present utility model;

[0019] Figure 4 It is the structure diagram of the feeding roller line component in the device of the present utility model;

[0020] Figure 5 It is the structure diagram of the loading component in the device of the present utility model;

[0021] Figure 6 It is the structure diagram of the main runner component in the device of the present utility model;

[0022] Figure 7 It is the structure diagram of the top view of the fixture above the main runner component in the device of the present utility model;

[0023] Figure 8 It is the structure diagram of the bottom view of the fixture above the main runner component in the device of the present utility model;

[0024] Figure 9 It is the structure diagram of the vision positioning component in the device of the present utility model;

[0025] Figure 10 It is the structure diagram of the laser marking component in the device of the present utility model;

[0026] Figure 11 It is the structure diagram of the vision line scan component in the device of the present utility model;

[0027] Figure 12 It is the structure diagram of the double-sided flipping component in the device of the present utility model;

[0028] Figure 13 It is the structure diagram of the unloading component in the device of the present utility model;

[0029] Figure 14 It is the structure diagram of the discharging roller line component in the device of the present utility model. Detailed implementation manners

[0030] In order to make the purpose, technical solutions and advantages of the present utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments.

[0031] The present utility model provides a laser marking detection device for IC carrier board finished boards, aiming to realize the functions of online vision detection of waste board information for IC carrier board finished boards, then laser marking the waste board information with a cross and laser coding, and after completion of the marking, the IC carrier boards flow out online and enter the cleaning line. It solves the problem that in this process in the industry, offline manual loading and unloading production was used before, and continuous automation could not be achieved, and realizes fully automated online detection and online full-automatic production of waste board marking.

[0032] As shown Figure 1 and 2 shown, a laser marking detection device for a finished IC carrier board of the present utility model includes a material taking component 1, a feeding roller line component 2, a loading component 3, a main runner component 4, a visual positioning component 51, a laser marking component 6, a visual line scanning component 52, a double-sided flipping component 7, a discharging component 8, and an output roller line component 9. The material taking component 1 is docked with the feeding roller line component 2. The loading component 3 spans between the feeding end of the feeding roller line component 2 and the main runner component 4. The visual positioning component 51, the laser marking component 6, and the visual line scanning component 52 are sequentially arranged above the main runner component 4. The double-sided flipping component 7 is docked with the discharging end of the main runner component 4. The discharging component 8 spans between the discharging end of the main runner component 4 and the output roller line component 9.

[0033] The laser marking detection device for the finished IC carrier board further includes a machine frame 101. The material taking component 1, the feeding roller line component 2, the loading component 3, the main runner component 4, the visual positioning component 51, the laser marking component 6, the visual line scanning component 52, the double-sided flipping component 7, the discharging component 8, and the output roller line component 9 are all installed inside the machine frame 101. The machine frame 101 is respectively provided with a loading port and an output port at the positions of the material taking component 1 and the output roller line component 9. The loading port is used to grab the IC carrier board from the upper board machine in the previous process, and the output port is used to convey the processed IC carrier board to the next process for further operations.

[0034] An efficient cleaning machine may also be provided on the machine frame 101 for keeping the internal space of the machine frame 101 clean, and a special dust extraction interface after laser marking is also provided for controlling the control component of the machine operation and maintenance doors and windows for later maintenance.

[0035] The material taking component 1 grabs the IC carrier board and places it on the feeding roller line component 2 and conveys it to the docking position of the loading component 3. The loading component 3 grabs the IC carrier board and places it on the main runner component 4. After the IC carrier board passes through the visual positioning component 51, the laser marking component 6, and the visual line scanning component 52 in sequence on the main runner component 4 to complete the front laser identification and marking, the double-sided flipping component 7 flips the IC carrier board, and the discharging component 8 grabs it and places it back on the main runner component 4 again. After passing through the visual positioning component 51, the laser marking component 6, and the visual line scanning component 52 in sequence again to complete the back laser identification and marking, the discharging component 8 grabs the IC carrier board and places it on the output roller line component 9 for conveying and discharging.

[0036] As shown Figure 3As shown in the figure, the material taking assembly 1 includes a material taking pallet 11, a material taking module 12, material taking suction cups, a material taking lifting cylinder 13, and a material pressing cylinder 14. The material taking module 12 is connected to the feeding roller line assembly 2. The material taking lifting cylinder 13 is slidably connected to the material taking module 12. The material taking pallet 11 is connected to the material taking lifting cylinder 13. The material pressing cylinder 14 is connected to one end of the material taking pallet 11. A plurality of material taking suction cups are arranged on the material taking pallet 11. The material taking pallet 11 is docked with an external IC carrier feeding device. After the material taking pallet 11 adsorbs the IC carrier through the material taking suction cups, the material pressing cylinder 14 presses one end of the IC carrier.

[0037] The material taking assembly 1 further includes a carrier sensor 15. The carrier sensor 15 is connected to one end of the material taking module 12 that is docked with the upper board machine and is aligned with the position of the upper board machine, and is used to judge whether the external upper board machine has pushed the carrier out of the magazine, so as to prevent the material taking assembly 1 from damaging the bottom carrier when taking the carrier for the second time.

[0038] The material taking assembly 1 is installed in the middle of the feeding roller line assembly. Specifically, the material taking module 12 is installed between two rows of magnetic wheel mounting plates of the feeding bracket 21. When taking materials, the material taking lifting cylinder 13 raises the material taking pallet 11 to be higher than the feeding roller line assembly 2. The material taking module 12 drives the material taking pallet 11 to move outward to a preset position to be docked with the IC carrier upper board machine. The material taking suction cups evacuate to adsorb the edge of the IC carrier. The material pressing cylinder 14 acts to press one end of the IC carrier. After the material taking module 12 retracts to the origin, the material pressing cylinder 14 opens and the vacuum of the material taking suction cups is turned off. The material taking lifting cylinder 13 descends to complete placing the IC carrier on the feeding magnetic wheel 22 of the feeding roller line assembly 2.

[0039] As Figure 4 shown in the figure, the feeding roller line assembly 2 includes a feeding bracket 21, feeding magnetic wheels 22, a feeding motor 23, a feeding support cylinder 24, a feeding adjustment linear guide 25, and a feeding adjustment lead screw 26. The material taking assembly 1 is connected to the front end of the feeding bracket 21. Two rows of magnetic wheel mounting plates 27 are movably connected to the feeding bracket 21 through the feeding adjustment linear guide 25. The feeding adjustment lead screw 26 is connected to the two rows of magnetic wheel mounting plates 27. A plurality of feeding magnetic wheels 22 are movably connected to each row of magnetic wheel mounting plates 27. The feeding motor 23 is connected to the feeding bracket 21 and drives the feeding magnetic wheels 22. The feeding support cylinder 24 is connected to the rear end of the feeding bracket 21.

[0040] The feeding roller line assembly 2 further includes a position detection switch 28 and a feeding induction switch 29. The position detection switch 28 and the feeding induction switch 29 are both connected to the feeding support 21. The feeding induction switch 29 faces the feeding end of the feeding roller line assembly 2 and is used to detect whether there is an IC carrier on the feeding magnetic wheel 22. The position detection switch 28 faces the discharging end of the feeding roller line assembly 2 and is used to detect whether the IC carrier has been conveyed in place. When the feeding induction switch 29 is triggered, the feeding motor 23 starts to drive the feeding magnetic wheel 22 to rotate to convey the IC carrier to the position of the position detection switch 28 and stop. The feeding support cylinder 24 rises to support the IC carrier, completing the conveyance of the carrier and waiting for the board to be taken. The two rows of magnetic wheel mounting plates 27 can slide along the feeding adjustment rail 25. When the sizes of the IC carriers to be fed are different, the distance between the two rows of magnetic wheel mounting plates 27 can be adjusted by the feeding adjustment screw rod 26 to meet the size requirements of different IC carriers.

[0041] As Figure 5 shown in the figure, the loading component 3 includes a loading fixing frame 31, a loading X-axis module 32, a loading Y-axis module 33, a loading code reader 34, a loading suction cup 36, and a loading lifting cylinder 35. The loading fixing frame 31 straddles the feeding ends of the feeding roller line assembly 2 and the main flow channel assembly 4. The loading Y-axis module 33 is connected to the loading fixing frame 31. The loading X-axis module 32 is slidably connected to the loading Y-axis module 33. The loading code reader 34 is slidably connected to the loading X-axis module 32. The loading lifting cylinder 35 is connected to the mounting base plate of the loading X-axis module 32, and the loading suction cup 36 is connected to the loading lifting cylinder 35.

[0042] The loading Y-axis module 33 moves to the code reading position and the board waiting to be taken position of the feeding roller line assembly 2. The loading code reader 34 reads the two-dimensional code information of the IC carrier. The loading Y-axis module 33 moves to the board waiting to be taken position of the feeding roller line assembly 2. The loading lifting cylinder 35 pushes the loading suction cup 36 down to the in-place position. The loading suction cup 36 vacuums and sucks the IC carrier. The loading lifting cylinder 35 rises. The loading Y-axis module 33 moves to the IC carrier placing position above the main flow channel assembly 4 and waits for use. The IC carrier is placed when the platform fixture 45 moves to the feeding end of the main flow channel assembly 4.

[0043] As Figures 6 to 8 shown in the figure, the main flow channel assembly 4 includes a main flow channel base 41, a main flow channel linear motor 42, a platform lifting motor 43, a platform mounting frame 44, a platform fixture 45, and a pressing plate cylinder 46. The main flow channel linear motor 42 is connected to the main flow channel base 41. The platform lifting motor 43 is slidably connected to the main flow channel linear motor 42. The platform lifting motor 43 is connected to and drives the platform mounting frame 44 to lift and lower. The platform fixture 45 is connected to the platform mounting frame 44. The platform fixture 45 is provided with vacuum suction holes. The pressing plate cylinder 46 is connected to the platform mounting frame 44. When an IC carrier is placed on the platform fixture 45, the pressing plate cylinder 46 presses the IC carrier.

[0044] The main runner base 41 is preferably a marble base. The main runner base 41 further includes a linear motor position dynamic sensor 47 for sensing the position of the main runner linear motor 42 on the main runner base 41. When the loading suction cup 36 moves down to the in-place position, the platform jig 45 sucks vacuum to adsorb the IC carrier board, and the pressing plate cylinder 46 presses the IC carrier board to complete the operation of loading the IC carrier board onto the platform jig 45. After fixing the IC carrier board, the main runner linear motor 42, the platform lifting motor 43, and the platform mounting bracket 44 drive the IC carrier board on the platform jig 45 to sequentially pass through the vision positioning component 51, the laser marking component 6, and the vision line scan component 52 for laser identification and marking. The platform lifting motor 43 can control the height of the platform mounting bracket 44 relative to the main runner linear motor 42 to meet the focusing heights of the subsequent vision positioning component 51, the laser marking component 6, and the vision line scan component 52.

[0045] An NG material platform 48 is also provided beside the unloading end of the main runner assembly 4. When the vision line scan component 52 determines that there are defects on the IC carrier board, the unloading component 8 will grab and place it on the NG material platform 48. Multiple parallel main runner assemblies 4 can be set inside the equipment to synchronously process and improve production efficiency.

[0046] As Figure 9 shown, the vision positioning component 51 includes a vision positioning fixed frame 53, a vision positioning moving module 54, and a vision positioning camera 55. The vision positioning fixed frame 53 straddles the main runner assembly 4. The vision positioning moving module 54 is connected to the vision positioning fixed frame 53, and the vision positioning camera 55 is slidably connected to the vision positioning moving module 54 and aligned with the main runner assembly 4. The linear motor of the main runner assembly 4 drives the platform jig 45 to the vision detection position, and the vision positioning moving module 54 drives the vision positioning camera 55 to perform a fixed-point movement along the Y-axis to complete the MARK point acquisition and upload parameters to complete the carrier board positioning.

[0047] As Figure 10 shown, the laser marking component 6 includes a laser marking fixed frame 61, a laser light source 62, a beam expander 63, a beam splitter 64, and a galvanometer scanner 65. The laser marking fixed frame 61 is connected to one side of the main runner assembly 4. The laser light source 62, the beam expander 63, the beam splitter 64, and the galvanometer scanner 65 are all connected inside the laser marking fixed frame 61. The laser light source 62, the beam expander 63, the beam splitter 64, and the galvanometer scanner 65 are arranged in sequence according to the laser light path direction, and the light outlet of the galvanometer scanner 65 is aligned with the main runner assembly 4. The laser marking fixed frame 61 is preferably a marble fixed frame. When the platform jig 45 moves to the in-place position, the laser light source 62 performs laser engraving on one side of the IC carrier board through the beam splitter 64, the galvanometer scanner 65, and the beam expander 63. A dust suction device 66 is also connected to the laser marking fixed frame 61 for sucking the dust generated during the engraving process.

[0048] As Figure 11 shown, the vision line scan assembly 52 includes a line scan fixture 56, a line scan camera 57, and a line scan light source 58. The line scan fixture 56 spans across the main runner assembly 4. The line scan camera 57 and the line scan light source 58 are connected to the line scan fixture 56, and both the line scan camera 57 and the line scan light source 58 are aligned with the main runner assembly 4. The line scan fixture 56 is preferably a marble fixture. When the platform jig 45 moves to the position of the vision line scan assembly 52, the line scan camera 57 performs on-line detection of the marking effect on the IC carrier board after laser marking and uploads the detection results. The line scan light source 58 provides sufficient light for the detection of the line scan camera 57.

[0049] As Figure 12 shown, the double-sided flipping assembly 7 includes a flipping fixture 71, a flipping lifting cylinder 72, a flipping transverse cylinder 73, a rotating motor 74, and a flipping suction cup 75. The flipping fixture 71 is connected to the discharging end of the main runner assembly 4. The flipping transverse cylinder 73 is connected to the flipping fixture 71. The flipping lifting cylinder 72 is slidably connected to the flipping transverse cylinder 73. The rotating motor 74 is connected to the flipping lifting cylinder 72. The output end of the rotating motor 74 is connected with a rotating bracket 76, and the flipping suction cup 75 is connected to the rotating bracket 76.

[0050] The double-sided flipping assembly 7 further includes a flipping material presence sensing optoelectronic device 77. When the flipping material presence sensing optoelectronic device 77 detects the IC carrier board on the platform jig 45, the flipping lifting cylinder 72 descends, and the flipping suction cup 75 adsorbs the IC carrier board on the platform jig 45. The pressing plate cylinder 46 of the platform jig 45 is opened, the platform jig 45 breaks the vacuum, the flipping suction cup 75 sucks the vacuum and flips, the lifting cylinder 72 ascends, the flipping transverse cylinder 73 moves, and the rotating motor 74 drives the IC carrier board to make a 180° flip, completing the function of taking the board and flipping it from the platform jig 45. The flipped IC carrier board faces upward, waiting to be grabbed by the discharging assembly 8.

[0051] As Figure 13 shown, the discharging assembly 8 includes a discharging fixture 81, a discharging Y-axis module 82, a discharging Z-axis module 83, and a discharging suction cup 84. The discharging fixture 81 spans across the discharging end of the main runner assembly 4 and the discharging roller line assembly 9. The discharging Y-axis module 82 is connected to the discharging fixture 81. The discharging Z-axis module 83 is slidably connected to the discharging Y-axis module 82. The discharging suction cup 84 is slidably connected to the discharging Z-axis module 83.

[0052] The blanking Y-axis module 82 moves to the flipping position of the double-sided flipping assembly 7. The blanking Z-axis module 83 moves downward, and the blanking suction cup 84 sucks the carrier plate. The blanking Z-axis module 83 rises. The blanking Y-axis module 82 moves horizontally to the position of the platform fixture 45. The blanking Z-axis module 83 descends and the blanking suction cup 84 breaks the vacuum. The platform fixture 45 evacuates the air and the pressing plate cylinder 46 operates to press the carrier plate, completing the function of flipping the carrier plate. The main runner assembly 4 returns to the visual positioning assembly 51 station to repeat all the previous functions. After the reverse side of the carrier plate is laser engraved, it returns to the lower plate position. The blanking Z-axis module 83 moves downward, and the blanking suction cup 84 sucks the carrier plate. The blanking Z-axis module 83 rises. The blanking Y-axis module 82 moves horizontally to the position of the discharge roller line assembly 9.

[0053] As Figure 14 shown, the discharge roller line assembly 9 includes a discharge support 91, discharge magnetic wheels 92, a discharge motor 93, a discharge support cylinder 94, a discharge adjustment linear guide 95, and a discharge adjustment lead screw 96. The material taking assembly 1 is connected to the front end of the discharge support 91. Two rows of magnetic wheel mounting plates 97 are movably connected to the discharge support 91 through the discharge adjustment linear guide 95. The discharge adjustment lead screw 96 connects the two rows of magnetic wheel mounting plates 97. A plurality of discharge magnetic wheels 92 are movably connected to each row of magnetic wheel mounting plates 97. The discharge motor 93 is connected to the discharge support 91 and drives the discharge magnetic wheels 92. The discharge support cylinder 94 is connected to the front end of the discharge support 91.

[0054] The discharge roller line assembly 9 further includes a discharge feedback photoelectric switch 98. The discharge support cylinder 94 rises. The blanking suction cup 84 of the blanking assembly 8 lowers the IC carrier plate into place. After breaking the vacuum, it rises to complete discharging the material onto the discharge support cylinder 94. The discharge support cylinder 94 descends, and the IC carrier plate contacts the discharge magnetic wheels 92. The discharge motor 93 drives the discharge magnetic wheels 92 to rotate, sending the IC carrier plate to the next process. The discharge feedback photoelectric switch 98 gives a signal that the second IC carrier plate can be discharged. The discharge adjustment linear guide 95 and the discharge adjustment lead screw 96 are used to adjust the product flow channels with different plate widths.

[0055] The working principle of this laser marking detection equipment for IC carrier finished boards is as follows:

[0056] The feeding roller line assembly 2 is installed at the first end inside the machine frame 101 and is used to convey the IC carrier board to the end for positioning. The picking component 1 is installed between the feeding roller line assemblies 2 to suck the IC carrier board onto the feeding roller line assembly. The feeding suction cup 36 on the feeding component 3 sucks the IC carrier board under vacuum and moves it onto the main runner assembly 4, and places it on the platform fixture 45 in the main runner assembly 4. After the platform fixture 45 fixes the carrier board, the main runner linear motor 42 drives it to the visual positioning component 51 station to perform visual MARK point acquisition. After the acquisition is completed, the platform fixture 45 moves to the laser marking component 6 station. After the laser performs laser engraving that meets the technical requirements, after the engraving is completed, it moves to the visual line scan component 52 to detect the effect after engraving. If the detected effect is unqualified, the platform fixture 45 moves to the unloading station, and the unloading component 8 grabs and places it on the NG material platform 48; if the detected effect is qualified, the platform fixture 45 moves to the unloading station, and the flipping suction cup 75 on the double-sided flipping component 7 sucks the IC carrier board under the drive of the flipping transverse movement cylinder 73, and performs a 180-degree flip under the drive of the rotating motor 74. When the flipping lifting cylinder 72 moves, the IC is moved away from the platform fixture 45. The unloading suction cup 84 of the unloading component 8 moves down with the unloading Z-axis module 83 to adsorb the IC carrier board, and the unloading Z-axis module 83 returns to its original position. The unloading Y-axis module 82 moves to directly above the platform fixture 45, and the unloading Z-axis module 83 moves downward to complete the turning over of the IC carrier board and load it onto the platform fixture 45. The platform fixture 45 moves to the position of the visual positioning component 51 to repeat all the above functions and movements to complete the reverse side processing of the IC carrier board. The unloading suction cup 84 of the unloading component 8 moves down with the unloading Z-axis module 83 to adsorb the IC carrier board, the unloading Z-axis module 83 returns to its original position, the unloading Y-axis module 82 moves above the discharging roller line assembly 9, and the unloading Z-axis module 83 moves downward to place the board on the discharging roller line assembly 9. The discharging magnetic wheel 92 completes the conveyance of the carrier board under the drive of the discharging motor 93. The equipment uses fully automated and online operation to replace manual loading and unloading operations, with higher processing efficiency and higher qualified rate of the product quality of the IC carrier board.

[0057] The laser marking detection equipment for the finished product board of the IC carrier board of the present utility model realizes automated production by providing a platform of the main runner assembly 4 inside the machine frame 101, conveying the carrier board to the visual positioning position for positioning, performing laser marking at the laser engraving position, detecting the IC carrier board after laser engraving at the line scan vision station, and using a flipping structure to complete the turning over of the reverse side engraving, and outputting the carrier board through the unloading channel. It can also be connected to the backend cleaning equipment to complete the cleaning of the inside of the machine frame 101. The present utility model uses fully automated online operation to replace manual loading and unloading operations, with higher processing efficiency, lower labor cost, higher qualified rate of the finished product quality of the IC carrier board, and no safety hazards.

[0058] The above content is a further detailed description of the present utility model in combination with specific preferred embodiments. It cannot be determined that the specific implementation of the present utility model is only limited to these descriptions. For those of ordinary skill in the technical field to which the present utility model pertains, without departing from the concept of the present utility model, several simple deductions or substitutions can still be made, which should all be regarded as belonging to the protection scope of the present utility model.

Claims

1. A laser marking detection device for IC substrate finished board, characterized in that: It includes a material picking component, a feeding roller line component, a loading component, a main channel component, a visual positioning component, a laser marking component, a visual line scanning component, a double-sided flipping component, a material unloading component, and a material discharging roller line component. The material picking component is connected to the feeding roller line component, the loading component spans between the feeding roller line component and the loading end of the main channel component, the visual positioning component, the laser marking component, and the visual line scanning component are arranged above the main channel component in sequence, the double-sided flipping component is connected to the unloading end of the main channel component, and the unloading component spans between the unloading end of the main channel component and the material discharging roller line component.

2. The laser marking detection device for IC substrate finished board according to claim 1 is characterized in that: The material picking assembly includes a material picking pallet, a material picking module, a material picking suction cup, a material picking lifting cylinder, and a material pressing cylinder. The material picking module is connected to the feeding roller line assembly, the material picking lifting cylinder is slidably connected to the material picking module, the material picking pallet is connected to the material picking lifting cylinder, the material pressing cylinder is connected to one end of the material picking pallet, a plurality of material picking suction cups are arranged on the material picking pallet, the material picking pallet is connected to an external IC carrier feeding device, and after the material picking pallet absorbs the IC carrier through the material picking suction cup, the material pressing cylinder presses one end of the IC carrier.

3. The laser marking detection device for IC substrate finished board according to claim 1 is characterized in that: The feed roller line assembly includes a feed bracket, a feed magnetic wheel, a feed motor, a feed support cylinder, a feed adjustment linear rail, and a feed adjustment screw. The material picking assembly is connected to the front end of the feed bracket, and the feed bracket is movably connected with two rows of magnetic wheel mounting plates through the feed adjustment linear rail. The feed adjustment screw is connected to the two rows of magnetic wheel mounting plates, and each row of the magnetic wheel mounting plates is movably connected with a plurality of feed magnetic wheels. The feed motor is connected to the feed bracket and drives the feed magnetic wheel, and the feed support cylinder is connected to the rear end of the feed bracket.

4. The laser marking detection device for IC substrate finished board according to claim 1 is characterized in that: The feeding assembly includes a feeding fixed frame, a feeding X-axis module, a feeding Y-axis module, a feeding code reader, a feeding suction cup, and a feeding lifting cylinder. The feeding fixed frame spans the feeding end of the feeding roller line assembly and the main channel assembly. The feeding Y-axis module is connected to the feeding fixed frame, the feeding X-axis module is slidably connected to the feeding Y-axis module, the feeding code reader is slidably connected to the feeding X-axis module, the feeding lifting cylinder is connected to the mounting base plate of the feeding X-axis module, and the feeding suction cup is connected to the feeding lifting cylinder.

5. The laser marking detection device for IC substrate finished board according to claim 1 is characterized in that: The main channel assembly includes a main channel base, a main channel linear motor, a platform lifting motor, a platform mounting frame, a platform fixture, and a pressure plate cylinder. The main channel linear motor is connected to the main channel base, the platform lifting motor is slidably connected to the main channel linear motor, the platform lifting motor is connected to and drives the platform mounting frame to rise and fall, the platform fixture is connected to the platform mounting frame, the platform fixture is provided with a vacuum suction hole, the pressure plate cylinder is connected to the platform mounting frame, and when an IC carrier is placed on the platform fixture, the pressure plate cylinder presses the IC carrier.

6. The laser marking detection device for IC substrate finished board according to claim 1 is characterized in that: The visual positioning component includes a visual positioning fixed frame, a visual positioning mobile module, and a visual positioning camera. The visual positioning fixed frame spans the main flow channel component, the visual positioning mobile module is connected to the visual positioning fixed frame, and the visual positioning camera is slidably connected to the visual positioning mobile module and is aligned with the main flow channel component. The visual line scan assembly includes a line scan fixing frame, a line scan camera, and a line scan light source. The line scan fixing frame spans across the main flow channel assembly. The line scan camera and the line scan light source are connected to the line scan fixing frame. The line scan camera and the line scan light source are both aimed at the main flow channel assembly.

7. The laser marking detection device for IC substrate finished board according to claim 1 is characterized in that: The laser marking assembly includes a laser marking fixing frame, a laser light source, a beam expander, a beam splitter lens, and a galvanometer. The laser marking fixing frame is connected to one side of the main channel assembly. The laser light source, the beam expander, the beam splitter lens, and the galvanometer lens are all connected inside the laser marking fixing frame. The laser light source, the beam expander, the beam splitter lens, and the galvanometer lens are arranged in sequence according to the direction of the laser light path, and the light outlet of the galvanometer lens is aligned with the main channel assembly.

8. The laser marking detection device for IC substrate finished board according to claim 1, characterized in that: The double-sided flipping assembly includes a flipping fixed frame, a flipping lifting cylinder, a flipping transverse movement cylinder, a rotating motor, and a flipping suction cup. The flipping fixed frame is connected to the unloading end of the main channel assembly, the flipping transverse movement cylinder is connected to the flipping fixed frame, the flipping lifting cylinder is slidably connected to the flipping transverse movement cylinder, the rotating motor is connected to the flipping lifting cylinder, the output end of the rotating motor is connected to a rotating bracket, and the flipping suction cup is connected to the rotating bracket.

9. The laser marking detection device for finished IC substrate according to claim 1, characterized in that: The unloading assembly includes an unloading fixed frame, an unloading Y-axis module, an unloading Z-axis module, and an unloading suction cup. The unloading fixed frame spans the unloading end of the main channel assembly and the discharge roller line assembly. The unloading Y-axis module is connected to the unloading fixed frame, the unloading Z-axis module is slidably connected to the unloading Y-axis module, and the unloading suction cup is slidably connected to the unloading Z-axis module.

10. The laser marking detection device for IC substrate finished board according to claim 1, characterized in that: The discharging roller line assembly includes a discharging bracket, a discharging magnetic wheel, a discharging motor, a discharging support cylinder, a discharging adjustment linear rail, and a discharging adjustment screw. The material picking assembly is connected to the front end of the discharging bracket. The discharging bracket is movably connected with two rows of magnetic wheel mounting plates through the discharging adjustment linear rail. The discharging adjustment screw is connected to the two rows of magnetic wheel mounting plates. Each row of the magnetic wheel mounting plates is movably connected with a plurality of discharging magnetic wheels. The discharging motor is connected to the discharging bracket and drives the discharging magnetic wheel. The discharging support cylinder is connected to the front end of the discharging bracket.

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