Matte LED packaging structure

Abstract

The utility model belongs to the technical field of LED elements, and relates to a matte LED packaging structure, which comprises a carrier plate, an LED wafer arranged above the carrier plate, and two conductive wires used for conducting an electrode on the surface of the LED wafer and the carrier plate, the LED wafer is fixed on the carrier plate through a connecting adhesive layer, the connecting adhesive layer is conductive adhesive or bonding adhesive, the number of the conductive wires is two, and the number of the conductive wires is two. The LED chip is arranged on the support plate, the LED chip is arranged on the support plate, the LED chip and the support plate are respectively used for conducting between the positive electrode and the negative electrode of the LED chip and the support plate, a bowl cup is further arranged above the support plate and located on the periphery of the LED chip, the bowl cup is filled with packaging colloid, and the surface of the packaging colloid is pressed through a mist release film to form an optical microstructure with a mist frosted surface. The surface of the colloid of the bowl lamp bead is designed to be the frosted surface, and the colloid in the bowl is originally designed to be transparent or in other colloid colors, so that the transparent frosted colloid can be packaged and designed, an optical microstructure is formed on the surface of the colloid, the brightness of a product can be improved, the uniformity of light emitted by the product is better, and the service life of the product is prolonged. And the color of emitted light is softer.

Description

Technical Field

[0001] The utility model belongs to the technical field of LED components, and particularly relates to a matte LED packaging structure. Background Art

[0002] At present, for traditional PLCC LED cup products on the market, the appearance of the colloid is mostly designed as transparent, fully foggy white, fluorescent glue color, etc. Due to the special structure of the cup product, the colloid cannot be designed in layers. The inside and outside of the colloid are of the same color, and the surface of the product is mostly designed as a slightly concave or flat smooth surface. Using such LED components has low brightness and poor light output uniformity, and cannot meet the increasingly demanding user needs. Content of the Utility Model

[0003] The purpose of the utility model is to solve the defects and deficiencies in the prior art, and design a matte LED packaging structure that can improve the brightness of the product, make the light output uniformity of the product better, the light output color softer, and has better application especially in the field of display LEDs.

[0004] To achieve the above purpose, the technical solution adopted by the utility model is: a matte LED packaging structure, including a carrier board, an LED chip disposed above the carrier board, and a conductive wire for conducting between the surface electrodes of the LED chip and the carrier board. A cup is further disposed above the carrier board and around the LED chip. The cup is filled with a packaging colloid, and the surface of the packaging colloid is pressed by a foggy release film to form an optical microstructure with a foggy and frosted surface.

[0005] Preferably, the LED chip is fixed on the carrier board through a connection glue layer, and the connection glue layer is a conductive glue or an adhesive glue.

[0006] Preferably, there are two conductive wires, which are respectively used for conducting between the positive and negative electrodes of the LED chip and the carrier board.

[0007] Preferably, the conductive wire is selected from gold wire, alloy wire, silver wire or copper wire.

[0008] Preferably, the packaging colloid wraps the LED chip and the conductive wire and fills the entire cup.

[0009] Preferably, the packaging colloid is a transparent glue or a colored glue.

[0010] Preferably, the size of the foggy release film is not less than the upper opening size of the cup.

[0011] Preferably, a pressing member is disposed above the foggy release film, and the pressing member is a roller or a flat fixture.

[0012] After adopting the above technical solution, a matte LED packaging structure provided by the present utility model has the following beneficial effects:

[0013] (1) Through the design of the matte frosted surface optical microstructure on the surface of the encapsulation colloid in the present utility model, while the colloid inside the bowl cup maintains the original design, transparent or other colored colloids can be selected, which can improve the brightness of the product, and at the same time ensure better light emission uniformity of the product and softer color;

[0014] (2) The present utility model will not have any adverse effects on the application of the product at the terminal, and instead of changing the optical characteristics of the product, it makes the light emission efficiency of the product better. When the terminal product is applied, it can be directly replaced without any design modification. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a schematic structural diagram of a matte LED packaging structure of the present utility model;

[0016] Figures 2-6 It is a schematic diagram of the packaging process of the present utility model.

[0017] Wherein: carrier plate 1, LED chip 2, conductive wire 3, bowl cup 4, encapsulation colloid 5, foggy release film 6, connection adhesive layer 7, pressing part 8. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0018] The present utility model will be further clearly and completely described below in conjunction with the drawings and specific embodiments. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. The description of at least one exemplary embodiment below is actually only illustrative and in no way limits the present utility model and its application or use. Based on the embodiments in the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts belong to the scope of protection of the present utility model.

[0019] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the present application. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprise" and / or "include" are used in this specification, they indicate the presence of features, steps, operations, devices, components, and / or combinations thereof.

[0020] Unless otherwise specifically stated, the relative arrangements, numerical expressions, and numerical values of the components and steps set forth in these embodiments do not limit the scope of the present invention. At the same time, it should be understood that, for the sake of convenience in description, the dimensions of the various parts shown in the drawings are not drawn in actual proportional relationships. Technologies, methods, and devices known to those of ordinary skill in the relevant art may not be discussed in detail, but where appropriate, such technologies, methods, and devices should be regarded as part of the authorization specification. In all the examples shown and discussed here, any specific values should be construed as merely exemplary and not as a limitation. Therefore, other examples of the exemplary embodiments may have different values. It should be noted that: like reference numerals and letters denote like items in the following drawings, and thus, once an item is defined in one drawing, it does not need to be further discussed in subsequent drawings.

[0021] In the description of the present invention, it should be understood that the orientation or positional relationships indicated by orientation terms such as "front, rear, upper, lower, left, right", "lateral, vertical, perpendicular, horizontal", and "top, bottom", etc. are generally based on the orientation or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description. Without contrary description, these orientation terms do not indicate and imply that the device or element referred to must have a specific orientation or be constructed and operated in a specific orientation, and thus cannot be construed as limiting the protection scope of the present invention; the orientation terms "inner, outer" refer to the inside and outside relative to the contour of each component itself.

[0022] For the convenience of description, spatial relative terms such as "above...", "over...", "on the upper surface of...", "above" can be used here to describe the spatial positional relationships of one device or feature to other devices or features as shown in the drawings. It should be understood that the spatial relative terms are intended to include different orientations in use or operation in addition to the orientation described in the drawings for the device. For example, if the device in the drawing is inverted, the device described as "above other devices or structures" or "over other devices or structures" will then be positioned "below other devices or structures" or "under other devices or structures". Thus, the exemplary term "above..." can include both the orientations of "above..." and "below...". The device can also be positioned in other different ways (rotated 90 degrees or in other orientations), and corresponding interpretations should be made for the spatial relative descriptions used here.

[0023] In addition, it should be noted that the use of words such as "first", "second", etc. to limit components is only for the convenience of distinguishing the corresponding components. Without otherwise stating, the above words have no special meanings, and thus cannot be construed as limiting the protection scope of the present invention.

[0024] The utility model provides a matte surface LED packaging structure, such as Figure 1 As shown, it includes a carrier board 1, an LED chip 2 arranged on the carrier board 1, and a conductive wire 3 used for conducting between the surface electrodes of the LED chip 2 and the carrier board 1, the LED chip 2 is fixedly connected to the pad above the carrier board 1, and the surface of the carrier board 1 connected to the LED chip 2 has a plated conductive layer, the LED chip 2 is fixed on the carrier board 1 through a connecting glue layer 7, the connecting glue layer 7 is a conductive glue or an adhesive glue, two conductive wires 3 are provided, which are respectively used for conducting between the positive and negative electrodes of the LED chip 2 and the carrier board 1, and the conductive wire 3 can be selected from gold wire, alloy wire, silver wire or copper wire, etc.

[0025] A bowl cup 4 is further provided above the carrier board 1 and located at the outer periphery of the LED chip 2. The bowl cup 4 is filled with a packaging colloid 5. The surface of the packaging colloid 5 is pressed by a mist-like release film 6 to form an optical microstructure of a frosted surface. Specifically, the packaging colloid 5 wraps the LED chip 2 and the conductive wire 3 and fills the entire bowl cup 4. The packaging colloid 5 is a transparent glue or a colored glue. The size of the mist-like release film 6 is not less than the size of the upper opening of the bowl cup 4 to ensure that the upper surface of the packaging colloid 5 can be completely covered. A pressing piece 8 is provided above the mist-like release film 6, and the pressing piece 8 is a roller or a flat fixture.

[0026] The utility model discloses a packaging process of a matte surface LED packaging structure, such as Figures 2-6 As shown, the following steps are included:

[0027] S1, fixing the LED chip 2 on the carrier 1 by means of conductive glue or other adhesive glue and curing it;

[0028] S2, connecting the electrodes of the LED chip 2 and the bottom carrier board 1 through the conductive wire 3 to form conduction;

[0029] S3, applying transparent glue or other colored glue to the bowl 4 to wrap the LED chip 2 and the conductive wire 3;

[0030] S4, a whole piece of mist release film 6 is pasted on the surface of the whole bowl and cup 4, and a pressing member 8 is used to press and bake the whole piece of mist release film 6 for curing. After curing, the whole piece of mist release film 6 is peeled off;

[0031] S5. Cut the product into individual LED products, and pack them in carrier tapes after testing and sorting.

[0032] In summary, for the matte LED packaging structure provided by the present utility model, the surface of the colloid of the cup-shaped lamp bead is designed as a matte and frosted surface, and the colloid inside the cup-shaped remains the original design as transparent or other colloid colors. In this way, it can be packaged into a transparent foggy colloid and form an optical microstructure on the surface of the colloid, which can improve the brightness of the product, make the light output uniformity of the product better, and the light output color softer. Especially in the field of display LEDs, it can have better applications and has great market value, worthy of wide promotion and application.

[0033] The above is only a preferred specific embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present utility model, according to the technical solution of the present utility model and its inventive concept, makes equivalent substitutions or changes, and all should be covered within the protection scope of the present utility model.

Claims

1. A matte LED packaging structure, characterized in that: The invention comprises a carrier board (1), an LED chip (2) arranged above the carrier board (1), and a conductive wire (3) used for conducting between the surface electrode of the LED chip (2) and the carrier board (1); a bowl (4) is also arranged above the carrier board (1) and located on the periphery of the LED chip (2); the bowl (4) is filled with a packaging colloid (5); and the surface of the packaging colloid (5) is pressed by a mist release film (6) to form an optical microstructure with a frosted surface.

2. The matte surface LED packaging structure according to claim 1, characterized in that: The LED chip (2) is fixed on the carrier board (1) via a connecting glue layer (7), and the connecting glue layer (7) is a conductive glue or an adhesive glue.

3. The matte surface LED packaging structure according to claim 1, characterized in that: Two conductive wires (3) are provided, which are used to respectively conduct electricity between the positive and negative electrodes of the LED chip (2) and the carrier board (1).

4. The matte surface LED packaging structure according to claim 1, characterized in that: The conductive wire (3) is selected from gold wire, alloy wire, silver wire or copper wire.

5. The matte surface LED packaging structure according to claim 1, characterized in that: The encapsulation colloid (5) wraps the LED chip (2) and the conductive wire (3) and fills the entire bowl (4).

6. The matte surface LED packaging structure according to claim 1, characterized in that: The packaging colloid (5) is transparent glue or colored glue.

7. The matte surface LED packaging structure according to claim 1, characterized in that: The size of the mist-like release film (6) is not less than the size of the upper opening of the bowl (4).

8. The matte surface LED packaging structure according to claim 1, characterized in that: A pressing piece (8) is arranged above the mist-like release film (6), and the pressing piece (8) is a roller or a flat jig.

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