Insulation isolation semiconductor device

Abstract

The utility model relates to an insulated isolation semiconductor device, which belongs to the technical field of semiconductors and comprises a lower shell, a protective structure for protecting a semiconductor is arranged on the upper side of the lower shell, and a clamping structure clamped with the protective structure is arranged at the right end of the upper side of the lower shell. The protection structure comprises two linear sliding rails fixedly connected to the upper side of the inner wall of the lower shell, an upper shell slidably connected between the two linear sliding rails, and a through hole formed in the right side surface of the upper shell. The clamping structure comprises a fixing plate fixedly connected to the right end of the upper side of the lower shell, a spring fixedly connected to the side, close to the upper shell, of the fixing plate, and a clamping rod arranged on the inner wall of the spring in a sleeving mode. According to the insulated isolation semiconductor device, when the upper shell is clamped into the lower shell, the clamping rods are clamped into the through holes under the elastic action of the springs, so that the lower shell and the upper shell are clamped and fixed, later disassembly is facilitated, and the semiconductor is convenient to take.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductors, and particularly relates to an insulated isolation semiconductor device. Background Art

[0002] Silicon-on-insulator includes a semiconductor layer and an insulating layer located below the semiconductor layer. The insulating layer can be a buried oxide layer in a single-crystalline silicon substrate. Semiconductor devices formed in silicon-on-insulator include transistors, diodes, etc., and an active region for forming semiconductor devices is formed in the semiconductor. Further, the insulating layer is used to isolate the semiconductor active region, so that leakage current of the semiconductor substrate and related parasitic capacitance can be suppressed. The semiconductor device can obtain advantages such as high speed, low power consumption, and high reliability.

[0003] After retrieval, the prior art with the publication number CN218241813U discloses a fully encapsulated inner-insulated semiconductor device, including a semiconductor body and a packaging shell. The semiconductor body is protected by the packaging shell to avoid the problem of leakage and short circuit caused by the damage of the outer insulating layer. The packaging shell includes a lower shell and an upper shell, and the upper shell and the lower shell are fixedly connected by bolts, which is easy to disassemble after installation, convenient for maintenance and replacement, and saves the maintenance cost of the semiconductor body. The utility model uses a protection component arranged between the packaging shell and the pins, which is convenient to protect the connection between the pins of the semiconductor body and the packaging shell through the protection component. The lower U-shaped protective sleeve and the upper U-shaped protective sleeve are clamped to fix the elastic rubber pad and the insulating rubber ring, and the pins of the semiconductor body are protected by the elastic rubber pad and the insulating rubber ring. At the same time, it can prevent external dust or gas from eroding the packaging shell and its internal components through this connection, increasing the service life of the device.

[0004] However, for the insulating semiconductor device of this utility model, multiple bolts are required for fixed connection between the upper shell and the lower shell, which is not convenient enough for later disassembly, resulting in difficulty in taking out the semiconductor placed in the shell. Therefore, an insulated isolation semiconductor device is proposed to solve the problems raised above. Summary of the Utility Model

[0005] Aiming at the deficiencies of the prior art, the utility model provides an insulated isolation semiconductor device, which has the advantages of convenient taking, etc., and solves the problem that multiple bolts are required for fixed connection between the upper shell and the lower shell of the insulating semiconductor device, which is not convenient enough for later disassembly, resulting in difficulty in taking out the semiconductor placed in the shell.

[0006] To achieve the above object, the utility model provides the following technical solution: An insulated isolation semiconductor device includes a lower shell, a protection structure for protecting the semiconductor is arranged on the upper side of the lower shell, and a clamping structure for clamping with the protection structure is arranged at the right end of the upper side of the lower shell;

[0007] The protection structure includes two linear sliding rails fixedly connected to the upper side of the inner wall of the lower shell, an upper shell slidably connected between the two linear sliding rails, and a through hole opened on the right side surface of the upper shell;

[0008] The clamping structure includes a fixing plate fixedly connected to the right end of the upper side of the lower shell, a spring fixedly connected to the side of the fixing plate close to the upper shell, and a clamping rod sleeved on the inner wall of the spring.

[0009] Furthermore, an insulating component for insulating the surface of the semiconductor is arranged on the surface of the inner wall of the lower shell. The insulating component includes a plurality of first insulating layers fixedly bonded to the surface of the inner wall of the lower shell, and the plurality of first insulating layers are arranged at equal intervals horizontally.

[0010] Furthermore, an output component for connecting the semiconductor is arranged on the left side of the lower shell. The output component includes two sleeves fixedly sleeved inside the left side of the lower shell and connecting pins sleeved on the inner walls of the sleeves.

[0011] Furthermore, a second insulating layer is bonded between the sleeve and the connecting pin, and a chute matching the upper shell is opened on the surface of the linear sliding rail.

[0012] Furthermore, a limiting hole for the upper shell to penetrate is opened inside the right side of the lower shell.

[0013] Furthermore, a storage groove for placing the semiconductor is opened on the surface of the lower shell.

[0014] Furthermore, the bottom of the first insulating layer and the lower shell are fixedly bonded and fixed by silicone rubber.

[0015] Furthermore, two heat dissipation grilles are inlaid on the upper side surface of the upper shell, and two heat conduction layers matching the heat dissipation grilles are inlaid on the lower side surface of the upper shell.

[0016] Compared with the prior art, the present utility model provides an insulated and isolated semiconductor device, which has the following beneficial effects:

[0017] 1. For this insulated and isolated semiconductor device, when the upper shell is snapped into the lower shell, the clamping rod cooperates with the elastic action of the spring to snap into the through hole, realizing the clamping and fixing of the lower shell and the upper shell, which is convenient for later disassembly and convenient for taking the semiconductor.

[0018] 2. For this insulated and isolated semiconductor device, the surface of the semiconductor is insulated by the first insulating layer, the insulation outside the connecting pin is ensured by the second insulating layer inside the sleeve, and the heat generated by the semiconductor is quickly discharged through the heat dissipation grille and the heat conduction layer on the surface of the upper shell, solving the problem that multiple bolts are required for fixed connection between the upper shell and the lower shell of the insulated semiconductor device, which is not convenient enough for later disassembly and makes it difficult to take the semiconductor placed in the shell. Description of the Drawings

[0019] Figure 1 This is a cross-sectional view of the structure of the present utility model;

[0020] Figure 2 This is a bottom view of the structure of the present utility model;

[0021] Figure 3 This is a top view of the structure of the present utility model;

[0022] Figure 4 This is a side view of the structure of the present utility model;

[0023] Figure 5 This is a three-dimensional view of the structure of the linear slide rail of the present utility model;

[0024] Figure 6 This is a three-dimensional view of the structure of the sleeve of the present utility model.

[0025] In the figure: 1 lower shell, 2 sleeve, 3 connecting pin, 4 linear slide rail, 5 upper shell, 6 heat dissipation grille, 7 through hole, 8 first insulating layer, 9 heat conducting layer, 10 fixing plate, 11 clamping rod, 12 spring, 13 sliding groove, 14 second insulating layer, 15 limiting hole. Specific embodiments

[0026] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all of the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present utility model.

[0027] Embodiment 1:

[0028] Please refer to Figure 1-6 , an insulating isolation semiconductor device in this embodiment includes a lower shell 1, a protection structure for protecting the semiconductor is arranged on the upper side of the lower shell 1, and a clamping structure for clamping with the protection structure is arranged at the right end of the upper side of the lower shell 1. The protection structure includes two linear slide rails 4 fixedly connected to the upper side of the inner wall of the lower shell 1, an upper shell 5 slidably connected between the two linear slide rails 4, and a through hole 7 opened on the right side surface of the upper shell 5. The clamping structure includes a fixing plate 10 fixedly connected to the right end of the upper side of the lower shell 1, a spring 12 fixedly connected to the side of the fixing plate 10 close to the upper shell 5, and a clamping rod 11 sleeved on the inner wall of the spring 12.

[0029] Among them, an insulating component for insulating the surface of the semiconductor is provided on the inner wall surface of the lower shell 1. The insulating component includes a plurality of first insulating layers 8 fixedly adhered to the inner wall surface of the lower shell 1. The plurality of first insulating layers 8 are arranged at equal intervals horizontally. An output component for connecting the semiconductor is provided on the left side of the lower shell 1. The output component includes two sleeves 2 fixedly sleeved inside the left side of the lower shell 1 and connection pins 3 sleeved on the inner wall of the sleeves 2. A second insulating layer 14 is adhered between the sleeve 2 and the connection pin 3. A chute 13 matching the upper shell 5 is provided on the surface of the linear slide rail 4. A limiting hole 15 for the upper shell 5 to penetrate is provided inside the right side of the lower shell 1. A storage groove for placing the semiconductor is provided on the surface of the lower shell 1. The bottom of the first insulating layer 8 and the lower shell 1 are fixedly bonded by silicone rubber.

[0030] Embodiment 2:

[0031] Please refer to Figure 1-3 , on the basis of Embodiment 1, it includes two heat dissipation grilles 6 embedded on the upper surface of the upper shell 5, and two heat conduction layers 9 matching the heat dissipation grilles 6 are embedded on the lower surface of the upper shell 5.

[0032] Adopting the above technical solution, when heat energy is generated by the semiconductor inside the lower shell 1, the heat energy will be absorbed by the heat conduction layer 9 and discharged to the heat dissipation grille 6 and then discharged, reducing the heat energy inside the lower shell 1. The heat conduction layer 9 is alumina ceramic, which has good heat conductivity by itself and also has a certain insulating effect.

[0033] The working principle of the above embodiment is as follows:

[0034] The semiconductor is placed on the upper side of the first insulating layer 8 inside the lower shell 1 and is electrically connected to the output end of the connection pin 3. The upper shell 5 is inserted into the limiting hole 15 opened on the right side of the lower shell 1, and the opposite side surface of the upper shell 5 slides in the linear slide rail 4 and moves towards one side of the lower shell 1. The through hole 7 opened on the upper shell 5 moves to the lower side of the fixing plate 10. The spring 12 rebounds to drive the lower end of the locking rod 11 to penetrate through the through hole 7 and extend to the outside to limit and fix the upper shell 5 on the upper side of the lower shell 1. During the operation of the semiconductor, the first insulating layer 8 plays a certain insulating role on the surface of the semiconductor, and the second insulating layer 14 on the inner wall of the sleeve 2 insulates the outside of the connection pin 3. At the same time, the heat energy generated inside the lower shell 1 will be absorbed by the heat conduction layer 9 and transferred to the heat dissipation grille 6 for discharge, effectively reducing the residual heat energy inside the lower shell 1. When it is necessary to separate the lower shell 1 and the upper shell 5, pull the locking rod 11 upward and separate it from the through hole 7 to cancel the limitation on the upper shell 5, and then the upper shell 5 can be pulled to separate from the upper side of the lower shell 1.

[0035] The electrical components mentioned in the text are all electrically connected to the main controller and the power supply. The main controller can be a conventional known device such as a computer for control, and the existing publicly known power connection technology is not described in detail in the text.

[0036] It should be noted that in this text, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the term "comprising", "including" or any other variant thereof is intended to cover non-exclusive inclusion, so that a process, method, article or device comprising a series of elements not only includes those elements but also includes other elements not expressly listed, or further includes elements inherent to such process, method, article or device. Without further limitation, an element defined by the statement "comprising an..." does not exclude the presence of additional identical elements in the process, method, article or device comprising said element.

[0037] Although the embodiments of the present utility model have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principle and spirit of the present utility model. The scope of the present utility model is defined by the appended claims and their equivalents.

Claims

1. An insulating isolation semiconductor device, characterized in that: It comprises a lower shell (1), wherein a protective structure for protecting semiconductors is arranged on the upper side of the lower shell (1), and a clamping structure for clamping with the protective structure is arranged on the upper right end of the lower shell (1); The protective structure comprises two linear slide rails (4) fixedly connected to the upper side of the inner wall of the lower shell (1), an upper shell (5) slidably connected between the two linear slide rails (4), and a through hole (7) opened on the right side surface of the upper shell (5); The clamping structure comprises a fixing plate (10) fixedly connected to the upper right end of the lower shell (1), a spring (12) fixedly connected to the fixing plate (10) on a side close to the upper shell (5), and a clamping rod (11) sleeved on the inner wall of the spring (12).

2. The insulating isolation semiconductor device according to claim 1, characterized in that: The inner wall surface of the lower shell (1) is provided with an insulating component for insulating the semiconductor surface, and the insulating component comprises a plurality of first insulating layers (8) fixedly bonded to the inner wall surface of the lower shell (1), and the plurality of first insulating layers (8) are arranged in a lateral and equidistant manner.

3. The insulating isolation semiconductor device according to claim 1, characterized in that: An output component for connecting a semiconductor is arranged on the left side of the lower shell (1), and the output component comprises two sleeves (2) fixedly sleeved inside the left side of the lower shell (1) and connecting pins (3) sleeved on the inner wall of the sleeves (2).

4. The insulating isolation semiconductor device according to claim 3, characterized in that: A second insulating layer (14) is bonded between the sleeve (2) and the connecting pin (3), and a sliding groove (13) matching the upper shell (5) is provided on the surface of the linear slide rail (4).

5. The insulating isolation semiconductor device according to claim 1, characterized in that: A limiting hole (15) for the upper shell (5) to pass through is provided inside the right side of the lower shell (1).

6. The insulating isolation semiconductor device according to claim 1, characterized in that: The surface of the lower shell (1) is provided with a receiving groove for placing the semiconductor.

7. The insulating isolation semiconductor device according to claim 2, characterized in that: The bottom of the first insulating layer (8) is bonded and fixed to the lower shell (1) by using silicone rubber.

8. The insulating isolation semiconductor device according to claim 1, characterized in that: The upper surface of the upper shell (5) is inlaid with two heat dissipation grilles (6), and the lower surface of the upper shell (5) is inlaid with two heat-conducting layers (9) that match the heat dissipation grilles (6).

Images