Test adjusting device of turret type sorting machine and turret type sorting machine

Abstract

The utility model relates to the field of chip processing equipment, in particular to a test adjusting device of a turret type sorting machine and the turret type sorting machine. The test adjusting device comprises a supporting seat, a circuit board and a test board, the upper end face of the supporting seat is horizontally arranged, the circuit board is fixed to the upper end face of the supporting seat, the test board is fixed to the circuit board, a positioning groove for positioning a chip is formed in the test board, and a guide pin is arranged in the positioning groove and used for conducting the chip and the circuit board. The test board is arranged on the circuit board to position the chip, so that a clamping mechanism in the prior art does not need to be adopted to clamp and position the chip, the structure and the operation process are simplified, meanwhile, the circuit board and the test board can be kept in a horizontal state through the supporting seat, leveling correction of the chip is facilitated, and the test precision is improved.

Description

Technical Field

[0001] The present application relates to the field of chip processing equipment, and in particular to a test adjustment device and a turret sorter for a turret sorter. Background Art

[0002] With the continuous development of semiconductor manufacturing and detection technologies, test sorters are widely used in the detection process of semiconductor devices to conduct quality tests on semiconductor packaged chips (ICs) and sort out qualified and unqualified finished products. Existing test sorters mainly include a turret and a test component. An adsorption mechanism is provided on the turret, and the adsorption mechanism is used to adsorb chips. The test component includes a plurality of test adjustment seats, and a circuit board is installed on the test adjustment seat. The turret rotates to drive the adsorption mechanism to rotate, so that the adsorption mechanism places the chips on the circuit boards at different workstations. A plurality of adsorption mechanisms are also provided to test multiple chips at one time. In the existing structure, the circuit board cannot directly position the chips. During chip testing, a clamping mechanism needs to be set to clamp the chips placed on the circuit board to adjust the positions of the chips in order to improve the test accuracy. However, this method requires the clamping mechanism to be loosened when the chips are taken out after testing, and the operation is not simple enough. In addition, due to the limited contact area between the test adjustment seat and the circuit board, both ends of the circuit board are suspended on the test adjustment seat, resulting in inaccurate adjustment and calibration of the chips and affecting the test accuracy. Summary of the Utility Model

[0003] In order to solve the problems of inconvenient chip adjustment and calibration and inconvenient operation for taking out chips after chip testing, the present application provides a test adjustment device and a turret sorter for a turret sorter.

[0004] In a first aspect, a test adjustment device for a turret sorter provided by the present application adopts the following technical solutions:

[0005] A test adjustment device for a turret sorter includes a support seat, a circuit board, and a test board. The upper end surface of the support seat is horizontally arranged. The circuit board is fixed on the upper end surface of the support seat. The test board is fixed on the circuit board. A positioning groove for positioning chips is provided on the test board, and guide pins are arranged in the positioning groove. The guide pins are used to conduct electricity between the chips and the circuit board.

[0006] By adopting the above technical solutions, a test board is provided on the circuit board to position the chips, so that there is no need to use a clamping mechanism in the prior art to clamp and position the chips, which simplifies the structure and operation process. Since one end of the circuit board is installed on the test adjustment seat through the support seat, and the contact area between the circuit board and the support seat is reasonably controlled, even if the other end of the circuit board is suspended, the circuit board can still be stably supported on the support seat. And through the horizontal treatment of the support seat, the circuit board and the test board are kept in a horizontal state, which is beneficial to the leveling and calibration of the chips, thereby improving the test accuracy.

[0007] Preferably, an avoidance groove is provided on the upper end surface of the support base, and the test board is located above the avoidance groove.

[0008] By adopting the above technical solution, the setting of the avoidance groove can reduce the interference to chip testing during detection.

[0009] Preferably, the periphery of the test board is connected to the circuit board through fastening bolts, and the tail ends of the fastening bolts sequentially pass through the test board, the circuit board and are located in the avoidance groove.

[0010] By adopting the above technical solution, since nuts are required when fastening the test board and the circuit board with the fastening bolts, and a certain operating space is required for screwing the nuts, the operation of the nuts can be carried out in the avoidance groove.

[0011] Preferably, an insulating pad that can contact the tail end of the fastening bolt is provided at the bottom of the avoidance groove.

[0012] By adopting the above technical solution, through the setting of the insulating pad, it is ensured that there is a certain supporting force between the locking bolt and the bottom of the groove, thereby playing a supporting role for the test board.

[0013] Preferably, the periphery of the bottom of the positioning groove is connected to the circuit board through reinforcing screws.

[0014] By adopting the above technical solution, the fastening bolt and the reinforcing screw constitute double fastening, strengthening the stability of the fixation of the test board.

[0015] Preferably, the circuit board is connected to the support base through locking screws.

[0016] By adopting the above technical solution, the detachable manner of the locking screws ensures that the circuit board can be replaced.

[0017] Preferably, a wiring terminal is provided at one end of the circuit board away from the support base.

[0018] By adopting the above technical solution, the connection between the circuit board and the external circuit is realized through the wiring terminals.

[0019] In a second aspect, a turret type sorter provided by the present application adopts the following technical solution:

[0020] A turret type sorter includes a turret, an adsorption mechanism and a test adjustment base. The adsorption mechanism is installed on the turret. A plurality of the adsorption mechanisms and test adjustment bases are provided. The test adjustment base is located below the adsorption mechanism. The turret type sorter further includes the above test adjustment device. A plurality of the support bases are provided and correspond to the number of test adjustment bases. The support bases are installed on the corresponding test adjustment bases.

[0021] By adopting the above technical solutions, the turret sorter adopts the above test adjustment device, simplifies the process of picking and placing chips, and improves the test accuracy.

[0022] In summary, the present application includes at least one of the following beneficial technical effects:

[0023] 1. By setting a test board on the circuit board to position the chip, there is no need to use the clamping mechanism in the prior art to clamp and position the chip, which simplifies the structure and operation process.

[0024] 2. Reasonably control the contact area between the circuit board and the support base. Even if the other end of the circuit board is suspended, the circuit board can still be stably supported on the support base. And through the horizontal treatment of the support base, the circuit board and the test board are kept in a horizontal state, which is beneficial to the leveling and calibration of the chip, thereby improving the test accuracy.

[0025] 3. The setting of the clearance groove on the support base reduces the interference with the chip test during detection on the one hand, and on the other hand, provides a certain operating space for the nut of the fastening bolt for fastening the test board and the circuit board. Description of the Drawings

[0026] Figure 1 is a schematic structural diagram of the test adjustment device according to Embodiment 1 of the present application.

[0027] Figure 2 is a schematic structural diagram of the test adjustment device according to Embodiment 1 of the present application applied to a turret sorter.

[0028] Figure 3 is a schematic structural diagram of the turret sorter according to Embodiment 2 of the present application.

[0029] Description of the reference numerals: 1. Support base; 11. Clearance groove; 2. Circuit board; 3. Test board; 31. Positioning groove; 4. Guide pin; 51. Fastening bolt; 52. Reinforcing screw; 53. Locking screw; 6. Wiring terminal; 7. Turret; 8. Adsorption mechanism; 9. Test adjustment seat. Detailed Description of the Embodiment

[0030] The following further Figures 1-3 describes the present application in detail with reference to the attached

[0031] The orientation words such as "upper", "lower", "left", "right", "front", and "rear" in the present application only represent the relative positions in the drawings, which are for the convenience of describing the present application and do not represent the absolute positions of the products, and should not be construed as limitations on the present application.

[0032] Embodiment 1

[0033] As Figure 1As shown in the figure, an embodiment of the present application discloses a test adjustment device for a turret sorter. The test adjustment device of the turret sorter includes a support base 1, a circuit board 2, and a test board 3. The circuit board 2 is fixed on the upper end surface of the support base 1. The upper end surface of the support base 1 is horizontally arranged to ensure that the circuit board 2 is in a horizontal state. The test board 3 is fixed on the circuit board 2. A positioning groove 31 is provided on the test board 3. The positioning groove 31 matches the shape of the chip. Guide pins 4 are provided in the positioning groove 31. The guide pins 4 are used to conduct the chip and the circuit board 2.

[0034] As Figure 2 shown in the figure, during use, the support base 1 is fixedly connected to the test adjustment base 9 of the turret sorter. The chip is moved to the test board 3 through the adsorption mechanism 8, and then placed into the positioning groove 31. The chip is positioned in the positioning groove 31. At this time, the lower end of the guide pin 4 contacts the circuit board, and the upper end abuts against the chip, so as to realize the conduction between the chip and the circuit board 2. The circuit board 2 is used to provide the voltage and signals required by the chip, and then the test is carried out. After the test is completed, the chip can be directly adsorbed and taken away by the adsorption mechanism 8. By setting the test board 3 on the circuit board 2 to position the chip, there is no need to use the clamping mechanism in the prior art to clamp and position the chip, which simplifies the structure and operation process. At the same time, since one end of the circuit board 2 is installed on the test adjustment base through the support base 1, and the contact area between the circuit board 2 and the support base 1 is reasonably controlled, even if the other end of the circuit board 2 is suspended, the circuit board 2 can still be stably supported on the support base 1. And through the horizontal treatment of the support base 1, the circuit board 2 and the test board are kept in a horizontal state, which is beneficial to the leveling and calibration of the chip, thereby improving the test accuracy.

[0035] In addition, when testing different chip models, only the circuit board 2 and the test board 3 need to be replaced.

[0036] In this embodiment, an avoidance groove 11 is provided on the upper end surface of the support base 1. The test board 3 is located above the avoidance groove 11 and within the area of the avoidance groove 11. The four sides of the test board 3 are connected to the circuit board 2 through fastening bolts 51. The tail ends of the fastening bolts 51 pass through the test board 3 and the circuit board 2 in sequence and are located in the avoidance groove 11. The setting of the avoidance groove 11 reduces the interference to the chip test during detection on the one hand. On the other hand, since nuts are required when tightening the test board 3 and the circuit board 2 with the fastening bolts 51, and a certain operating space is required for the screwing of the nuts, the operation of the nuts can be carried out in the avoidance groove 11.

[0037] In this embodiment, in order to improve the stability of the test board, the fastening bolts 51 are set as long bolts, and can preferably abut against the bottom of the avoidance groove, so as to support the test board 3. An insulating pad (not shown in the figure) that can contact the tail end of the fastening bolt 51 is provided at the bottom of the avoidance groove 11. Through the setting of the insulating pad, it is ensured that there is a certain supporting force between the fastening bolt 51 and the bottom of the groove.

[0038] In this embodiment, in order to enhance the stability of the test board fixation, the four sides of the bottom of the positioning groove 31 are connected to the circuit board 2 through reinforcement screws 52. The periphery of the test board 3 is provided with fastening bolts 51, and the inside is provided with reinforcement screws 52. The fastening bolts 51 and the reinforcement screws 52 constitute double fastening.

[0039] In this embodiment, the circuit board 2 is connected to the support base 1 through locking screws 53. One end of the circuit board 2 away from the support base 1 is provided with a wiring terminal 6. The wiring terminal 6 is snap-connected to the circuit board 2, and the wiring terminal is used for connecting to external wires.

[0040] Embodiment 2

[0041] As Figure 3 shown, an embodiment of the present application discloses a turret sorter, which includes a turret 7, an adsorption mechanism 8, and a test adjustment base 9. The adsorption mechanism 8 is installed on the turret 7. A plurality of adsorption mechanisms 8 and test adjustment bases 9 are provided, and the test adjustment base 9 is located below the adsorption mechanism 8.

[0042] This turret sorter further includes the test adjustment device of Embodiment 1. A plurality of support bases 1 are provided and correspond to the number of test adjustment bases 9. The support bases 1 are installed on the corresponding test adjustment bases 9.

[0043] The implementation principle of the turret sorter in this embodiment is as follows:

[0044] Install the support base 1 on the corresponding test adjustment base 9. Adjust the distance between the test board 3 and the adsorption mechanism 8 through the test adjustment base 9. The turret 7 rotates, driving the adsorption mechanism to rotate. The adsorption mechanism sucks the chip from the loading position, moves to the corresponding test adjustment base 9, places the chip in the positioning groove 31 on the test board 3. After the guide pins 4 conduct the chip and the circuit board 2, connect to the external wire through the wiring terminal, and then perform the test work. After the test is completed, the adsorption mechanism 8 removes the chip and moves it to the working position of the next process. Since the circuit board 2 itself may have a built-in power supply or signal generation circuit for providing the voltage and signal required by the chip, the test voltages required by different chips may be the same or different. Therefore, when testing different chips, it is necessary to replace the circuit board 2 and the test board 3 corresponding to the chip.

[0045] The above are all the preferred embodiments of the present application. The protection scope of the present application is not limited by this. Therefore, all equivalent changes made according to the structure, shape, and principle of the present application should be covered within the protection scope of the present application.

Claims

1. A test and adjustment device for a turret type sorting machine, characterized in that: The invention comprises a support seat (1), a circuit board (2) and a test board (3); the upper end surface of the support seat (1) is arranged horizontally; the circuit board (2) is fixed on the upper end surface of the support seat (1); the test board (3) is fixed on the circuit board (2); a positioning groove (31) for positioning a chip is provided on the test board (3); a guide pin (4) is provided in the positioning groove (31); the guide pin (4) is used for conducting the chip and the circuit board (2).

2. The testing and adjusting device of the turret type sorting machine according to claim 1, characterized in that: The upper end surface of the support seat (1) is provided with a void avoidance groove (11), and the test plate (3) is located above the void avoidance groove (11).

3. The testing and adjusting device of the turret type sorting machine according to claim 2, characterized in that: The test board (3) is connected to the circuit board (2) via fastening bolts (51) on all sides, and the tail ends of the fastening bolts (51) pass through the test board (3) and the circuit board (2) in sequence and are located in the air avoidance groove (11).

4. The testing and adjusting device of the turret type sorting machine according to claim 3, characterized in that: An insulating pad capable of contacting the tail end of the fastening bolt (51) is provided at the bottom of the avoidance groove (11).

5. The testing and adjusting device of a turret type sorting machine according to any one of claims 1 to 4, characterized in that: The four sides of the bottom of the positioning groove (31) are connected to the circuit board (2) via reinforcing screws (52).

6. The testing and adjusting device of a turret type sorting machine according to any one of claims 1 to 4, characterized in that: The circuit board (2) is connected to the support base (1) via a locking screw (53).

7. The testing and adjusting device of a turret type separator according to any one of claims 1 to 4, characterized in that: A connection terminal (6) is provided at one end of the circuit board (2) away from the support seat (1).

8. A turret type sorting machine, comprising a turret (7), an adsorption mechanism (8) and a test adjustment seat (9), wherein the adsorption mechanism (8) is mounted on the turret (7), a plurality of the adsorption mechanism (8) and the test adjustment seat (9) are provided, and the test adjustment seat (9) is located below the adsorption mechanism (8), characterized in that: The turret sorting machine further comprises the test adjustment device according to any one of claims 1 to 7, wherein a plurality of the support seats (1) are provided and the number corresponds to the number of the test adjustment seats (9), and the support seats (1) are mounted on the corresponding test adjustment seats (9).

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