Cooling device for ceramic tile manufacturing and production
By designing a cooling device for ceramic tile manufacturing, the combination of air pump and hollow plates is used to solve the problem of slow heat release speed during air cooling of ceramic tile, and a more efficient cooling effect is achieved.
Patent Information
- Application Number
- CN202421989439.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-16
- Publication Date
- 2025-06-10
- Estimated Expiration
- 2034-08-16
AI Technical Summary
When ceramic tiles are air-cooled and heat dissipated, due to their contact with each other, the heat release speed is slow and cannot be cooled by the wind, resulting in a reduced cooling effect.
A cooling device for tiles manufacturing production is designed to absorb gas through an air pump, and the gas is released through the hollow plate and through holes, blowing to the ceramic tiles on the support mechanism to achieve heat dissipation and cooling, and to improve heat release efficiency through the gap between the support mechanisms.
By increasing the gap between the tiles, the airflow can blow the surface of the tiles more effectively, improving the cooling effect of the tiles, and solving the problem of slow heat release during air-cooling heat dissipation.
Smart Images
Figure CN222964280U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of ceramic tile production, in particular to a cooling device for ceramic tile manufacturing and production. Background Technique
[0002] Ceramic tiles are made of refractory metal oxides and semi-metal oxides through processes such as grinding, mixing, pressing, glazing, and sintering, and form an acid and alkali resistant porcelain or stone-like building or decorative material, called ceramic tiles. Their raw materials are mostly mixed from clay, quartz sand, etc. after high temperature compression, etc., and have high hardness.
[0003] After the ceramic tiles are fired and formed, they need to be cooled. The cooling is divided into several stages. Those with high temperatures cannot be directly immersed in water or sprayed. After cooling by blowing or natural cooling to a certain temperature, they can be cooled by covering with a wet cloth. When stacking the ceramic tiles for air cooling, the ceramic tiles are in contact with each other, resulting in a slow heat release rate on the contact surface. During air cooling, the heat on the contact surfaces of the mutually contacting ceramic tiles cannot be blown and cooled, reducing the cooling effect of the ceramic tiles. Content of the Utility Model
[0004] The purpose of the utility model is to solve the problem in the prior art that the ceramic tiles are in contact with each other, resulting in a slow heat release rate on the contact surface. During air cooling, the heat on the contact surfaces of the mutually contacting ceramic tiles cannot be blown and cooled, reducing the cooling effect of the ceramic tiles, and to propose a cooling device for ceramic tile manufacturing and production.
[0005] In order to achieve the above purpose, the utility model adopts the following technical scheme:
[0006] Design a cooling device for ceramic tile manufacturing and production, including a bottom plate. The upper end of the bottom plate is fixedly connected with a hollow plate. The hollow plate is fixedly connected with a first support plate. The upper end of the first support plate is fixedly connected with an air pump. The outlet of the air pump is communicated with the hollow plate through a connecting pipe. The upper end of the bottom plate is fixedly connected with a fixed shaft. A plurality of support mechanisms are rotatably connected to the fixed shaft at equal intervals along the length direction. A plurality of first through holes are opened on the hollow plate, and the first through holes and the support mechanisms are on the same side.
[0007] Preferably, an anti-slip pad is fixedly connected to the bottom end of the bottom plate.
[0008] Preferably, the support mechanism includes a second support plate. The second support plate is rotatably connected to the fixed shaft. Heat dissipation holes are opened on the second support plate. A plurality of support bars are connected to the heat dissipation holes at equal intervals along the length direction.
[0009] Preferably, a plurality of second through holes are evenly spaced along the length direction on both sides of the second support plate, the second through holes communicate with the heat dissipation holes, and the second through holes and the support bars are staggered.
[0010] Preferably, a plug rod is fixedly connected to the second support plate, a card slot is formed on the hollow plate, and one end of the plug rod is clamped in the card slot.
[0011] A cooling device for tile manufacturing and production proposed by the present utility model has the beneficial effects that:
[0012] By placing tiles on different support mechanisms, a certain gap is generated between each tile. After the air pump is started, it sucks in gas, and the sucked gas is introduced into the hollow plate through the connecting pipe. The gas in the hollow plate is released from the first through hole, and the released gas blows towards the support mechanism to dissipate heat and cool the tiles on the support mechanism. There is a certain gap between the tiles, and the heat release from the tiles will not be blocked, thereby improving the cooling effect on the tiles. BRIEF DESCRIPTION OF THE DRAWINGS
[0013] Figure 1 is a schematic structural view of a cooling device for tile manufacturing and production proposed by the present utility model Figure 1 ;
[0014] Figure 2 is a schematic structural view of a cooling device for tile manufacturing and production proposed by the present utility model Figure 2 ;
[0015] Figure 3 is a schematic cross-sectional structural view of a cooling device for tile manufacturing and production proposed by the present utility model;
[0016] Figure 4 is a schematic structural view of the support mechanism in a cooling device for tile manufacturing and production proposed by the present utility model.
[0017] In the figure: 1, bottom plate; 2, hollow plate; 3, first through hole; 4, first support plate; 5, air pump; 6, fixed shaft; 7, support mechanism; 71, second support plate; 72, heat dissipation hole; 73, support bar; 74, second through hole; 75, plug rod. DETAILED DESCRIPTION OF THE EMBODIMENTS
[0018] The following will clearly and completely describe the technical solutions in the embodiments of the present utility model with reference to the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all of the embodiments.
[0019] Example 1: Refer to Figures 1-4, A cooling device for tile manufacturing production, including a bottom plate 1. An anti-slip pad is fixedly connected to the bottom end of the bottom plate 1. A hollow plate 2 is fixedly connected to the upper end of the bottom plate 1. A first support plate 4 is fixedly connected to the hollow plate 2. An air pump 5 is fixedly connected to the upper end of the first support plate 4. The outlet of the air pump 5 is communicated with the hollow plate 2 through a connecting pipe. A fixed shaft 6 is fixedly connected to the upper end of the bottom plate 1. A number of support mechanisms 7 are rotatably connected to the fixed shaft 6 at equal intervals along the length direction. A number of first through holes 3 are opened on the hollow plate 2. The first through holes 3 and the support mechanisms 7 are on the same side.
[0020] Working process:
[0021] When cooling the tiles, rotate the support mechanism 7 to make the support mechanism 7 expand in a staggered manner. Place the tiles on different support mechanisms 7 so that there is a certain gap between the tiles. After the air pump 5 is started, it sucks gas, and the sucked gas is introduced into the hollow plate 2 through the connecting pipe. The gas in the hollow plate 2 is released from the first through holes 3, and the released gas blows towards the support mechanism 7 to cool the tiles on the support mechanism 7. There is a certain gap between the tiles, and the heat released from the tiles will not be blocked, thereby improving the cooling effect on the tiles.
[0022] Example 2: Refer to Figure 4 , As another preferred embodiment of the present invention, the difference from Embodiment 1 is that the support mechanism 7 includes a second support plate 71. The second support plate 71 is rotatably connected to the fixed shaft 6. Heat dissipation holes 72 are opened on the second support plate 71. A number of support bars 73 are connected to the heat dissipation holes 72 at equal intervals along the length direction. A number of second through holes 74 are equally spaced along the length direction on both sides of the second support plate 71. The second through holes 74 communicate with the heat dissipation holes 72. The second through holes 74 and the support bars 73 are staggered. A plug rod 75 is fixedly connected to the second support plate 71. A card slot is opened on the hollow plate 2. One end of the plug rod 75 is clamped in the card slot. Rotate the second support plate 71, and the second support plate 71 drives the plug rod 75 to rotate. After the plug rod 75 is separated from the card slot, the second support plate 71 is misaligned. Place the tiles on the second support plate 71, and a number of support bars 73 are in contact with the bottom end of the tiles. The heat at the bottom of the tiles is released from the heat dissipation holes 72. A part of the gas released from the first through holes 3 passes through the second through holes 74 to dissipate heat from the bottom end of the tiles, improving the heat dissipation effect on the tiles. Then push the second support plate 71, and the second support plate 71 is clamped in the card slot through the plug rod 75 to limit and fix the second support plate 71.
[0023] The above is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present invention, according to the technical solution of the present invention and its inventive concept, makes equivalent replacements or changes, and should be covered by the protection scope of the present invention.
Claims
1. A cooling device for tile manufacturing, characterized in that: It comprises a bottom plate (1), wherein: The upper end of the base plate (1) is fixedly connected to a hollow plate (2), the hollow plate (2) is fixedly connected to a first support plate (4), the upper end of the first support plate (4) is fixedly connected to an air pump (5), the outlet of the air pump (5) is connected to the hollow plate (2) through a connecting pipe, the upper end of the base plate (1) is fixedly connected to a fixed shaft (6), a plurality of support mechanisms (7) are rotatably connected to the fixed shaft (6) at equal intervals along the length direction, a plurality of first through holes (3) are provided on the hollow plate (2), and the first through holes (3) and the support mechanisms (7) are located on the same side.
2. The cooling device for tile manufacturing according to claim 1, characterized in that: An anti-slip pad is fixedly connected to the bottom end of the base plate (1).
3. The cooling device for tile manufacturing according to claim 1, characterized in that: The support mechanism (7) comprises a second support plate (71), the second support plate (71) is rotatably connected to the fixed shaft (6), a heat dissipation hole (72) is provided on the second support plate (71), and a plurality of support bars (73) are connected to the heat dissipation hole (72) at equal intervals along the length direction.
4. The cooling device for tile manufacturing according to claim 3, characterized in that: A plurality of second through holes (74) are provided at equal intervals on both sides of the second support plate (71) along the length direction, the second through holes (74) are connected to the heat dissipation holes (72), and the second through holes (74) and the support bars (73) are distributed in an alternating manner.
5. The cooling device for tile manufacturing according to claim 4, characterized in that: The second support plate (71) is fixedly connected with an insertion rod (75), the hollow plate (2) is provided with a clamping groove, and one end of the insertion rod (75) is clamped in the clamping groove.