Slide glass jig for metal evaporation of LED (light-emitting diode) chip

Abstract

The utility model provides an LED chip metal vapor plating slide glass jig, including slide glass body, spacing projection and connecting piece, the middle part of the front side of slide glass body is recessed to form a groove, the recess comprises a groove bottom and a groove wall, one side of slide glass body opposite to the spacing projection is provided with a chute, the opening of the chute is arranged back to the center of slide glass body, and the connecting piece is connected with the slide glass body. A slide taking groove is formed in the position, between the limiting protrusion and the sliding groove, of the front face of the slide glass body, the depth of the slide taking groove is consistent with the depth of the groove bottom, one side of the slide taking groove is communicated with the groove, the other side of the slide taking groove penetrates through the slide glass body, a spring fixing column is arranged on the side, opposite to the sliding groove, of the back face of the slide glass body, and the slide glass jig for LED chip metal evaporation further comprises a spring used for fixing an LED chip. According to the slide glass jig for metal evaporation of the LED chip, the groove and the chip taking groove are formed in the slide glass body, so that the contact area when the LED chip and the slide glass body are fixed is reduced, and scratches caused when the LED chip is fixed and taken are effectively reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of LED chips, in particular to a wafer fixture for metal evaporation plating of LED chips. Background Art

[0002] The metal evaporation plating of LEDs mainly includes front electrode evaporation plating of chips and back evaporation plating of chips. During the front evaporation plating operation, the back contacts the wafer stage; the back evaporation plating operation is for products with a vertical structure of GaAs substrate and a reverse-polarity electrode structure, and the front of the product contacts the wafer stage during the operation. Currently, the metal evaporation plating wafer stage contacts the entire surface of the wafer source.

[0003] When the operator loads and unloads the wafers, the wafer source contacts the entire surface of the wafer stage, and the back evaporation plating wafer source is too thin and not easy to pick up. There is friction between the product and the wafer stage, causing scratches on the front of the wafer source; a large amount of time is wasted. Summary of the Utility Model

[0004] Aiming at the deficiencies of the prior art, the purpose of the utility model is to provide a wafer fixture for metal evaporation plating of LED chips, aiming to solve the technical problems in the prior art that the contact area between the LED chip and the wafer fixture is large, it is easy to scratch the surface of the LED chip, and it is not easy to pick up the chip during loading and unloading.

[0005] To achieve the above purpose, the utility model is realized by the following technical solutions: A wafer fixture for metal evaporation plating of LED chips, including a wafer body, a limiting protrusion and a connecting piece for fixing the wafer stage body. A groove is formed by a depression in the middle of the front surface of the wafer body. The depression includes a groove bottom and a groove wall. A chute is provided on one side of the wafer body opposite to the limiting protrusion. The opening of the chute is set away from the center of the wafer body. The bottom of the chute is located inside the groove near the groove wall. A pick-up groove is provided on the front surface of the wafer body between the limiting protrusion and the chute. The depth of the pick-up groove is the same as the depth of the groove bottom. One side of the pick-up groove communicates with the groove, and the other side penetrates through the wafer body. A spring fixing column is provided on the back surface of the wafer body on the side opposite to the chute. The wafer fixture for metal evaporation plating of LED chips further includes a spring for fixing the LED chip.

[0006] Compared with the prior art, the beneficial effects of the utility model are as follows: By forming a stepped setting by depressing the front part of the wafer body in contact with the LED chip, the contact area between the wafer body and the LED chip is reduced, avoiding the problem of scratching the evaporation plating surface of the LED chip due to the too large contact area between the front surface of the wafer body and the LED chip. And a pick-up groove is provided on the wafer body. By connecting the pick-up groove with the groove, the picking tool can extend into the groove to contact one side of the LED chip, making the picking more convenient.

[0007] According to one aspect of the above technical solution, the spring is detachably crimped on the side of the carrier body away from the limiting protrusion. The spring includes a spring body portion. One end of the spring body portion axially extends to form a handle, and a chuck is connected to the end away from the handle. The chuck is arranged inside the spring body portion.

[0008] According to one aspect of the above technical solution, the chuck is arranged in a shape of '7'. The chuck includes a connecting portion radially bent and connected to the end of the spring body portion away from the handle, and a pressing portion connected to the other end of the connecting portion.

[0009] According to one aspect of the above technical solution, the connecting portion is arranged on the inner side close to the handle, and the pressing portion is arranged radially towards the spring body portion.

[0010] According to one aspect of the above technical solution, the connecting portion is arranged on the inner side close to the handle, and the pressing portion is arranged radially towards the spring body portion. The sliding groove is arranged on the reverse side of the carrier body. The spring includes a spring body portion. One end of the spring body portion is connected with a fixing portion detachably connected to the spring fixing column, and a hook is connected to the end away from the fixing portion.

[0011] According to one aspect of the above technical solution, the end of the hook away from the spring body portion passes through the sliding groove and extends out of the front side of the carrier body.

[0012] According to one aspect of the above technical solution, the spring fixing column is arranged in a shape of 'T'.

[0013] According to one aspect of the above technical solution, an idle groove arranged in a semi-circular shape is formed on one side of the carrier body close to the sliding groove. The opening diameter of the idle groove is twice the diameter of the hook portion. Description of the Drawings

[0014] Figure 1 Schematic structural diagram of the carrier fixture for metal evaporation of LED chips in the first embodiment of the present invention;

[0015] Figure 2 Schematic structural diagram of the spring in the carrier fixture for metal evaporation of LED chips in the first embodiment of the present invention;

[0016] Figure 3 Top view of the carrier fixture for metal evaporation of LED chips in the second embodiment of the present invention;

[0017] Figure 4 Bottom view of the carrier fixture for metal evaporation of LED chips in the second embodiment of the present invention;

[0018] Description of main component symbols: 1 - carrier body, 2 - limit protrusion, 3 - LED chip, 4 - groove, 41 - bottom of the groove, 42 - groove wall, 5 - sliding groove, 6 - chip taking groove, 7 - spring, 71 - spring body part, 72 - taking handle, 73 - chuck, 731 - connecting part, 732 - pressing part, 74 - fixing part, 75 - hook, 8 - spring fixing column, 9 - idle groove;

[0019] The following specific embodiments will further illustrate the present invention in conjunction with the above-mentioned drawings. Specific embodiments

[0020] For the convenience of understanding the present invention, the present invention will be described more comprehensively below with reference to the relevant drawings. Several embodiments of the present invention are shown in the drawings. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, these embodiments are provided to make the disclosure of the present invention more thorough and comprehensive.

[0021] It should be noted that when an element is referred to as being "fixed to" another element, it can be directly on the other element or there may also be an intermediate element. When an element is considered to be "connected" to another element, it can be directly connected to the other element or there may be an intermediate element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only.

[0022] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those of ordinary skill in the technical field to which the present invention belongs. The terms used in the description of the present invention herein are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more of the related listed items.

[0023] Please refer to Figure 1, A wafer fixture for metal evaporation of an LED chip provided by an embodiment of the present utility model includes a wafer body 1, a limiting protrusion 2, and a connecting member for fixing the wafer table body. A groove 4 is formed by a depression in the middle of the front surface of the wafer body 1. The groove 4 includes a groove bottom 41 and a groove wall 42. A sliding groove 5 is formed on one side of the wafer body 1 opposite to the limiting protrusion 2. The opening of the sliding groove 5 is arranged facing away from the center of the wafer body 1. The bottom of the sliding groove 41 is located inside the groove 4 near the groove wall 42. A wafer taking groove 6 is arranged on the front surface of the wafer body 1 between the limiting protrusion 2 and the sliding groove 5. The depth of the wafer taking groove 6 is the same as the depth of the groove bottom 41. One side of the wafer taking groove 6 communicates with the groove 4, and the other side penetrates through the wafer body 1. A spring fixing column 8 is arranged on the back surface of the wafer body 1 opposite to the sliding groove 5. The wafer fixture for metal evaporation of the LED chip 3 further includes a spring 7 for fixing the LED chip 3.

[0024] Please refer to Figure 2 , A point-clamping type fixing spring 7 is provided in the first embodiment of the present utility model. The spring 7 includes a spring body portion 71. A taking handle 72 for installation and disassembly extends from one end of the spring body portion 71, and a 7-shaped clamping head 73 is connected to the other end. The clamping head 73 is connected inside the spring body portion 71. Specifically, the spring 7 includes a spring body portion 71. One end of the spring body portion 71 extends axially to form a taking handle 72, and a clamping head 73 is connected to the end far from the taking handle. The clamping head 73 is arranged inside the spring body portion 71. The clamping head 73 is arranged in a 7-shaped manner. The clamping head 73 includes a connecting portion 731 radially bent and connected to the end of the spring body portion 71 far from the taking handle 72, and a pressing portion 732 connected to the other end of the connecting portion 731. When fixing the LED chip 3, the LED chip 3 is placed on the front surface of the wafer body. At this time, the side of the LED chip 3 is abutted against one side of the limiting protrusion 2. It can be understood that the limiting protrusion 2 plays a role of quick limiting and positioning. Then, the spring 7 is pressed by hand, causing the spring 7 to be compressed and deformed. It should be noted that in the natural state, the clamping head 73 is located inside the spring body portion 71. When the spring 7 is in a compressed state, as the pressure increases, the pressing portion 732 at the end of the clamping head 73 will extend out of the spring 7, and until the spring 7 cannot be compressed, the opening distance between the pressing portion 732 and the spring body portion 71 is the largest at this time. Then, after the spring 7 is compressed until the opening is greater than the sum of the thicknesses of the LED chip 3 and the wafer body 1, the pressing portion 732 contacts and presses the upper surface of the LED chip 3, and the spring body portion 71 contacts and presses the back surface of the wafer body 1. The spring 7 is limited to the side of the wafer body 1 through the connecting portion 731 of the spring 7. Finally, the spring 7 is released, and the LED chip 3 is clamped on the wafer body 1 under the elastic force, completing the fixation of the LED chip 3.

[0025] In this embodiment, in order to achieve the best clamping effect of the spring 7, the connecting portion 731 of the chuck 73 is close to the inner side of the spring body portion 71, and the pressing portion 732 is arranged along the axial direction of the spring body portion 71. Only in this way can the contact area between the spring 7 and the carrier body 1 be maximized during the clamping process, the clamping effect be the best, and the spring 7 is not likely to fall off. Specifically, the connecting portion 731 is arranged close to the inner side of the handle 72, and the pressing portion 732 is arranged radially towards the spring body portion 71.

[0026] In the embodiment, two such springs 7 are installed on the carrier fixture for metal evaporation plating of the LED chip 3, and are respectively installed on both sides close to the sliding groove 5, so that the LED chip 3 cannot be detached from the carrier body 1. Specifically, the spring 7 is detachably press-connected to the side of the carrier body 1 away from the limiting protrusion 2.

[0027] When disassembling the LED chip 3, by pushing the spring body portion 71 in a direction perpendicular to the carrier body 1, the spring 7 is compressed at this time, so that the pressing portion 732 is separated from the contact with the surface of the LED chip 3. Then, the handle 72 is toggled in a direction away from the center of the carrier body 1, so that the spring 7 is disassembled from the carrier body 1. Then, the picking tool can be inserted from the picking groove 6 into the groove 4 to reach the inner side of the LED chip 3, and by lifting the LED chip 3, the separation of the LED chip 3 from the carrier body 1 is realized, and the chip picking is completed. It should be noted that if the picking groove 6 and the groove 4 are not provided in this embodiment, when picking the chip, since the LED chip 3 is closely attached to the upper surface of the carrier body 1, it is necessary to toggle the LED chip 3 to perform the next step of chip picking. However, when toggling, the sliding friction will occur on the surface where the LED chip 3 contacts the carrier body 1, resulting in scratches and affecting the product yield.

[0028] In summary, for the carrier fixture for metal evaporation plating of the LED chip in the above embodiment of the present utility model, by providing a groove on the carrier body, it is avoided that scratches are generated due to excessive contact friction between one side of the LED chip and the carrier body during the fixing and feeding of the LED chip. And by selectively installing the position and number of the point-clamping springs, the LED chip is fixed more stably, and the carrier fixture for metal evaporation plating of the novel LED chip has the characteristics of simple structure. In addition, the carrier body is also provided with spring fixing columns and sliding grooves used in cooperation with the spring fixing columns, so that the novel type also retains the structure of the traditional fixing method.

[0029] Please refer to Figures 3 to 4, shown is a wafer fixture for metal vapor deposition of LED chips in the second embodiment of the utility model, which is different from the wafer fixture for metal vapor deposition of LED chips in the first embodiment in that the spring 7 is a hook-type fixing spring 7. Specifically, the slide groove 5 is arranged on the reverse side of the wafer carrier 1, and the spring 7 includes a spring body part 71, one end of the spring body part 71 is connected to a fixing part 74 detachably connected to the spring fixing column 8, and the other end is connected to a cylindrical hook 75. When fixing the LED chip 3, the fixing part 74 of the spring 7 is fixed by the spring fixing column 8 on the reverse side of the wafer carrier 1, and the hook 75 at the other end of the spring 7 passes through the slide groove 5 and hooks on the side of the LED chip 3. Under the action of the limiting of the two side walls of the slide groove 5, the hook 75 of the spring 7 can only slide along the slide groove 5 to the bottom 41 of the slide groove under the action of the elastic force of the spring 7, thereby moving with the LED chip 3, and at the same time, under the limiting cooperation of the limiting protrusion 2, the LED chip 3 is fixed on the wafer carrier 1, and the fixing of the LED chip 3 is completed. It should be noted that the spring fixing column 8 is arranged in a T shape, and the diameter of the annular fixing portion 74 is the same as the length of the T end of the spring fixing column 8, which can prevent the fixing portion 74 from detaching when the spring 7 is in an unnatural state, and also enable the spring 7 to achieve a detachable function in a natural state.

[0030] In this embodiment, since one end of the hook 75 is away from the spring body 71 and extends through the slide 5 to the front of the wafer carrier 1, when taking the material, the hook 75 extending from the front outer part of the wafer carrier 1 is manually moved to hang the hook 75 in the idle groove 9 close to the slide 5, thereby separating the spring 7 from the squeeze fixation with the LED chip 3, and then the LED chip 3 is taken away by the wafer taking tool to complete the wafer taking. It should be noted that in order to facilitate the hook 75 to be quickly and accurately placed in the limiting groove, the limiting groove is set to be semicircular, and the diameter is twice the diameter of the cylindrical hook 75. Specifically, the wafer carrier 1 is provided with an idle groove 9 set in a semicircular shape on the side close to the slide 5, and the opening diameter of the idle groove 9 is twice the diameter of the hook 75.

[0031] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0032] The above-described embodiments merely represent several implementation manners of the present utility model. The description thereof is relatively specific and detailed, but it should not be construed as a limitation to the scope of the present utility model. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present utility model, several modifications and improvements can still be made, and these all belong to the protection scope of the present utility model. Therefore, the protection scope of the present utility model shall be subject to the appended claims.

Claims

1. A wafer carrier fixture for metal evaporation of LED chips, comprising a wafer carrier body, a limiting protrusion and a connector for fixing the wafer carrier body, characterized in that: The middle part of the front side of the wafer carrier body is sunken to form a groove, and the depression includes a groove bottom and a groove wall. A slide groove is provided on the side of the wafer carrier body opposite to the limiting protrusion, and the slide groove opening is arranged facing away from the center of the wafer carrier body, and the slide groove bottom is located inside the groove and close to the groove wall. A film taking groove is provided on the front side of the wafer carrier body between the limiting protrusion and the slide groove, and the depth of the film taking groove is consistent with the depth of the groove bottom. One side of the film taking groove is connected to the groove, and the other side passes through the wafer carrier body. A spring fixing column is provided on the back side of the wafer carrier body opposite to the slide groove. The wafer carrier fixture for metal evaporation of LED chips also includes a spring for fixing the LED chip.

2. The wafer carrier jig for metal evaporation of LED chips according to claim 1, characterized in that: The spring is detachably crimped on the side of the carrier body away from the limiting protrusion. The spring includes a spring body part, one end of the spring body part axially extends to form a handle, and the end away from the handle is connected to a chuck, and the chuck is arranged inside the spring body part.

3. The wafer carrier jig for metal evaporation of LED chips according to claim 2, characterized in that: The chuck is arranged in a 7-shape, and comprises a connecting portion which is radially bent and connected to one end of the spring body away from the handle, and a pressing portion which is connected to the other end of the connecting portion.

4. The wafer carrier jig for metal evaporation of LED chips according to claim 3, characterized in that: The connecting portion is arranged close to the inner side of the taking handle, and the pressing portion is arranged radially toward the spring body.

5. The wafer carrier jig for metal evaporation of LED chips according to claim 1, characterized in that: The slide groove is arranged on the reverse side of the carrier body, and the spring comprises a spring body part, one end of the spring body part is connected to a fixing part which is detachably connected to the spring fixing column, and the other end away from the fixing part is connected to a hook.

6. The wafer carrier jig for metal evaporation of LED chips according to claim 5, characterized in that: One end of the hook away from the spring body passes through the slide slot and extends out of the front side of the wafer carrier body.

7. The wafer carrier jig for metal evaporation of LED chips according to claim 1, characterized in that: The spring fixing column is arranged in a T shape.

8. The wafer carrier jig for metal evaporation of LED chips according to claim 5, characterized in that: The wafer carrier body is provided with an idle groove in a semicircular shape on one side close to the slide groove, and the opening diameter of the idle groove is twice the diameter of the hook portion.

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