Photovoltaic solar cell electroplating device
By designing a photovoltaic solar cell plating device composed of inner and outer grooves, the problem of overflow of plating liquid is solved, and better plating effect and cell performance are achieved.
Patent Information
- Application Number
- CN202421988486.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-15
- Publication Date
- 2025-06-10
- Estimated Expiration
- 2034-08-15
AI Technical Summary
In the existing photovoltaic solar cell plating technology, the plating solution is prone to spread to the upper surface of the silicon wafer, resulting in corrosion on the upper surface and leakage at the edges, affecting the electrical performance of the battery.
A photovoltaic solar cell plating device is designed, including an inner tank and an outer tank. The notch area of the inner tank is smaller than the area of the battery cell. The plating solution is injected into the inner tank through the liquid inlet, and the overflowing liquid enters the outer tank and is discharged through the liquid discharge port to prevent liquid from overflowing.
It effectively avoids the plating solution from spreading to the upper surface of the silicon wafer, reduces edge leakage and upper surface corrosion, and improves the electrical performance of the battery.
Smart Images
Figure CN222961604U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of electroplating of photovoltaic solar cells, and in particular to an electroplating device for photovoltaic solar cells. Background Art
[0002] In a common single-sided electroplating tank for silicon wafers, the water surface area of the tank body is much larger than the area of the silicon wafer. As Figure 5 shown, during electroplating, the liquid level height is almost the same as the upper surface of the silicon wafer. Even a slight disturbance or due to surface tension problems will cause the plating solution to overflow onto the upper surface of the silicon wafer, having an adverse effect on the electroplating effect, resulting in edge leakage and upper surface corrosion, and affecting the electrical performance of the battery chip. Summary of the Utility Model
[0003] The purpose of the utility model is to provide an electroplating device for photovoltaic solar cells to solve the technical problems in the prior art that the plating solution is likely to overflow onto the upper surface of the silicon wafer, resulting in upper surface corrosion, and that there is more metal plating on the edge, resulting in large edge leakage and affecting the electrical performance of the battery chip.
[0004] An electroplating device for photovoltaic solar cells provided by the utility model is used for electroplating battery chips. The electroplating device includes: an anode, a cathode, and at least one electroplating tank;
[0005] The electroplating tank includes an inner tank and an outer tank, and the outer tank surrounds the inner tank. The anode is arranged in the inner tank. A liquid inlet is arranged at the bottom of the inner tank, and a liquid drain is arranged at the bottom of the outer tank. The outer tank is used for recovering the electroplating solution overflowing from the inner tank;
[0006] The area of the opening of the inner tank is smaller than the area of the battery chip.
[0007] As a further technical solution, an overflow inclined surface is arranged at the top end of the tank wall of the inner tank, and the overflow inclined surface is located outside the inner tank.
[0008] As a further technical solution, when electroplating the battery chip, the projection of the outer edge of the battery chip on the inner tank is located at the top end of the tank wall of the inner tank.
[0009] As a further technical solution, it further includes a flow equalizing plate, and the flow equalizing plate is arranged in the inner tank;
[0010] The flow equalizing plate is located above the anode, or the flow equalizing plate is located below the anode.
[0011] As a further technical solution, it further includes a circulation pump, a liquid inlet pipe, and a liquid return pipe;
[0012] One end of the liquid inlet pipe is communicated with the liquid inlet, and the other end is communicated with the outlet of the circulation pump;
[0013] One end of the liquid return pipe is communicated with the liquid discharge port, and the other end is communicated with the inlet of the circulation pump.
[0014] As a further technical solution, it further includes a liquid storage tank, the liquid storage tank is arranged between the liquid return pipe and the circulation pump, and both the liquid return pipe and the circulation pump are communicated with the liquid storage tank.
[0015] As a further technical solution, it further includes a heating mechanism, the heating mechanism is arranged on the liquid storage tank and is used for heating the liquid in the liquid storage tank;
[0016] and / or;
[0017] It further includes a cooling mechanism, the cooling mechanism is arranged on the liquid storage tank and is used for cooling the liquid in the liquid storage tank.
[0018] As a further technical solution, it further includes a handling mechanism, the handling mechanism is used for handling the battery sheet to the electroplating tank for electroplating;
[0019] The handling mechanism is arranged on at least one side of the opposite sides of the electroplating tank.
[0020] As a further technical solution, the handling mechanism includes a transfer track and a manipulator, and the manipulator is arranged between the transfer track and the electroplating tank;
[0021] A suction cup is arranged on the manipulator, and the cathode is arranged on the suction cup.
[0022] As a further technical solution, the angle of the overflow slope is between 5-30°.
[0023] Compared with the prior art, the technical advantages of a photovoltaic solar cell electroplating device provided by the present utility model are:
[0024] The photovoltaic solar cell electroplating device provided by the present utility model is used for electroplating battery sheets. The electroplating device includes: an anode, a cathode and at least one electroplating tank; the electroplating tank includes an inner tank and an outer tank, and the outer tank surrounds the inner tank. The anode is arranged in the inner tank, a liquid inlet is arranged at the bottom of the inner tank, a liquid discharge port is arranged at the bottom of the outer tank, and the outer tank is used for recovering the electroplating liquid overflowed from the inner tank; the area of the opening of the inner tank is smaller than the area of the battery sheet.
[0025] The electroplating solution is injected into the inner tank through the liquid inlet. After the electroplating solution in the inner tank overflows, it can enter the outer tank and be discharged through the liquid outlet, avoiding the leakage of the electroplating solution. At the same time, since the area of the opening of the inner tank is smaller than the area of the battery chip, when electroplating, the battery chip cannot enter the inner tank. By pressing the electroplating solution at the opening of the inner tank with the battery chip, the distance between the battery chip and the top of the inner tank wall can be increased, thereby increasing the height difference between the battery chip and the electroplating solution, enabling the electroplating solution to directly enter the outer tank, avoiding the overflow caused by tension, further avoiding adverse effects on the electroplating effect, avoiding edge leakage and upper surface corrosion, and improving the electrical performance of the battery chip.
[0026] Other features and advantages of the present utility model will be described in detail in the subsequent specific implementation section. BRIEF DESCRIPTION OF THE DRAWINGS
[0027] In order to more clearly illustrate the specific implementation manners of the present utility model or the technical solutions in the prior art, the following will briefly introduce the drawings required for use in the description of the specific implementation manners or the prior art. Obviously, the following drawings are some implementation manners of the present utility model. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.
[0028] Figure 1 Structural schematic diagram of the photovoltaic solar cell electroplating device provided by the embodiment of the present utility model;
[0029] Figure 2 Side cross-sectional view of the electroplating tank provided by the embodiment of the present utility model;
[0030] Figure 3 Side cross-sectional view of the electroplating tank with an overflow slope provided by the embodiment of the present utility model;
[0031] Figure 4 Schematic diagram of the cooperation between the top of the inner tank and the battery chip provided by the embodiment of the present utility model;
[0032] Figure 5 Schematic diagram of the prior art provided by the embodiment of the present utility model.
[0033] Reference numerals: 1 - battery chip; 2 - anode; 3 - cathode; 4 - electroplating tank; 5 - inner tank; 6 - outer tank; 7 - overflow slope; 8 - flow equalizing plate; 9 - circulation pump; 10 - liquid inlet pipe; 11 - liquid return pipe; 12 - liquid storage tank; 13 - heater; 14 - conveying track; 15 - manipulator; 16 - suction cup. DETAILED DESCRIPTION OF THE EMBODIMENTS
[0034] The technical solution of the present utility model will be clearly and completely described below in conjunction with the embodiments. Obviously, the described embodiments are some of the embodiments of the present utility model, rather than all of them. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present utility model without creative efforts shall fall within the protection scope of the present utility model.
[0035] In the description of the present utility model, it should be noted that the orientation or positional relationship indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation to the present utility model. In addition, the terms "first", "second", and "third" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance.
[0036] In the description of the present utility model, it should be noted that unless otherwise clearly specified and defined, the terms "installation", "connection", and "connection" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.
[0037] In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the ability of those of ordinary skill in the art to implement. When the combination of technical solutions results in contradictions or cannot be implemented, it should be considered that such a combination of technical solutions does not exist and is not within the protection scope required by the present utility model.
[0038] The present utility model will be further described in detail below through specific embodiments in conjunction with the drawings.
[0039] The specific structure is as Figures 1 to 5 shown.
[0040] This embodiment provides a photovoltaic solar cell electroplating device for electroplating a battery slice 1. The electroplating device includes: an anode 2, a cathode 3, and at least one electroplating tank 4; the electroplating tank 4 includes an inner tank 5 and an outer tank 6, and the outer tank 6 surrounds the inner tank 5. The anode 2 is arranged in the inner tank 5. A liquid inlet is arranged at the bottom of the inner tank 5, and a liquid outlet is arranged at the bottom of the outer tank 6. The outer tank 6 is used to recover the electroplating solution overflowing from the inner tank 5; the area of the opening of the inner tank 5 is smaller than the area of the battery slice 1.
[0041] In this embodiment, the electroplating solution is injected into the inner tank 5 through the liquid inlet. After the electroplating solution in the inner tank 5 overflows, it can enter the outer tank 6 and be discharged through the liquid outlet, avoiding the leakage of the electroplating solution. At the same time, since the area of the notch of the inner tank 5 is smaller than the area of the battery cell 1, during electroplating, the battery cell 1 cannot enter the inner tank 5. By pressing the electroplating solution at the notch of the inner tank 5 with the battery cell 1, the distance between the battery cell 1 and the top of the inner tank 5 wall can be increased, thereby increasing the drop of the electroplating solution between the battery cell 1 and the electroplating solution, enabling the electroplating solution to directly enter the outer tank 6, avoiding the overflow of the solution caused by tension, and further avoiding adverse effects on the electroplating effect, edge leakage and upper surface corrosion, and improving the electrical performance of the battery cell 1.
[0042] In this embodiment, both the cathode 3 and the anode 2 are connected to the power supply. The anode 2 is an insoluble anode, and the insoluble anode is a titanium anode or a titanium anode with an iridium ruthenium alloy plated on its surface. The anode 2 is connected to the positive pole of the power supply through a terminal, and there is an insulating material between the terminal and the battery cell 1 for isolation.
[0043] In this embodiment, a light source is provided at the bottom or side of the electroplating tank 4, and the color of the light source is one or several of green light, white light and red light.
[0044] In this embodiment, a vacuum generating device is also provided to provide a vacuum electroplating environment.
[0045] In an alternative technical solution of this embodiment, an overflow slope 7 is provided at the top of the inner tank 5 wall, and the overflow slope 7 is located outside the inner tank 5.
[0046] In this embodiment, by adding the design of the overflow slope 7, the drop at the edge of the battery cell 1 is increased, enabling the electroplating solution to flow downward preferentially, and further reducing the overflow of the solution caused by tension. The angle of the overflow slope 7 can be designed according to requirements. The smaller the angle, the greater the drop. It is preferably between 5-30°.
[0047] In an alternative technical solution of this embodiment, when electroplating the battery cell 1, the projection of the outer edge of the battery cell 1 on the inner tank 5 is located at the top of the inner tank 5 wall. That is, the outer edge of the battery cell 1 is directly opposite to the top of the inner tank 5 wall. Since the electroplating solution overflowing from the inner tank 5 needs to pass through the top of the inner tank 5 wall, such a setting enables the electroplating surface of the battery cell 1 to be completely in contact with the electroplating solution, ensuring the electroplating effect.
[0048] In this embodiment, the size of the inner tank 5 is slightly smaller than that of the battery cell 1 to be electroplated, but the outer edge shapes are the same, ensuring the electroplating effect.
[0049] In an alternative technical solution of this embodiment, a flow equalizing plate 8 is further included. The flow equalizing plate 8 is disposed in the inner tank 5; the flow equalizing plate 8 is located above the anode 2, or the flow equalizing plate 8 is located below the anode 2. When the electroplating solution is injected through the liquid inlet on the bottom of the inner tank 5, it is equalized by the flow equalizing plate 8, making the electroplating solution stable when contacting the battery sheet 1, avoiding a large impact force concentrated in one place, and improving the electroplating effect.
[0050] In this embodiment, the flow equalizing plate 8 is a perforated plate or a mesh structure, as long as the requirements are met.
[0051] In an alternative technical solution of this embodiment, a circulation pump 9, a liquid inlet pipe 10 and a liquid return pipe 11 are further included; one end of the liquid inlet pipe 10 is communicated with the liquid inlet, and the other end is communicated with the outlet of the circulation pump 9; one end of the liquid return pipe 11 is communicated with the liquid discharge port, and the other end is communicated with the inlet of the circulation pump 9. The electroplating solution is circulated in the inner tank 5 and the outer tank 6 through the circulation pump 9, the liquid inlet pipe 10 and the liquid return pipe 11, and the recycling saves costs.
[0052] In an alternative technical solution of this embodiment, a liquid storage tank 12 is further included. The liquid storage tank 12 is disposed between the liquid return pipe 11 and the circulation pump 9, and both the liquid return pipe 11 and the circulation pump 9 are communicated with the liquid storage tank 12. The electroplating solution is buffered by the liquid storage tank 12 to ensure the stability of the electroplating solution circulation.
[0053] In an alternative technical solution of this embodiment, a heating mechanism is further included. The heating mechanism is disposed on the liquid storage tank 12 for heating the liquid in the liquid storage tank 12; and / or; a cooling mechanism is further included. The cooling mechanism is disposed on the liquid storage tank 12 for cooling the liquid in the liquid storage tank 12.
[0054] In this embodiment, a heating mechanism is disposed on the liquid storage tank 12. When nickel plating the battery sheet 1, the heating mechanism heating the electroplating solution can ensure the electroplating effect; a cooling mechanism is disposed on the liquid storage tank 12. When copper plating the battery sheet 1, the cooling mechanism cooling the electroplating solution can ensure the electroplating effect. It can be specifically set according to requirements. A heating mechanism can be disposed on the liquid storage tank 12, or a cooling mechanism can be disposed on the liquid storage tank 12, or both a heating mechanism and a cooling mechanism can be disposed on the liquid storage tank 12.
[0055] Among them, the heating mechanism includes a heater 13, and the material of the heater 13 is Teflon or graphite. However, it is not limited thereto. The heating mechanism can also be other heating devices in the prior art that meet the requirements.
[0056] Among them, the cooling mechanism includes a chiller and a heat exchanger. However, it is not limited thereto. The cooling mechanism can also be other cooling devices in the prior art that meet the requirements.
[0057] In an alternative technical solution of this embodiment, a handling mechanism is further included. The handling mechanism is used to transport the battery sheet 1 to the electroplating tank 4 for electroplating; the handling mechanism is disposed on at least one side of the opposite sides of the electroplating tank 4.
[0058] In this embodiment, the battery wafers 1 are transported by a handling mechanism, which has a high degree of automation and improves the electroplating efficiency.
[0059] In this embodiment, a support structure can be arranged in the inner tank 5, and the cathode 3 is arranged on the support structure. The handling mechanism transports and places the battery wafers 1 on the support structure for electroplating. Among them, the handling mechanism can be an existing robotic arm.
[0060] In an alternative technical solution of this embodiment, the handling mechanism includes a transfer track 14 and a manipulator 15. The manipulator 15 is arranged between the transfer track 14 and the electroplating tank 4; a suction cup 16 is arranged on the manipulator 15, and the cathode 3 is arranged on the suction cup 16.
[0061] In this embodiment, the transfer track 14 is used to transfer the battery wafers 1. The manipulator 15 adsorbs one side of the battery wafer 1 on the transfer track 14 through the suction cup 16. The manipulator 15 transports the battery wafer 1 above the electroplating tank 4 and slowly moves down to make the other side of the battery wafer 1 in full contact with the electroplating solution in the inner tank 5. After electroplating is completed, the manipulator 15 transports the battery wafer 1 to the discharging position for discharging, and then repeats to transport new battery wafers 1 on the transfer track 14. The handling mechanism has a simple structure and stable handling effect. It should be noted that at this time, there is no need to set up a support structure, and the suction cup 16 can be used as a support structure to ensure the stability of the battery wafer 1. Preferably, in this embodiment, handling mechanisms are arranged on both opposite sides of the electroplating tank 4, and the two handling mechanisms work alternately. That is, after one handling mechanism discharges the electroplated battery wafers 1, the other handling mechanism electroplates new battery wafers 1, and the previous handling mechanism grabs new battery wafers 1, effectively improving the electroplating efficiency.
[0062] In this embodiment, since the area of the opening of the inner tank 5 is smaller than the area of the battery wafer 1, the overall electroplating tank 4 is smaller, which is convenient for replenishing the electroplating solution. At the same time, multiple electroplating tanks 4 can be arranged in an array to improve production capacity.
[0063] An electroplating process provided by this embodiment is used for the above-mentioned photovoltaic solar cell electroplating device. Therefore, the technical advantages and effects achieved by this electroplating process include the technical advantages and effects achieved by the above-mentioned photovoltaic solar cell electroplating device, which will not be elaborated here.
[0064] The electroplating process includes the steps of:
[0065] Preparing the solution: Pour a preset volume of nickel electroplating solution and hydrofluoric acid into the storage tank to form a mixed electroplating solution. Turn on the heating mechanism to heat the mixed electroplating solution in the storage tank to the preset temperature, and turn on the circulation pump 9 to circulate the mixed electroplating solution into the electroplating tank 4. Or, pour a preset volume of copper electroplating solution and hydrofluoric acid into the storage tank to form a mixed electroplating solution. Turn on the cooling mechanism to cool the mixed electroplating solution in the storage tank to the preset temperature, and turn on the circulation pump 9 to circulate the mixed electroplating solution into the electroplating tank 4;
[0066] Loading: The suction cup 16 on the manipulator 15 grabs one side of the battery chip 1 on the transfer track 14, moves the battery chip 1 above the electroplating tank 4, and makes the other side of the battery chip 1 come into full contact with the mixed plating solution in the electroplating tank 4 by moving downwards.
[0067] Electroplating: Immerse the battery chip 1 in the mixed plating solution for a preset time, and then turn on the power supply for electroplating.
[0068] Unloading: After the electroplating of the battery chip 1 is completed, the battery chip 1 is removed from the electroplating tank 4 by the suction cup 16 on the manipulator 15.
[0069] The electroplating process provided in this embodiment realizes automatic electroplating through the cooperation of the manipulator 15 and the electroplating tank 4, with a high degree of automation and labor saving. Since the mixed plating solution contains hydrofluoric acid, pickling and nickel plating or copper plating can be completed in the same electroplating tank 4 to prevent the oxidation of the battery chip 1 during electroplating and ensure the bonding force of the metal electrode. It should be noted that a small amount of hydrofluoric acid is added to the mixed plating solution.
[0070] Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that: they can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements on some or all of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present invention.
Claims
1. A photovoltaic solar cell electroplating device, used for electroplating a cell sheet (1), characterized in that: The electroplating device comprises: an anode (2), a cathode (3) and at least one electroplating tank (4); The electroplating tank (4) comprises an inner tank (5) and an outer tank (6), wherein the outer tank (6) surrounds the inner tank (5), the anode (2) is arranged in the inner tank (5), the bottom of the inner tank (5) is provided with a liquid inlet, the bottom of the outer tank (6) is provided with a liquid outlet, and the outer tank (6) is used to recover the electroplating liquid overflowing from the inner tank (5); The area of the notch of the inner groove (5) is smaller than the area of the battery cell (1).
2. The photovoltaic solar cell electroplating device according to claim 1, characterized in that: An overflow slope (7) is provided at the top end of the groove wall of the inner groove (5), and the overflow slope (7) is located outside the inner groove (5).
3. The photovoltaic solar cell electroplating device according to claim 1, characterized in that: When the battery cell (1) is electroplated, the projection of the outer edge of the battery cell (1) on the inner groove (5) is located at the top of the groove wall of the inner groove (5).
4. The photovoltaic solar cell electroplating device according to claim 1, characterized in that: It also includes a flow balancing plate (8), wherein the flow balancing plate (8) is arranged in the inner groove (5); The current balancing plate (8) is located on the upper side of the anode (2), or the current balancing plate (8) is located on the lower side of the anode (2).
5. The photovoltaic solar cell electroplating device according to claim 1, characterized in that: It also includes a circulation pump (9), a liquid inlet pipe (10) and a liquid return pipe (11); One end of the liquid inlet pipe (10) is connected to the liquid inlet, and the other end is connected to the outlet of the circulation pump (9); One end of the liquid return pipe (11) is connected to the liquid discharge port, and the other end is connected to the inlet of the circulation pump (9).
6. The photovoltaic solar cell electroplating device according to claim 5, characterized in that: The invention also comprises a liquid storage tank (12), wherein the liquid storage tank (12) is arranged between the liquid return pipe (11) and the circulation pump (9), and the liquid return pipe (11) and the circulation pump (9) are both in communication with the liquid storage tank (12).
7. The photovoltaic solar cell electroplating device according to claim 6, characterized in that: It also includes a heating mechanism, which is arranged on the liquid storage tank (12) and is used to heat the liquid in the liquid storage tank (12); and / or; It also comprises a cooling mechanism, which is arranged on the liquid storage tank (12) and is used to cool the liquid in the liquid storage tank (12).
8. The photovoltaic solar cell electroplating device according to any one of claims 1 to 7, characterized in that: It also includes a transport mechanism, which is used to transport the battery cell (1) to the electroplating tank (4) for electroplating; The transport mechanism is arranged on at least one of the two opposite sides of the electroplating tank (4).
9. The photovoltaic solar cell electroplating device according to claim 8, characterized in that: The transport mechanism comprises a transport track (14) and a manipulator (15), wherein the manipulator (15) is arranged between the transport track (14) and the electroplating tank (4); The robot arm (15) is provided with a suction cup (16), and the cathode (3) is arranged on the suction cup (16).
10. The photovoltaic solar cell electroplating device according to claim 2, characterized in that: The angle of the overflow slope (7) is between 5° and 30°.