Circuit board with hole sealing structure

Abstract

The utility model discloses a circuit board with a hole sealing structure, which relates to the technical field of circuit boards, and comprises a circuit board body and a hole sealing mechanism, one end of the circuit board body is provided with a first packaging shell, the other end of the circuit board body is provided with a second packaging shell, the inner side of the first packaging shell and the inner side of the second packaging shell are respectively pasted with a sponge layer, and the hole sealing mechanism is arranged in the first packaging shell. The hole sealing mechanism is installed on the inner side of the circuit board body. According to the circuit board with the hole sealing structure, the soldering tin is shielded through the hole sealing ring, and the cross section structure of the hole sealing ring is wide at the top and narrow at the bottom, so that the soldering tin can be prevented from overflowing, the soldering tin can conveniently flow into the through hole, the unsealed through hole can be shielded in the hole sealing process, the through hole can be shielded through the protective cover, and the sealing effect of the circuit board is improved. And then the protective cover is pulled towards one side, so that the two ends of the protective cover slide towards one side in the sliding grooves, hole sealing operation can be conveniently carried out on other through holes, and the practicability of the circuit board is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit boards, and specifically relates to a circuit board with a hole-sealing structure. Background Technique

[0002] Circuit boards are an indispensable part of modern electronic products. They carry electronic components and provide electrical connections, and are applied in multiple fields such as automobiles, home appliances, computers, communications, industry, medical treatment, and military. Circuit boards usually include three types: rigid PCBs, flexible PCBs, and rigid-flexible combined PCBs. Rigid PCBs are suitable for most electronic products. Flexible PCBs use flexible substrates and can be bent and folded, and are suitable for devices that require space saving and bendable designs. Rigid-flexible combined PCBs combine the rigid and flexible characteristics and are suitable for specific application requirements.

[0003] However, the existing circuit boards have the following disadvantages. Since holes are usually opened on the welding pads of most circuit boards for electrical connection, hole-sealing operations are usually performed on the holes. However, there is no anti-overflow structure on the outer side of the holes, resulting in that when the circuit board is subjected to hole-sealing operations, the solder easily overflows from the holes and flows into other holes, affecting the hole-sealing quality. Therefore, the current circuit boards need to be improved. Summary of the Invention

[0004] The purpose of the utility model is to provide a circuit board with a hole-sealing structure to solve the problem that there is no anti-overflow structure on the outer side of the holes on the current market circuit boards, resulting in that when the circuit board is subjected to hole-sealing operations, the solder easily overflows from the holes as proposed in the above background technique.

[0005] To achieve the above purpose, the utility model provides the following technical scheme: A circuit board with a hole-sealing structure includes a circuit board body and a hole-sealing mechanism. One end of the circuit board body is provided with a first encapsulation shell, and the other end of the circuit board body is provided with a second encapsulation shell. Sponge layers are pasted on the inner sides of the first encapsulation shell and the second encapsulation shell. The hole-sealing mechanism is installed inside the circuit board body. Through holes are provided inside the circuit board body and the hole-sealing mechanism. The hole-sealing mechanism includes a welding pad, a protective cover, a hole-sealing ring, and a chute. A welding pad is provided on one side of the circuit board body.

[0006] Preferably, the through holes are located inside the welding pad and the circuit board body. Equally spaced hole-sealing rings are provided on the side of the welding pad away from the circuit board body, and the hole-sealing rings are located on one side of the through holes.

[0007] Preferably, a protective cover is provided on the side of the welding pad close to the hole-sealing ring. A chute is opened on the side of the welding pad close to the protective cover, and both ends of the protective cover are slidably connected to the chute.

[0008] Preferably, a second docking block and a first docking block are connected to one side of the second encapsulation shell close to the first encapsulation shell, and a second docking groove and a first docking groove are formed in one side of the first encapsulation shell close to the second docking block.

[0009] Preferably, a limiting mechanism is arranged inside the first encapsulation shell, and one side of the limiting mechanism is connected to the first docking block.

[0010] Preferably, the limiting mechanism includes a fixing ring, a limiting block, a push rod, a limiting groove and a supporting spring, and a supporting spring is arranged in the built-in groove of the first docking block.

[0011] Preferably, a limiting block is arranged on one side of the supporting spring, and the limiting block is slidably connected to the first docking block. A limiting groove is formed in the inner wall of the first encapsulation shell close to the limiting block.

[0012] Preferably, a fixing ring is fixed on the outer side of the first encapsulation shell, and a push rod slidably penetrates through the inner side of the first encapsulation shell close to the limiting groove, and the push rod is located in the middle of the fixing ring.

[0013] Compared with the prior art, the beneficial effects of the present utility model are as follows:

[0014] 1. A hole-sealing mechanism is provided. The soldering tin is blocked by the hole-sealing ring, and the cross-sectional structure of the hole-sealing ring is wider at the top and narrower at the bottom, which can prevent the soldering tin from overflowing and is convenient for the soldering tin to flow into the through hole. During the hole-sealing process, the un-sealed through holes can be blocked. The through holes can be blocked by the protective cover, and then the protective cover is pulled to one side, so that both ends of the protective cover slide to one side in the sliding groove, which is convenient for the hole-sealing operation of other through holes, and improves the practicability of the circuit board.

[0015] 2. A limiting mechanism is provided. The first docking block and the second docking block are respectively inserted into the first docking groove and the second docking groove. At the same time, the supporting spring rebounds to drive the limiting block to insert into the limiting groove, which can quickly connect the first encapsulation shell and the second encapsulation shell, and perform encapsulation protection on the circuit board body. And the push rod can be directly pressed to make the push rod squeeze the limiting block, so that the limiting block disengages from the limiting groove, and the first encapsulation shell can be quickly disassembled from the second encapsulation shell, which is beneficial to the encapsulation and transportation of the circuit board and is convenient for disassembly, and improves the convenience of the circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic main sectional structure diagram of the present utility model;

[0017] Figure 2 It is a schematic top view structure diagram of the present utility model;

[0018] Figure 3 It is a schematic top sectional structure diagram of the present utility model;

[0019] Figure 4 This is a schematic top-sectional view of the hole-sealing mechanism of the present utility model;

[0020] Figure 5 This is a schematic front-sectional view of the hole-sealing mechanism of the present utility model;

[0021] Figure 6 This is an enlarged schematic view of part A of the present utility model;

[0022] Figure 7 This is a three-dimensional structural schematic view of the hole-sealing ring of the present utility model;

[0023] Figure 8 This is a three-dimensional structural schematic view of the protective cover of the present utility model.

[0024] In the figure: 1. Circuit board body; 2. First encapsulation shell; 3. Sponge layer; 4. Second encapsulation shell; 5. Through hole; 6. Hole-sealing mechanism; 601. Pad; 602. Protective cover; 603. Hole-sealing ring; 604. Slide groove; 7. First docking block; 8. Limiting mechanism; 801. Fixed ring; 802. Limiting block; 803. Push rod; 804. Limiting groove; 805. Support spring; 9. First docking groove; 10. Second docking block; 11. Second docking groove. Specific embodiments

[0025] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all of the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present utility model.

[0026] Please refer to Figures 1-3 and Figure 6, the present utility model provides a technical solution: a circuit board with a hole-sealing structure, including a circuit board body 1 and a hole-sealing mechanism 6. One end of the circuit board body 1 is provided with a first encapsulation shell 2, and the other end of the circuit board body 1 is provided with a second encapsulation shell 4. Sponge layers 3 are pasted on the inner sides of the first encapsulation shell 2 and the second encapsulation shell 4. One side of the second encapsulation shell 4 close to the first encapsulation shell 2 is connected with a second docking block 10 and a first docking block 7. Second docking grooves 11 and first docking grooves 9 are opened on one side of the first encapsulation shell 2 close to the second docking block 10. A limiting mechanism 8 is arranged inside the first encapsulation shell 2, and one side of the limiting mechanism 8 is connected with the first docking block 7. The limiting mechanism 8 includes a fixed ring 801, a limiting block 802, a push rod 803, a limiting groove 804 and a supporting spring 805. A supporting spring 805 is arranged in the built-in groove of the first docking block 7. A limiting block 802 is arranged on one side of the supporting spring 805, and the limiting block 802 is slidably connected with the first docking block 7. A limiting groove 804 is opened on the inner wall of the first encapsulation shell 2 close to the limiting block 802. A fixed ring 801 is fixed on the outer side of the first encapsulation shell 2. A push rod 803 slidably penetrates through the inner side of the first encapsulation shell 2 close to the limiting groove 804, and the push rod 803 is located in the middle of the fixed ring 801.

[0027] During specific implementation, since the circuit board needs to be encapsulated and transported after processing, most of them use bolts to connect the shell, place the circuit board in the shell for encapsulation and transportation. Multiple bolt connections are time-consuming. The first docking block 7 and the second docking block 10 of the first encapsulation shell 2 can be respectively inserted into the first docking groove 9 and the second docking groove 11. At the same time, the supporting spring 805 rebounds to drive the limiting block 802 to insert into the limiting groove 804, which can quickly connect the first encapsulation shell 2 and the second encapsulation shell 4, perform encapsulation protection on the circuit board body 1, and the push rod 803 can be directly pressed to make the push rod 803 squeeze the limiting block 802, so that the limiting block 802 disengages from the limiting groove 804, and the first encapsulation shell 2 can be quickly disassembled from the second encapsulation shell 4, which is beneficial to the encapsulation and transportation of the circuit board and is convenient for disassembly, improving the convenience of the circuit board.

[0028] Please refer to Figure 1 、 Figure 3 、 Figure 4 、 Figure 5 、 Figure 7 and Figure 8, the hole-sealing mechanism 6 is installed inside the circuit board body 1. Through holes 5 are provided inside the circuit board body 1 and the hole-sealing mechanism 6. The hole-sealing mechanism 6 includes a solder pad 601, a protective cover 602, a hole-sealing ring 603, and a sliding groove 604. A solder pad 601 is provided on one side of the circuit board body 1. The through hole 5 is located inside the solder pad 601 and the circuit board body 1. On the side of the solder pad 601 away from the circuit board body 1, hole-sealing rings 603 are arranged at equal intervals, and the hole-sealing rings 603 are located on one side of the through hole 5. A protective cover 602 is provided on the side of the solder pad 601 close to the hole-sealing ring 603. A sliding groove 604 is formed on the side of the solder pad 601 close to the protective cover 602, and both ends of the protective cover 602 are slidably connected to the sliding groove 604. The cross-sectional shape of the hole-sealing ring 603 is trapezoidal, and the cross-sectional shapes of both ends of the protective cover 602 and the sliding groove 604 are "T" shaped.

[0029] During specific implementation, since holes are usually opened on the welding pads of most circuit boards for electrical connection, hole-sealing operations are usually performed on the holes. However, there is no anti-overflow structure on the outside of the holes, resulting in the solder easily overflowing from the holes and flowing into other holes during the hole-sealing operation of the circuit board, affecting the hole-sealing quality. The solder can be blocked by the hole-sealing ring 603, and the cross-sectional structure of the hole-sealing ring 603 is wider at the top and narrower at the bottom, which can prevent the solder from overflowing and facilitate the flow of the solder into the through hole 5. During the hole-sealing process, the un-sealed through holes 5 can be blocked to prevent the solder paste from splashing into the through holes 5. The through holes 5 can be blocked by the protective cover 602, and then the protective cover 602 is pulled to one side, so that both ends of the protective cover 602 slide to one side in the sliding groove 604, facilitating the hole-sealing operation of other through holes 5 and improving the practicability of the circuit board.

[0030] Working principle: When using the circuit board with a hole-sealing structure, first, the through holes 5 can be sealed by the hole-sealing mechanism 6. Then, the hole-sealed circuit board is placed inside the first encapsulation shell 2 and the second encapsulation shell 4, and the first encapsulation shell 2 and the second encapsulation shell 4 are pushed closer to each other, so that the first docking block 7 and the second docking block 10 are respectively inserted into the first docking groove 9 and the second docking groove 11. At the same time, the first encapsulation shell 2 and the second encapsulation shell 4 are connected by the limiting mechanism 8, and the sponge layer 3 protects the circuit board, improving the convenience and practicability of the circuit board. The content not described in detail in this specification belongs to the prior art well-known to those skilled in the art.

[0031] Although the present invention has been described in detail with reference to the foregoing embodiments, for those skilled in the art, they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements for some of the technical features. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A circuit board with a sealing structure, comprising a circuit board body (1) and a sealing mechanism (6), characterized in that: A No. 1 packaging shell (2) is provided at one end of the circuit board body (1), and a No. 2 packaging shell (4) is provided at the other end of the circuit board body (1); a sponge layer (3) is adhered to the inner sides of the No. 1 packaging shell (2) and the No. 2 packaging shell (4); the sealing mechanism (6) is installed on the inner side of the circuit board body (1); through holes (5) are provided on the inner sides of the circuit board body (1) and the sealing mechanism (6); the sealing mechanism (6) comprises a solder pad (601), a protective cover (602), a sealing ring (603) and a slide groove (604); and a solder pad (601) is provided on one side of the circuit board body (1).

2. The circuit board with a sealing structure according to claim 1, characterized in that: The through hole (5) is located on the inner side of the soldering pad (601) and the circuit board body (1); a side of the soldering pad (601) away from the circuit board body (1) is provided with equally spaced sealing rings (603); and the sealing ring (603) is located on one side of the through hole (5).

3. The circuit board with a sealing structure according to claim 2, characterized in that: A protective cover (602) is provided on one side of the soldering pad (601) close to the sealing ring (603), a sliding groove (604) is provided on one side of the soldering pad (601) close to the protective cover (602), and two ends of the protective cover (602) are slidably connected to the sliding groove (604).

4. The circuit board with a sealing structure according to claim 1, characterized in that: A side of the No. 2 packaging shell (4) close to the No. 1 packaging shell (2) is connected to a No. 2 docking block (10) and a No. 1 docking block (7), and a side of the No. 1 packaging shell (2) close to the No. 2 docking block (10) is provided with a No. 2 docking groove (11) and a No. 1 docking groove (9).

5. The circuit board with a sealing structure according to claim 4, characterized in that: A limiting mechanism (8) is provided on the inner side of the No. 1 packaging shell (2), and one side of the limiting mechanism (8) is connected to the No. 1 docking block (7).

6. The circuit board with a sealing structure according to claim 5, characterized in that: The limiting mechanism (8) comprises a fixing ring (801), a limiting block (802), a push rod (803), a limiting groove (804) and a supporting spring (805), and a supporting spring (805) is provided in the built-in groove of the No. 1 docking block (7).

7. The circuit board with a sealing structure according to claim 6, characterized in that: A limit block (802) is provided on one side of the support spring (805), and the limit block (802) is slidably connected to the first docking block (7), and a limit groove (804) is provided on the inner wall of the first packaging shell (2) close to the limit block (802).

8. The circuit board with a sealing structure according to claim 7, characterized in that: A fixing ring (801) is fixed on the outer side of the No. 1 packaging shell (2), and a push rod (803) is slidably penetrated through the inner side of the No. 1 packaging shell (2) close to the limiting groove (804), and the push rod (803) is located in the middle of the fixing ring (801).

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