Medium flow channel, flow channel plate, liquid cooling server and data center

Abstract

The utility model provides a medium flow channel, a flow channel plate, a liquid cooling server and a data center. The medium flow channel comprises at least two sub-sections and a connecting section, wherein the at least two sub-sections are sequentially connected in a bending manner; the connecting section is used for connecting two adjacent sub-sections; a plurality of heat dissipation fins are arranged in each sub-section side by side, each heat dissipation fin extends in the extension direction of the sub-section where the heat dissipation fin is located, and each sub-section is divided into a plurality of sub-flow channels which are arranged side by side; the connecting section is provided with a flow guide structure, the flow guide structure comprises a convex curved plate, the convex curved plate protrudes towards the outer wall of a flow channel of the connecting section where the convex curved plate is located, and gaps are reserved between the convex curved plate and the cooling fins in the sub-sections located at the upstream and the downstream of the convex curved plate; wherein two opposite convex curved surfaces of the convex curved plate are arranged in parallel to form flow guide surfaces respectively. According to the utility model, the flow velocity and temperature uniformity of the medium flow in the width direction of the flow channel can be increased, so that the temperature consistency of heating chips at all positions can be improved.

Description

Technical Field

[0001] The utility model relates to the technical field of liquid cooling, in particular to a medium flow channel, a flow channel plate, a liquid-cooled server and a data center. Background Art

[0002] With the development of technology, more and more electronic devices use air cooling or liquid cooling to solve their heat dissipation problems. For example, servers with high computing power have a large number of heat-generating chips. When working, the heat generated by these heat-generating chips is very large. If the heat is not conducted out in time, it will affect the performance and service life of each chip, and even cause the device to crash and the system to collapse.

[0003] In the existing liquid cooling, some add heat dissipation fins in the flow channel of the liquid cooling plate to improve the heat dissipation effect on the heat-generating chips. However, the existing medium flow channel still cannot meet the high requirements for the temperature consistency of each heat-generating chip under a large amount of computation, especially the temperature consistency of the heat-generating chips in the width direction of the medium flow channel is poor. Summary of the Utility Model

[0004] Based on the above situation, the main purpose of the utility model is to provide a medium flow channel, a flow channel plate, a liquid-cooled server and a data center, which can increase the flow velocity and temperature uniformity of the medium in the width direction of the flow channel, so as to improve the temperature consistency of the heat-generating chips at each place.

[0005] To achieve the above purpose, the technical solution adopted by the utility model is as follows:

[0006] The first aspect of the utility model provides a medium flow channel for dissipating heat from the heat-generating chips on a circuit board, and the heat-generating chips on the circuit board are arranged in multiple rows; the medium flow channel includes at least two sub-sections connected in sequence by bending and a connection section connecting two adjacent sub-sections; each sub-section corresponds to at least one row of the heat-generating chips, and a plurality of heat dissipation fins are arranged side by side in each sub-section, and each heat dissipation fin extends along the extension direction of the sub-section where it is located, dividing the sub-section into a plurality of sub-flow channels arranged side by side;

[0007] The connection section is provided with a flow guiding structure, and the flow guiding structure includes a convex curved panel, the convex curved panel protrudes towards the flow channel outer wall of the connection section where it is located, and there is a gap between the convex curved panel and the heat dissipation fins in the upstream and downstream sub-sections; wherein, the two convex curved surfaces of the convex curved panel are arranged in parallel, respectively forming a flow guiding surface.

[0008] Optionally, the convex curved panel is an arc-shaped plate, and both flow guiding surfaces are arc-shaped surfaces.

[0009] Optionally, the convex curved panel is a parabolic panel, and both of the two guiding surfaces are parabolic surfaces.

[0010] Optionally, the two guiding surfaces of the convex curved panel are arranged in parallel, and are smoothly transitioned at the ends.

[0011] Optionally, the guiding structure includes a plurality of the convex curved panels arranged side by side and at intervals.

[0012] Optionally, the plurality of convex curved panels in the same guiding structure are arranged in parallel, and the lengths increase from inside to outside.

[0013] Optionally, a row of the heating chips forms a chip group, and there are multiple rows of chip groups corresponding to the same sub-section; the number of sub-channels formed by the plurality of convex curved panels in the same guiding structure dividing the connecting section is equal to the number of chip groups.

[0014] Optionally, in at least one set of interconnected connecting sections and two sub-sections, the two sub-sections are arranged side by side, and the guiding structures are respectively arranged on the upstream side and the downstream side of the connecting section.

[0015] Optionally, in the same connecting section, the length of the guiding structure on the upstream side is less than the length of the guiding structure on the downstream side.

[0016] Optionally, in the guiding structure on the upstream side, the included angle between the tangent plane at the upstream end of the same convex curved panel and the flow direction of the medium in the sub-section on the upstream side is less than or equal to 60°, and the included angle between the tangent plane at the downstream end and the tangent plane at the upstream end of the guiding structure on the downstream side is 90° - 180°; the included angle between the tangent plane at the upstream end and the tangent plane at the downstream end of the guiding structure on the downstream side is 90° - 180°, and the included angle between the tangent plane at the downstream end and the flow direction of the medium in the sub-section on the downstream side is less than or equal to 60°; and the minimum distance between each guiding structure and the outer wall of the flow channel of the connecting section where it is located is greater than or equal to one-third of the width of the flow channel at that place.

[0017] Optionally, a partition bar is arranged in the medium flow channel, one end of the partition bar is connected to the side wall of the flow channel, the other end is a free end, two adjacent sub-sections are separated by the partition bar, and are connected by the connecting section on the free end side; the two guiding structures are respectively located on both sides of the partition bar.

[0018] The second aspect of the present invention provides a flow channel plate for dissipating heat from the heating chips on a circuit board, and the medium flow channel as described in any one of the above is arranged in the flow channel plate.

[0019] The third aspect of the utility model provides a liquid cooling server, comprising a circuit board and the flow channel plate described above, wherein a plurality of heat generating chips are arranged on the circuit board, and the plurality of heat generating chips are arranged into a plurality of rows of chipsets on the circuit board, and each row of the chipsets comprises a plurality of heat generating chips arranged along the extension direction X of the sub-section; the circuit board is mounted on the flow channel plate, and each of the sub-sections corresponds to at least one row of the chipsets.

[0020] Optionally, each of the chipsets includes at least forty of the heat generating chips, and the heat generating chips of the same chipset are arranged in series, and the circuit board is arranged with at least eight rows of chipsets.

[0021] A fourth aspect of the present invention provides a data center, comprising a plurality of the liquid-cooled servers described above.

[0022] The medium flow channel of the utility model is provided with a convex curved plate at the connection of the two sub-sections, i.e., the connection section. Both guide surfaces of the convex curved plate are convex curved surfaces, and each guide surface is a smooth curved surface. Therefore, the medium flow can flow smoothly along the guide surface at the connection section, and the heat conduction effect can be avoided as much as possible due to the bubbles generated by the medium flow at the turning point, especially the heat conduction effect of the medium flow at the edge part close to the side wall of the flow channel, so that the heat conduction effect at various places in the width direction of the flow channel is as consistent as possible; and by adding the guide structure of the convex curved plate, the flow velocity at various places in the width direction of the flow channel can be made as consistent as possible, which is further conducive to the consistency of the heat conduction effect at various places in the width direction of the flow channel. When the medium flow channel is used to dissipate heat for the heat-generating chip, each sub-section corresponds to at least one row of heat-generating chips, so that the heat dissipation effect of each heat-generating chip in the width direction of the flow channel is as consistent as possible, the temperature consistency of each heat-generating chip in the width direction is improved, the working performance of the entire liquid cooling server is improved, and its service life is extended.

[0023] Other beneficial effects of the utility model will be explained through the introduction of specific technical features and technical solutions in the specific implementation manner. Through the introduction of these technical features and technical solutions, those skilled in the art should be able to understand the beneficial technical effects brought about by the technical features and technical solutions. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] The preferred embodiments of the present invention will be described below with reference to the accompanying drawings.

[0025] Figure 1 A schematic structural diagram of a preferred embodiment of the medium flow channel provided by the utility model;

[0026] Figure 2 A partial structural front view of a preferred embodiment of the medium flow channel provided by the utility model;

[0027] Figure 3 The structural schematic diagram of a preferred embodiment of the flow guiding structure in the medium flow channel provided by the present utility model;

[0028] Figure 4 The front view of a partial structure of another preferred embodiment of the medium flow channel provided by the present utility model;

[0029] Figure 5 The front view of a partial structure of still another preferred embodiment of the medium flow channel provided by the present utility model;

[0030] Figure 6 The structural schematic diagram of a preferred embodiment of the flow channel plate provided by the present utility model.

[0031] In the figure:

[0032] 10. Medium flow channel; 11. Sub-section; 12. Connection section; 121. Inner wall of the flow channel; 122. Outer wall of the flow channel; 13. Heat dissipation fins; 131. Sub-fragment; 14. Flow guiding structure; 141. Convex curved panel; 1411. Flow guiding surface; 1412. End face; 142. Connection surface; 15. Partition bar;

[0033] 20. Bottom shell; 21. Medium inlet; 22. Medium outlet;

[0034] 30. Cover plate. Detailed implementation manners

[0035] The following describes the present utility model based on embodiments, but the present utility model is not limited to these embodiments. In the following detailed description of the present utility model, some specific details are described in detail. In order to avoid obscuring the essence of the present utility model, well-known methods, processes, procedures, and components are not described in detail.

[0036] In addition, those of ordinary skill in the art should understand that the drawings provided herein are for illustrative purposes only, and the drawings are not necessarily drawn to scale.

[0037] Unless the context clearly requires otherwise, the words such as "including", "comprising" and the like in the whole specification and claims should be interpreted in an inclusive sense rather than an exclusive or exhaustive sense; that is, the meaning of "including but not limited to".

[0038] In the description of the present utility model, it should be understood that the terms "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying relative importance. In addition, in the description of the present utility model, unless otherwise specified, the meaning of "a plurality of" is two or more.

[0039] For convenience of description, a rectangular coordinate system is established with the extension direction X, width direction Y, and depth direction Z of a sub-segment of the medium flow channel. As Figure 1 shown, it should be noted that the setting of this coordinate system is only for convenience of description and does not specifically limit the usage state of the medium flow channel. In use or placement, the corresponding directions can be determined according to the state of the flow channel plate.

[0040] The present utility model provides a flow channel plate, which can be used for heat-generating devices of electronic equipment. Specifically, it can dissipate heat from heat-generating chips on a circuit board, such as heat-generating chips of a liquid-cooled server. Among them, the heat-generating chips on the circuit board are arranged in multiple rows. As Figure 6 shown, a medium flow channel 10 is provided inside the flow channel plate. Referring to Figures 1-5 , the medium flow channel 10 includes at least two sub-segments 11 connected in sequence by bending and connection segments 12 connecting adjacent two sub-segments 11. That is to say, multiple sub-segments 11 are connected together by multiple connection segments 12, so that these sub-segments 11 and connection segments 12 form a mutually connected medium flow channel 10. The medium flow channel 10 is bent and provided with turning points to change the direction of the medium flow. The medium flow channel 10 includes flow channel side walls. At the turning point, the flow channel side wall located on the radially inner side in the connection segment 12 is the flow channel inner wall 121, and the flow channel side wall located on the radially outer side is the flow channel outer wall 122. A plurality of heat dissipation fins 13 are arranged side by side in each sub-segment 11, and each heat dissipation fin 13 extends along the extension direction X of the sub-segment 11 where it is located. The plurality of heat dissipation fins 13 divide the sub-segment 11 into a plurality of sub-flow channels arranged side by side. The connection segment 12 is provided with a flow guiding structure 14. The flow guiding structure 14 includes a convex curved surface plate 141. The convex curved surface plate 141 protrudes towards the flow channel outer wall of the connection segment 11 where it is located, and there is a gap between the convex curved surface plate 141 and the heat dissipation fins 13 in the sub-segments 11 located upstream and downstream of it. Among them, the two convex curved surfaces of the convex curved surface plate 141 are arranged in parallel, respectively forming a flow guiding surface 1411. Both flow guiding surfaces 1411 are smooth curved surfaces and protrude towards the outer side in the radial direction at the turning point where they are located. When the medium flow channel dissipates heat from the heat-generating chips, each sub-segment 11 can at least correspond to one row of heat-generating chips (detailed below).

[0041] In the above-mentioned medium flow channel 10, a convex curved panel 141 is provided at the connection section 12 of the two sub-sections 11, that is, the connection section. Both diversion surfaces 1411 of the convex curved panel 141 are convex curved surfaces, and each diversion surface is a smooth curved surface. Therefore, at the connection section 12, the medium flow can smoothly flow along the diversion surfaces 1411, as much as possible to avoid the influence of bubbles generated at the turning of the medium flow on the heat conduction effect, especially the heat conduction effect of the edge part of the medium flow close to the side wall of the flow channel, so that the heat conduction effects at various positions in the flow channel width direction Y are as consistent as possible; and by increasing the diversion structure 14 of the convex curved panel 141, the flow velocities at various positions in the flow channel width direction Y can be made as consistent as possible, which is further conducive to the consistency of the heat conduction effects at various positions in the flow channel width direction Y; at the same time, by leaving a gap between the diversion structure 14 and the upstream and downstream heat dissipation fins 13, and not directly connecting them, it can not only make the medium flow smoothly, but also avoid the occurrence of turbulence at the turning to affect the heat conduction performance and flow velocity of the medium flow, so as to better improve the consistency of the flow velocity and temperature of the medium flow in the width direction at the turning. When the medium flow channel 10 is used for dissipating heat from the heating chips, the heat dissipation effects of the heating chips in the flow channel width direction Y can be made as the same as possible, improving the consistency of the temperatures of the heating chips in the width direction Y, improving the working performance of the entire liquid-cooled server, and extending its service life.

[0042] Specifically, the heat dissipation fins 13 are in the shape of strip plates. In each sub-section 11, two, three or more heat dissipation fins 13 can be provided, such as Figure 1 shown, five heat dissipation fins are provided in each sub-section 11. The spaces between two adjacent heat dissipation fins 13 in the width direction Y, the space between the innermost heat dissipation fin 13 and the inner wall of the flow channel of its sub-section, and the space between the outermost heat dissipation fin 13 and the outer wall of the flow channel of its sub-section 11 respectively form a sub-flow channel. In this way, a plurality of heat dissipation fins 13 arranged side by side in the same sub-section 11 divide the sub-section 11 into a plurality of sub-flow channels. In this way, the medium flow in the sub-section 11 can be squeezed by the plurality of heat dissipation fins 13, thereby increasing the flow velocity of the medium flow, increasing the heat exchange area, improving the heat exchange efficiency of the medium flow channel, and at the same time making the flow velocities of the medium flow at various positions in the width direction Y as consistent as possible.

[0043] Among them, the multiple sub-sections 11 can be arranged in parallel, that is, arranged side by side along their respective width directions Y, and their respective flow-through areas are equal, such as the width dimension in the width direction Y and the depth dimension in the depth direction Z are both equal. Further, the flow-through areas of the connection sections 12 are also equal and are basically equal to the flow-through areas of the sub-sections 11. The flow-through areas when removing the heat dissipation fins 13 in each sub-section 11 and the flow-through areas when removing the diversion structure 14 in each connection section 12 are equal.

[0044] Each heat dissipation fin 13 within the sub-section 11 can be one arranged over the entire area along the extension direction X of the sub-section 11, as Figure 1 shown, or can be multiple sub-fragments 131 arranged discontinuously, as Figure 4 , Figure 5 shown. In the same sub-section 11, multiple sub-fragments 131 of different heat dissipation fins 13 form multiple heat dissipation groups. A plurality of the heat dissipation groups are arranged at intervals along the extension direction X. Each heat dissipation group includes one sub-fragment 131 of a different heat dissipation fin 13. By means of the multiple sub-fragments arranged at intervals, the turbulent flow phenomenon in the sub-section 11 can be further avoided, and the heat dissipation performance and anti-noise ability of the entire medium flow channel can be improved.

[0045] Wherein, the two guiding surfaces 1411 of the same convex curved panel 141 are parallel to each other, that is, the convex curved panel 141 has an equal wall thickness structure, thereby increasing the consistency of the guiding effect on the medium flow at various positions in the width direction of the connection section 12 in the connection section 12.

[0046] Furthermore, the two guiding surfaces 1411 of the same convex curved panel 141 are smoothly transitioned at the ends. That is to say, the convex curved panel 141 has an end surface 1412 connecting the two guiding surfaces 1411, and this end surface 1412 is a smooth convex curved surface. That is, the two guiding surfaces 1411 and the end surface 1412 are smoothly connected. The same-side ends of the two guiding surfaces 1411 are non-acute-angle structures, and the two guiding surfaces are not connected by a plane perpendicular to these two guiding surfaces 1411 (i.e., the tangent plane of these two guiding surfaces). By adopting the convex curved panel 141 of this embodiment, the guiding effect of the medium flow at the connection section 12 can be further increased.

[0047] Specifically, the convex curved panel 141 can be various curved panels such as an arc-shaped plate, a parabolic plate, and a free curved panel. Among them, when the convex curved panel 141 is an arc-shaped plate, the two guiding surfaces are both arc-shaped surfaces; when the convex curved panel 141 is a parabolic plate, the two guiding surfaces are both parabolic surfaces; when the convex curved panel 141 is a free curved panel, the two guiding surfaces are both free curved surfaces. In a preferred embodiment, the convex curved panel 141 is an arc-shaped plate, which can be a circular arc plate or an elliptical arc plate, and is further preferably a circular arc plate, which can basically avoid the direct impact of the medium flow on the inner wall of the medium flow channel, and further increase the guiding effect of the convex curved panel 141 on the medium flow. Especially compared with setting a wedge-shaped structure at the bending connection, its guiding effect is particularly obvious.

[0048] The guiding structure 14 can only include one convex curved panel 141, as Figure 2As shown, the convex curved panel 141 can be basically arranged at the middle position in the width direction of the medium flow channel, that is, the distances between the two guiding surfaces 1411 and the side walls of the flow channel on the same side are basically equal. In one embodiment, the guiding structure 14 includes a plurality of convex curved panels 141 arranged side by side and at intervals, that is, a plurality of convex curved panels 141 are arranged side by side in the width direction of the medium flow channel. Specifically, the same guiding structure 14 can be provided with two convex curved panels 141, three convex curved panels 141 or more convex curved panels 141. These convex curved panels 141 divide the connecting section 12 into a plurality of sub-flow channels. Refer to Figure 4 , as shown in the figure, a guiding structure 14 is provided in the same connecting section 12. The guiding structure 14 includes two convex curved panels 141. The two convex curved panels 141 divide the connecting section 12 into three sub-flow channels. By arranging a plurality of convex curved panels 141, the flow velocity and temperature consistency of the medium flow at each part in the width direction at the connecting section 12 can be further increased, thereby improving the heat dissipation performance of the entire flow channel plate. Further, a plurality of convex curved panels 141 are evenly distributed in the width direction of the connecting section 12 so that the divided plurality of sub-flow channels are uniform.

[0049] In the embodiment where the guiding structure 14 includes a plurality of convex curved panels 141, the plurality of convex curved panels 141 are arranged in parallel, and the length increases from the inside to the outside. That is to say, among the plurality of convex curved panels 141, the convex curved panel 141 closest to the inner wall 121 of the flow channel has the smallest length, and the convex curved panel 141 closest to the outer wall 122 of the flow channel has the largest length. More preferably, the surface formed by connecting the same-side ends of the plurality of convex curved panels 141 is a plane. As shown by the dotted line in the figure, the connecting surface 142 is a plane, as Figure 5 shown. By adopting this structure, the guiding length of the guiding structure 14 for the medium flow in the relatively outer part of the connecting section 12 can be extended, thereby further reducing the air generated by the impact of this part of the medium flow and the outer wall 122 of the flow channel, so as to improve the heat conduction performance of the entire medium flow. Among them, the length of the convex curved panel 141 refers to the dimension of the convex curved panel 141 along its bending direction, and is also the length when the convex curved panel 141 is unfolded into a flat plate.

[0050] In order to improve the heat dissipation efficiency of the flow channel plate, when the flow channel plate is installed with the circuit board (not shown in the figure), multiple rows of chip groups (described in detail below) can correspond to the same sub-section. In this embodiment, preferably, the number of sub-channels formed by the multiple convex curved plates 141 in the same diversion structure 14 in the connection section 12 is equal to the number of chip groups. For example, when two rows of chip groups correspond to the same sub-section 11, one convex curved plate 141 can be provided in the same diversion structure 14 to divide the connection section 12 into two sub-channels; another example is when three rows of chip groups correspond to the same sub-section 11, two convex curved plates 141 can be provided in the same diversion structure 14 to divide the connection section 12 into three sub-channels. By forming sub-channels with the same number as the chip groups corresponding to the sub-section 11 at the connection section 12, it is possible to increase the flow velocity and temperature consistency of the medium flow corresponding to each chip group in the medium flow channel, and improve the heat dissipation effect consistency for each chip group. Among them, in the same sub-section 11, the number of sub-channels formed by the multiple heat dissipation fins 13 is preferably greater than the number of chip groups corresponding to the sub-section. For example, when three rows of chip groups correspond to the same sub-section 11, 5 heat dissipation fins 13 can be provided to divide the sub-section 11 into six sub-channels. In this way, while improving the heat dissipation efficiency of the circuit board, the extrusion of the medium flow by the heat dissipation fins 13 can be increased, thereby increasing the flow velocity of the medium flow, and the heat exchange area can also be increased to better improve the heat dissipation efficiency.

[0051] In the same connection section 12, only one diversion structure 14 can be provided, and this diversion structure can be arranged on the upstream side, downstream side, or a certain position in the middle of the connection section 12. In a preferred embodiment, the diversion structures 14 of any of the above embodiments are respectively arranged on the upstream side and downstream side of the same connection section 12. Preferably, there is a gap (described in detail below) between the two diversion structures 14. For example, Figure 5 As shown, in at least one group of interconnected connection sections 12 and two sub-sections 11, the two sub-sections 11 are arranged side by side. The diversion structures 14 are respectively arranged on the upstream side and downstream side of the connection section 12, and there is a gap between the two diversion structures 14, that is, the two diversion structures 14 are not adjacent to each other. Preferably, the number of convex curved plates 141 included in each of the two diversion structures is equal. This embodiment is particularly applicable to the embodiment where multiple sub-sections 11 are arranged side by side, which can increase the diversion effect of the upstream medium flow from the upstream sub-section 11 into the connection section 12 and from the connection section 12 into the downstream sub-section 11, and reduce the collision of the medium flow with the inner wall 121 and outer wall 122 of the flow channel, further improving the heat dissipation effect of the entire flow channel plate.

[0052] In an embodiment where the flow guiding structures 14 are provided on both the upstream side and the downstream side in the same connection section 11, preferably, the length of the flow guiding structure 14 on the upstream side is less than the length of the flow guiding structure on the downstream side, that is, the length of the convex curved panel 141 on the upstream side is less than the length of the convex curved panel 141 on the downstream side. By providing a flow guiding structure 14 with a larger length on the downstream side as much as possible, the guiding path of the medium flow is extended, so that the medium flow can enter the sub-section 11 on the downstream side more smoothly, enhancing the guiding effect of the entire medium flow and increasing the consistency of the flow velocity and temperature of each medium flow in the width direction at the same position.

[0053] In the flow guiding structure on the upstream side, the included angle between the tangent plane at the upstream end of the same convex curved panel 141 and the medium flow direction of the sub-section 11 on the upstream side is less than or equal to 60°, and the included angle between the tangent plane at the downstream end and the tangent plane at the upstream end of the flow guiding structure 14 on the downstream side is 90° - 180°; the included angle between the tangent plane at the downstream end of the flow guiding structure on the downstream side and the medium flow direction of the sub-section 11 on the downstream side is less than or equal to 60°. Refer to Figure 5 , in the figure, the flow guiding structure 14 on the upper side is the flow guiding structure 14 on the upstream side, and each convex curved panel 141 it includes is denoted as the upstream curved panel. The flow guiding structure 14 on the lower side in the figure is the flow guiding structure 14 on the downstream side, and each convex curved panel 141 it includes is denoted as the downstream curved panel. The included angle between the tangent plane at the upstream end of the upstream curved panel and the medium flow direction of the medium flow in the sub-section 11 on the upstream side is denoted as the first included angle A, the included angle between the tangent plane at the downstream end of the upstream curved panel and the tangent plane at the upstream end of the downstream curved panel is denoted as the second included angle B, and the included angle between the tangent plane at the downstream end of the downstream curved panel and the medium flow direction of the medium flow in the sub-section 11 on the downstream side is denoted as the third included angle C. Then, the first included angle A and the third included angle C are less than or equal to 60 degrees, such as 60°, 50°, 40°, 30°, 20°, 10°, 5° or 1°, etc., even 0°, that is, parallel, that is, the tangent plane at the upstream end of the upstream curved panel is parallel to the medium flow direction of the medium flow in the sub-section 11 on the upstream side, and the tangent plane at the downstream end of the downstream curved panel is parallel to the medium flow direction of the medium flow in the sub-section 11 on the downstream side; the second included angle B is 90° - 180°, such as 90°, 120°, 135°, 150° or 180°, etc. It should be noted that the first included angle A and the third included angle C can be equal or not equal. Among them, in an embodiment where each flow guiding structure includes a plurality of convex curved panels, in the same connection section 12, each upstream curved panel is arranged in parallel, and each downstream curved panel is arranged in parallel. Preferably, the tangent plane at the upstream end of the upstream curved panel is parallel to the medium flow direction of the medium flow in the sub-section 11 on the upstream side, and the tangent plane at the downstream end of the downstream curved panel is parallel to the medium flow direction of the medium flow in the sub-section 11 on the downstream side. By adopting this setting method, the flow guiding effect at the connection section 12 can be increased, and the flow velocity and heat dissipation of the entire medium flow can be improved.

[0054] Regardless of which of the above embodiments the diversion structure 14 is arranged in, in a preferred embodiment, the minimum distance between each diversion structure 14 and the outer wall 122 of the flow channel of the connection section 12 where it is located is greater than or equal to one-third of the width of the flow channel at this place. As Figure 5 shown, among the diversion structures 14 on the downstream side, the distance d between the upstream end of the outermost downstream curved panel and the outer wall of the flow channel of the connection section 12 at this place is the smallest, and this minimum distance d is greater than or equal to one-third of the width D of the flow channel at this place, such as d being equal to one-third D or one-half D, etc.

[0055] Wherein, a partition strip 15 is arranged in the medium flow channel 10. One end of the partition strip 15 is connected to the side wall of the flow channel, and the other end is a free end. As Figure 1 shown, two adjacent sub-sections 11 are separated by the partition strip 15 and are connected by the connection section 12 on the free end side. The two diversion structures 14 are located on both sides of the partition strip 15. Specifically, the connection section 12 includes a first connection segment, a second connection segment, and a third connection segment that are connected in sequence. The first connection segment and the second connection segment are respectively connected to the sub-sections 11 on the upstream side and the downstream side. The first connection segment can be formed by the upstream sub-section 11 extending along its medium flow direction (i.e., the extension direction X). The third connection segment is formed by the downstream sub-section 11 extending in the reverse direction of its medium flow direction. The second connection segment is located in the extension direction of the partition strip 15. An interval space is formed on the free end side of the partition strip 15 in the entire medium flow channel, and the two diversion structures 14 are separated by this interval space. By the two diversion structures arranged at intervals, the diversion effect can be improved in the connection section 12 while preventing the medium flow from generating turbulence between the two diversion structures, so as to further improve the heat dissipation performance and noise resistance of the flow channel plate.

[0056] Referring to Figure 6 , the flow channel plate includes a bottom shell 20 and a cover plate 30. The bottom shell 20 and the cover plate 30 are closed, and the medium flow channel 10 described in any of the above embodiments is formed inside. Specifically, the flow channel plate can be a rectangular plate-like structure. A plurality of sub-sections 11 extend along the length direction of the flow channel plate. The width direction of the sub-section 11 is the width direction of the flow channel plate, and the depth direction of the sub-section 11 is the thickness direction of the flow channel plate. Specifically, a plurality of concave regions are formed by the depression of one surface of the bottom shell 20. The heat dissipation fins 13 are arranged in the concave regions. The cover plate 30 covers the openings of the concave regions, and the concave regions and the corresponding regions on the cover plate 30 form the medium flow channel. A medium inlet 21 and a medium outlet 22 are arranged on the end face of the bottom shell 20 (i.e., the face in the above extension direction X). The medium inlet 21 and the medium outlet 22 are respectively communicated with both ends of the medium flow channel. Among them, the medium inlet 21 and the medium outlet 22 can be located on the same end face or on different end faces.

[0057] Preferably, pipeline connectors are respectively connected to the medium inlet 21 and the medium outlet 22 to facilitate the connection of the liquid cooling plate with the refrigerant outside.

[0058] The present utility model also provides a liquid-cooled server, which includes the flow channel plate described in any one of the above embodiments. The liquid-cooled server further includes a circuit board, on which a plurality of heat-generating chips are arranged. After the circuit board and the flow channel plate are installed, the heat-generating chips are located in the area where the medium flow channels are located on the liquid cooling plate, so as to improve the heat dissipation efficiency of the heat-generating chips.

[0059] Among them, the plurality of heat-generating chips are arranged in multiple rows of chip groups on the circuit board. Each row of chip groups includes a plurality of heat-generating chips arranged along the extension direction X of the sub-segment 11. When the circuit board is installed on the flow channel plate, at least one row of chip groups corresponds to each sub-segment. One sub-segment 11 may correspond to one row of chip groups, or one sub-segment 11 may correspond to multiple rows of chip groups, such as two rows, three rows or more rows of chip groups.

[0060] In one embodiment, each chip group includes at least forty heat-generating chips, and the heat-generating chips in the same chip group are connected in series. The circuit board is arranged with at least eight rows of chip groups. For example, the circuit board may be arranged with eight rows, ten rows, twelve rows, fourteen rows, fifteen rows or sixteen rows of chip groups, etc. One row of chip groups includes forty, forty-five, fifty, fifty-five or sixty heat-generating chips, etc. Among them, the number of heat-generating chips in each chip group may be equal or unequal.

[0061] The present utility model also provides a data center, which includes a plurality of the liquid-cooled servers described in any one of the above embodiments.

[0062] Those skilled in the art can understand that, on the premise of no conflict, the above preferred solutions can be freely combined and superimposed.

[0063] It should be understood that the above embodiments are merely exemplary and not restrictive. Without departing from the basic principle of the present utility model, various obvious or equivalent modifications or substitutions made by those skilled in the art to the above details will all be included within the scope of the claims of the present utility model.

Claims

1. A medium flow channel for dissipating heat from a heat generating chip on a circuit board, wherein the heat generating chips on the circuit board are arranged in multiple rows; characterized in that: The medium flow channel includes at least two sub-sections connected by bending in sequence and a connecting section connecting two adjacent sub-sections; each of the sub-sections can correspond to at least one row of the heat generating chips, and a plurality of heat dissipation fins are arranged side by side in each of the sub-sections, and each of the heat dissipation fins extends along the extension direction of the sub-section in which it is located, so as to divide the sub-section into a plurality of sub-flow channels arranged side by side; The connecting section is provided with a guide structure, which includes a convex curved plate, which protrudes toward the outer wall of the flow channel of the connecting section where it is located, and there is a gap between the convex curved plate and the heat dissipation fins located in the upstream and downstream sub-sections thereof; wherein, two opposite convex curved surfaces of the convex curved plate are arranged in parallel to form guide surfaces respectively.

2. The medium flow channel according to claim 1, characterized in that: The convex curved plate is an arc-shaped plate, and the two guide surfaces are both arc-shaped surfaces.

3. The medium flow channel according to claim 1, characterized in that: The convex curved panel is a parabolic panel, and the two guide surfaces are both parabolas.

4. The medium flow channel according to claim 1, characterized in that: The two guide surfaces of the convex curved plate are arranged in parallel, and the two have a smooth transition at the ends.

5. The medium flow channel according to claim 1, characterized in that: The guide structure includes a plurality of convex curved plates arranged side by side and at intervals.

6. The medium flow channel according to claim 5, characterized in that: The plurality of convex curved panels in the same guide structure are arranged in parallel, and their lengths increase from the inside to the outside.

7. The medium flow channel according to claim 5, characterized in that: A row of the heat generating chips forms a chipset group, and the same sub-section corresponds to multiple rows of chipsets; the number of sub-flow channels into which the connecting section is divided by multiple convex curved panels in the same guide structure is equal to the number of chipsets.

8. The medium flow channel according to any one of claims 1 to 7, characterized in that: In at least one group of interconnected connecting sections and two sub-sections, the two sub-sections are arranged side by side, and the flow guiding structure is respectively arranged on the upstream side and the downstream side of the connecting section.

9. The medium flow channel according to claim 8, characterized in that: In the same connecting section, the length of the flow guiding structure located on the upstream side is shorter than the length of the flow guiding structure located on the downstream side.

10. The medium flow channel according to claim 8, characterized in that: In the guide structure located on the upstream side, the angle between the tangent plane of the upstream end of the same convex curved plate and the medium flow direction of the sub-section located on the upstream side is less than or equal to 60°, and the angle between the tangent plane of the downstream end and the tangent plane of the upstream end of the downstream side guide structure is 90° to 180°; the angle between the tangent plane of the downstream end of the guide structure located on the downstream side and the medium flow direction of the sub-section located on the downstream side is less than or equal to 60°; and the minimum distance between each of the guide structures and the outer wall of the flow channel of the connecting section where it is located is greater than or equal to one third of the flow channel width where the guide structure is located.

11. The medium flow channel according to claim 8, characterized in that: A dividing strip is arranged in the medium flow channel, one end of the dividing strip is connected to the side wall of the flow channel, and the other end is a free end. Two adjacent sub-sections are separated by the dividing strip and connected by the connecting section on the free end side; the two guide structures are separated on both sides of the dividing strip.

12. A flow channel plate, used for cooling a heat generating chip on a circuit board, characterized in that: The flow channel plate is provided with the medium flow channel according to any one of claims 1 to 11.

13. A liquid cooling server, characterized in that: It comprises a circuit board and the flow channel plate as claimed in claim 12, wherein a plurality of heat generating chips are arranged on the circuit board, and the plurality of heat generating chips are arranged into a plurality of rows of chip groups on the circuit board, and each row of the chip groups comprises a plurality of heat generating chips arranged along the extension direction X of the sub-section; the circuit board is mounted on the flow channel plate, and each of the sub-sections corresponds to at least one row of the chip groups.

14. The liquid cooling server according to claim 13, characterized in that: Each of the chipsets includes at least forty of the heating chips, and the heating chips of the same chipset are arranged in series, and the circuit board is arranged with at least eight rows of chipsets.

15. A data center, characterized in that: Including the liquid cooling server described in claim 13 or 14.

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