Photosensitive module and vehicle-mounted camera

Abstract

The photosensitive module comprises a metal shell, a photosensitive circuit board, a shielding cover and a heat conduction piece, and the photosensitive circuit board comprises a circuit substrate contained in the metal shell and a processing chip installed on the side, facing the bottom wall of the metal shell, of the circuit substrate. The shielding cover surrounds the processing chip and extends from the circuit substrate to the bottom wall of the metal shell to form a shielding space for accommodating the processing chip, the heat conduction piece is located between the processing chip and the bottom wall of the metal shell, and the two ends of the heat conduction piece are in heat transfer connection with the processing chip and the bottom wall of the metal shell respectively. High-configuration signals are isolated through cooperation of the shielding cover and the metal shell, signal interference on the processing chip located in the shielding space is avoided, meanwhile, the heat conduction piece is directly connected with the processing chip and the metal shell in a heat transfer mode, and the heat dissipation efficiency is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of vehicle-mounted photosensitive modules, in particular to a photosensitive module and a vehicle-mounted camera. Background Art

[0002] With the update and iteration of autonomous driving technology, more and more cameras are used in vehicles. However, as the pixel of the camera becomes higher and the volume becomes smaller, the requirements for electromagnetic shielding and heat dissipation of the photosensitive chip become more and more stringent.

[0003] Traditional cameras generally adopt a shielding cover structure for electromagnetic shielding. However, after using the shielding cover, the heat of the internal chip is not easily dissipated, and thermal conductive adhesives need to be used both inside and outside the shielding cover, which is cumbersome to operate, has a high defective rate, and has a poor heat dissipation effect. Summary of the Utility Model

[0004] Based on the technical solution of using double-layer thermal conductive adhesive and a shielding cover for bonding to achieve heat dissipation in the existing photosensitive module, which requires a relatively cumbersome production process, and has the deficiencies of high defective rate of products and poor heat dissipation effect, it is necessary to provide a photosensitive module and a vehicle-mounted camera.

[0005] A photosensitive module includes:

[0006] A metal shell;

[0007] A photosensitive circuit board, which includes a circuit substrate accommodated in the metal shell and a processing chip installed on one side of the circuit substrate facing the bottom wall of the metal shell;

[0008] A shielding cover, which surrounds the processing chip and extends from the circuit substrate to the bottom wall of the metal shell to enclose a shielding space for accommodating the processing chip; and

[0009] A heat conducting member, which is located between the processing chip and the bottom wall of the metal shell, and both ends of the heat conducting member are heat transfer connected to the processing chip and the bottom wall of the metal shell respectively.

[0010] With such a setting, the high-frequency signal is isolated by the cooperation of the shielding cover and the metal shell, avoiding signal interference to the processing chip located in the shielding space. At the same time, the heat conducting member is directly heat transfer connected to the processing chip and the metal shell, without the need to conduct heat through the shielding cover, reducing the heat transfer path, improving the heat dissipation efficiency, and also reducing the assembly cost, which is beneficial to improving the product yield.

[0011] In one embodiment, the shielding cover includes a cylindrical portion and an elastic portion extending inward or outward from the cylindrical portion, and the metal shell has a limiting step corresponding to the elastic portion for abutting.

[0012] With such a setting, by arranging a limiting step on the bottom wall of the metal shell to limit the end of the shielding cover, it is beneficial to reduce the shaking of the shielding cover and increase the overall structural stability of the photosensitive module.

[0013] In one embodiment, the cylindrical portion abuts against the bottom wall of the metal shell.

[0014] With such a setting, the internal structural strength of the photosensitive module is further improved, and the shielding effect on electromagnetic signals is also ensured.

[0015] In one embodiment, the elastic portion is a stamping part.

[0016] With such a setting, the elastic portion is integrally connected to the cylindrical portion, which can further reduce the production difficulty and facilitate mass production.

[0017] In one embodiment, the side of the elastic portion facing the limiting step is arc-shaped.

[0018] With such a setting, it is beneficial to reduce the scraping of the elastic portion against the limiting step, and at the same time, it can also guide the elastic portion to abut against the limiting step.

[0019] In one embodiment, the elastic portion extends obliquely from the cylindrical portion relative to the central axis of the cylindrical portion towards the circuit board.

[0020] With such a setting, it is beneficial to protect the elastic portion and improve the smoothness of the assembly of the shielding cover and the metal shell. When the shielding cover and the metal shell are subjected to an axial pulling force, the abutting end applies a resistance to the metal shell along its own extension direction to prevent the metal shell from accidentally detaching.

[0021] In one embodiment, the elastic portion extends from the inside of the cylindrical portion, the limiting step is located in the shielding space and extends from the bottom wall of the metal shell towards the processing chip, and the heat-conducting member is heat-conductively connected to the limiting step.

[0022] With such a setting, the setting of the limiting step shortens the heat transfer path of the thermal conductive adhesive, which is beneficial to improving the heat dissipation efficiency.

[0023] In one embodiment, the elastic portion extends from the outside of the cylindrical portion, a limiting groove is formed in the middle of the bottom wall of the metal shell to form the limiting step, and one end of the cylindrical portion close to the bottom wall of the metal shell is inserted into the limiting groove.

[0024] With such a setting, the limiting groove of the metal shell forms a limit for the shielding cover. In addition, the bottom wall at the limiting groove of the metal shell is thinner and the heat transfer path is shorter, so it is easier to conduct the heat of the processing chip through the heat-conducting member.

[0025] In one embodiment, the shielding cover is welded to a side of the circuit substrate facing the bottom wall of the metal shell.

[0026] With such arrangement, the shielding cover and the photosensitive circuit board can form a pre-assembled semi-finished product structure, which is helpful to simplify the assembly process.

[0027] In one embodiment, the circuit substrate is provided with a mounting groove, the shielding cover is passed through the mounting groove and is welded to a side of the circuit substrate away from the bottom wall of the metal shell.

[0028] Such a configuration is beneficial to increase the connection strength between the shielding cover and the circuit substrate. In addition, due to the opening of the installation groove, the shielding cover can be preferentially clamped and fixed with the metal shell. When the circuit board and the metal shell are fixed, the welding process is carried out. At this time, the shielding cover and the circuit board are both fixed to the metal shell and are not easy to shake, which is beneficial to improve the welding quality.

[0029] The present application also provides a vehicle-mounted camera, comprising:

[0030] Install the shell;

[0031] a lens assembly, the lens assembly being mounted on the mounting housing; and

[0032] As in the above-mentioned photosensitive module, the lens assembly is located in the photosensitive path of the photosensitive module, and the mounting shell is fixedly connected to the metal shell of the photosensitive module.

[0033] With such arrangement, the metal shell is also used to form the outer shell of the vehicle-mounted camera together with the mounting shell, which is beneficial to improving the structural strength of the vehicle-mounted camera. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] Figure 1 A schematic diagram of an exploded structure of a vehicle-mounted camera in an embodiment provided in the present application;

[0035] Figure 2 A cross-sectional view of a vehicle-mounted camera in an embodiment provided in the present application;

[0036] Figure 3 A cross-sectional view of a vehicle-mounted camera in another embodiment provided in the present application;

[0037] Figure 4 A schematic diagram of the structure of a shielding cover in an embodiment provided in the present application;

[0038] Figure 5 A schematic diagram of the structure of a shielding cover and a metal shell in an embodiment provided in the present application;

[0039] Figure 6 A schematic diagram of the structure of a shielding cover and a metal shell in another embodiment provided by the present application;

[0040] Figure 7 A schematic structural diagram of a shielding cover and a photosensitive circuit board in an embodiment provided for this application;

[0041] Figure 8 A schematic structural diagram of a shielding cover and a photosensitive circuit board in another embodiment provided for this application.

[0042] Reference numerals:

[0043] 101, shielding space; 10, metal shell; 11, limiting step; 12, limiting groove; 20, photosensitive circuit board; 21, circuit substrate; 211, mounting groove; 22, processing chip; 30, shielding cover; 301, opening groove; 31, cover cylinder part; 32, elastic part; 321, connection end; 322, abutting end; 40, heat conducting member; 50, mounting shell; 60, lens assembly. Detailed implementation manners

[0044] To make the above objects, features, and advantages of the present utility model more apparent and understandable, the following will describe in detail the specific implementation manners of the present utility model with reference to the accompanying drawings. Many specific details are set forth in the following description to fully understand the present utility model. However, the present utility model can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without departing from the connotation of the present utility model. Therefore, the present utility model is not limited by the specific embodiments disclosed below.

[0045] In the description of the present utility model, it should be understood that the orientation or positional relationship indicated by the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. is based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present utility model.

[0046] In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include at least one of such features. In the description of the present utility model, "a plurality" means at least two, such as two, three, etc., unless otherwise specifically and clearly defined.

[0047] In the present utility model, unless otherwise clearly defined and limited, terms such as "installation", "connection", "linkage", "fixation", etc. shall be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or integrated; it may be a mechanical connection or an electrical connection; it may be directly connected or indirectly connected through an intermediate medium, and it may be the internal communication between two components or the interaction relationship between two components, unless otherwise clearly defined. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.

[0048] In the present utility model, unless otherwise clearly defined and limited, the first feature being "on" or "under" the second feature may be that the first and second features are in direct contact, or the first and second features are indirectly in contact through an intermediate medium. Moreover, the first feature being "above", "over" and "on top of" the second feature may be that the first feature is directly above or obliquely above the second feature, or merely indicates that the first feature is at a higher horizontal height than the second feature. The first feature being "under", "beneath" and "underneath" the second feature may be that the first feature is directly below or obliquely below the second feature, or merely indicates that the first feature is at a lower horizontal height than the second feature.

[0049] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or there may also be an intermediate element. When an element is considered to be "connected" to another element, it can be directly connected to the other element or there may be an intermediate element at the same time. The terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used herein are only for the purpose of illustration and do not represent the only implementation.

[0050] With the continuous update and iteration of autonomous driving technology, more and more cameras are used in automobiles. However, as the pixel of the camera becomes higher and the volume becomes smaller, the requirements for electromagnetic shielding and heat dissipation of the processing chip 22 that cooperates with the photosensitive chip on the circuit board become more and more stringent.

[0051] Traditional cameras generally add a shielding cover 30 inside to wrap the processing chip 22 to achieve electromagnetic shielding. However, after using the shielding cover 30, the heat of the processing chip 22 on the circuit board is not easily dissipated. Therefore, existing cameras use thermal conductive glue both inside and outside the shielding cover 30 to conduct the heat of the processing chip 22 to the housing through the shielding cover 30, which has cumbersome operations, a high defective rate and poor heat dissipation effect.

[0052] Based on this, it is necessary to provide a photosensitive module and an in-vehicle camera that can simplify the production process of the camera, improve the heat dissipation effect of the camera and reduce the defective rate.

[0053] Please refer to Figure 1 andFigure 2 , Figure 1 A schematic explosion structure diagram of an in-vehicle camera in an embodiment provided by the present application Figure 2 A cross-sectional view of an in-vehicle camera in an embodiment provided by the present application. The in-vehicle camera provided by the present application includes a mounting shell 50, a lens assembly 60 and a photosensitive module. The lens assembly 60 is located on the photosensitive path of the photosensitive module and is mounted on the mounting shell 50. Specifically, the photosensitive module includes a metal shell 10, a photosensitive circuit board 20, a shielding cover 30 and a heat conducting member 40. The photosensitive circuit board 20 includes a circuit substrate 21 and a processing chip 22. The circuit substrate 21 is accommodated in the metal shell 10. The processing chip 22 is mounted on one side of the circuit substrate 21 facing the bottom wall of the metal shell 10. The shielding cover 30 surrounds the processing chip 22 and extends from the circuit substrate 21 to the bottom wall of the metal shell 10 to enclose a shielding space 101 for accommodating the processing chip 22. The heat conducting member 40 is located between the processing chip 22 and the bottom wall of the metal shell 10, and both ends of the heat conducting member 40 are respectively heat-conductively connected to the processing chip 22 and the bottom wall of the metal shell 10. The present application uses the cooperation of the shielding cover 30 and the metal shell 10 to isolate the high-frequency signal, avoiding signal interference to the processing chip 22 located in the shielding space 101. At the same time, the heat conducting member 40 is directly heat-conductively connected to the processing chip 22 and the metal shell 10, without relying on the shielding cover 30 for heat conduction, reducing the heat conduction path, improving the heat dissipation efficiency, and reducing the assembly cost, which is beneficial to improving the product yield.

[0054] Please refer to Figure 2 and Figure 3 , specifically, the shielding cover 30 includes a cover cylinder portion 31 and an elastic portion 32 extending inward or outward from the cover cylinder portion 31. The metal shell 10 has a limiting step 11 corresponding to the elastic portion 32 for abutting. By arranging the limiting step 11 on the bottom wall of the metal shell 10 to limit the end of the shielding cover 30, it is beneficial to reduce the shaking of the shielding cover 30 and increase the overall structural stability of the photosensitive module. In addition, since the shielding cover 30 extends from the circuit substrate 21, the limiting step 11 also indirectly forms a limit on the circuit substrate 21, which is beneficial to reducing the shaking of the circuit substrate 21.

[0055] Optionally, in order to improve the shielding effect on high - level electromagnetic signals, in an embodiment provided by the present application, the barrel part 31 abuts against the bottom wall of the metal shell 10. Specifically, for the convenience of processing and assembly, the shielding cover 30 is made by rolling a metal sheet, and the heat - conducting member 40 is heat - conducting glue. In this way, the barrel part 31 of the shielding cover 30 has no obstruction to the processing chip 22 along the axial direction, which facilitates directly pasting the heat - conducting glue to the processing chip 22 after the shielding cover 30 is installed on the circuit board 21, without the need to transfer heat through multiple heat - conducting members 40, simplifies the heat transfer path, reduces the production difficulty, and is beneficial to improving the product yield. At the same time, since the barrel part 31 has no obstruction to the processing chip 22, the heat transfer path between the processing chip 22 and the metal shell 10 is increased, and the heat dissipation efficiency is improved.

[0056] Optionally, in order to increase the integrity between the barrel part 31 and the elastic part 32, the elastic part 32 is a stamping part, that is, the elastic part 32 is integrally connected to the barrel part 31, so that the production difficulty can be further reduced and mass production is facilitated.

[0057] Please refer to Figure 5 , Figure 5 , which is a schematic structural diagram of the shielding cover 30 and the metal shell 10 in an embodiment provided by the present application. Optionally, in an embodiment provided by the present application, the side of the elastic part 32 facing the limiting step 11 is arc - shaped. Specifically, the elastic part 32 protrudes radially from the barrel part 31, which is beneficial to reducing the scraping of the elastic part 32 against the limiting step 11, and can also guide the elastic part 32 to abut against the limiting step 11.

[0058] Please refer to Figure 6 , Figure 6 , which is a schematic structural diagram of the shielding cover 30 and the metal shell 10 in another embodiment provided by the present application. Optionally, in another embodiment provided by the present application, the elastic part 32 extends obliquely from the barrel part 31 towards the circuit board 21 relative to the central axis of the barrel part 31, that is, extends obliquely upwards. Specifically, the elastic part 32 has a connecting end 321 and an abutting end 322. When the shielding cover 30 and the metal shell 10 are assembled, the limiting step 11 first abuts against the middle part of the elastic part 32 and slides towards the abutting end 322 until the abutting end 322 abuts against the limiting step 11, which is beneficial to protecting the elastic part 32 and improving the smoothness of the assembly of the shielding cover 30 and the metal shell 10. In addition, when the shielding cover 30 and the metal shell 10 are subjected to an axial pulling force, the abutting end 322 applies a resistance to the metal shell 10 along its own extending direction to prevent the metal shell 10 from accidentally detaching. Further, the number of the elastic parts 32 is at least two and is arranged circumferentially along the barrel part 31, such as Figure 5The two elastic parts 32 shown are symmetrically arranged on both sides of the limiting step 11, so that the shielding cover 30 is clamped to the limiting step 11 of the metal shell 10, enabling the shielding cover 30 and the metal shell 10 to form a pre-position, which facilitates the subsequent further installation of the photosensitive circuit board 20 into the metal shell 10. The photosensitive circuit board 20 can be connected to the metal shell 10 by, but not limited to, bolts, adhesives or welding.

[0059] Please refer to Figure 2 , Figure 5 and Figure 6 , optionally, in an embodiment provided by the present application, the elastic part 32 extends from within the cover cylinder part 31, the limiting step 11 is located within the shielding space 101 and extends from the bottom wall of the metal shell 10 towards the processing chip 22, and the heat conducting member 40 is heat transfer connected to the limiting step 11. Specifically, the heat conducting member 40 is a heat conducting adhesive, and both sides of the heat conducting adhesive are respectively bonded to the processing chip 22 and the limiting step 11. In this way, the setting of the limiting step 11 shortens the heat transfer path of the heat conducting adhesive, which is beneficial to improving the heat dissipation efficiency.

[0060] Please refer to Figure 3 , optionally, in an embodiment provided by the present application, the elastic part 32 extends from outside the cover cylinder part 31, a limiting groove 12 is formed in the middle of the bottom wall of the metal shell 10 to form the limiting step 11, and one end of the cover cylinder part 31 close to the bottom wall of the metal shell 10 is inserted into the limiting groove 12, which can also limit the shielding cover 30. In addition, the bottom wall at the limiting groove 12 of the metal shell 10 is thinner, and the heat transfer path is shorter, so it is easier to conduct the heat of the processing chip 22 through the heat conducting member 40.

[0061] Particularly, please refer to Figure 3 and Figure 4 , Figure 4 is a schematic structural diagram of the shielding cover 30 in an embodiment provided by the present application. In an embodiment provided by the present application, the shielding cover 30 has an opening groove 301 located in the cover cylinder part 31, and the opening groove 301 penetrates through both ends of the cover cylinder part 31. In actual production, in order to save production costs, the shielding cover 30 is made by rolling a metal sheet or metal strip with the elastic part 32 punched out. When such a shielding cover 30 is inserted into the limiting groove 12, the elastic part 32 abuts against the limiting step 11 to cause the radial contraction of the cover cylinder part 31, and the opening groove 301 is used to accommodate the circumferential deformation of the cover cylinder part 31. Preferably, when the shielding cover 30 and the metal shell 10 are assembled, the two ends of the metal sheet or metal strip abut against each other, that is, the opening groove 301 of the shielding cover 30 disappears, which can improve the shielding effect on electromagnetic signals. The shielding cover 30 is, but not limited to, circular or rectangular, and the specific shape needs to be determined according to the shape of the processing chip 22 and the component layout of the photosensitive circuit board 20.

[0062] Please refer to Figure 7 , Figure 7The schematic diagram of the structure of the shielding cover 30 and the photosensitive circuit board 20 in one embodiment provided by the present application. Optionally, in one embodiment provided by the present application, the shielding cover 30 is welded to the side of the circuit substrate 21 facing the bottom wall of the metal shell 10, so that the shielding cover 30 and the photosensitive circuit board 20 can form a pre-assembled semi-finished product structure, which is conducive to simplifying the assembly process.

[0063] See also Figure 8 , Figure 8 The schematic diagram of the structure of the shielding cover 30 and the photosensitive circuit board 20 in another embodiment provided by the present application. Optionally, in another embodiment provided by the present application, the circuit substrate 21 is provided with a mounting groove 211, and the shielding cover 30 is inserted into the mounting groove 211 and welded to the side of the bottom wall of the circuit substrate 21 away from the metal shell 10. This is conducive to increasing the connection strength between the shielding cover 30 and the circuit substrate 21, and avoiding the shielding cover 30 and the circuit substrate 21 from being dislocated and broken due to shear force. In addition, due to the opening of the mounting groove 211, the shielding cover 30 can be preferentially clamped and fixed with the metal shell 10. When the circuit board and the metal shell 10 are fixed, the welding process is carried out. At this time, the shielding cover 30 and the circuit board are fixed to the metal shell 10 and are not easy to shake, which is conducive to improving the welding quality.

[0064] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0065] The above-mentioned embodiments only express several implementation methods of the utility model, and the description is relatively specific and detailed, but it cannot be understood as limiting the scope of the utility model patent. It should be pointed out that for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the utility model, which all belong to the protection scope of the utility model. Therefore, the protection scope of the utility model patent shall be based on the attached claims.

Claims

1. A photosensitive module, characterized in that: include: Metal shell; A photosensitive circuit board, the photosensitive circuit board comprising a circuit substrate accommodated in the metal shell and a processing chip mounted on a side of the circuit substrate facing the bottom wall of the metal shell; A shielding cover surrounds the processing chip and extends from the circuit substrate to the bottom wall of the metal shell to enclose and form a shielding space for accommodating the processing chip; as well as A heat conducting member is located between the processing chip and the bottom wall of the metal shell, and two ends of the heat conducting member are respectively connected to the processing chip and the bottom wall of the metal shell in a heat transfer manner.

2. The photosensitive module according to claim 1, characterized in that: The shielding cover comprises a cover tube portion and an elastic portion extending inwardly or outwardly from the cover tube portion, and the metal shell has a limiting step corresponding to and abutting against the elastic portion.

3. The photosensitive module according to claim 2, characterized in that: The cover tube portion abuts against the bottom wall of the metal shell.

4. The photosensitive module according to claim 2, characterized in that: The elastic part is a stamped part.

5. The photosensitive module according to claim 4, characterized in that: The side of the elastic portion facing the limiting step is arc-shaped.

6. The photosensitive module according to claim 4, characterized in that: The elastic portion extends from the cover tube portion toward the circuit board at an inclination with respect to a central axis of the cover tube portion.

7. The photosensitive module according to any one of claims 2 to 6, characterized in that: The elastic portion extends inwardly from the cover tube portion, the limiting step is located in the shielding space and extends from the bottom wall of the metal shell toward the processing chip, and the heat conducting member is heat-conductingly connected to the limiting step.

8. The photosensitive module according to any one of claims 2 to 6, characterized in that: The elastic part extends outward from the cover tube part, a limiting groove is provided in the middle of the bottom wall of the metal shell to form the limiting step, and one end of the cover tube part close to the bottom wall of the metal shell is inserted into the limiting groove.

9. The photosensitive module according to claim 1, characterized in that: The shielding cover is welded to a side of the circuit substrate facing the bottom wall of the metal shell; and / or The circuit substrate is provided with a mounting groove, the shielding cover is passed through the mounting groove and welded to a side of the circuit substrate away from the bottom wall of the metal shell.

10. A vehicle-mounted camera, characterized in that: include: Install the shell; A lens assembly, wherein the lens assembly is mounted on the mounting shell; as well as According to the photosensitive module as described in any one of claims 1 to 9, the lens assembly is located in the photosensitive path of the photosensitive module, and the mounting shell is fixedly connected to the metal shell of the photosensitive module.

Images