Test structure for testing performance of chip-type multi-terminal component

Abstract

The utility model provides a test structure for testing the performance of a chip-type multi-terminal component, and the structure comprises a bearing assembly which is used for bearing a to-be-detected chip-type component; the probe assembly is arranged below the bearing assembly and is used for testing the performance of the to-be-detected chip component; and the power assembly comprises a first cylinder, and the first cylinder is arranged below the probe assembly and is used for driving the probe assembly to move up and down to be in contact with the to-be-detected chip component or be far away from the to-be-detected chip component. According to the utility model, an integrated cylinder driving system is introduced to replace an original roller mechanism, so that more accurate and stable test actions are realized; the cylinder is controlled by the solenoid valve, and is matched with the precisely designed probe assembly and the bearing assembly, so that the terminals with different numbers and layouts can be flexibly and accurately tested.

Description

Technical Field

[0001] The utility model relates to the technical field of automatic testing equipment, and particularly relates to a testing structure for testing the performance of chip multi-terminal components. Background Art

[0002] In the production and inspection processes of electronic components, ensuring the testing accuracy of chip multi-terminal components is a key challenge; traditional testing methods, especially those relying on roller-driven testing mechanisms, are difficult to meet the precise testing requirements of modern miniaturized and high-density multi-terminal chip components; due to the tiny size and extremely fine electrode contact points of such components, using rollers for testing not only easily leads to poor contact and inaccurate test results, but may also damage the components themselves, affecting their subsequent functions and reliability.

[0003] Deficiencies of the prior art:

[0004] 1. Precision and stability issues: Traditional testing equipment uses rollers for contact testing. Due to the limitations of the mechanical structure, it is impossible to achieve precise alignment and stable contact with tiny electrodes, resulting in large errors in test results and inability to meet the high-precision testing requirements.

[0005] 2. Adaptability limitations: For multi-terminal chip components, especially those with complex terminal layouts or extremely small pitch, traditional testing structures are difficult to adapt to, restricting their application scope.

[0006] Therefore, there are deficiencies in the prior art and further improvements are needed. Summary of the Utility Model

[0007] Aiming at the problems existing in the prior art, the utility model provides a testing structure for testing the performance of chip multi-terminal components.

[0008] To achieve the above object, the specific scheme of the utility model is as follows:

[0009] The utility model provides a testing structure for testing the performance of chip multi-terminal components, including:

[0010] A supporting component for supporting the chip component to be detected;

[0011] A probe component arranged below the supporting component for testing the performance of the chip component to be detected;

[0012] A power component including a first cylinder arranged below the probe component for driving the probe component to move up and down to contact or move away from the chip component to be detected.

[0013] Furthermore, the probe component includes a probe group, a first fixing block, a first slider, a first slide rail, and a second slide rail;

[0014] The first slide rail and the second slide rail are arranged side by side in the up and down direction on an installation backplane;

[0015] The first slider is slidably installed on the first slide rail and the second slide rail;

[0016] A first fixing block is arranged on the first slider for installing a probe group;

[0017] Each probe group is composed of several probes.

[0018] Further, the probe group is composed of two or three probes, and the number of probes is determined according to the number of terminals to be detected of the chip component to be detected;

[0019] The distance between the probes gradually decreases from bottom to top.

[0020] Further, the first air cylinder is installed at the lower left end of the installation backplane;

[0021] The telescopic rod of the first air cylinder is connected to the left side of the first slider, and is used to drive the first slider to move up and down, so as to drive the probe group installed on the first fixing block to move up and down.

[0022] Further, a solenoid valve is also installed at the lower right end of the installation backplane, and the solenoid valve is connected to the first air cylinder for controlling the telescopic action of the telescopic rod of the first air cylinder;

[0023] An air inlet interface is arranged at the lower end of the solenoid valve.

[0024] Further, the supporting assembly includes: a first supporting plate, a second supporting plate, and a third supporting plate;

[0025] The second supporting plate is provided with a first through groove penetrating up and down, and the third supporting plate is embedded in the first through groove;

[0026] The second supporting plate is arranged on the first supporting plate;

[0027] Oblique through holes corresponding to the number and positions of the probes are arranged on the third supporting plate;

[0028] A first groove corresponding to the oblique through hole is arranged on the first supporting plate for the probe to pass through.

[0029] Further, a controller is also arranged in the middle of the lower end of the installation backplane, and the controller is connected to the solenoid valve for controlling the start and stop of the solenoid valve.

[0030] Further, a network interface is also arranged at the lower end of the controller for network communication.

[0031] Adopting the technical solution of the present utility model has the following beneficial effects:

[0032] 1. Improve the test accuracy: Through the carefully designed probe assembly and support assembly, especially the personalized configuration of the probe group (such as adjusting the number of probes according to the number of terminals to be tested, and the design that the distance between the lower ends of the probes is greater than the distance between the upper ends), it can ensure the accurate positioning and contact of the chip multi-terminal components, significantly improving the accuracy and reliability of the test, and solving the problem of microelectrode contact that cannot be satisfied by the traditional roller test method.

[0033] 2. Enhance the test stability: Using an integrated cylinder as the power source, combined with a precision slide rail and slider mechanism, and the precise control of the solenoid valve, it realizes the rapid and stable up and down movement of the test probe, reduces the vibration and false touch during the test, makes the test action more stable and reliable, is suitable for batch and efficient testing while ensuring the test quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] Figure 1 is the perspective view of the present utility model;

[0035] Figure 2 is the exploded view of the present utility model;

[0036] Figure 3 is the perspective view of the probe of the present utility model;

[0037] Figure 4 is the perspective view of the third support plate of the present utility model.

[0038] In the figure:

[0039] 1. Probe; 2. First fixing block; 3. First slider; 4. First slide rail; 5. Second slide rail;

[0040] 6. Installation back plate;

[0041] 7. Solenoid valve;

[0042] 8. Air inlet interface;

[0043] 9. First support plate; 10. Second support plate; 11. Third support plate;

[0044] 12. First through slot;

[0045] 13. Oblique through hole;

[0046] 14. First groove;

[0047] 15. Controller;

[0048] 16. Network interface; 17. First cylinder; 18. Chip component to be detected. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0049] The present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It can be understood that the specific embodiments described herein are only used to explain the present utility model, rather than limiting the present utility model. In addition, it should be noted that for the convenience of description, only the parts related to the present utility model rather than all the structures are shown in the drawings.

[0050] In the description of the present utility model, unless otherwise clearly defined and limited, the terms "connected", "connected to", and "fixed" shall be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or integrated; it can be a mechanical connection or an electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, and it can be the communication inside two elements or the interaction relationship between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific situations.

[0051] In the present utility model, unless otherwise clearly defined and limited, the first feature being "above" or "below" the second feature may include the direct contact between the first and second features, or may include the situation where the first and second features are not in direct contact but in contact through other features therebetween. Moreover, the first feature being "above", "over", and "on" the second feature includes that the first feature is directly above and obliquely above the second feature, or simply means that the horizontal height of the first feature is higher than that of the second feature. The first feature being "below", "under", and "beneath" the second feature includes that the first feature is directly below and obliquely below the second feature, or simply means that the horizontal height of the first feature is lower than that of the second feature.

[0052] In the description of this embodiment, the orientation or positional relationships such as "above", "below", "front", "rear", "left", and "right" are based on the orientation or positional relationships shown in the drawings, and are only for the convenience of description and simplifying the operation, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation to the present utility model. In addition, the terms "first" and "second" are only used for distinction in description and have no special meanings.

[0053] Combined with Figures 1 - 4 As shown, the present utility model provides a test structure for testing the performance of a chip multi-terminal component, including:

[0054] A supporting component for supporting the chip component 18 to be detected;

[0055] A probe component disposed below the supporting component for performing performance testing on the chip component 18 to be detected;

[0056] The power assembly includes a first cylinder 17, which is arranged below the probe assembly and is used to drive the probe assembly to move up and down to contact or move away from the chip component 18 to be detected.

[0057] The probe assembly includes a set of probes 1, a first fixing block 2, a first slider 3, a first slide rail 4, and a second slide rail 5;

[0058] The first slide rail 4 and the second slide rail 5 are arranged side by side in the vertical direction on an installation backplane 6;

[0059] The first slider 3 is slidably installed on the first slide rail 4 and the second slide rail 5;

[0060] A first fixing block 2 is arranged on the first slider 3 for installing a set of probes 1;

[0061] Each set of probes 1 is composed of several probes 1.

[0062] The set of probes 1 is composed of two or three probes 1, and the number of probes 1 is determined according to the number of terminals to be detected of the chip component 18 to be detected;

[0063] The distance between the probes 1 gradually decreases from bottom to top.

[0064] The first cylinder 17 is installed at the lower left end of the installation backplane 6;

[0065] The telescopic rod of the first cylinder 17 is connected to the left side of the first slider 3 and is used to drive the first slider 3 to move up and down, so as to drive the set of probes 1 installed on the first fixing block 2 to move up and down.

[0066] An electromagnetic valve 7 is also installed at the lower right end of the installation backplane 6, and the electromagnetic valve 7 is connected to the first cylinder 17 to control the telescopic movement of the telescopic rod of the first cylinder 17;

[0067] An air inlet interface 8 is arranged at the lower end of the electromagnetic valve 7.

[0068] The supporting assembly includes: a first support plate 9, a second support plate 10, and a third support plate 11;

[0069] The second support plate 10 is provided with a first through groove 12 penetrating up and down, and the third support plate 11 is embedded in the first through groove 12;

[0070] The second support plate 10 is arranged on the first support plate 9;

[0071] Oblique through holes 13 corresponding to the number and positions of the probes 1 are arranged on the third support plate 11;

[0072] A first groove 14 is provided at a position on the first pallet 9 corresponding to the inclined through hole 13 for the probe 1 to pass through.

[0073] A controller 15 is further provided in the middle at the lower end of the mounting backplane 6. The controller 15 is connected to the solenoid valve 7 and is used to control the start and stop of the solenoid valve 7.

[0074] A network interface 16 is further provided at the lower end of the controller 15 for network communication.

[0075] The principle of the present utility model is as follows:

[0076] Initialization and setting: First, place the multi-terminal chip component to be tested on the supporting assembly, which is composed of a first pallet 9, a second pallet 10 (with a first through slot 12), and a third pallet 11 embedded in the first through slot 12. The inclined through hole 13 on the third pallet 11 is aligned with the probe assembly to ensure that the probe 1 can accurately pass through the first groove 14 on the first pallet 9 to contact the terminals of the component.

[0077] Probe assembly preparation: The probe assembly includes components such as a set of probes 1, a first fixing block 2, and a first slider 3. These components are installed on the first slide rail 4 and the second slide rail 5, and the slide rail system is fixed to the mounting backplane 6. The set of probes 1 is configured according to the number of terminals of the component to be tested (for example, two or three probes 1), and the distance between the lower ends of the probes 1 is designed to be larger than that of the upper ends to better adapt to the terminal layout of the component.

[0078] Power drive and control: The core of the power assembly is the integral first cylinder 17, which is installed at the lower left end of the mounting backplane 6 and is connected to the left side of the first slider 3 through its telescopic rod. The telescopic movement of the cylinder is controlled by the solenoid valve 7, and the solenoid valve 7 is regulated by the instructions of the controller 15 installed in the middle at the lower end of the backplane. The controller 15 can not only manually control the start and stop of the solenoid valve 7 but also achieve remote control and data transmission through the network interface 16, greatly improving the flexibility and intelligence of the operation.

[0079] Test execution: When the test starts, the controller 15 sends a signal to the solenoid valve 7, and the solenoid valve 7 opens, allowing compressed gas to enter the first cylinder 17, driving the telescopic rod of the cylinder to move upward, driving the entire probe assembly upward through the first slider 3, so that the probe 1 accurately contacts the corresponding terminals of the chip component for electrical performance testing. After the test is completed, the cylinder moves in the reverse direction, the probe assembly descends, and the component can be removed or replaced.

[0080] Stability and Precision Assurance: The system replaces traditional mechanical motion with pneumatic drive, significantly improving the stability and precision of the test. The precise positioning and flexible adjustment capabilities of the probe 1, combined with the precise control of the controller 15, ensure efficient and accurate testing of multi-terminal chip components, solving problems such as unstable contact and low precision existing in traditional testing methods.

[0081] The above are only the preferred embodiments of the present utility model, and thus do not limit the scope of the present utility model. Any equivalent structural transformation made under the inventive concept of the present utility model by using the content of the specification and drawings of the present utility model, or any direct / indirect application in other related technical fields is included in the protection scope of the present utility model.

Claims

1. A test structure for performance testing of chip-type multi-terminal components, characterized in that: include: A supporting assembly, used for supporting the chip components to be tested; The probe assembly is arranged below the supporting assembly and is used to perform performance testing on the chip components to be tested; The power assembly includes a first cylinder, which is arranged below the measuring needle assembly and is used to drive the measuring needle assembly to move up and down to contact or stay away from the chip component to be detected.

2. The test structure for chip-type multi-terminal component performance testing according to claim 1, characterized in that: The measuring needle assembly comprises a measuring needle group, a first fixed block, a first sliding block, a first sliding rail, and a second sliding rail; The first slide rail and the second slide rail are arranged side by side on a mounting back plate in the up-down direction; The first sliding block is slidably mounted on the first sliding rail and the second sliding rail; The first slider is provided with a first fixing block for mounting a measuring needle assembly; Each probe group consists of several probes.

3. The test structure for chip-type multi-terminal component performance testing according to claim 2, characterized in that: The probe group is composed of two or three probes, and the number of probes is determined according to the number of terminals to be tested of the chip component to be tested; The distances between the measuring pins gradually decrease from bottom to top.

4. The test structure for chip-type multi-terminal component performance testing according to claim 3, characterized in that: The first cylinder is mounted on the lower left end of the mounting back plate; The telescopic rod of the first cylinder is connected to the left side of the first sliding block, and is used to drive the first sliding block to move up and down, thereby driving the measuring needle group installed on the first fixed block to move up and down.

5. The test structure for chip-type multi-terminal component performance test according to claim 4, characterized in that: A solenoid valve is also installed at the lower right end of the mounting back plate, and the solenoid valve is connected to the first cylinder to control the telescopic action of the telescopic rod of the first cylinder; An air inlet interface is arranged at the lower end of the solenoid valve.

6. The test structure for chip-type multi-terminal component performance testing according to claim 2, characterized in that: The supporting assembly includes: a first supporting plate, a second supporting plate, and a third supporting plate; The second support plate is provided with a first through slot which runs through the second support plate from top to bottom, and the third support plate is embedded in the first through slot; The second support plate is arranged on the first support plate; The third support plate is provided with oblique through holes corresponding to the number and positions of the measuring needles; A first groove is provided on the first supporting plate at a position corresponding to the oblique through hole for the measuring needle to pass through.

7. The test structure for chip-type multi-terminal component performance test according to claim 5, characterized in that: A controller is also provided in the middle of the lower end of the mounting back plate, and the controller is connected to the solenoid valve and is used to control the start and stop of the solenoid valve.

8. The test structure for chip-type multi-terminal component performance test according to claim 7, characterized in that: The lower end of the controller is also provided with a network interface for network communication.

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