Heat dissipation structure and electronic equipment

Abstract

The utility model relates to a heat dissipation structure and electronic equipment, and the heat dissipation structure comprises a loudspeaker unit which comprises a housing, a separator plate and a loudspeaker, the separator plate and the loudspeaker are disposed in the housing, the loudspeaker is disposed in the separator plate, and the interior of the housing is divided into a front sound cavity and a rear sound cavity by the loudspeaker and the separator plate; the valve unit comprises a first valve assembly arranged on the shell and / or the partition plate, and the first valve assembly has an open state and a closed state; the first valve assembly can switch an open state and a closed state according to the working frequency band of the loudspeaker; the heat dissipation unit comprises a first heat dissipation part and a second heat dissipation part connected to the first heat dissipation part, the first heat dissipation part is located in the rear sound cavity, and the second heat dissipation part is located outside the rear sound cavity. According to the heat dissipation structure, external air is sucked into the rear sound cavity through vibration of the vibrating diaphragm of the loudspeaker, heat exchange is achieved between the external air and the first heat dissipation part in the rear sound cavity, and the air subjected to heat exchange can be discharged out of the rear sound cavity through the first valve assembly, so that heat dissipation is achieved.

Description

Technical Field

[0001] The present disclosure relates to the technical field of heat dissipation for electronic products, and particularly, to a heat dissipation structure and an electronic device. Background Art

[0002] Currently, heat dissipation for electronic devices (such as mobile phones) usually adopts a vapor chamber or a heat pipe. However, the application of a heat pipe and a vapor chamber only transfers heat from one end to the other end. Ultimately, heat dissipation still depends on the structure of the mobile phone to conduct heat from the inside to the surface layer, and then dissipate heat through air convection or human contact. The heat dissipation efficiency is low. Summary of the Utility Model

[0003] The purpose of the present disclosure is to provide a heat dissipation structure and an electronic device. The heat dissipation structure inhales external gas into the sound cavity through the vibration of the diaphragm of the speaker, exchanges heat with the first heat dissipation part in the rear sound cavity, and can discharge the gas after heat exchange from the rear sound cavity through the first valve assembly to achieve heat dissipation.

[0004] To achieve the above purpose, in the first aspect of the present disclosure, a heat dissipation structure is provided, including:

[0005] A speaker unit, including a housing, a partition board, and a speaker. The partition board and the speaker are arranged inside the housing. The speaker is arranged on the partition board. The speaker and the partition board divide the interior of the housing into a front sound cavity and a rear sound cavity;

[0006] A valve unit, including a first valve assembly arranged on the housing and / or the partition board, and the first valve assembly has an open state and a closed state; the first valve assembly can switch between the open state and the closed state according to the working frequency band of the speaker; and

[0007] A heat dissipation unit, including a first heat dissipation part and a second heat dissipation part connected to the first heat dissipation part. The first heat dissipation part is inside the rear sound cavity, and the second heat dissipation part is outside the rear sound cavity.

[0008] Optionally, the valve unit further includes a second valve assembly arranged on the housing and / or the partition board. The second valve assembly has an open state and a closed state; the first valve assembly and the second valve assembly can switch between the open state and the closed state according to the working frequency band of the speaker.

[0009] Optionally, the first valve assembly is arranged on the partition board; the second valve assembly is arranged on the housing.

[0010] Optionally, the first valve assembly and the second valve assembly are respectively located on opposite sides of the first heat dissipation part.

[0011] Optionally, the first valve assembly and the second valve assembly are configured such that when the diaphragm of the speaker moves towards the front sound cavity, the first valve assembly is in an open state and the second valve assembly is in a closed state; when the diaphragm of the speaker moves towards the rear sound cavity, the first valve assembly is in a closed state and the second valve assembly is in an open state.

[0012] Optionally, the speaker has a first operating frequency band and a second operating frequency band;

[0013] The first operating frequency band is used to output audio;

[0014] The second operating frequency band is used for heat dissipation, and the frequency of the second operating frequency band is greater than the frequency of the first operating frequency band.

[0015] Optionally, the frequency of the second operating frequency band is greater than or equal to 30KHZ.

[0016] Optionally, both the first valve assembly and the second valve assembly include:

[0017] A mounting base including air holes;

[0018] A seal including a metal part and a piston connected to the metal part. The metal part is fixedly connected to the mounting base, and the piston is openably sealed in the air hole;

[0019] A piezoelectric ceramic is provided on the metal part and is connected to a driver through a top electrode and a bottom electrode.

[0020] Optionally, a sealing layer for sealing between the piston and the air hole is provided circumferentially on the piston and / or the air hole; and / or

[0021] An insulating layer is formed on the side of the metal part away from the piston, and the piezoelectric ceramic is fixedly mounted on the insulating layer.

[0022] In a second aspect of the present disclosure, an electronic device is further provided. The electronic device includes the above-mentioned heat dissipation structure.

[0023] Through the above technical solution, that is, the heat dissipation structure of the present disclosure includes a speaker unit, a valve unit, and a heat dissipation unit. By utilizing the existing speaker unit of the electronic device and arranging the first heat dissipation part of the heat dissipation unit in the rear sound cavity of the housing, and by providing a first valve assembly with an open state and a closed state on the housing and / or the partition, when heat dissipation needs to be achieved, the first valve assembly is switched to the open state, and the external gas is inhaled into the rear sound cavity through the vibration of the diaphragm of the speaker, so as to perform heat exchange with the first heat dissipation part in the rear sound cavity, and the gas after the heat exchange can be discharged from the rear sound cavity by the first valve assembly to achieve heat dissipation.

[0024] Other features and advantages of the present disclosure will be described in detail in the following detailed description section. Brief Description of the Drawings

[0025] The accompanying drawings are used to provide a further understanding of the present disclosure, and constitute a part of the specification. Together with the following detailed description, they are used to explain the present disclosure, but do not constitute a limitation to the present disclosure. In the accompanying drawings:

[0026] Figure 1 is a structural diagram of a heat dissipation structure provided by some embodiments of the present disclosure.

[0027] Figure 2 is a schematic structural diagram of a first valve assembly and a second valve assembly of the heat dissipation structure provided by some embodiments of the present disclosure.

[0028] Figure 3 is a corresponding diagram of the diaphragm of a speaker, the open state and the closed state of the first valve assembly and the second valve assembly provided by some embodiments of the present disclosure.

[0029] Figure 4 is a driving schematic diagram of the first valve assembly, the second valve assembly and the speaker provided by some embodiments of the present disclosure.

[0030] Description of the Reference Numerals

[0031] 10 - Heat dissipation structure; 100 - Speaker unit; 110 - Housing; 111 - Front sound cavity; 112 - Rear sound cavity; 120 - Partition; 130 - Speaker; 131 - Diaphragm; 200 - Valve unit; 210 - First valve assembly; 211 - Mounting base; 2111 - Air hole; 212 - Seal; 2121 - Metal part; 2122 - Piston; 213 - Piezoelectric ceramic; 2131 - Top electrode; 2132 - Bottom electrode; 214 - Sealing layer; 215 - Insulating layer; 220 - Second valve assembly; 300 - Heat dissipation unit; 310 - First heat dissipation part; 320 - Second heat dissipation part. Detailed Description of the Embodiments

[0032] The following provides a detailed description of the specific embodiments of the present disclosure with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are only used to illustrate and explain the present disclosure, and do not limit the present disclosure.

[0033] In the present disclosure, unless otherwise stated, the orientation terms such as "top, bottom, left, right" generally refer to the upper, lower, left, and right in the relative drawings; "inside, outside" refer to the inside and outside of the corresponding component contour. In addition, the terms "first", "second", etc. used in the present disclosure are used to distinguish one element from another, and do not have sequentiality and importance. Furthermore, in the following description, when referring to the drawings, unless otherwise explained, the same reference numerals in different drawings represent the same or similar elements. The above definitions are only used to explain and illustrate the present disclosure and should not be construed as a limitation to the present disclosure.

[0034] The purpose of the present disclosure is to provide a heat dissipation structure 10 and an electronic device. The heat dissipation structure 10 sucks external gas into the rear sound cavity 112 through the vibration of the diaphragm 131 of the speaker 130, exchanges heat with the first heat dissipation part 310 in the rear sound cavity 112, and can discharge the gas after heat exchange from the rear sound cavity 112 to achieve heat dissipation.

[0035] To achieve the above purpose, as Figures 1 to 4 shown, an embodiment of the present disclosure provides a heat dissipation structure 10 for an electronic device, such as a mobile phone, a tablet computer, etc. The heat dissipation structure 10 includes a speaker unit 100, a valve unit 200, and a heat dissipation unit 300. Among them, the speaker unit 100 includes a housing 110, a partition 120, and a speaker 130. The partition 120 and the speaker 130 are arranged inside the housing 110, the speaker 130 is arranged on the partition 120, and the speaker 130 and the partition 120 divide the internal space of the housing 110 into a front sound cavity 111 and a rear sound cavity 112; the valve unit 200 includes a first valve assembly 210 arranged on the housing 110 and / or the partition 120, and the first valve assembly 210 has an open state and a closed state; the first valve assembly 210 can switch between the open state and the closed state according to the working frequency band of the speaker 130; the heat dissipation unit 300 includes a first heat dissipation part 310 and a second heat dissipation part 320 connected to the first heat dissipation part 310. The first heat dissipation part 310 is inside the rear sound cavity 112, and the second heat dissipation part 320 is located outside the rear sound cavity 112.

[0036] Through the above technical solution, that is, the heat dissipation structure 10 of the present disclosure includes a speaker unit 100, a valve unit 200, and a heat dissipation unit 300. By utilizing the existing speaker unit 100 of the electronic device, and arranging the first heat dissipation part 310 of the heat dissipation unit 300 in the rear sound cavity 112 of the housing 110, by providing a first valve assembly 210 with an open state and a closed state on the housing 110 and / or the partition 120, when heat dissipation needs to be achieved, the first valve assembly 210 is switched to the open state, and the external gas is inhaled into the rear sound cavity 112 through the vibration of the diaphragm 131 of the speaker 130, to perform heat exchange with the first heat dissipation part 310 in the rear sound cavity 112, and the gas after heat exchange can be discharged from the rear sound cavity 112 by the first valve assembly 210 to achieve heat dissipation.

[0037] It can be understood that for the heat dissipation structure 10 of the present disclosure, when heat dissipation is required, the first valve assembly 210 is switched to the open state. Through the vibration of the diaphragm 131 of the speaker 130, that is, when the diaphragm 131 moves towards the front sound cavity 111, the external air is inhaled into the interior of the rear sound cavity 112. The inhaled air exchanges heat with the first heat dissipation part 310, and then when the diaphragm 131 moves towards the rear sound cavity 112, the air after heat exchange is discharged from the rear sound cavity 112, thereby achieving heat exchange. This heat dissipation structure 10 utilizes the existing structure of the speaker 130, and through corresponding improvements, that is, by adding the valve unit 200 and the heat dissipation unit 300, an air-cooling channel is formed in the rear sound cavity 112 of the housing 110 of the speaker 130 to achieve heat dissipation, providing a new heat dissipation structure 10 to improve the heat dissipation efficiency.

[0038] In addition, when the speaker 130 needs to perform a sound-emitting operation, the first valve assembly 210 is switched to the closed state. Here, the rear sound cavity 112 forms a relatively closed space, thereby realizing the sound-emitting function of the speaker 130.

[0039] It should be noted that the first heat dissipation part 310 and the second heat dissipation part 320 can be constructed in any suitable structure. Among them, the second heat dissipation part 320 can transfer the heat generated by the heat source of the electronic device to the first heat dissipation part 310, and at the same time can also dissipate heat to the outside through itself. That is, the second heat dissipation part 320 can include a heat absorption part connected to the heat source of the electronic device, a heat transfer part connected to the first heat dissipation part 310, and a heat conduction part that dissipates the heat of the heat absorption part to the outside of the electronic device. For example, the first heat dissipation part 310 can be constructed as a heat conduction block, and the second heat dissipation part 320 can be a heat pipe, VC (vapor chamber technology), or LHC (cold oil cooler).

[0040] Such as Figure 1As shown in the figure, the first valve assembly 210 is disposed on the partition 120, and the second valve assembly 220 is disposed on the inner side wall on the left side of the housing 110, and both correspond to the through holes on the partition 120 and the housing 110, constituting an intake valve and an exhaust valve. In the middle is a conventional speaker 130. The diaphragm 131 of the speaker 130 functions as a piston 2122 for intake and exhaust in the solution of this embodiment.

[0041] The first heat dissipation part 310 can be a heat-conducting metal block in the housing 110. On the one hand, this heat-conducting metal block serves as the wall of the rear sound cavity 112 to seal the rear sound cavity 112. On the other hand, it is in contact with the second heat dissipation part 320 in the electronic device, such as a heat pipe, a VC, an LHC, etc. The two (the first heat dissipation part 310 and the second heat dissipation part 320) can be welded or connected with a heat-conducting material (such as silicone grease) to play a role in guiding heat into the heat dissipation cavity.

[0042] In some embodiments, the valve unit 200 may further include a second valve assembly 220 disposed on the housing 110 and / or the partition 120. The second valve assembly 220 has an open state and a closed state; the first valve assembly 210 and the second valve assembly 220 can switch between the open state and the closed state according to the working frequency band of the speaker 130. Among them,

[0043] As Figure 1 shown, the valve unit 200 may include a first valve assembly 210 and a second valve assembly 220, both of which have an open state and a closed state. When heat dissipation is required, one of the first valve assembly 210 and the second valve assembly 220 is in the open state, and the other is in the closed state. For example, the first valve assembly 210 is in the open state and the second valve assembly 220 is in the closed state. When the diaphragm 131 moves towards the front sound cavity 111, the first valve assembly 210 in the open state can suck gas into the rear sound cavity 112 for heat exchange with the first heat dissipation part 310; when the diaphragm 131 moves towards the rear sound cavity 112, the first valve assembly 210 switches to the closed state and the second valve assembly 220 switches to the open state, and the second valve assembly 220 in the open state can discharge the air that has completed heat exchange from the rear sound cavity 112, thereby realizing heat exchange.

[0044] The first valve assembly 210 and the second valve assembly 220 can be disposed on the housing 110 at the same time, or can be disposed on the partition 120 at the same time. Of course, one of the first valve assembly 210 and the second valve assembly 220 can be disposed on the housing 110 and the other can be disposed on the partition 120. To further improve the heat exchange efficiency, as Figure 1As shown, the first valve assembly 210 can be disposed on the partition 120; the second valve assembly 220 can be disposed on the housing 110, and the first valve assembly 210 and the second valve assembly 220 are respectively located on opposite sides of the first heat dissipation portion 310. Among them, since the first valve assembly 210 and the second valve assembly 220 are respectively disposed on both sides of the first heat dissipation portion 310, one of the first valve assembly 210 and the second valve assembly 220 can be used for air intake, and the other can be used for air exhaust. When air flows in the rear sound cavity 112, it passes through the first heat dissipation portion 310, thereby better achieving the heat dissipation effect. It should be noted that the first valve assembly 210 and the second valve assembly 220 can also be disposed on the same side of the first heat dissipation portion 310, and at least partial heat dissipation effect can also be achieved.

[0045] As Figure 1 shown, in some embodiments, the first valve assembly 210 and the second valve assembly 220 are configured such that when the diaphragm 131 of the speaker 130 moves towards the front sound cavity 111, the first valve assembly 210 is in an open state and the second valve assembly 220 is in a closed state; when the diaphragm 131 of the speaker 130 moves towards the rear sound cavity 112, the first valve assembly 210 is in a closed state and the second valve assembly 220 is in an open state. Since the first valve assembly 210 is disposed on the partition 120 and the front sound cavity 111 is a cavity communicating with the outside, for example, it can communicate with the outside of the electronic device through the sound outlet channel. Therefore, air is inhaled from the front sound cavity 111 into the rear sound cavity 112, and at the same time, it is discharged through the second valve assembly 220 disposed on the side of the housing 110 to better achieve heat dissipation.

[0046] It should be noted that in some other embodiments, when the diaphragm 131 of the speaker 130 moves towards the front sound cavity 111, the second valve assembly 220 is in an open state and the first valve assembly 210 is in a closed state; when the diaphragm 131 of the speaker 130 moves towards the rear sound cavity 112, the second valve assembly 220 is in a closed state and the first valve assembly 210 is in an open state. Different from the above embodiments, the gas (wind) used for heat exchange enters through the second valve assembly 220 and is discharged through the first valve assembly 210, and the first valve assembly 210 communicates with the front sound cavity 111, and the exhaust can be discharged through the sound outlet channel of the speaker 130.

[0047] In addition to the above-mentioned air intake and exhaust functions, the speaker 130 of this embodiment also has the sound output function of the speaker 130 itself. For example, in some embodiments, the speaker 130 has a first working frequency band and a second working frequency band; the first working frequency band is used to output audio; the second working frequency band is used for heat dissipation, and the frequency of the second working frequency band is greater than the frequency of the first working frequency band. When the speaker 130 needs to make a sound, the first valve assembly 210 or the first valve assembly 210 and the second valve assembly 220 can be completely closed, so that the rear sound cavity 112 forms a relatively closed space to ensure the normal use of the speaker 130. When heat dissipation is required, as described above, when the diaphragm 131 of the speaker 130 vibrates to expand the volume of the rear sound cavity 112, one of the first valve assembly 210 and the second valve assembly 220 (for example, the first valve assembly 210) is switched to an open state, and the other (for example, the second valve assembly 220) is switched to a closed state to achieve air intake. When the diaphragm 131 of the speaker 130 vibrates to compress the volume of the rear sound cavity 112, one of the first valve assembly 210 and the second valve assembly 220 (for example, the first valve assembly 210) is switched to a closed state, and the other (for example, the second valve assembly 220) is switched to an open state to achieve exhaust, thereby achieving heat exchange.

[0048] The frequency of the first working frequency band is less than the frequency of the second working frequency band. For example, the second working frequency band can be set to avoid the frequency detectable by the human ear as much as possible, such as the ultrasonic frequency band. Optionally, the frequency of the second working frequency band is greater than or equal to 30KHZ. For example, the second working frequency band is preferably 30KHZ-40KHZ. The speaker 130 operating in this working frequency band is not fully detected by the human ear, thereby improving the customer experience.

[0049] The first valve assembly 210 and the second valve assembly 220 can adopt any suitable structure, but they only need to be able to switch between the open state and the closed state. Figure 2 As shown, the structures of the first valve assembly 210 and the second valve assembly 220 can be completely the same, so the first valve assembly 210 and the second valve assembly 220 both include a mounting base 211, a sealing member 212 and a piezoelectric ceramic 213. The mounting base 211 includes an air hole 2111; the sealing member 212 includes a metal member 2121 and a piston 2122 connected to the metal member 2121, the metal member 2121 is fixedly connected to the mounting base 211, and the piston 2122 can be opened and sealed to the air hole 2111; the piezoelectric ceramic 213 is arranged on the metal member 2121, and is connected to the driver through the top electrode 2131 and the bottom electrode 2132. The mounting base 211 is arranged on the housing 110 or the partition 120, and the housing 110 and the partition 120 are also provided with through holes corresponding to the air holes 2111, which are used to communicate with the outside of the housing 110.

[0050] Optionally, a sealing layer 214 is provided circumferentially on the piston 2122 and / or the air hole 2111 for sealing between the piston 2122 and the air hole 2111. Among them, the sealing layer 214 can be provided circumferentially on the piston 2122 or on the circumferential direction of the mounting base 211 to better seal the air hole 2111. Of course, the sealing layer 214 can also be provided circumferentially on both the piston 2122 and the mounting base 211 to achieve the sealing effect.

[0051] In order to avoid conduction between the metal part 2121 and the piezoelectric ceramic 213, in some embodiments, an insulating layer 215 is formed on the side of the metal part 2121 away from the piston 2122, and the piezoelectric ceramic 213 is fixedly installed on the insulating layer 215. It can be understood that both the above-mentioned sealing layer 214 and insulating layer 215 can be designed with materials known in the related art, which will not be elaborated here.

[0052] The first valve assembly 210 and the second valve assembly 220 can be a controllable deformation structure composed of a piezoelectric ceramic 213 combined with a metal sheet. As Figure 2 Shown is a cross-sectional view of the first valve assembly 210 and the second valve assembly 220. The first valve assembly 210 and the second valve assembly 220 can be designed with a normally closed structure.

[0053] The metal part 2121 is fixedly connected to the mounting base 211. The piston 2122 is fixedly connected below the metal part 2121 (such as a metal sheet or a metal plate) and can open and seal the air hole 2111. The piezoelectric ceramic 213 is provided above the metal part 2121, and the top of the piezoelectric ceramic 213 is connected to the top electrode, and the bottom is connected to the bottom electrode 2132. Among them, an insulating layer 215 is provided between the piezoelectric ceramic 213 and the metal part 2121. The piezoelectric ceramic 213, the insulating layer 215, and the metal part 2121 constitute the driving part of the valve assembly, and the piezoelectric ceramic 213 is a controlled deformation device.

[0054] It should be noted that the metal sheet plays three roles: 1) As the bearing surface of the top electrode 2131 above the piezoelectric ceramic 213, the bottom electrode 2132 below, the piezoelectric ceramic 213, and the insulating layer 215. 2) As the connection between the lower piston 2122 and the upper driving part. 3) As an elastic member to maintain the closure of the piston 2122.

[0055] The lower piston 2122 is connected to the metal sheet, and together with the mounting base 211 and the sealing layer 214 thereon, it constitutes a movable valve as a follower part.

[0056] Principle of operation:

[0057] Open state: When a DC voltage is applied to the piezoelectric ceramic 213 through the top electrode 2131 and the bottom electrode 2132, the piezoelectric ceramic 213 will bend to one side, driving the metal part 2121 to bend and driving the piston 2122 to move, so as to Figure 2 Taking the normally closed design on the inner side in Figure 2 as an example, the piezoelectric ceramic 213 bends upward, the piston 2122 moves upward, and separates from the mounting base 211, forming an air flow path for gas to flow through (including inhalation and exhalation).

[0058] Valve closed state: This state can be divided into natural closing and forced closing.

[0059] Natural closing is to stop applying voltage to the piezoelectric ceramic 213. The metal sheet presses the piston 2122 to close the air hole 2111.

[0060] Forced closing is to apply a voltage opposite to opening the valve to the piezoelectric ceramic 213. At this time, the elasticity of the metal sheet and the reverse deformation of the piezoelectric ceramic 213 together press the piston 2122 to close the air hole 2111.

[0061] As Figure 4 shown, the driving methods of the piezoelectric ceramic 213 and the speaker 130 are as follows: The speaker 130 is still driven by the speaker 130 power amplifier. The first valve assembly 210 and the second valve assembly 220 can be controlled by a motor driver. The driving of the LRA motor (linear motor) can add a switch to switch between normal operation and control.

[0062] It should be noted that during the heat dissipation stage, the states of the speaker 130, the first valve assembly 210, and the second valve assembly 220 need to be synchronized. As Figure 3 shown, in a specific embodiment, the position of the diaphragm 131 of the speaker 130 is schematically shown in the upper part. Corresponding to the open state and closed state of the first valve assembly 210 and the second valve assembly 220 in the lower part, so as to use the vibration of the diaphragm 131 of the speaker 130 and the state cooperation of the first valve assembly 210 and the second valve assembly 220 to complete inhalation and exhalation and achieve air-cooled heat dissipation.

[0063] The embodiment of the present disclosure also provides an electronic device, which includes the above-mentioned heat dissipation structure 10. Therefore, this electronic device also has all the advantages of the above-mentioned heat dissipation structure 10, which will not be elaborated here.

[0064] For example, the electronic device can be any device with a speaker unit 100, such as a mobile phone, a tablet computer, a laptop computer, etc., to better achieve the heat dissipation of the electronic device.

[0065] The preferred embodiments of the present disclosure have been described in detail above in conjunction with the accompanying drawings. However, the present disclosure is not limited to the specific details in the above embodiments. Within the scope of the technical concept of the present disclosure, various simple modifications can be made to the technical solutions of the present disclosure, and these simple modifications all fall within the protection scope of the present disclosure.

[0066] In addition, it should be noted that, in the above specific embodiments, the various specific technical features described can be combined in any suitable manner without contradiction. To avoid unnecessary repetition, the present disclosure will not separately describe various possible combination manners.

[0067] Furthermore, any combination can be made between various different embodiments of the present disclosure as long as it does not violate the idea of the present disclosure, and it should also be regarded as the content disclosed by the present disclosure.

Claims

1. A heat dissipation structure, characterized in that: include: A speaker unit comprises a housing, a partition and a speaker, wherein the partition and the speaker are arranged inside the housing, the speaker is arranged on the partition, and the speaker and the partition divide the interior of the housing into a front sound cavity and a rear sound cavity; The valve unit comprises a first valve component provided on the housing and / or the partition, wherein the first valve component has an open state and a closed state; the first valve component can switch between the open state and the closed state according to the working frequency band of the speaker; and The heat dissipation unit includes a first heat dissipation part and a second heat dissipation part connected to the first heat dissipation part, the first heat dissipation part is located inside the rear sound cavity, and the second heat dissipation part is located outside the rear sound cavity.

2. The heat dissipation structure according to claim 1, characterized in that: The valve unit also includes a second valve component arranged on the shell and / or the partition, and the second valve component has an open state and a closed state; the first valve component and the second valve component can switch the open state and the closed state according to the working frequency band of the speaker.

3. The heat dissipation structure according to claim 2, characterized in that: The first valve component is arranged on the partition; the second valve component is arranged on the shell.

4. The heat dissipation structure according to claim 3, characterized in that: The first valve component and the second valve component are respectively located on two opposite sides of the first heat dissipation portion.

5. The heat dissipation structure according to claim 4, characterized in that: The first valve component and the second valve component are configured such that when the diaphragm of the speaker moves toward the front sound cavity, the first valve component is in an open state and the second valve component is in a closed state; When the diaphragm of the speaker moves toward the rear sound cavity, the first valve component is in a closed state, and the second valve component is in an open state.

6. The heat dissipation structure according to any one of claims 1 to 5, characterized in that: The speaker has a first working frequency band and a second working frequency band; The first working frequency band is used to output audio; The second working frequency band is used for heat dissipation, and the frequency of the second working frequency band is greater than the frequency of the first working frequency band.

7. The heat dissipation structure according to claim 6, characterized in that: The frequency of the second working frequency band is greater than or equal to 30KHZ.

8. The heat dissipation structure according to claim 2, characterized in that: The first valve assembly and the second valve assembly each include: Mounting base, including air holes; A sealing member, comprising a metal member and a piston connected to the metal member, wherein the metal member is fixedly connected to the mounting base, and the piston is openably sealed to the air hole; The piezoelectric ceramic is disposed on the metal member and connected to the driver through a top electrode and a bottom electrode.

9. The heat dissipation structure according to claim 8, characterized in that: A sealing layer for sealing between the piston and the air hole is provided around the piston and / or the air hole; and / or An insulating layer is formed on the side of the metal piece away from the piston, and the piezoelectric ceramic is fixedly mounted on the insulating layer.

10. An electronic device, characterized in that: The electronic device comprises the heat dissipation structure according to any one of claims 1 to 9.

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