Flexible printed circuit (FPC) for preventing tin connection of connector and display module thereof

Abstract

The embodiment of the utility model belongs to the technical field of display modules. The utility model also relates to an FPC capable of preventing tin connection of the connector, which comprises a main screen FPC, the main screen FPC is provided with a welding piece, the welding piece is welded with the connector, the welding piece comprises a bonding pad window arranged on the main screen FPC, the main screen FPC is connected with a plurality of bonding pad main bodies positioned in the area of the bonding pad window, the plurality of bonding pad main bodies are all connected with connecting wires, and the connecting wires are connected with the main screen FPC. A combined wiring main body is connected among the plurality of connecting wires, and an avoiding gap is arranged between the combined wiring main body and the bonding pad window. According to the invention, after the defined bonding pad main body is led out through the connecting wire, the bonding pad main body and the bonding pad main body are combined together through the combining wire main body, and the avoiding gap is arranged between the combining wire main body and the bonding pad window, so that the risk that soldering tin is directly connected at the joint of the combining wire main body and the connecting wire is avoided; and the phenomenon of tin connection is effectively reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of display modules, and more specifically, to an FPC for preventing solder bridging of a connector and a display module thereof. Background Art

[0002] With the rapid development of liquid crystal display technology, liquid crystal display modules (LCD Modules) are increasingly widely used in various electronic devices, such as smart phones, tablet computers, TV screens, in-vehicle display screens, etc. In these devices, the flexible printed circuit board (FPC), as a key bridge connecting the main board and the LCD display, its performance and reliability directly affect the operation effect and user experience of the entire display module; the FPC, with its characteristics of being thin, flexible, and highly reliable, occupies an important position in the design of electronic products. However, in the manufacturing and assembly process of the FPC, especially in the SMT (Surface Mount Technology) process, there is a problem that cannot be ignored - solder bridging. The solder bridging phenomenon refers to the situation where, during the soldering process, the solder accidentally connects two or more conductive parts that should not be connected, resulting in a short circuit in the circuit or signal interference, seriously affecting the functionality and stability of the product.

[0003] In the FPC design of liquid crystal display modules, in order to enhance the stability of signal transmission and the ability to withstand large currents, some key pin feet (such as functional pins or high-current pins) will adopt a parallel lead-out method (merged traces), that is, 2 - 3 pin feet are used to jointly undertake the transmission task of a signal or current. Although this design improves the safety and reliability of the circuit, it also increases the risk of solder bridging during SMT; in the traditional FPC design, the layout of the pin feet and the position of the cover film window opening are often not finely optimized. The position of the cover film window opening of the FPC is flush with the position of the merged traces of the pin feet, which is prone to solder bridging problems during SMT. During the SMT process, the solder is likely to form a bridge between the pin feet or between the pin feet and the edge of the cover film, thereby causing solder bridging problems. Solder bridging will not only cause faults such as abnormal display and color distortion in the display module, but may also cause damage to the entire device, bringing inconvenience to users, and at the same time increasing the cost burden of the production enterprise. Therefore, we make improvements on this and propose an FPC for preventing solder bridging of a connector and a display module thereof. Summary of the Utility Model

[0004] The technical problem to be solved by the embodiment of the utility model is that the position of the cover film window opening of the FPC is flush with the position of the merged traces of the pin feet, which is prone to solder bridging problems during SMT.

[0005] In order to solve the above technical problems, the utility model adopts the following technical solutions:

[0006] An FPC for preventing solder bridging of a connector, comprising: a main screen FPC, a welding part is arranged on the main screen FPC, and a connector is welded at the welding part. The welding part includes a pad opening formed on the main screen FPC, and the main screen FPC is connected with a plurality of pad bodies located in the pad opening area. Among them, a plurality of pad bodies are all connected with connecting traces, a merging trace body is connected between the plurality of connecting traces, and an avoiding gap is arranged between the merging trace body and the pad opening.

[0007] As an improved way of the utility model, the distance of the avoiding gap ≥ 0.2mm.

[0008] As an improved way of the utility model, the connector is composed of a main connector and a sub-connector, and the number of the welding parts is two, and the main connector and the sub-connector are respectively connected with the main screen FPC through the two welding parts.

[0009] As an improved way of the utility model, the pins of the sub-connector and the main connector are welded with the pad bodies.

[0010] As an improved way of the utility model, the main screen FPC is also connected with an FPC binding positioner, and one end of the merging trace body far away from the connecting trace is connected with the FPC binding positioner.

[0011] As an improved way of the utility model, a backlight FPC pad is arranged on the main screen FPC, and two alignment lines are arranged on the main screen FPC and are respectively located on both sides of the backlight FPC pad.

[0012] As an improved way of the utility model, it includes a display module body, and the FPC binding positioner is bound with the display module body.

[0013] As an improved way of the utility model, the display module body includes a rubber frame, a backlight body is arranged in the rubber frame, and a backlight iron frame is arranged outside the rubber frame. A backlight FPC body is arranged between the backlight body and the backlight FPC pad.

[0014] As an improved way of the utility model, a light-shielding rubber is connected to one side of the rubber frame far away from the backlight iron frame, a lower polarizer is connected to one side of the light-shielding rubber far away from the rubber frame, the lower polarizer is connected with a liquid crystal display, and the FPC binding positioner is connected with the liquid crystal display.

[0015] As an improved way of the utility model, an upper polarizer is connected to one side of the liquid crystal display far away from the lower polarizer, an OCA optical adhesive is connected to one side of the upper polarizer far away from the liquid crystal display, and a cover plate is connected to one side of the OCA optical adhesive far away from the upper polarizer.

[0016] Compared with the prior art, the embodiments of the utility model mainly have the following beneficial effects:

[0017] In order to solve the problem that the window position of the FPC covering film is flush with the pin foot merged routing position in the prior art, which is prone to bridging during SMT, the present application leads out the same defined pad body through a connecting routing, and then merges the routing body together through the merged routing body, and sets an avoidance gap between the merged routing body and the pad window. This design avoids the risk of direct connection of solder at the connection between the merged routing body and the connecting routing, effectively reduces the occurrence of bridging, allows the solder to be evenly distributed during the welding process, reduces the short circuit problem caused by solder overflow or uneven distribution, thereby improving the welding quality and overall reliability of the product, and reducing the occurrence of bridging problems, which means reducing the rework and scrap rate caused by quality problems, thereby reducing production costs. At the same time, it also reduces customer complaints and after-sales repair costs caused by product failures, and improves the brand image and customer satisfaction. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 A schematic diagram of the structure of the FPC for preventing the connector from tinning provided in this application;

[0019] Figure 2 A schematic diagram of the structure of the combined wiring body and the connecting wiring provided for this application;

[0020] Figure 3 A schematic diagram of the structure of the FPC and display module for preventing the connector from tinning provided in this application;

[0021] Figure 4 A schematic diagram of the structure of the display module provided in this application;

[0022] Figure 5 Provided for this application Figure 4 Schematic diagram of the local structure.

[0023] Indicated in the figure:

[0024] 1. Main screen FPC; 2. Solder pad window; 3. Solder pad body; 4. Merged wiring body; 401. Connecting wiring; 5. Main connector; 6. Sub-connector; 7. FPC binding position; 8. Display module body; 801. Glue frame; 802. Backlight body; 803. Backlight iron frame; 804. Shading glue; 805. Lower polarizer; 806. Liquid crystal display; 807. Upper polarizer; 808. OCA optical glue; 809. Cover plate; 10. Backlight FPC solder pad; 11. Alignment line; 14. Backlight FPC body. DETAILED DESCRIPTION

[0025] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those of ordinary skill in the technical field to which this utility model belongs; the terms used in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this utility model. The mention of "embodiment" herein means that the specific features, structures or characteristics described in connection with the embodiment can be included in at least one embodiment of this utility model. The appearance of this phrase at various positions in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment mutually exclusive with other embodiments. Those skilled in the art will explicitly and implicitly understand that the embodiments described herein can be combined with other embodiments.

[0026] As described in the background art, in the FPC design of a liquid crystal display module, in order to enhance the stability of signal transmission and the ability to withstand large currents, some key pin feet (such as functional pins or high-current pins) will adopt a parallel lead-out method (merged traces), that is, 2-3 pin feet are used to jointly undertake the transmission task of a signal or current. Although this design improves the safety and reliability of the circuit, it also increases the risk of solder bridging during SMT; in the traditional FPC design, the layout of the pin feet and the position of the cover film opening are often not finely optimized. The position of the cover film opening of the FPC is flush with the position of the merged traces of the pin feet, which is likely to cause solder bridging problems during SMT. During the SMT process, the solder is likely to form a bridge between the pin feet or between the pin feet and the edge of the cover film, thereby triggering solder bridging problems. Solder bridging will not only cause faults such as abnormal display and color distortion in the display module, but may also cause damage to the entire device, bringing inconvenience to users and increasing the cost burden of the manufacturing enterprise.

[0027] To solve this technical problem, this utility model provides an FPC for preventing connector solder bridging and its display module.

[0028] Specifically, please refer to Figures 1-2 , preventing connector solder bridging specifically includes:

[0029] A main screen FPC1, on which there is a welding part, and a connector is welded at the welding part. The welding part includes a pad opening 2 opened on the main screen FPC1, and the main screen FPC1 is connected with a plurality of pad bodies 3 located in the area of the pad opening 2. Among them, a plurality of pad bodies 3 are all connected with connection traces 401, a merged trace body 4 is connected between the plurality of connection traces 401, and an avoidance gap is provided between the merged trace body 4 and the pad opening 2.

[0030] The FPC and display module for preventing solder bridging of the present utility model. After the pads main body 3 with the same definition is led out through the connection trace 401 in this application, they are then merged together through the merged trace main body 4, and an avoidance gap is set between the merged trace main body 4 and the pad opening 2. This design avoids the risk of solder directly connecting at the connection of the merged trace main body 4 and the connection trace 401, effectively reducing the occurrence of solder bridging. It enables the solder to be evenly distributed during the soldering process, reducing short-circuit problems caused by solder overflow or uneven distribution. Thereby, it improves the soldering quality and overall reliability of the product, reduces the occurrence of solder bridging problems, which means reducing the rework and scrap rates caused by quality problems, and further reducing the production cost. At the same time, it also reduces customer complaints and after-sales maintenance costs caused by product failures, enhancing the brand image and customer satisfaction.

[0031] In order to enable those skilled in the art to better understand the solution of the present utility model, the technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings.

[0032] It should be noted that, without conflict, the embodiments and the features and technical solutions in the embodiments of the present utility model can be combined with each other.

[0033] It should be noted that similar reference numerals and letters indicate similar items in the following drawings. Therefore, once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings.

[0034] Embodiment 1

[0035] Please refer to Figures 1-2, the FPC of the utility model for preventing the connector from bridging solder, includes: a main screen FPC1, on which a welding part is arranged, and a connector is welded at the welding part. The welding part includes a pad opening 2 formed on the main screen FPC1, and the main screen FPC1 is connected with a plurality of pad bodies 3 located in the area of the pad opening 2. Among them, a plurality of pad bodies 3 are all connected with connection traces 401, and a merging trace main body 4 is connected between the plurality of connection traces 401. And an avoidance gap is arranged between the merging trace main body 4 and the pad opening 2. In this application, after the same-defined pad bodies 3 are led out through the connection traces 401, they are merged together through the merging trace main body 4, and an avoidance gap is arranged between the merging trace main body 4 and the pad opening 2. This design avoids the risk of the bridging solder directly connecting at the connection of the merging trace main body 4 and the connection trace 401, effectively reducing the occurrence of the bridging solder phenomenon, enabling the bridging solder to be evenly distributed during the welding process, reducing the short-circuit problem caused by the overflow or uneven distribution of the bridging solder, thereby improving the welding quality and overall reliability of the product, reducing the occurrence of the bridging solder problem, which means reducing the rework and scrap rate caused by quality problems, and further reducing the production cost. At the same time, it also reduces the customer complaints and after-sales maintenance costs caused by product failures, enhancing the brand image and customer satisfaction;

[0036] Assume that the traces of Pin1 and Pin2 are separately led out through the connection traces 401 and then merged together through the merging trace main body 4. The distance between the merging position and the pad opening 2 is the avoidance gap, so that there will be no risk of the bridging solder connecting at the trace merging position during SMT.

[0037] Further, as Figure 2 shown, the distance of the avoidance gap ≥ 0.2mm. Referring to Figure 2 , set the avoidance gap as L, that is Figure 2 as marked in the figure.

[0038] Further, as Figure 1 shown, the connector is composed of a main connector 5 and a sub-connector 6, and the number of the welding parts is two, and the main connector 5 and the sub-connector 6 are respectively connected with the main screen FPC1 through the two welding parts.

[0039] Further, the pins of the sub-connector 6 and the main connector 5 are welded to the pad bodies 3 to improve the firmness of the connection part.

[0040] Further, as Figure 1 shown, the main screen FPC1 is also connected with an FPC binding position 7. One end of the merging trace main body 4 far from the connection trace 401 is connected with the FPC binding position 7, and the FPC binding position 7 is used for binding the main screen FPC1 and the display module.

[0041] Further, as Figure 1As shown in the figure, a backlight FPC pad 10 is provided on the main screen FPC 1, and two alignment lines 11 are provided on the main screen FPC 1 on both sides of the backlight FPC pad 10 respectively. The backlight FPC pad 10 is used to connect with the FPC of the backlight, and the alignment lines 11 are used for alignment when connecting the FPC of the backlight.

[0042] Embodiment 2

[0043] Please refer to Figures 3-5 , the display module of the present utility model for preventing solder bridging of the connector uses an FPC for preventing solder bridging of the connector, including a display module main body 8. The FPC binding position 7 is bound to the display module main body 8 to realize the connection between the main screen FPC 1 and the display module main body 8.

[0044] Furthermore, as Figures 3-5 shown, the display module main body 8 includes a rubber frame 801. A backlight main body 802 is arranged inside the rubber frame 801, and a backlight iron frame 803 is arranged outside the rubber frame 801. A backlight FPC main body 14 is arranged between the backlight main body 802 and the backlight FPC pad 10. The backlight FPC main body 14 is used to realize the connection between the backlight main body 802 and the backlight FPC pad 10.

[0045] Furthermore, as Figure 1 shown, a light-shielding rubber 804 is connected to one side of the rubber frame 801 away from the backlight iron frame 803. A lower polarizer 805 is connected to one side of the light-shielding rubber 804 away from the rubber frame 801. The lower polarizer 805 is connected to a liquid crystal display 806, and the FPC binding position 7 is connected to the liquid crystal display 806;

[0046] The main function of the lower polarizer 805 is to convert the non-polarized light generated by the backlight main body 802 into polarized light in a specific direction, which is achieved by the selective absorption of light by the polarizer, that is, the light with the vibration direction perpendicular to the transmission axis of the polarizer is absorbed, while the light with the vibration direction parallel to the transmission axis is allowed to pass through; the polarized light converted by the lower polarizer 805 provides the necessary conditions for subsequent liquid crystal modulation. These polarized lights then enter the liquid crystal display 806, and according to the arrangement of liquid crystal molecules and the action of the electric field, their polarization states will change accordingly.

[0047] Furthermore, as Figure 4As shown in the figure, a polarizer 807 is connected to the side of the liquid crystal display 806 away from the lower polarizer 805. An OCA optical adhesive 808 is connected to the side of the polarizer 807 away from the liquid crystal display 806. A cover plate 809 is connected to the side of the OCA optical adhesive 808 away from the polarizer 807. The polarizer 807 is responsible for analyzing the polarized light modulated by the liquid crystal display 806. Under the action of an electric field, the liquid crystal molecules will change their arrangement, thereby changing the polarization direction of the polarized light passing through them. The polarizer 807 can recognize these changed polarized lights and generate light and dark contrasts according to their different polarization states. Finally, the polarizer 807 converts the analyzed polarized light into light and dark signals that can be recognized by the human eye, thus forming the display image we see. In this process, the changes in parameters such as the polarization direction and intensity of the polarized light are converted into information such as the brightness and color of the pixel points on the image.

[0048] Obviously, the embodiments described above are only a part of the embodiments of the present invention, rather than all of the embodiments. The accompanying drawings show the preferred embodiments of the present invention, but do not limit the patent scope of the present invention. The present invention can be implemented in many different forms. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosed content of the present invention more thorough and comprehensive. Although the present invention has been described in detail with reference to the foregoing embodiments, for those skilled in the art, they can still modify the technical solutions described in the foregoing specific embodiments, or perform equivalent replacements on some of the technical features. Any equivalent structure made by using the specification and drawings of the present invention, directly or indirectly applied in other related technical fields, is similarly within the scope of the patent protection of the present invention.

Claims

1. An FPC for preventing connector tinning, characterized in that: include: A main screen FPC (1), wherein a welding part is provided on the main screen FPC (1), and a connector is welded on the welding part, wherein the welding part comprises a solder pad window (2) provided on the main screen FPC (1), and the main screen FPC (1) is connected to a plurality of solder pad bodies (3) located in the region of the solder pad window (2), wherein a plurality of solder pad bodies (3) are all connected to connecting wires (401), a combined wiring body (4) is connected between the plurality of connecting wires (401), and an avoidance gap is provided between the combined wiring body (4) and the solder pad window (2).

2. The FPC for preventing connector tinning according to claim 1, characterized in that: The distance avoiding the gap is ≥0.2 mm.

3. The FPC for preventing connector tinning according to claim 2, characterized in that: The connector is composed of a main connector (5) and a sub-connector (6), and the number of welding parts is two, and the main connector (5) and the sub-connector (6) are connected to the main screen FPC (1) through the two welding parts respectively.

4. The FPC for preventing connector tinning according to claim 3, characterized in that: The pins of the secondary connector (6) and the primary connector (5) are welded to the pad body (3).

5. The FPC for preventing connector tinning according to claim 4, characterized in that: The main screen FPC (1) is also connected to an FPC binding position (7), and one end of the combined wiring body (4) away from the connecting wiring (401) is connected to the FPC binding position (7).

6. The FPC for preventing connector tinning according to claim 5, characterized in that: The main screen FPC (1) is provided with a backlight FPC pad (10), and the main screen FPC (1) is provided with two alignment lines (11) respectively located on two sides of the backlight FPC pad (10).

7. A display module for preventing connector tinning, using the FPC for preventing connector tinning as claimed in claim 6, characterized in that: It comprises a display module main body (8), wherein the FPC binding position (7) is bound together with the display module main body (8).

8. The display module for preventing connector tinning according to claim 7, characterized in that: The display module body (8) comprises a plastic frame (801), a backlight body (802) is arranged inside the plastic frame (801), a backlight iron frame (803) is arranged outside the plastic frame (801), and a backlight FPC body (14) is arranged between the backlight body (802) and the backlight FPC pad (10).

9. The display module for preventing connector tinning according to claim 8, characterized in that: A side of the glue frame (801) away from the backlight iron frame (803) is connected to a light shielding glue (804), a side of the light shielding glue (804) away from the glue frame (801) is connected to a lower polarizer (805), the lower polarizer (805) is connected to a liquid crystal display (806), and the FPC binding position (7) is connected to the liquid crystal display (806).

10. The display module for preventing connector tinning according to claim 9, characterized in that: The side of the liquid crystal display (806) away from the lower polarizer (805) is connected to an upper polarizer (807), the side of the upper polarizer (807) away from the liquid crystal display (806) is connected to an OCA optical adhesive (808), and the side of the OCA optical adhesive (808) away from the upper polarizer (807) is connected to a cover plate (809).

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