Electronic atomization device

Abstract

The utility model discloses an electronic atomization device which comprises an atomization module, a power supply module, a liquid storage module and a liquid supply module, the liquid storage module is connected with the atomization module and used for supplying an aerosol generating substrate to the atomization module, the atomization module is located outside the liquid storage module, and the liquid storage module is used for supplying the aerosol generating substrate to the liquid storage module. The liquid storage module is provided with a storage bin and a containing bin which are arranged in a separated mode. Belongs to the technical field of atomizers. In the application, the atomization module, the power supply module and the liquid storage module are modularly arranged, and the atomization module is arranged outside the liquid storage module, so that the atomization module and the liquid storage module are two independent modules which can be directly split, and compared with the mode that the atomization module, the power supply module and the liquid storage module are installed in an outer shell, the atomization module, the power supply module and the liquid storage module can be directly split; according to the electronic atomization device, the arrangement of an independent outer shell is avoided, so that the assembly steps of the electronic atomization device are simplified, the assembly difficulty of the electronic atomization device is reduced, and meanwhile, the atomization module and the liquid storage module are convenient to replace.

Description

Technical Field

[0001] The present application relates to the technical field of atomizers, and more particularly, to an electronic atomization device. Background Art

[0002] An electronic atomization device is an appliance that can heat a target liquid to atomize it to form an aerosol. An electronic atomization device generally includes a housing, an atomization module, a power module, and a liquid storage module. Among them, the liquid storage module is used to accommodate the aerosol generating matrix, the power module is used to supply power to the atomization module, and the atomization module is used to heat the aerosol generating matrix so that the heated aerosol generating matrix is atomized to form an aerosol.

[0003] In the prior art, the atomization module, the power module, and the liquid storage module are respectively accommodated in the housing to form an integrated structure, resulting in that the atomization module and the liquid storage module cannot be directly disassembled, which increases the assembly difficulty. Utility Model Content

[0004] The main object of the present application is to provide an electronic atomization device to solve the problem that the atomization module and the liquid storage module in the prior art cannot be directly disassembled.

[0005] The present application provides an electronic atomization device, including:

[0006] An atomization module, configured to heat an aerosol generating matrix to generate an aerosol;

[0007] A power module, electrically connected to the atomization module and configured to supply power to the atomization module;

[0008] A liquid storage module, connected to the atomization module and configured to supply the aerosol generating matrix to the atomization module. Among them, the atomization module is located outside the liquid storage module. The liquid storage module is configured to form a storage bin and a receiving bin that are separately arranged. The storage bin is used to accommodate the aerosol generating matrix, and the receiving bin is used to accommodate the power module.

[0009] Further, the atomization module includes a first housing and an atomization component. The atomization component is arranged in the first housing, and the first housing has a first plane;

[0010] The liquid storage module includes a second housing. The second housing is configured to form the storage bin and the receiving bin, and the second housing has a second plane;

[0011] The power module includes a third housing and a power supply component. The power supply component is arranged in the third housing, and the third housing is accommodated in the receiving bin;

[0012] When the atomization module is connected to the liquid storage module, the power supply assembly is electrically connected to the atomization assembly, and the first plane abuts against the second plane, so that the atomization module is located outside the liquid storage module.

[0013] Further, the atomization module includes a first magnetic member, and the first magnetic member is disposed in the first housing and does not protrude from the first plane;

[0014] The liquid storage module includes a second magnetic member, and the second magnetic member is disposed in the second housing and does not protrude from the second plane;

[0015] The first magnetic member and the second magnetic member attract each other, so that the second plane abuts against the first plane, and the power supply assembly is electrically connected to the atomization assembly.

[0016] Further, the second housing includes a first mounting shell and a second mounting shell, the first mounting shell and the second mounting shell are hermetically connected to form the storage bin, and the second mounting shell is recessed into the storage bin to form the accommodation bin, wherein the first mounting shell and / or the second mounting shell are configured to form the second plane.

[0017] Further, the power supply module is inserted into the accommodation bin and is limited in the accommodation bin by a limiting structure.

[0018] Further, one end of the accommodation bin is open, and the limiting structure is disposed in the accommodation bin and close to the opening. Wherein, the limiting structure includes a limiting state and a releasing state. When the limiting structure is in the limiting state, the power supply module is limited in the accommodation bin. When the limiting structure is in the releasing state, the power supply module can enter and exit the accommodation bin from the opening.

[0019] Further, the limiting structure includes a first clamping arm and a second clamping arm. When the limiting structure is in the limiting state, the first clamping arm and the second clamping arm respectively limit the third housing. When the limiting structure is in the releasing state, the first clamping arm and the second clamping arm respectively release the third housing.

[0020] Further, the second mounting shell is formed with a first avoidance groove and a second avoidance groove, the first avoidance groove and the second avoidance groove are respectively communicated with the accommodation bin, and the first notch of the first avoidance groove and the second notch of the second avoidance groove are oppositely arranged;

[0021] The first clamping arm includes a first arm and a first protrusion, the first arm is located in the first avoidance groove, and the first protrusion is disposed on the first arm;

[0022] The second clamping arm includes a second arm and a second protrusion. The second arm is located in the second avoidance groove, and the second protrusion is provided on the second arm.

[0023] When the limiting structure is in the limiting state, the first protrusion and the second protrusion respectively extend into the accommodating chamber and respectively limit the third housing.

[0024] When the limiting structure is in the release state, the first protrusion is located in the first avoidance groove, and the second protrusion is located in the second avoidance groove to release the third housing.

[0025] Further, the third housing is configured to form a first card slot and a second card slot.

[0026] When the limiting structure is in the limiting state, the first protrusion is limited in the first card slot, and the second protrusion is limited in the second card slot. When the limiting structure is in the release state, the first protrusion exits the first card slot, and the second protrusion exits the second card slot.

[0027] Further, the third housing includes a third mounting shell and a fourth mounting shell. The fourth mounting shell and the third mounting shell are connected to form a mounting cavity, and the power supply assembly is arranged in the mounting cavity. Wherein, the first card slot and the second card slot are formed by the third mounting shell and / or the fourth mounting shell.

[0028] Further, the third mounting shell includes a bottom plate; and

[0029] a side plate. The side plate extends along the outer edge of the bottom plate and is configured to form a first open end. The fourth mounting shell is closed in the first open end in a plate shape and defines the mounting cavity with the bottom plate and the side plate. Wherein, the first card slot and the second card slot are opened on the side plate.

[0030] Further, the mounting cavity includes a first mounting position and a second mounting position.

[0031] A clamping arm is provided on the side plate, and the clamping arm can extend into the first mounting position.

[0032] The power supply assembly includes a first circuit board. A clamping position is provided on the first circuit board. When the first circuit board is inserted into the first mounting position along the first open end, the clamping arm is clamped in the clamping position to limit the movement of the first circuit board in the first mounting position; and

[0033] A storage battery, which is electrically connected to the first circuit board, and the storage battery is inserted into the third mounting case along the first open end and is located at the second mounting position.

[0034] Further, the second mounting case includes a first plate, and a hole is formed in the middle of the first plate to form an inner edge and an outer edge;

[0035] An outer shell, which extends along the outer edge in the first direction and is configured to form a second open end;

[0036] An inner shell, which extends along the inner edge in the first direction and is configured to form a third open end, and the third open end is located inside the outer shell; and

[0037] A second plate, which closes the third open end and defines the accommodation chamber with the inner shell;

[0038] The first mounting case is sealingly connected to the second open end and defines the storage chamber with the outer shell, the first plate, the inner shell and the second plate.

[0039] Further, a mounting hole is formed in the first mounting case, and the mounting hole communicates with the storage chamber;

[0040] The liquid storage module includes a liquid guiding member, and the liquid guiding member is disposed in the mounting hole and extends out of the mounting hole to be connected to the atomizing assembly.

[0041] Further, an atomizing chamber and a receiving hole are formed in the first housing, the receiving hole communicates with the atomizing chamber, and the position of the receiving hole corresponds to the position of the mounting hole;

[0042] The atomizing assembly includes a base and a heating element, the base is disposed in the atomizing chamber, and the heating element is disposed on the base;

[0043] The liquid guiding member includes an opposite first end and a second end, the first end is disposed in the mounting hole, the second end extends out of the mounting hole, passes through the receiving hole and is connected to the base.

[0044] Further, the base has a buffer cavity, and the heating element is embedded in the base;

[0045] The liquid guiding member is a liquid guiding pipe, the first end of the liquid guiding pipe is sealingly connected in the mounting hole, and the second end of the liquid guiding pipe passes through the first housing and at least partially extends into the buffer cavity to communicate the storage chamber with the buffer cavity.

[0046] Further, the liquid guide tube is provided with a stopper for preventing the aerosol generation matrix in the buffer chamber from flowing back to the storage chamber through the liquid guide tube.

[0047] Further, the first housing is configured to form a mouthpiece and an air inlet. The mouthpiece is located at one end of the first housing away from the first plane. The air inlet is located on the side surface of the first housing along the direction from the first plane to the mouthpiece, and the air inlet communicates with the atomization chamber and forms an atomization channel with the atomization chamber and the mouthpiece.

[0048] Further, the first housing includes a first connection shell and a second connection shell. The first connection shell and the second connection shell are connected to form the atomization chamber. The first connection shell is configured to form the mouthpiece and the air inlet, and the second connection shell is configured to form the receiving hole and the first plane.

[0049] Further, a second circuit board is provided in the atomization chamber. The second circuit board is electrically connected to the power supply component; and

[0050] a detection sensor, which is electrically connected to the second circuit board and activates the power supply component to supply power to the atomization component in response to the gas flow in the atomization chamber.

[0051] Further, a seal is further provided in the atomization chamber for sealing the detection sensor and the second circuit board at the bottom of the atomization chamber.

[0052] Further, the seal is formed with a first hole. The position of the first hole corresponds to the position of the receiving hole and is sealed on the outer sidewall of the corresponding liquid guide member; and

[0053] a second hole. The position of the second hole corresponds to the position of the detection sensor, and the second hole forms a detection channel with the atomization chamber and the mouthpiece.

[0054] Further, the first connection shell is configured to form an air guide tube. The air guide tube is located in the atomization chamber and is at least partially sealed and inserted into the second hole. Wherein, the air guide tube communicates with the mouthpiece and defines the detection channel.

[0055] Further, the first connection shell includes a first sub-shell configured to form the mouthpiece; and

[0056] The second sub-shell is hermetically connected between the first sub-shell and the second connection shell, and forms a receiving cavity with the first sub-shell, and forms the atomization chamber with the second connection shell. Wherein, the second sub-shell is configured to form the air duct, and the air duct communicates with the mouthpiece through the receiving cavity to define and form the detection channel. A liquid collecting member is arranged in the receiving cavity, and the liquid collecting member is used for adsorbing condensate.

[0057] Further, a first through hole is provided on the first mounting shell;

[0058] A second through hole is provided on the second plate, and the position of the second through hole corresponds to the position of the first through hole;

[0059] The liquid storage module includes a sealing ring, and the sealing ring is hermetically connected between the first through hole and the second through hole;

[0060] The power supply module includes a conductive member, the conductive member is electrically connected to the power supply assembly, the conductive member extends out of the third housing, and sequentially passes through the second through hole, the sealing ring and the first through hole to be electrically connected to the atomization assembly.

[0061] In this application, by modularizing the atomization module, the power supply module and the liquid storage module, and arranging the atomization module outside the liquid storage module, the atomization module and the liquid storage module are two independent and directly separable modules. Compared with installing the atomization module, the power supply module and the liquid storage module in a single housing, the need for a separate housing is avoided, thereby simplifying the assembly steps of the electronic atomization device, reducing the assembly difficulty of the electronic atomization device, and at the same time facilitating the replacement of the atomization module and the liquid storage module. Description of the Drawings

[0062] The drawings described herein are used to provide a further understanding of the present application and constitute a part of the present application. The schematic embodiments of the present application and their descriptions are used to explain the present application and do not constitute an improper limitation to the present application. In the drawings:

[0063] Figure 1 is a schematic diagram of an electronic atomization device in an embodiment disclosed in the present application.

[0064] Figure 2 is another perspective schematic diagram of an electronic atomization device in an embodiment disclosed in the present application.

[0065] Figure 3 is Figure 1 a cross-sectional view along A-A1.

[0066] Figure 4 is Figure 1 a cross-sectional view along B-B1.

[0067] Figure 5 Schematic diagram of the first housing in an embodiment disclosed in the present application.

[0068] Figure 6 Schematic diagram of the second housing in an embodiment disclosed in the present application.

[0069] Figure 7 Schematic diagram of the power module in an embodiment disclosed in the present application.

[0070] Figure 8 Exploded view of the power module in an embodiment disclosed in the present application.

[0071] Figure 9 Schematic diagram of the second mounting housing in an embodiment disclosed in the present application.

[0072] Figure 10 Schematic diagram of the second mounting housing from another perspective in an embodiment disclosed in the present application.

[0073] Figure 11 Schematic diagram of the third mounting housing in an embodiment disclosed in the present application.

[0074] Figure 12 Schematic diagram of the seal in an embodiment disclosed in the present application. Detailed implementation manners

[0075] It should be noted that, without conflict, the embodiments in the present application and the features in the embodiments may be combined with each other. The present application will be described in detail below with reference to the drawings and in conjunction with the embodiments.

[0076] It should be noted that the terms used herein are only for describing the specific implementation manners and are not intended to limit the exemplary implementation manners according to the present application. As used herein, unless otherwise clearly specified in the context, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprise" and / or "include" are used in this specification, they indicate the presence of features, steps, operations, devices, components and / or their combinations.

[0077] Unless otherwise specifically stated, the relative arrangements, numerical expressions, and numerical values of the components and steps set forth in these embodiments do not limit the scope of the present application. At the same time, it should be understood that for the sake of convenience of description, the sizes of the various parts shown in the drawings are not drawn in actual proportional relationships. Technologies, methods, and devices known to those of ordinary skill in the relevant art may not be discussed in detail, but where appropriate, the technologies, methods, and devices should be regarded as part of the authorization specification. In all the examples shown and discussed here, any specific value should be construed as merely exemplary and not as a limitation. Therefore, other examples of the exemplary embodiments may have different values. It should be noted that like reference numerals and letters denote like items in the following drawings, and thus, once an item is defined in one drawing, it does not need to be further discussed in subsequent drawings.

[0078] Please refer to Figure 1-2 As shown, the present application provides an electronic atomization device 100, which includes an atomization module 10, a power module 30, and a liquid storage module 20. The liquid storage module 20 is used to contain an aerosol generating matrix and supply the aerosol generating matrix to the atomization module 10; the power module 30 is electrically connected to the atomization module 10 and is used to supply power to the atomization module 10; the atomization module 10 is used to heat the aerosol generating matrix to generate an aerosol. Among them, the liquid storage module 20 and the atomization module 10 are magnetically connected, and the atomization module 10 is located outside the liquid storage module 20.

[0079] By modularizing the atomization module 10, the power module 30, and the liquid storage module 20, and arranging the atomization module 10 outside the liquid storage module 20, the atomization module 10 and the liquid storage module 20 are two independent and directly separable modules. This avoids the need to set up a separate outer casing to install the atomization module 10, the power module 30, and the liquid storage module 20. Thereby simplifying the assembly steps of the electronic atomization device 100, reducing the assembly difficulty of the electronic atomization device 100, and at the same time facilitating the replacement of the atomization module 10 and the liquid storage module 20.

[0080] Further, please refer to Figure 3-4 As shown, the liquid storage module 20 is constructed to form a storage bin 211 and a receiving bin 212 that are separately arranged. The storage bin 211 is used to contain the aerosol generating matrix. The receiving bin 212 is used to contain the power module 30. By the liquid storage module 20 carrying the power module 30, the heat generated when the power module 30 operates can be absorbed by the aerosol generating matrix contained in the storage bin 211, thereby achieving rapid heat dissipation of the power module 30.

[0081] Further, please refer to Figure 5 and in combination with Figure 3-4As shown, the atomization module 10 includes a first housing 11 and an atomization component 12. The atomization component 12 is disposed within the first housing 11 and is configured to heat an aerosol-forming substrate such that the heated aerosol-forming substrate forms an aerosol.

[0082] Please refer to Figure 6 and in conjunction with Figure 3-4 As shown, the liquid storage module 20 includes a second housing 21. The second housing 21 is configured to form a storage bin 211 and a receiving bin 212.

[0083] Further, please refer to Figure 7-8 and in conjunction with Figure 3-4 As shown, the power supply module 30 includes a third housing 31 and a power supply component 32. The power supply component 32 is disposed within the third housing 31, and the third housing 31 is received within the receiving bin 212 such that the power supply component 32 is located within the receiving bin 212 and is electrically connected to the atomization component 12.

[0084] Further, please refer to Figure 3-6 As shown, the first housing 11 has a first plane 1131. The second housing 21 has a second plane 213. When the atomization module 10 is connected to the liquid storage module 20, the power supply component 32 is electrically connected to the atomization component 12 such that the atomization component 12 can heat based on the electrical energy supplied by the power supply component 32 and heat the aerosol-forming substrate within the heating region of the atomization component 12, thereby causing the heated aerosol-forming substrate to form an aerosol.

[0085] At the same time, the atomization module 10 and the liquid storage module 20 are magnetically connected such that the first plane 1131 abuts against the second plane 213, and such that the atomization module 10 is located outside the liquid storage module 20, thereby enabling the atomization module 10 and the liquid storage module 20 to be two independent modules that can be directly disassembled and assembled.

[0086] Further, in one embodiment, the atomization module 10 includes a first magnetic member 13. The first magnetic member 13 is disposed within the first housing 11 and does not protrude beyond the first plane 1131. Wherein, the first magnetic member 13 can be embedded in the first housing 11 or built into the first housing 11.

[0087] The liquid storage module 20 includes a second magnetic member 22. The second magnetic member 22 is disposed within the second housing 21 and does not protrude beyond the second plane 213. Wherein, the second magnetic member 22 can be embedded in the second housing 21 or built into the second housing 21.

[0088] When the first magnetic member 13 and the second magnetic member 22 attract each other, the second plane 213 abuts against the first plane 1131, and the power supply component 32 is electrically connected to the atomization component 12.

[0089] Furthermore, the atomization module 10 includes two first magnetic members 13, and the two first magnetic members 13 are spaced apart. The liquid storage module 20 includes two second magnetic members 22, and the two second magnetic members 22 respectively correspond to one first magnetic member 13.

[0090] Further, please refer to Figure 9-10 and in conjunction with Figure 3-4 as shown in FIGS. 6, the second housing 21 includes a first mounting shell 214 and a second mounting shell 215. The first mounting shell 214 and the second mounting shell 215 are hermetically connected to form a storage bin 211.

[0091] Further, in the first implementation manner, the first mounting shell 214 is configured to form a second plane 213.

[0092] In the second implementation manner, the second mounting shell 215 is configured to form a second plane 213.

[0093] In the third implementation manner, the first mounting shell 214 and the second mounting shell 215 are connected and jointly configured to form a second plane 213.

[0094] Further, the accommodation bin 212 is located at the middle position of the storage bin 211, so that the storage bin 211 is disposed around the periphery of the accommodation bin 212, thereby increasing the contact area between the power module 30 and the liquid storage module 20, and further increasing the heat dissipation area of the power module 30, so that the aerosol generating matrix accommodated in the storage bin 211 can more efficiently absorb the heat generated when the power module 30 works.

[0095] Further, the power module 30 is inserted into the accommodation bin 212 and is limited by a limiting structure 23. So that the power module 30 is detachably fixed in the accommodation bin 212.

[0096] In one implementation manner, one end of the accommodation bin 212 is open, and the limiting structure 23 is disposed in the accommodation bin 212 and close to the opening, so as to facilitate limiting and inserting the power module 30 into the accommodation bin 212, or taking out the power module 30 from the accommodation bin 212.

[0097] Further, the limiting structure 23 includes a limiting state and a release state. When the limiting structure 23 is in the limiting state, the power module 30 is limited in the accommodation bin 212 and is electrically connected to the atomization module 10. When the limiting structure 23 is in the release state, the power module 30 can enter the accommodation bin 212 from the opening, or exit from the accommodation bin 212.

[0098] Furthermore, the limiting structure 23 includes a first clamping arm 231 and a second clamping arm 232. When the limiting structure 23 is in the limiting state, the first clamping arm 231 and the second clamping arm 232 respectively limit the third housing 31, so that the power supply module 30 is limited within the accommodation bin 212. When the limiting structure 23 is in the releasing state, the first clamping arm 231 and the second clamping arm 232 respectively release the third housing 31, so that the power supply module 30 can enter the accommodation bin 212 or exit from the accommodation bin 212.

[0099] Further, the second mounting shell 215 is formed with a first avoidance groove 2151 and a second avoidance groove 2152. The first avoidance groove 2151 and the second avoidance groove 2152 are respectively communicated with the accommodation bin 212, and the first avoidance groove 2151 and the second avoidance groove 2152 are oppositely arranged.

[0100] The first clamping arm 231 includes a first arm 2311 and a first protrusion 2312. The first arm 2311 is located within the first avoidance groove 2151, and the first protrusion 2312 is provided on the first arm 2311. The second clamping arm 232 includes a second arm 2321 and a second protrusion 2322. The second arm 2321 is located within the second avoidance groove 2152, and the second protrusion 2322 is provided on the second arm 2321.

[0101] When the limiting structure 23 is in the limiting state, the first protrusion 2312 and the second protrusion 2322 respectively extend into the accommodation bin 212 to limit the third housing 31. Thus, the power supply module 30 is limited within the accommodation bin 212.

[0102] Furthermore, the first protrusion 2312 and the second protrusion 2322 can be respectively limited on the end face of the third housing 31 close to the opening; or, the first protrusion 2312 and the second protrusion 2322 can also be respectively limited on the side surface of the third housing 31.

[0103] When the limiting structure 23 is in the releasing state, the first protrusion 2312 and the second protrusion 2322 move relatively away from each other, so that the first protrusion 2312 is located within the first avoidance groove 2151, and the second protrusion 2322 is located within the second avoidance groove 2152, thereby releasing the third housing 31.

[0104] Furthermore, neither the first clamping arm 231 nor the second clamping arm 232 extends out of the opening of the accommodation bin 212. When the power supply module 30 is inserted into the accommodation bin 212, the power supply module 30 also does not extend out of the opening of the accommodation bin 212, so that the power supply module 30 is completely located within the accommodation bin 212.

[0105] Further, the third housing 31 is formed with a first card slot 3111 and a second card slot 3112. The first card slot 3111 is for the first protrusion 2312 to be inserted, and the second card slot 3112 is for the second protrusion 2322 to be inserted.

[0106] When the limiting structure 23 is in the limiting state, the first protrusion 2312 is limited within the first card slot 3111, and the second protrusion 2322 is limited within the second card slot 3112. Thus, with the cooperation between the first protrusion 2312 and the first card slot 3111, and between the second protrusion 2322 and the second card slot 3112, the limiting of the third housing 31 is realized, and further the power module 30 is limited and received within the accommodation bin 212.

[0107] When the limiting structure 23 is in the released state, the first protrusion 2312 exits the first card slot 3111, and the second protrusion 2322 exits the second card slot 3112. Thus, the limiting of the third housing 31 by the limiting structure 23 is released, and further the power module 30 can enter and exit the accommodation bin 212.

[0108] Further, please refer to Figure 11 and in combination with Figure 7-8 as shown, the third housing 31 includes a third mounting shell 311 and a fourth mounting shell 312. The fourth mounting shell 312 and the third mounting shell 311 are connected to form a mounting cavity 313. The power supply assembly 32 is disposed within the mounting cavity 313 so that the power supply assembly 32 can be received and protected by the third housing 31.

[0109] In the first implementation manner, the fourth mounting shell 312 is formed with the first card slot 3111 and the second card slot 3112.

[0110] In the second implementation manner, the third mounting shell 311 and the fourth mounting shell 312 jointly form the first card slot 3111 and the second card slot 3112.

[0111] In the third implementation manner, the third mounting shell 311 is formed with the first card slot 3111 and the second card slot 3112.

[0112] Further, the third mounting shell 311 includes a bottom plate 3113 and a side plate 3114. Among them, the side plate 3114 extends along the outer edge of the bottom plate 3113 so that the third mounting shell 311 is formed into a hollow structure with a first open end.

[0113] The fourth mounting shell 312 is in a plate-like structure and closes the first open end, thereby enclosing and defining the mounting cavity 313 together with the bottom plate 3113 and the side plate 3114.

[0114] Further, the side plate 3114 is a hollow structure with openings at both ends, and is formed by the first side wall 31141, the second side wall 31142, the third side wall 31143, and the fourth side wall 31144 that are connected end to end in sequence. Among them, the first side wall 31141 is opposite to the third side wall 31143, and the second side wall 31142 is opposite to the fourth side wall 31144.

[0115] Furthermore, the first card slot 3111 and the second card slot 3112 are opened on the side plate 3114. Among them, the first card slot 3111 is opened on the first side wall 31141, and the second card slot 3112 is opened on the third side wall 31143, so that the first card slot 3111 and the second card slot 3112 are arranged oppositely. Alternatively, the first card slot 3111 is opened on the second side wall 31142, and the second card slot 3112 is opened on the fourth side wall 31144, so that the first card slot 3111 and the second card slot 3112 are arranged oppositely.

[0116] Further, the installation cavity 313 includes a first installation position 3131 and a second installation position 3132. The power supply assembly 32 includes a first circuit board 321 and a storage battery 322. The storage battery 322 is electrically connected to the first circuit board 321.

[0117] Among them, the first circuit board 321 is inserted into the first installation position 3131 along the first open end, and the storage battery 322 is inserted into the second installation position 3132 along the first open end.

[0118] Further, a first partition 3116 and a second partition 3117 that are opposite and spaced apart are provided in the installation cavity 313. The first partition 3116 and the second partition 3117 divide the installation cavity 313 into a first installation position 3131 and a second installation position 3132.

[0119] In the first embodiment, the first partition 3116 is provided on the inner surface of the first side wall 31141, and the second partition 3117 is provided on the inner surface of the third side wall 31143, so that the first partition 3116 and the second partition 3117 are arranged oppositely.

[0120] Further, a clamping arm 3118 is provided on the side plate 3114. The clamping arm 3118 is provided on the second side wall 31142 and can extend into the first installation position 3131. A clamping position 3211 is provided on the first circuit board 321. When the first circuit board 321 is inserted into the first installation position 3131 along the first open end, the clamping arm 3118 is clamped in the clamping position 3211 to limit the movement of the first circuit board 321 in the first installation position 3131. Thus, under the limitation of the first installation position 3131 and the cooperation of the clamping part and the clamping position 3211, the accommodation and limitation of the first circuit board 321 are realized, and the need to set fixing parts to fix the first circuit board 321 in the first installation position 3131 is avoided.

[0121] In the second embodiment, the first partition portion 3116 is provided on the inner side surface of the second side wall 31142, and the second partition portion 3117 is provided on the inner side surface of the fourth side wall 31144.

[0122] Further, please refer to Figure 9-10 As shown, the second mounting case 215 includes a first plate 2153, an outer case 2154, an inner case 2155, and a second plate 2156. A hole is formed in the middle of the first plate 2153 to form an inner edge and an outer edge. The outer case 2154 extends along the outer edge in the first direction and is configured to form a second open end. The inner case 2155 extends along the inner edge in the first direction and is configured to form a third open end. Wherein, the extension length of the inner case 2155 in the first direction is less than the extension length of the outer case 2154 in the first direction, so that the third open end is located inside the outer case 2154.

[0123] Further, the second plate 2156 closes the third open end and defines a receiving bin 212 with the inner case 2155. The first mounting case 214 is sealingly connected to the second open end and defines a storage bin 211 with the outer case 2154, the first plate 2153, the inner case 2155, and the second plate 2156. Thus, the storage bin 211 and the receiving bin 212 are separated, and their corresponding openings are opposite to each other in the first direction. Further, when the liquid storage module 20 is connected to the atomization module 10, the opening of the receiving bin 212 is located on the side away from the atomization module 10, so as to facilitate the operation of the power module 30 to enter and exit the receiving bin 212. Further, the power module 30 can be directly disassembled and assembled from the inside of the receiving bin 212.

[0124] Further, the inner side surface of the receiving bin 212 is adapted to the outer side surface of the third housing 31, so that the power module 30 is received in the receiving bin 212 and, under the limiting action of the limiting structure 23, the power module 30 remains stationary relative to the second housing 21.

[0125] Further, please refer to Figure 3-4 As shown, an installation hole 2141 is formed on the first mounting case 214, and the installation hole 2141 communicates with the storage bin 211. The liquid storage module 20 includes a liquid guiding member 24, and the liquid guiding member 24 is disposed in the installation hole 2141 and extends out of the installation hole 2141 to be connected to the atomization assembly 12. Thus, the aerosol generating matrix received in the storage bin 211 can move towards the atomization assembly 12 through the liquid guiding member 24.

[0126] Further, the liquid guiding member 24 includes opposite first end 241 and second end 242. The first end 241 is disposed in the installation hole 2141, and the second end 242 is connected to the atomization assembly 12.

[0127] Furthermore, the first end 241 is hermetically connected within the mounting hole 2141 to prevent the aerosol - generating matrix within the storage chamber 211 from leaking along the gap between the outer wall of the liquid - guiding member 24 and the mounting hole 2141.

[0128] In one embodiment, the first end 241 is press - fitted into the mounting hole 2141 so that the first end 241 is hermetically connected within the mounting hole 2141.

[0129] In the second embodiment, a sealing ring is provided between the outer side of the first end 241 and the mounting hole 2141 so that the first end 241 is hermetically connected within the mounting hole 2141.

[0130] Further, an atomization chamber 111 and a receiving hole 1132 are formed on the first housing 11. The receiving hole 1132 communicates with the atomization chamber 111. Among them, the receiving hole 1132 is opened on one side of the first housing 11 corresponding to the first plane 1131, and the position of the receiving hole 1132 corresponds to the position of the mounting hole 2141.

[0131] The atomization assembly 12 is disposed within the atomization chamber 111. The second end 242 extends out of the mounting hole 2141 and passes through the receiving hole 1132 to be connected to the atomization assembly 12, so that the aerosol - generating matrix within the storage chamber 211 can move to the atomization assembly 12 through the liquid - guiding member 24.

[0132] Further, for the magnetically - connected atomization module 10 and liquid - storage module 20, under the limiting action of the liquid - guiding member 24 in its radial direction, after the atomization module 10 and the liquid - storage module 20 are connected, they will not shift along the first plane 1131 or the second plane 213.

[0133] Further, the atomization assembly 12 includes a base 121 and a heating element 122. The base 121 is disposed within the atomization chamber 111, and the heating element 122 is disposed on the base 121 so that the heating element 122 is fixed through the base 121.

[0134] Further, the base 121 is a porous structure. Among them, the base 121 can be formed by at least one of ceramic materials, cotton materials, and fiber materials, but is not limited thereto.

[0135] Preferably, the base 121 is formed of ceramic material, so as to facilitate embedding the heating element 122 within the base 121 and forming the atomization assembly 12 with the base 121. At the same time, the base 121 made of ceramic material has higher structural strength compared to cotton materials or limiting materials, so as to effectively fix the heating element 122.

[0136] In the first embodiment, the base 121 has a buffer cavity 1211, and the heating element 122 is embedded in the base 121 and is located on the peripheral side of the buffer cavity 1211. The liquid guide 24 is a liquid guide tube, and the aerosol generating substrate in the storage bin 211 enters the buffer cavity 1211 through the liquid guide tube by inverting the electronic atomization device 100, and enters the base 121 in the buffer cavity 1211 and flows to the heating element 122, so that the aerosol generating substrate located in the heating area of ​​the heating element 122 is heated to form an aerosol, and diffuses into the atomization bin 111. Among them, when the electronic atomization device 100 is inverted, the aerosol generating substrate in the storage bin 211 can move into the buffer cavity 1211 through the liquid guide tube by its own gravity. When the electronic atomization device 100 is placed upright, the storage bin 211 is located below the atomization bin 111.

[0137] In some embodiments, the base 121 is a hollow structure with openings at both ends, and the atomizer assembly 12 further includes a sealing cover 123, which covers an opening of the base 121 away from the first plane 1131 and forms a buffer chamber 1211 with the base 121, and the second end 242 of the liquid guide tube is inserted into another opening of the base 121. By removing the sealing cover 123, the buffer chamber 1211 can be cleaned and the liquid guide tube can be easily installed.

[0138] Furthermore, the first end 241 of the liquid conduit is sealed and connected in the mounting hole 2141 , and the second end 242 of the liquid conduit passes through the first shell 11 and at least partially extends into the cache cavity 1211 to connect the storage bin 211 with the cache cavity 1211 .

[0139] Furthermore, the liquid guiding tube is provided with a baffle 25, and the baffle 25 is used to prevent the aerosol generating matrix in the buffer cavity 1211 from flowing back to the storage bin 211 through the liquid guiding tube.

[0140] The blocking member 25 has a release position and a blocking position. When the electronic atomization device 100 is inverted, the blocking member 25 will be located in the release position, so that the aerosol substrate in the storage bin 211 can pass through the liquid guide tube and pass over the blocking member 25 into the cache chamber 1211. When the electronic atomization device 100 is placed upright, the blocking member 25 will be located in the blocking position, so that the aerosol-generating substrate in the cache chamber 1211 cannot pass through the blocking member 25, and thus cannot flow back to the storage bin 211 through the liquid guide tube.

[0141] Furthermore, the blocking member 25 can be a one-way valve piece. When the electronic atomization device 100 is in an inverted state, the one-way valve piece will be located at the release position at least under its own gravity or under the pressure of the aerosol generating matrix, so that the aerosol generating matrix in the storage chamber 211 can move into the buffer chamber 1211. When the electronic atomization device 100 is placed upright, the one-way valve piece will be located at the blocking position at least under its own gravity or under the pressure of the aerosol generating matrix in the buffer chamber 1211 to prevent the aerosol generating matrix in the buffer chamber 1211 from flowing back to the storage chamber 211 through the liquid guide tube.

[0142] In the second embodiment, the liquid guiding member 24 conveys the aerosol generating matrix in the storage chamber 211 to the base 121 by capillary action. Among them, the liquid guiding member 24 can be made of materials such as liquid guiding cotton and liquid guiding fiber.

[0143] In the third embodiment, the liquid guiding member 24 can also convey the aerosol generating matrix in the storage chamber 211 to the base 121 by self-priming action. Among them, the liquid guiding member 24 can be a capillary tube.

[0144] Furthermore, the first housing 11 is configured to form a mouthpiece 11211 and an air inlet hole 11221. The mouthpiece 11211 is located at one end of the first housing 11 away from the first plane 1131, and the air inlet hole 11221 is located on the side surface of the first housing 11 along the direction from the first plane 1131 to the mouthpiece 11211.

[0145] Furthermore, the air inlet hole 11221 communicates with the atomization chamber 111, and together with the atomization chamber 111 and the mouthpiece 11211, forms an atomization channel 40. When external air enters the atomization chamber 111 through the air inlet hole 11221, it will be mixed with the formed aerosol in the atomization chamber 111 and flow out through the mouthpiece 11211.

[0146] Preferably, a plurality of air inlet holes 11221 are provided on the side surface of the first housing 11 so that the air entering the atomization chamber 111 through the air inlet holes 11221 can be more fully and evenly mixed with the aerosol in the atomization chamber 111.

[0147] Furthermore, the first housing 11 includes a first connection shell 112 and a second connection shell 113. The first connection shell 112 and the second connection shell 113 are connected to form the atomization chamber 111.

[0148] Among them, the first connection shell 112 is configured to form the mouthpiece 11211 and the air inlet hole 11221, and the second connection shell 113 is configured to form a receiving hole 1132 and the first plane 1131.

[0149] Furthermore, the first connection shell 112 and the second connection shell 113 can be, but are not limited to, connected by means such as threaded connection, plug-in connection, and snap connection.

[0150] Further, a second circuit board 14 and a detection sensor 15 are provided in the atomization chamber 111. The second circuit board 14 is electrically connected between the detection sensor 15 and the power supply component 32, and the heating element 122 is electrically connected to the second circuit board 14, so that the power supply component 32 can supply power to the second circuit board 14, the heating element 122, and the detection sensor 15.

[0151] Further, the detection sensor 15 responds to the gas flow in the atomization chamber 111 to activate the power supply component 32 to supply power to the atomization component 12, so that the heating element 122 generates heat to heat the aerosol generation matrix to form an aerosol.

[0152] Further, the detection sensor 15 is an electret sensor or a silicon microphone sensor.

[0153] Further, please refer to Figure 12 and combine with Figure 3-4 As shown, a seal 16 is further provided in the atomization chamber 111. The seal 16 is used to seal the detection sensor 15 and the second circuit board 14 at the bottom of the atomization chamber 111, so as to prevent the aerosol in the atomization chamber 111 from cooling to form condensate from contacting the second circuit board 14 and the detection sensor 15, thereby affecting the use of the second circuit board 14 and the detection sensor 15.

[0154] Further, a liquid collecting groove 161 is formed on the side of the seal 16 facing the mouthpiece 11211. The liquid collecting groove 161 is used to collect the condensate in the atomization chamber 111.

[0155] Further, the seal 16 is formed with a first hole 162 and a second hole 163. The position of the first hole 162 corresponds to the position of the receiving hole 1132 and is sealed on the outer side wall of the corresponding liquid guiding member 24 to prevent the aerosol generation matrix in the buffer chamber 1211 from leaking.

[0156] The position of the second hole 163 corresponds to the position of the detection sensor 15, so that the second hole 163 and the atomization chamber 111 and the mouthpiece 11211 form a detection channel 50, so that the detection sensor 15 can detect the gas flow in the atomization chamber 111 and activate the power supply component 32 to supply power to the atomization component 12 based on the gas flow in the atomization chamber 111, so that the heating element 122 generates heat to heat the aerosol generation matrix to form an aerosol.

[0157] Further, a plugging groove 164 is further formed on the side of the seal 16 facing the mouthpiece 11211. The first hole 162 is located in the middle of the plugging groove 164, and one end of the base 121 away from the mouthpiece 11211 is hermetically plugged into the plugging groove 164.

[0158] Further, the first connection shell 112 is configured to form an air duct 11222, which is located in the atomization chamber 111 and is at least partially and sealingly inserted into the second hole 163. Among them, the air duct 11222 communicates with the mouthpiece 11211 and defines a detection channel 50. Thus, the detection sensor 15 is separated from the atomization chamber 111 through the air duct 11222, so that the detection sensor 15 activates the power supply component 32 to supply power to the atomization component 12 based on the gas flow in the air duct 11222, so that the heating element 122 generates heat to heat the aerosol generation matrix to form an aerosol. And it avoids the condensate formed in the atomization chamber 111 from contacting the detection sensor 15.

[0159] Further, the first connection shell 112 includes a first sub-shell 1121 and a second sub-shell 1122. The second sub-shell 1122 is sealingly connected between the first sub-shell 1121 and the second connection shell 113, forms a receiving cavity 1123 with the first sub-shell 1121, and forms an atomization chamber 111 with the second connection shell 113.

[0160] Among them, the first sub-shell 1121 is configured to form a mouthpiece 11211, and the second sub-shell 1122 is configured to form an air duct 11222 and an air inlet hole 11221. The air duct 11222 communicates with the mouthpiece 11211 through the receiving cavity 1123 to define a detection channel 50, so that the detection channel 50 does not pass through the atomization chamber 111.

[0161] Further, a liquid collecting member 17 is provided in the receiving cavity 1123. The liquid collecting member 17 is used to collect the condensate in the mouthpiece 11211. Among them, the liquid collecting member 17 can be made of materials such as absorbent cotton or absorbent paper that can adsorb condensate.

[0162] Further, a first through hole 2142 is provided on the first mounting shell 214. A second through hole 21561 is provided on the second plate 2156, and the position of the second through hole 21561 corresponds to the position of the first through hole 2142.

[0163] The liquid storage module 20 includes a sealing ring 26. The sealing ring 26 is sealingly connected between the first through hole 2142 and the second through hole 21561 to prevent the aerosol generation matrix in the storage chamber 211 from leaking from the first through hole 2142 or the second through hole 21561.

[0164] The power module 30 includes a conductive member 33. The conductive member 33 is electrically connected to the power supply component 32. Among them, the conductive member 33 extends out of the third housing 31 and sequentially passes through the second through hole 21561, the sealing ring 26, and the first through hole 2142 to be electrically connected to the atomization component 12. Thus, it avoids the conductive member 33 from contacting the aerosol generation matrix in the storage chamber 211.

[0165] Furthermore, the power supply module 30 includes two conductive members 33, which are electrically connected between the first circuit board 321 and the second circuit board 14 respectively. Thus, the power supply path from the storage battery 322 to the first circuit board 321, the second circuit board 14, the heating element 122, and the detection sensor 15 is realized.

[0166] For ease of description, spatial relative terms such as "above", "over", "on the upper surface", "upper" etc. can be used here to describe the spatial position relationship of one device or feature shown in the figure with other devices or features. It should be understood that the spatial relative terms are intended to encompass different orientations in use or operation in addition to the orientation depicted in the figure. For example, if the device in the drawing is inverted, the device described as "above" or "over" other devices or structures will then be positioned "below" or "under" other devices or structures. Thus, the exemplary term "above" can include both the orientations of "above" and "below". The device can also be positioned in other different ways (rotated 90 degrees or in other orientations), and corresponding interpretations should be made for the spatial relative descriptions used herein.

[0167] In addition, it should be noted that using terms such as "first", "second" to limit components is only for the convenience of differentiating the corresponding components. Without additional statements, the above terms have no special meanings, so they should not be construed as limitations on the protection scope of this application.

[0168] The above are only the preferred embodiments of this application and are not used to limit this application. For those skilled in the art, this application can have various changes and modifications. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of this application shall be included within the protection scope of this application.

Claims

1. An electronic atomization device, characterized in that: include: an atomization module, for heating an aerosol generating substrate to generate an aerosol; A power module, electrically connected to the atomization module and used to supply power to the atomization module; A liquid storage module is connected to the atomization module and is used to supply the aerosol generating matrix to the atomization module, wherein the atomization module is located outside the liquid storage module, and the liquid storage module is constructed to form a storage bin and a receiving bin that are separated and arranged, the storage bin is used to accommodate the aerosol generating matrix, and the receiving bin is used to accommodate the power module.

2. The electronic atomization device according to claim 1, characterized in that: The atomization module comprises a first shell and an atomization assembly, wherein the atomization assembly is arranged in the first shell, and the first shell has a first plane; The liquid storage module comprises a second shell, the second shell is structured to form the storage bin and the accommodating bin, and the second shell has a second plane; The power module includes a third shell and a power supply component, the power supply component is arranged in the third shell, and the third shell is accommodated in the accommodating compartment; When the atomization module is connected to the liquid storage module, the power supply assembly is electrically connected to the atomization assembly, and the first plane abuts against the second plane, so that the atomization module is located outside the liquid storage module.

3. The electronic atomization device according to claim 2, characterized in that: The atomization module includes a first magnetic attraction member, which is disposed in the first housing and does not extend out of the first plane; The liquid storage module includes a second magnetic attraction member, which is disposed in the second shell and does not extend out of the second plane; The first magnetic attraction member and the second magnetic attraction member attract each other so that the second plane is against the first plane, and the power supply component is electrically connected to the atomization component.

4. The electronic atomization device according to claim 2, characterized in that: The second shell includes a first mounting shell and a second mounting shell, the first mounting shell and the second mounting shell are sealed and connected to form the storage bin, and the second mounting shell is recessed into the storage bin to form the accommodating bin, wherein the first mounting shell and / or the second mounting shell are constructed to form the second plane.

5. The electronic atomization device according to claim 4, characterized in that: The power module is inserted into the accommodating compartment and is limited in the accommodating compartment by a limiting structure.

6. The electronic atomization device according to claim 5, characterized in that: One end of the accommodating bin is open, and the limiting structure is arranged in the accommodating bin and close to the opening, wherein the limiting structure includes a limiting state and a releasing state, and when the limiting structure is in the limiting state, the power module is limited in the accommodating bin, and when the limiting structure is in the releasing state, the power module can enter and exit the accommodating bin from the opening.

7. The electronic atomization device according to claim 6, characterized in that: The limiting structure includes a first clamping arm and a second clamping arm. When the limiting structure is in the limiting state, the first clamping arm and the second clamping arm respectively limit the third shell. When the limiting structure is in the releasing state, the first clamping arm and the second clamping arm respectively release the third shell.

8. The electronic atomization device according to claim 7, characterized in that: The second mounting shell is formed with a first avoidance groove and a second avoidance groove, the first avoidance groove and the second avoidance groove are respectively connected to the accommodating bin, and a first notch of the first avoidance groove is arranged opposite to a second notch of the second avoidance groove; The first clamping arm comprises a first arm and a first protrusion, the first arm is located in the first avoidance groove, and the first protrusion is arranged on the first arm; The second clamping arm comprises a second arm and a second protrusion, the second arm is located in the second avoidance groove, and the second protrusion is arranged on the second arm; When the limiting structure is in the limiting state, the first protrusion and the second protrusion extend into the accommodating compartment respectively and limit the third shell respectively; When the limiting structure is in the released state, the first protrusion is located in the first avoidance groove, and the second protrusion is located in the second avoidance groove, so as to release the third shell.

9. The electronic atomization device according to claim 8, characterized in that: The third housing structure is formed with a first card slot and a second card slot; When the limiting structure is in the limiting state, the first protrusion is limited in the first card slot, and the second protrusion is limited in the second card slot. When the limiting structure is in the releasing state, the first protrusion exits the first card slot, and the second protrusion exits the second card slot.

10. The electronic atomization device according to claim 9, characterized in that: The third shell includes a third mounting shell and a fourth mounting shell, the fourth mounting shell is connected to the third mounting shell to form a mounting cavity, the power supply component is arranged in the mounting cavity, wherein the third mounting shell and / or the fourth mounting shell are constructed to form the first card slot and the second card slot.

11. The electronic atomization device according to claim 10, characterized in that: The third mounting shell includes a bottom plate; and A side plate extending along the outer edge of the base plate and having a first opening end, wherein the fourth mounting shell is plate-shaped and closed at the first opening end, and defines the mounting cavity with the base plate and the side plate, wherein the first card slot and the second card slot are provided on the side plate.

12. The electronic atomization device according to claim 11, characterized in that: The mounting cavity includes a first mounting position and a second mounting position; The side plate is provided with a clamping arm, and the clamping arm can extend into the first installation position; The power supply assembly includes a first circuit board, and a clamping position is provided on the first circuit board. When the first circuit board is inserted into the first installation position along the first opening end, the clamping arm is clamped at the clamping position to limit the movement of the first circuit board in the first installation position; and A storage battery is electrically connected to the first circuit board, and the storage battery is inserted into the third installation shell along the first opening end and is located at the second installation position.

13. The electronic atomization device according to claim 4, characterized in that: The second mounting shell includes a first plate, a hole is opened in the middle of the first plate to form an inner edge and an outer edge; A shell, the shell is extended along the outer edge toward the first direction and is structured to form a second opening end; An inner shell, the inner shell is extended along the inner edge toward the first direction and is configured to have a third opening end, the third opening end being located inside the outer shell; as well as A second plate, the second plate is closed at the third open end and defines the accommodating bin with the inner shell; The first mounting shell is sealed and connected to the second opening end, and defines the storage bin together with the outer shell, the first plate, the inner shell and the second plate.

14. The electronic atomization device according to claim 13, characterized in that: A mounting hole is formed on the first mounting shell, and the mounting hole is connected to the storage bin; The liquid storage module includes a liquid guide member, which is arranged in the mounting hole and extends out of the mounting hole to be connected with the atomization assembly.

15. The electronic atomization device according to claim 14, characterized in that: An atomizing bin and a receiving hole are formed on the first shell, the receiving hole is connected to the atomizing bin, and the position of the receiving hole corresponds to the position of the mounting hole; The atomizing assembly comprises a base and a heating element, wherein the base is arranged in the atomizing bin, and the heating element is arranged on the base; The liquid guide member includes a first end and a second end opposite to each other, the first end is arranged in the mounting hole, and the second end extends out of the mounting hole and passes through the receiving hole to be connected with the base.

16. The electronic atomization device according to claim 15, characterized in that: The base has a buffer cavity, and the heating element is embedded in the base; The liquid guiding member is a liquid guiding tube, a first end of which is sealed and connected in the mounting hole, and a second end of which passes through the first shell and at least partially extends into the cache cavity to connect the storage bin with the cache cavity.

17. The electronic atomization device according to claim 16, characterized in that: The liquid conduit is provided with a baffle, and the baffle is used to prevent the aerosol generating matrix in the cache cavity from flowing back to the storage bin through the liquid conduit.

18. The electronic atomization device according to claim 15, characterized in that: The first shell structure is formed with a suction nozzle and an air inlet hole, the suction nozzle is located at one end of the first shell away from the first plane, the air inlet hole is located on the side of the first shell along the direction from the first plane to the suction nozzle, and the air inlet hole is connected to the atomization bin, and forms an atomization channel with the atomization bin and the suction nozzle structure.

19. The electronic atomization device according to claim 18, characterized in that: The first shell includes a first connecting shell and a second connecting shell, the first connecting shell and the second connecting shell are connected to form the atomization bin, the first connecting shell structure forms the suction nozzle and the air inlet hole, and the second connecting shell structure forms the receiving hole and the first plane.

20. The electronic atomization device according to claim 19, characterized in that: A second circuit board is provided in the atomization chamber, and the second circuit board is electrically connected to the power supply component; as well as A detection sensor is electrically connected to the second circuit board and is responsive to the gas flow in the atomization chamber to activate the power supply component to supply power to the atomization component.

21. The electronic atomization device according to claim 20, characterized in that: A sealing member is also provided in the atomization bin, and the sealing member is used to seal the detection sensor and the second circuit board at the bottom of the atomization bin.

22. The electronic atomization device according to claim 21, characterized in that: The sealing member is formed with a first hole, the position of the first hole corresponds to the position of the receiving hole, and is sealed on the outer side wall of the corresponding liquid guide member; as well as The second hole is located at a position corresponding to the position of the detection sensor, and the second hole, the atomization bin and the suction nozzle form a detection channel.

23. The electronic atomization device according to claim 22, characterized in that: The first connecting shell structure is formed with an air duct, which is located in the atomization bin and is at least partially sealed and inserted in the second hole, wherein the air duct is communicated with the suction nozzle and defines the detection channel.

24. The electronic atomization device according to claim 23, characterized in that: The first connecting shell includes a first subshell, and the first subshell is configured to form the suction nozzle; as well as The second sub-shell is sealed and connected between the first sub-shell and the second connecting shell, and forms a receiving cavity with the first sub-shell, and forms the atomization chamber with the second connecting shell, wherein the second sub-shell structure forms the air duct, the air duct is connected with the suction nozzle through the receiving cavity to define the detection channel, and a liquid collecting part is provided in the receiving cavity, and the liquid collecting part is used to absorb condensed liquid.

25. The electronic atomization device according to claim 13, characterized in that: The first mounting shell is provided with a first through hole; The second plate is provided with a second through hole, and the position of the second through hole corresponds to the position of the first through hole; The liquid storage module comprises a sealing ring, and the sealing ring is sealingly connected between the first through-hole and the second through-hole; The power module includes a conductive member, which is electrically connected to the power supply assembly. The conductive member extends out of the third shell and passes through the second through hole, the sealing ring and the first through hole in sequence to be electrically connected to the atomization assembly.

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