Liquid cooling plate of computing power server, computing power liquid cooling unit, computing power server and data center

Abstract

The utility model provides a liquid cooling plate of a computing power server, a computing power liquid cooling unit, a computing power server and a data center, the liquid cooling plate comprises a medium flow channel, heat dissipation fins and a flow guide structure, the medium flow channel is provided with a flow channel end wall, and the flow channel end wall is provided with a medium port; the heat dissipation fins are arranged in the medium flow channel and located between the two flow channel end walls, and the medium flow channel is divided into a plurality of sub flow channels. A flow guide structure is arranged between at least one flow channel end wall and the heat dissipation fins, and the flow guide structure, the flow channel end wall on the side where the flow guide structure is located and the heat dissipation fins are arranged at intervals. The flow guide structure comprises a first flow guide plate and a second flow guide plate which are oppositely arranged, the first flow guide plate and the second flow guide plate protrude in the opposite directions, a gap is reserved between the first flow guide plate and the second flow guide plate in the width direction of the medium flow channel, and the size of the gap close to the end wall of the flow channel is smaller than that of the gap close to the cooling fins. According to the utility model, the uniformity of the medium in the liquid cooling plate in the width direction of the flow channel can be improved, and the computing power chips at all positions are improved.

Description

Technical Field

[0001] The utility model relates to the technical field of liquid cooling, in particular to a liquid cooling plate of a computing power server, a computing power liquid cooling unit, a computing power server and a data center. Background Art

[0002] With the development of technology, more and more electronic devices are cooled by liquid cooling to solve their heat dissipation problems. For example, servers used for large computing volumes have a large number of computing power chips. When working, these computing power chips generate a large amount of heat. If the heat is not conducted out in time, it will affect the performance and service life of each chip, and even cause the device to crash and the system to collapse. In the prior art, although some have used liquid cooling plates to dissipate heat from computing power chips, and even added heat dissipation fins in the flow channels of the liquid cooling plates, still, the high requirements for temperature consistency of each computing power chip in a large computing volume server cannot be met. Summary of the Utility Model

[0003] Based on the above situation, the main purpose of the utility model is to provide a liquid cooling plate of a computing power server, a computing power liquid cooling unit, a computing power server and a data center, which can increase the uniformity of the medium in the flow channel width direction of the liquid cooling plate and improve each computing power chip.

[0004] To achieve the above purpose, the technical solution adopted by the utility model is as follows:

[0005] In the first aspect of the utility model, a liquid cooling plate of a computing power server is provided. The computing power server includes a computing power board and the liquid cooling plate. The computing power board is installed on the outer surface of the liquid cooling plate. The computing power board includes a substrate and a plurality of computing power chips. The plurality of computing power chips form multiple rows of chip groups on the same surface of the substrate. The liquid cooling plate includes a medium flow channel, heat dissipation fins and a flow guiding structure. The medium flow channel is correspondingly arranged with the chip group. The medium flow channel has flow channel end walls at both ends of its extending direction, and a medium port is arranged on the flow channel end wall. The heat dissipation fins are arranged in the medium flow channel and are located between the two flow channel end walls, dividing the medium flow channel into multiple sub-flow channels;

[0006] The flow guiding structure is arranged at least between one of the flow channel end walls and the heat dissipation fins. The flow guiding structure and the flow channel end wall and the heat dissipation fins on its side are all arranged at intervals;

[0007] Wherein, the flow guiding structure includes a first flow guiding plate and a second flow guiding plate which are oppositely arranged. The first flow guiding plate and the second flow guiding plate protrude in opposite directions, and there is an interval between the two in the width direction of the medium flow channel. The size of the interval near the flow channel end wall is smaller than the size near the heat dissipation fins.

[0008] Optionally, both the first deflector and the second deflector include a first straight plate segment and a second straight plate segment connected by bending. The first straight plate segment is closer to the medium port, and the two first straight plate segments are farther from the side wall of the flow channel at one end closer to the end wall of the flow channel than at the other end; the two second straight plate segments are arranged in parallel.

[0009] Optionally, in the extending direction, the size of the first straight plate segment is larger than that of the second straight plate segment.

[0010] Optionally, the included angle between the two first straight plate segments is 45° - 75°.

[0011] Optionally, on the side of the flow guiding structure closer to the medium port, the distance between the first deflector and the second deflector is 1 / 3 - 1 / 2 of the maximum width of the medium port, and the width of the medium port refers to its dimension in the width direction of the medium flow channel.

[0012] Optionally, both the first deflector and the second deflector are curved plates.

[0013] Optionally, in the first deflector and the second deflector, the end faces closer to the end wall of the flow channel and the two opposite side faces are all smoothly transitioned.

[0014] Optionally, the flow guiding structure further includes a third deflector, and the third deflector is located between the first deflector and the second deflector.

[0015] Optionally, one of the medium ports is a liquid inlet, and the flow guiding structure is arranged at the liquid inlet. A plurality of heat dissipation fins are arranged side by side in the width direction of the medium flow channel, and one ends of the heat dissipation fins closer to the liquid inlet are flush.

[0016] Optionally, a plurality of heat dissipation groups are arranged at intervals of the plurality of heat dissipation fins in the extending direction, and each heat dissipation group includes a plurality of the heat dissipation fins;

[0017] The medium flow channel includes a plurality of sub - sections connected in sequence. In the sub - section where the liquid inlet is located, the distance between the heat dissipation group closest to the flow guiding structure and the flow guiding structure, and the distance between the two heat dissipation groups closest to the flow guiding structure are both greater than the distance between any other two adjacent heat dissipation groups.

[0018] The second aspect of the present utility model provides a computing power liquid cooling unit, including the liquid cooling plate as described in any one of the above.

[0019] Optionally, it further includes a computing power board, and the computing power board is installed on the outer side surface of the liquid cooling plate;

[0020] The housing of the liquid cooling plate includes a bottom case and a cover plate that are covered with each other. The bottom case includes a bottom plate, a case wall protruding from the bottom plate, and a partition strip. The partition strip is located inside the case wall. The partition strip, the case wall, the bottom plate, and the cover plate form the medium flow channel. A plurality of positioning posts are provided on at least part of the partition strip and the case wall, and a first mounting hole is provided on the positioning post. A positioning hole corresponding to the positioning post is provided on the cover plate. The heat dissipation fins and the flow guiding structure are both provided on the bottom plate.

[0021] A second mounting hole corresponding to the first mounting hole is provided on the computing power board.

[0022] The cover plate covers the bottom plate. The corresponding positioning posts and the positioning holes are in positioning cooperation. The computing power board is locked to the bottom case by a spring screw in cooperation with the corresponding first mounting hole. Wherein, both ends of the spring of the spring screw are respectively located between the screw head and the computing power board.

[0023] Optionally, the positioning posts are provided on two first sections opposite to each other in the width direction of the case wall, and a positioning boss is further provided on a second section connecting the two first sections. A positioning notch is provided on the corresponding edge of the cover plate, and the positioning boss and the positioning notch are in positioning cooperation.

[0024] Optionally, the computing power board includes a substrate, a plurality of computing power chips, a power supply interface, and a signal interface. The plurality of computing power chips are arranged on the same surface of the substrate and are attached to the liquid cooling plate. The power supply interface and the signal interface are arranged at the same edge of the substrate and are both electrically connected to the computing power chips.

[0025] The third aspect of the present invention provides a computing power server, including the computing power liquid cooling unit described in any one of the above.

[0026] The fourth aspect of the present invention provides a data center, including the computing power server described above.

[0027] For the liquid cooling plate of the present utility model, by arranging a flow guiding structure between the medium port and the heat dissipation fins, and making the two flow guiding plates of the flow guiding structure protrude in opposite directions, and the distance between the two flow guiding plates is smaller at one end close to the medium port than at the other end, it can enable the medium flow between the medium port and the heat dissipation fins to be better divided into each sub-flow channel formed by the heat dissipation fins, or better converge from each sub-flow channel to the medium port, thereby ensuring the consistency of the flow velocity and temperature of the medium flow in the width direction of the medium flow channel, improving the heat dissipation performance of the entire liquid cooling plate. When it is installed with the computing power board, it ensures that the temperatures of each computing power chip in the width direction at the same position on the medium flow channel can be as consistent as possible, improving the performance of the computing power board and extending its service life. At the same time, the flow guiding structure of the present utility model forms a buffer zone with the space between the medium port and the heat dissipation fins, thereby avoiding the turbulence problem caused by sudden flow channel changes, reducing the air in the medium flow, and further improving the heat dissipation performance of the liquid cooling plate.

[0028] Other beneficial effects of the present utility model will be described by introducing specific technical features and technical solutions in the specific implementation manner. Those skilled in the art should be able to understand the beneficial technical effects brought by the described technical features and technical solutions through these introductions. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] The preferred embodiments of the present utility model will be described below with reference to the accompanying drawings.

[0030] Figure 1 It is a schematic structural diagram of a preferred embodiment of the liquid cooling plate provided by the present utility model;

[0031] Figure 2 It is a partial structural schematic diagram of a preferred embodiment of the bottom shell in the liquid cooling plate provided by the present utility model;

[0032] Figure 3 It is a schematic structural diagram of a preferred embodiment of the flow guiding structure in the liquid cooling plate provided by the present utility model;

[0033] Figure 4 It is a schematic structural diagram of another preferred embodiment of the flow guiding structure in the liquid cooling plate provided by the present utility model;

[0034] Figure 5 It is a schematic structural diagram of yet another preferred embodiment of the flow guiding structure in the liquid cooling plate provided by the present utility model;

[0035] Figure 6 It is a schematic structural diagram of a preferred embodiment of the computing power liquid cooling unit provided by the present utility model;

[0036] Figure 7 It is an exploded view of another preferred embodiment of the computing power liquid cooling unit provided by the present utility model;

[0037] Figure 8 is Figure 6 a sectional view of the illustrated embodiment.

[0038] In the figure:

[0039] 10. Liquid cooling plate; 11. Medium flow channel; 111. Flow channel end wall; 1111. Medium port; 112. Flow channel side wall; 113. Bottom wall; 114. Sub-section; 12. Heat dissipation fins; 121. First heat dissipation group; 122. Second heat dissipation group; 123. Third heat dissipation group; 13. Flow guiding structure; 131. First flow guiding plate; 1311. First straight plate section; 1312. Second straight plate section; 132. Second flow guiding plate; 133. Third flow guiding plate; 14. Housing; 141. Bottom case; 1411. Bottom plate; 1412. Case wall; 1413. Partition bar; 1414. Positioning post; 1415. Positioning boss; 142. Cover plate;

[0040] 20. Computing power board; 21. Substrate; 22. Computing power chip; 23. Power supply interface; 24. Signal interface;

[0041] 30. Spring screw. Detailed implementation manners

[0042] The following describes the present utility model based on embodiments, but the present utility model is not limited to these embodiments. In the following detailed description of the present utility model, some specific detail parts are described in detail. In order to avoid obscuring the essence of the present utility model, well-known methods, processes, flows, and components are not described in detail.

[0043] In addition, those of ordinary skill in the art should understand that the drawings provided herein are for illustrative purposes only, and the drawings are not necessarily drawn to scale.

[0044] Unless the context clearly requires otherwise, the words such as "including", "comprising", etc. throughout the specification and claims should be interpreted as having the meaning of including rather than exclusive or exhaustive; that is, the meaning of "including but not limited to".

[0045] In the description of the present utility model, it should be understood that the terms "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying relative importance. In addition, in the description of the present utility model, unless otherwise specified, the meaning of "a plurality of" is two or more.

[0046] For the convenience of description, a rectangular coordinate system is established with the extension direction X, width direction Y, and depth direction Z of the medium flow channel in the liquid cooling plate. It should be noted that the extension direction X and width direction Y of the medium flow channel described herein refer to the extension direction of the medium flow channel at the described position.Figure 2 Only the extension direction X and the width direction Y at the sub-section 114 are shown. At the connecting section connecting the sub-sections, the extension direction is a bending direction, and the width direction Y is the radial direction of the connecting section. The setting of this coordinate system is only for convenience of description and does not specifically limit the use state of the liquid cooling plate. In use or placement, the corresponding direction can be determined according to the state of the liquid cooling plate.

[0047] The present utility model provides a liquid cooling plate 10, which can be used to dissipate heat from heat-generating devices of electronic devices, such as computing power chips. Specifically, when used in a computing power server, it can dissipate heat from the heat-generating components, i.e., computing power chips, on its computing power board. Among them, the computing power server includes a computing power board 20 and a liquid cooling plate. The computing power board 20 is installed on the outer surface of the liquid cooling plate. The computing power board 20 includes a substrate 21 and a plurality of computing power chips 22. The plurality of computing power chips 22 form multiple rows of chip groups on the same surface of the substrate 21. The specific structure of the computing power board 20 will be described in detail below.

[0048] Reference Figures 1-5 , the liquid cooling plate 10 includes a medium flow channel 11, heat dissipation fins 12 and a diversion structure 13. The medium flow channel 11 is correspondingly arranged with the chip group. The medium flow channel 11 has flow channel end walls 111 at both ends of its extension direction X, and a medium port 1111 is arranged on the flow channel end wall 111; the heat dissipation fins 12 are arranged in the medium flow channel 11 and are located between the two flow channel end walls 111. It extends along the extension direction X of the medium flow channel 11 and divides the medium flow channel 11 where it is located into multiple sub-flow channels. The multiple sub-flow channels are arranged side by side in the width direction Y of the medium flow channel 11. At least a diversion structure 13 is arranged between one of the flow channel end walls 111 and the heat dissipation fins 12, and there is a gap between the diversion structure 13 and the flow channel end wall 111 and the heat dissipation fins 12 on its side. As Figure 2 shown, one flow channel end wall 111 of the medium flow channel 11 is denoted as the first flow channel end wall, and the other flow channel end wall 111 is denoted as the second flow channel end wall. One end of the heat dissipation fins 12 close to the first flow channel end wall is the first heat dissipation end, and one end close to the second flow channel end wall is the second heat dissipation end. A diversion structure 13 can be arranged only between the first flow channel end wall and the first heat dissipation end, and there is a distance between the diversion structure 13 and the first flow channel end wall and the first heat dissipation end, that is, the diversion structure 13 is not in contact with the first flow channel end wall and the first heat dissipation end; or a diversion structure 13 can be arranged only between the second flow channel end wall and the second heat dissipation end, and there is a distance between the diversion structure 13 and the second flow channel end wall and the second heat dissipation end, that is, the diversion structure 13 is not in contact with the second flow channel end wall and the second heat dissipation end; or a diversion structure 13 can be arranged between the first flow channel end wall and the first heat dissipation end and between the second flow channel end wall and the second heat dissipation end at the same time. Of course, the diversion structure 13 is not in contact with any flow channel end wall 111 and the heat dissipation fins 12.

[0049] Continue to refer toFigures 2-5 , the flow guiding structure 13 includes a first flow guiding plate 131 and a second flow guiding plate 132 which are oppositely arranged. The first flow guiding plate 131 and the second flow guiding plate 132 protrude in opposite directions, and there is a gap between them in the width direction Y of the medium flow channel 11. The size of this gap near the flow channel end wall 111 is smaller than that near the heat dissipation fins. That is to say, the distance between the first flow guiding plate 131 and the second flow guiding plate 132 changes in the width direction Y. This distance becomes larger along the direction from the flow channel end wall 111 to the heat dissipation fins 12. That is, the first flow guiding plate 131 and the second flow guiding plate 132 form a structure similar to a horn shape. The opening of this structure similar to a horn shape is smaller at the first end of the flow guiding structure 13 near the medium port 1111 than at the second end near the heat dissipation fins 12. That is, at the first end, the distance between the first flow guiding plate 131 and the second flow guiding plate 132 is smaller, and they do not intersect on the side near the medium port 1111, but leave this smaller distance. At the second end, the distance between the first flow guiding plate 131 and the second flow guiding plate 132 is larger.

[0050] For the liquid cooling plate 10 of the present utility model, by arranging the flow guiding structure 13 between the medium port 1111 and the heat dissipation fins 12, and making the two flow guiding plates (i.e., the first flow guiding plate 131 and the second flow guiding plate 132) of the flow guiding structure 13 protrude in opposite directions, and the distance between the two flow guiding plates is smaller at one end near the medium port 1111 than at the other end, it can enable the medium flow between the medium port 1111 and the heat dissipation fins 12 to be better diverted into the sub-flow channels formed by the heat dissipation fins 12, or better converge from the sub-flow channels to the medium port 1111, thereby ensuring the consistency of the flow velocity and temperature of the medium flow in the width direction Y of the medium flow channel 11, improving the heat dissipation performance of the entire liquid cooling plate 10. When the liquid cooling plate 10 is installed with the computing power plate 20 (refer to Figure 6 ), it ensures that the temperatures of the computing power chips 22 at the same position in the width direction Y of the medium flow channel 11 can be as consistent as possible, improves the performance of the computing power plate 20, and extends its service life. At the same time, the space between the flow guiding structure 13 of the present utility model and the medium port 1111 and the heat dissipation fins 12 forms a buffer zone, thereby avoiding the turbulence problem caused by sudden flow channel changes, reducing the air in the medium flow, and further improving the heat dissipation performance of the liquid cooling plate 10.

[0051] The medium flow channel 11 also has two flow channel side walls 112, a bottom wall 113 and a top wall (not shown in the figure) extending along itself. Two flow channel end walls 111 are perpendicular to the extension direction X. The two flow channel side walls 112 are parallel to the extension direction X. Each flow channel side wall 112 connects the two flow channel end walls 111. The top wall and the bottom wall 113 are oppositely arranged in the height direction. The flow channel end walls 111 and the flow channel side walls 112 are connected to the bottom wall 113 along the edge of the bottom wall 113 and are also connected to the top wall along the edge of the top wall, so that the medium flow channel 11 is formed by enclosing with the two flow channel end walls 111, the two flow channel side walls 112, the bottom wall 113 and the top wall. The diversion structure 13 (including a first diversion plate 131 and a second diversion plate 132) and the heat dissipation fins 12 can be connected to the bottom wall 113, and they can be in contact with the top wall at the same time or there can be a gap between them and the flow channel top wall. The heat dissipation fins 12 can also be directly arranged on the flow channel bottom wall 143 and be in contact with the flow top wall or there can be a gap between them and the flow channel top wall. Among them, among the two flow channel end walls 111, the medium port 1111 on one flow channel end wall 111 is the liquid inlet, and the medium port 1111 on the other flow channel end wall 111 is the liquid outlet, so that the medium enters the medium flow channel 11 through the liquid inlet and then flows out from the liquid outlet.

[0052] Among them, the medium flow channel 11 can include a plurality of sub-sections 114. Each sub-section can be arranged side by side in the width direction Y and be connected in sequence, that is, these sub-sections 114 are connected in series. The outlet end of one sub-section is the inlet end of the adjacent other sub-section. Among them, the ends of the two sub-sections 114 at the head and the tail form the flow channel end walls 111. Each sub-section 114 corresponds to at least one row of chip sets, that is, each sub-section 114 can dissipate heat for the corresponding one row or multiple rows of chip sets.

[0053] There is a distance between the diversion structure 13 and the two flow channel side walls 112. In this way, the medium flow is divided into a part located between the two first diversion plates 131 and the second diversion plate 132, a part located between the first diversion plate 131 and the flow channel side wall 112 on its same side, and a part located between the second diversion plate 132 and the flow channel side wall 112 on its same side.

[0054] Specifically, the first diversion plate 131 and the second diversion plate 132 are respectively located on both sides of the central plane of the medium flow channel 11, that is, the first diversion plate 131 and the second diversion plate 132 are symmetrically distributed about the central plane, forming a structure similar to a horn shape. Among them, the central plane of the medium flow channel 11 refers to a plane parallel to the extension direction X at its position and passing through the center line of the width direction Y of the medium flow channel 11. The first diversion plate 131 and the second diversion plate 132 can be curved panels respectively or can be bent plates formed by bending flat plates respectively. No matter which structure they are, the first diversion plate 131 and the second diversion plate 132 both protrude towards the side away from the central plane.

[0055] In one embodiment, Figure 3 As shown, the first guide plate 131 and the second guide plate 132 both include a first straight plate segment 1311 and a second straight plate segment 1312 connected by bending, the first straight plate segment 1311 is closer to the medium port 1111, and the two first straight plate segments 1311 are farther away from the flow channel side wall 112 at one end close to the flow channel end wall 111 than at the other end; the two second straight plate segments 1312 are arranged in parallel. Figure 2 As shown, the first straight plate segment 1311 and the second straight plate segment 1312 are both plane plates, and the first straight plate segment 1311 is tilted relative to the extension direction X, that is, the end of the first straight plate segment 1311 close to the medium port 1111 is closer to the center plane of the medium flow channel 11 than the other end, and the distance between the two first straight plate segments 1311 gradually increases along the direction of the flow channel end wall 111 pointing to the heat sink fins 12, so that the two first straight plate segments 1311 form a structure with a smaller opening at one end close to the medium port 1111 and a larger opening at one end away from the medium port 1111, and the two second straight plate segments 1311 are arranged in a plane shape. Segment 1312 is located at a position with a larger opening, and the distance between the two second straight plate segments 1312 remains unchanged in the extension direction X, that is, the two second straight plate segments 1312 are arranged in parallel. Furthermore, the two second straight plate segments 1312 are parallel to the extension direction X. In this way, after the diversion by the first straight plate segment 1311, the medium flow can continue to be guided to a direction parallel to the extension direction X through the second straight plate segment 1312, thereby reducing the resistance to the medium flow and avoiding turbulence as much as possible, thereby further improving the temperature consistency of each computing power chip located at the same position in the width direction Y of the medium flow channel 11.

[0056] Preferably, the first straight plate section 1311 and the second straight plate section 1312 have a smooth transition. In one embodiment, the length of the first straight plate section 1311 is greater than that of the second straight plate section 1312, so that the medium flow has sufficient diversion distance to achieve a better flow balancing effect. Furthermore, the angle A between the first straight plate section 1311 and the second straight plate section 1312 is 45° to 75°, referring to Figure 3, such as the included angle A being 45°, 50°, 55°, 60°, 65°, 70° or 75°, etc. Preferably, the included angle A is 60°. In this way, when the flow guiding structure 13 is located on the liquid inlet side, it will not cause the medium flow to be too dispersed during flow guiding, so as to avoid too large an impact of part of the medium flow on the side wall 112 of the flow channel and generate bubbles, and at the same time, it can enable the medium flow to better enter the sub-channels formed by each heat dissipation fin 12 after being shunted; when the flow guiding structure 13 is located on the liquid outlet side, it can enable the medium flow flowing out of each sub-channel to enter the outlet through the internal space of the flow guiding structure 13 as much as possible, and can also avoid turbulence due to the change of the flow channel at the flow guiding structure 13, and can enable part of the medium flow between the flow guiding structure 13 and the side wall 112 of the flow channel to smoothly enter the outlet under the guidance of the outer wall of the flow guiding structure 13, and minimize the collision with the end wall 111 of the flow channel.

[0057] Further, on the side of the flow guiding structure 13 close to the medium port 1111, the distance between the first flow guiding plate 131 and the second flow guiding plate 132 is 1 / 3 to 1 / 2 of the maximum width of the medium port 1111, that is, the minimum distance between the first flow guiding plate 131 and the second flow guiding plate 132 is 1 / 3 to 1 / 2 of the maximum width of the medium port 1111, such as 0.33 times, 0.34 times, 0.36 times, 0.38 times, 0.4 times, 0.43 times, 0.45 times, 0.48 or 0.5 times of the maximum width of the medium port 1111, so as to further improve the flow equalizing effect of the flow guiding structure 13. Wherein, the width of the medium port 1111 refers to its dimension in the width direction of the medium flow channel. When the medium port 1111 is a circular hole, its maximum width is the diameter of the circular hole.

[0058] In another embodiment, both the first flow guiding plate 131 and the second flow guiding plate 132 are curved plates, such as Figure 4 shown, the two relatively large surfaces (i.e., the surfaces that play a flow guiding role) of the curved plate are curved surfaces, such as circular arc plates, elliptical arc plates, parabolic plates, hyperbolic plates, or free curved plates, etc. Of course, it can also be other curved plates. Among them, the circular arc plate means that the curved surface of the curved plate is an arc surface, the elliptical arc plate refers to the part of the curved surface of the curved plate that is an ellipse surface, the parabolic plate refers to the part of the curved surface of the curved plate that is a parabolic surface, the hyperbolic plate refers to the part of the curved surface of the curved plate that is a hyperbolic surface, and the free curved plate refers to the part of the curved surface of the curved plate that is a free curved surface.

[0059] Among them, at the end faces of the first flow guiding plate 131 and the second flow guiding plate 132 close to the medium port 1111, fillets are provided, and the end faces of the first flow guiding plate 131 and the second flow guiding plate 132 are smoothly transitioned with the two opposite side faces, that is, the end face of the first flow guiding plate 131 and its two flow guiding faces are smoothly transitioned, and the end face of the second flow guiding plate 132 and its two flow guiding faces are smoothly transitioned, such as Figures 3-5 shown, in this way, the resistance to the medium flow can be further reduced.

[0060] In yet another embodiment, the flow guiding structure 13 further includes a third flow guiding plate 133. The third flow guiding plate 133 is located between the first flow guiding plate 131 and the second flow guiding plate 132. By adding the third flow guiding plate 133, the medium flow can be better dispersed (when located on the liquid inlet side) or gradually converged (when located on the liquid outlet side) in the flow guiding structure 13. Further, only one third flow guiding plate 133 may be provided, or multiple third flow guiding plates 133 may be provided. When multiple third flow guiding plates 133 are provided, the number of the third flow guiding plates 133 is less than the number of the heat dissipation fins 12 in the width direction of the medium flow channel 11 minus 2, so that the number of sub-channels formed at the flow guiding structure 13 is less than the number of sub-channels formed at the heat dissipation fins 12.

[0061] Specifically, the number of sub-channels formed by the flow guiding structure 13 can be selected according to the arrangement of the components to be cooled. For example, when the components to be cooled (specifically, the computing power chips described below) are arranged in multiple columns, when one sub-section corresponds to 3 columns of components to be cooled, only the first flow guiding plate 131 and the second flow guiding plate 132 may be provided; when one sub-section corresponds to more columns of components to be cooled, one or two third flow guiding plates 133 may also be provided.

[0062] In the width direction of the medium flow channel 11, only one heat dissipation fin 12 may be provided, or multiple heat dissipation fins 12 may be provided. When multiple heat dissipation fins 12 are provided, the multiple heat dissipation fins 12 are spaced apart in the width direction Y of the medium flow channel 11, and there is also a gap between the two outermost heat dissipation fins 12 and the channel side wall 112. The medium flow channel 11 is divided into multiple sub-channels by the heat dissipation fins 12.

[0063] In the extending direction X, the multiple heat dissipation fins 12 may form a heat dissipation group, or may be spaced apart to form multiple heat dissipation groups. Each heat dissipation group includes multiple heat dissipation fins 12 spaced apart in the width direction Y. In the embodiment where only one heat dissipation group is formed, each heat dissipation fin 12 in this heat dissipation group extends from a position close to the liquid inlet to a position close to the liquid outlet and is arranged substantially along the entire medium flow channel 11. In the embodiment where multiple heat dissipation groups are formed, as Figure 2 shown, a first heat dissipation group 121, a second heat dissipation group 122, and a third heat dissipation group 123. The multiple heat dissipation groups are spaced apart along the extending direction X. Each heat dissipation group includes multiple heat dissipation fins 12 spaced apart in the width direction Y. Each heat dissipation fin 12 in each heat dissipation group is only arranged along a partial area of the medium flow channel 11. When the medium flow channel 11 includes multiple sub-sections 114 connected by bending, multiple heat dissipation groups may be provided in each sub-section 114. By such multiple heat dissipation groups arranged at intervals, the possibility of the medium flow generating turbulence can be reduced, thereby avoiding the influence of bubbles caused by the turbulence phenomenon on the heat transfer performance of the medium flow, and further improving the heat dissipation performance of the entire liquid cooling plate 10.

[0064] In one embodiment, a flow guiding structure 13 is provided at the liquid inlet. A plurality of heat dissipation fins 12 are arranged side by side in the width direction Y of the medium flow channel 11, and one ends of the heat dissipation fins 12 close to the liquid inlet are flush. As Figure 2 shown, the medium port in the upper left of the figure is the medium inlet. Near this medium inlet, one ends of the plurality of heat dissipation fins 12 close to the flow guiding structure 13 are flush, and the distances from one ends of the heat dissipation fins 12 close to the flow guiding structure 13 to the flow guiding structure 13 are equal. When a plurality of heat dissipation groups are provided, it means that the ends of the heat dissipation fins 12 in the heat dissipation group adjacent to the flow guiding structure 13 are flush. In this way, the medium flow can be basically evenly distributed in the sub-channels formed by the plurality of heat dissipation fins 12 after passing through the flow guiding structure from the medium inlet, thereby better improving the flow equalization effect.

[0065] Continue to refer to Figure 2 , in the embodiment where a plurality of heat dissipation groups are provided and a flow guiding structure 13 is provided at the liquid inlet, in the sub-segment 114 of the medium flow channel 11 where the liquid inlet is located, the distance between the heat dissipation group closest to the flow guiding structure 13 and the flow guiding structure 13, and the distance between the two heat dissipation groups closest to the flow guiding structure 13 are both greater than the distances between other adjacent two heat dissipation groups. As Figure 2 shown, in the sub-segment 114 where the liquid inlet is located, the heat dissipation group closest to the flow guiding structure 13 is denoted as the first heat dissipation group 121, the heat dissipation group next closest to the flow guiding structure 13 is denoted as the second heat dissipation group 122, and the other heat dissipation groups located in the sub-segment 114 where the flow guiding structure 13 is located are denoted as the third heat dissipation groups 123. The distance between the flow guiding structure 13 and the first heat dissipation group 121 is the first distance (i.e., the distance between the two closest ends), the distance between the second heat dissipation group 122 and the third heat dissipation group 123 is the second distance (i.e., the distance between the two closest ends), and the distance between two adjacent third heat dissipation groups 123 is the third distance (i.e., the distance between the two closest ends). Then, both the first distance and the second distance are greater than the third distance. Further, the lengths of the two heat dissipation groups closest to the flow guiding structure 13 are less than the lengths of the other heat dissipation groups, that is, the lengths of the first heat dissipation group 121 and the second heat dissipation group 122 themselves are both less than the length of the third heat dissipation group 123. In this way, it is possible to further reduce the generation of turbulence in the vicinity of the heat dissipation fins 12 close to the liquid inlet, and it is possible to further increase the confluence effect of the flow guiding structure 13 at this position, thereby increasing the flow velocity of the entire medium flow.

[0066] As Figure 1 and Figure 2As shown, the liquid cooling plate 10 includes a housing 14. Inside the housing 14, the above-mentioned medium flow channel 11 is provided, that is, the inner cavity of the housing 14 forms a channel for the medium to flow through. The medium port 1111 penetrates the housing wall and communicates the medium flow channel 11 with the outside. Specifically, the housing 14 includes a bottom shell 141 and a cover plate 142 that cover each other. The bottom shell 141 includes a bottom plate 1411, and a housing wall 1412 and a partition strip 1413 protruding from the bottom plate 1411. The housing wall 1412 has an annular structure. The partition strip 1413 is located inside the housing wall 1412. One end of the partition strip 1413 is connected to the housing wall 1412, and there is a gap between the other end and the housing wall 1412. In this way, the partition strip 1413, the housing wall 1412, the bottom plate 1411, and the cover plate 142 enclose the medium flow channel 11. Among them, the flow channel end wall 111 is formed on the inner wall of the housing wall 1412, the flow channel side wall 112 is formed on the inner wall of the housing wall 1412 and the side wall of the partition strip 1413, the flow channel bottom wall 113 is formed on the inner surface of the bottom plate 1411, and the flow channel top wall is formed on the inner surface of the cover plate 142. Among them, the heat dissipation fins 12 and the flow guiding structure 13 are both arranged on the bottom plate 1411, and the heat dissipation fins 12, the flow guiding structure 13, and the bottom shell 141 can be integrally formed.

[0067] Reference Figure 2 , a plurality of positioning posts 1414 are provided on at least some sections of the partition strip 1413 and the housing wall 1412, and a first mounting hole is provided on the positioning post 1414; positioning holes corresponding to the positioning posts 1414 are provided on the cover plate 142; the cover plate 142 covers the bottom shell 141, and each positioning post 1414 is in positioning cooperation with the corresponding positioning hole. The cover plate 142 and the bottom shell 141 can also be connected by welding, specifically by brazing, so that the cover plate 142 and the bottom shell 141 form an integral structure. At the same time, the solder will fill the gap between the cover plate and the bottom shell to ensure that the medium does not leak in the medium flow channel 11.

[0068] Furthermore, positioning posts 1414 are provided on two first sections of the housing wall 1412 that are opposite to each other in the width direction Y, and a positioning boss 1415 is also provided on the second section connecting the two first sections; positioning notches are provided on the edge of the cover plate 142 corresponding to the first section, and the positioning boss 1415 is in positioning cooperation with the positioning notches. That is to say, the housing wall 1412 includes a first section and a second section. The first section extends along the extension direction X, and the second section extends in the width direction Y and connects the two first sections.

[0069] By increasing the positioning cooperation between the positioning posts 1414 and the positioning holes, and between the positioning boss 1415 and the positioning notches, the position accuracy of the cover plate 142 and the medium flow channel 11 can be further improved. Furthermore, the positioning accuracy of the computing power board 20 installed on the cover plate 142 and the medium flow channel 11 can be improved. As a result, all the computing power chips 22 on the computing power board 20 are located on the outer surface corresponding to the medium flow channel 11 of the housing 14, and the performance of the entire computing power liquid cooling unit is improved.

[0070] The utility model also provides a computing power liquid cooling unit, such as Figures 6-8 As shown, it includes the liquid cooling plate described in any one of the above embodiments.

[0071] The computing power liquid cooling unit also includes a computing power board 20, which includes a substrate 21 and a plurality of computing power chips 22. The plurality of computing power chips 22 are arranged on the same surface of the substrate 21. The computing power board 20 is installed on the outer side of the liquid cooling plate 10, that is, the outer surface corresponding to the medium flow channel 11. Specifically, the computing power board 20 is installed on at least one outer surface of the shell 14 that is away from the medium flow channel 11, such as only the computing power board 20 is installed on the side of the cover plate 142 away from the bottom plate 1411, or only the computing power board 20 is installed on the side of the bottom plate 1411 away from the cover plate 142. The computing power board 20 can also be installed on both surfaces at the same time, that is, two computing power boards 20 are installed, such as Figure 6 As shown, the two computing boards 20 and the liquid cooling plate 10 form a sandwich structure. In this way, the liquid cooling plate 10 can dissipate heat for the computing board 20, thereby making the temperature of each computing chip 22 on the computing board 20 as consistent as possible, thereby improving the working performance of the entire computing board 20.

[0072] Furthermore, each computing power chip 22 is bonded to the shell 14 (including direct bonding and indirect bonding), and corresponds to the area where the medium flow channel 11 is set on the shell 14, that is, the medium flow channel 11 and the computing power chip 22 are respectively located on both sides of the shell in the depth direction Z of the medium flow channel 11 of the shell 14. In this way, the thermal conductivity of the medium flow to the computing power chip 22 can be further increased.

[0073] Among them, multiple computing chips 22 are arranged into multiple columns of chipsets arranged along the width direction Y, and each chipset includes multiple computing chips 22 arranged at intervals along the extension direction X. Each column of chipsets is bonded to the area where the medium flow channel 11 is provided on the shell 14. When the medium flow channel 11 is provided with multiple sub-sections 114, the areas where the sub-sections 114 are provided on the shell 14 correspond to multiple columns of chipsets. At this time, each chipset can be bonded to the area where the sub-sections 114 are provided on the shell 14, and one sub-section 114 corresponds to multiple columns of chipsets at the same time. In this way, each sub-section 114 can conduct heat to multiple columns of chipsets at the same time, thereby improving the heat dissipation efficiency, and can also ensure that the temperatures of these chipsets corresponding to the same sub-section 114 in the width direction are kept as consistent as possible.

[0074] It can be understood that the computing board 20 also includes a power supply interface 23 and a signal interface 24. Multiple computing chips 22 are arranged on the same surface of the substrate 31 and are attached to the liquid cooling plate 10. The power supply interface 23 and the signal interface 24 are arranged at the same edge of the substrate 21 and are both electrically connected to the computing chip 22 for supplying power to the computing chip 22 and transmitting signals.

[0075] The computing power board 20 and the liquid cooling board 10 can be locked by screws, and the two can also be positioned by a positioning structure. In the embodiment where the computing power board 20 is installed on the side of the cover plate 142 away from the bottom plate 1411, preferably, the computing power board 20, the cover plate 142 and the bottom plate 1411 are locked by spring screws 30. The spring screw 30 includes a spring, a screw head and a screw rod connected to each other, and the spring is sleeved outside the screw rod. In the embodiment where the positioning posts 1414 are arranged on the bottom case 141, first mounting holes are arranged on each positioning post 1414; second mounting holes corresponding to the first mounting holes are arranged on the computing power board 20 (specifically, the substrate 21); the cover plate 142 is covered on the bottom case 141, and the corresponding positioning posts 1414 are in positioning fit with the positioning holes. The computing power board 20 is locked to the bottom case 141 through the spring screw 30 passing through the second mounting hole and cooperating with the corresponding first mounting hole. The two ends of the spring of the spring screw 30 respectively abut against the screw head and the computing power board 20. In this embodiment, when the computing power board 20 and the liquid cooling board 10 are installed, by adjusting the pressing force of the spring screw 30, each computing power chip 22 can be closely attached to the housing 14, improving the heat dissipation effect, and at the same time, without adding an additional limiting structure between the housing 14 and the computing power board 20, the damage to the computing power chip 22 caused by too large a pressing force between the computing power board 20 and the housing 14 can be avoided. Specifically, a plurality of spring screws 30 are respectively arranged on each partition bar 1413 and each housing wall 1412 to better enable each computing power chip 22 to be closely attached to the housing 14, improving the heat dissipation performance of the electronic device.

[0076] In the embodiment where the computing power board 20 is installed on the side of the bottom plate 1411 away from the cover plate 142, the computing power board 20 and the housing 14 can also be locked by spring screws 30. In this embodiment, the substrate 21 can be directly locked to the first mounting hole on the bottom plate 1411 through the second mounting hole 211 passing through it, and the two ends of the spring of the spring screw 30 respectively abut against the screw head and the substrate 21. In the embodiment where the computing power boards 20 are installed on both sides of the housing 14, the first mounting holes on the bottom case 141 can be through holes, as Figure 8 shown. Of course, in other embodiments, the first mounting holes can also be set as through holes.

[0077] The present utility model also provides a computing power server, including the computing power liquid cooling unit described in any of the above embodiments. The computing power server further includes a chassis, and the computing power liquid cooling unit is installed in the chassis. The medium port is connected with an interface adapter tube, and the interface adapter tube extends out of the chassis to facilitate communication with an external medium source.

[0078] The computing power server further includes a power supply unit. The power supply unit is installed in the chassis side by side with the computing power liquid cooling unit, and the power supply unit is electrically connected to the computing power board to supply power to the computing power board.

[0079] The present utility model further provides a data center, including the above-mentioned computing power server.

[0080] Those skilled in the art can understand that, on the premise of no conflict, the above-mentioned preferred solutions can be freely combined and superimposed.

[0081] It should be understood that the above embodiments are merely exemplary and not restrictive. Without departing from the basic principle of the present utility model, various obvious or equivalent modifications or substitutions made by those skilled in the art to the above details will be included within the scope of the claims of the present utility model.

Claims

1. A liquid cooling plate for a computing power server, the computing power server comprising a computing power board and the liquid cooling plate, the computing power board being mounted on the outer surface of the liquid cooling plate, the computing power board comprising a substrate and a plurality of computing power chips, the plurality of computing power chips forming a plurality of rows of chipsets on the same surface of the substrate; characterized in that: The liquid cooling plate includes a medium flow channel, a heat dissipation fin and a flow guide structure. The medium flow channel is arranged corresponding to the chipset. The medium flow channel has flow channel end walls at both ends of its extension direction. The flow channel end walls are provided with a medium port. The heat dissipation fin is arranged in the medium flow channel and between the two flow channel end walls, dividing the medium flow channel into a plurality of sub-flow channels. The flow guide structure is arranged between at least one of the flow channel end walls and the heat dissipation fins, and the flow guide structure and the flow channel end wall and the heat dissipation fins on the side thereof are arranged at intervals; Among them, the guide structure includes a first guide plate and a second guide plate arranged opposite to each other, the first guide plate and the second guide plate protrude in opposite directions, and there is a gap between them in the width direction of the medium flow channel, and the size of the gap near the end wall of the flow channel is smaller than the size near the heat dissipation fins.

2. The liquid cooling plate according to claim 1, characterized in that: The first guide plate and the second guide plate both include a first straight plate segment and a second straight plate segment that are bent and connected, the first straight plate segment is closer to the medium port, and the two first straight plate segments are farther away from the flow channel side wall at one end close to the flow channel end wall than at the other end; the two second straight plate segments are arranged in parallel.

3. The liquid cooling plate according to claim 2, characterized in that: In the extending direction, the size of the first straight plate segment is greater than the size of the second straight plate segment.

4. The liquid cooling plate according to claim 2, characterized in that: The angle between the two first straight plate sections is 45° to 75°.

5. The liquid cooling plate according to claim 1, characterized in that: The guide structure is on a side close to the medium port, and the distance between the first guide plate and the second guide plate is 1 / 3 to 1 / 2 of the maximum width of the medium port. The width of the medium port refers to its size in the width direction of the medium flow channel.

6. The liquid cooling plate according to claim 1, characterized in that: The first guide plate and the second guide plate are both curved plates.

7. The liquid cooling plate according to claim 1, characterized in that: In the first guide plate and the second guide plate, the end surface close to the end wall of the flow channel and the two opposite side surfaces of each plate are smoothly transitioned.

8. The liquid cooling plate according to claim 1, characterized in that: The guide structure further includes a third guide plate, and the third guide plate is located between the first guide plate and the second guide plate.

9. The liquid cooling plate according to claim 1, characterized in that: One of the medium ports is a liquid inlet, the flow guide structure is arranged at the liquid inlet, a plurality of heat sink fins are arranged side by side in the width direction of the medium flow channel, and one end of each heat sink fin close to the liquid inlet is flush.

10. The liquid cooling plate according to claim 9, characterized in that: The plurality of heat dissipation fins are arranged in a plurality of heat dissipation groups at intervals along the extension direction, and each heat dissipation group includes a plurality of heat dissipation fins; The medium flow channel includes a plurality of subsections connected in sequence. In the subsection where the liquid inlet is located, the distance between the heat dissipation group closest to the guide structure and the guide structure, and the distance between the two heat dissipation groups closest to the guide structure are both greater than the distance between the other two adjacent heat dissipation groups.

11. A computing power liquid cooling unit, characterized in that: The liquid cooling plate comprises the liquid cooling plate according to any one of claims 1 to 10.

12. The computing power liquid cooling unit according to claim 11, characterized in that: It also includes a computing board, which is installed on the outer side of the liquid cooling plate; The shell of the liquid cooling plate includes a bottom shell and a cover plate which cover each other, the bottom shell includes a bottom plate, a shell wall protruding from the bottom plate and a partition bar, the partition bar is located in the shell wall, and the partition bar, the shell wall, the bottom plate and the cover plate form the medium flow channel; a plurality of positioning posts are provided on at least part of the sections of the partition bar and the shell wall, and a first mounting hole is provided on the positioning post; a positioning hole corresponding to the positioning post is provided on the cover plate; the heat dissipation fins and the guide structure are both provided on the bottom plate; The computing board is provided with a second mounting hole corresponding to the first mounting hole; The cover plate is covered on the bottom plate, the corresponding positioning column is positioned and matched with the positioning hole, and the computing board is locked to the bottom shell by a spring screw matched with the corresponding first mounting hole, wherein the two ends of the spring of the spring screw are respectively located between the screw head and the computing board.

13. The computing power liquid cooling unit according to claim 12, characterized in that: The shell wall is provided with the positioning columns at two first sections opposite to each other in the width direction, and a positioning boss is also provided on the second section connecting the two first sections; the corresponding edge of the cover plate is provided with a positioning notch, and the positioning boss is positioned and matched with the positioning notch.

14. The computing power liquid cooling unit according to claim 11, characterized in that: The computing board includes a substrate, multiple computing chips, a power supply interface and a signal interface. The multiple computing chips are arranged on the same surface of the substrate and are attached to the liquid cooling plate; the power supply interface and the signal interface are arranged at the same edge of the substrate and are both electrically connected to the computing chips.

15. A computing power server, characterized in that: A computing power liquid cooling unit comprising the computing power liquid cooling unit as described in any one of claims 11-14.

16. A data center, characterized in that: Including the computing power server described in claim 15.

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