Tin bead blocking mechanism of tin soldering machine and tin soldering machine with tin bead blocking mechanism

By designing a tin blocking bead mechanism in a soldering machine, the tin blocking assembly and capillary suction force are used to block the excess tin beads, the problem of tin beads sticking on the line frame is solved, and the quality of soldering and the tin dipping accuracy of the product is improved.

CN222971188UActive Publication Date: 2025-06-13XIAMEN SIPU ELECTROMECHANICAL CO LTD
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Patent Information

Application Number
CN202421985118.X
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-08-16
Publication Date
2025-06-13
Estimated Expiration
2034-08-16

AI Technical Summary

Technical Problem

During the process of dipping tin, due to the rosin when the machine automatically dips tin, the tin beads are easily stuck on the frame, resulting in damage to the copper wire and affecting product quality.

Method used

A tin stop bead mechanism for soldering machine is designed, including a tin stop bracket, a first drive source and a tin stop assembly. The tin stop assembly is rotatably arranged on the tin stop bracket, and the first driving source (such as a cylinder) drives the tin stop assembly to flip back and forth, using capillary suction and tin scraper plates to block the excess tin beads.

Benefits of technology

It effectively avoids splashing tin beads sticking to the online rack, reduces the generation of bad products, improves the quality of soldering and the tin dipping accuracy of the product.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to a tin bead blocking mechanism of a tin soldering machine, which is applied to the tin soldering machine, the tin soldering machine comprises a rack and a tin melting mechanism erected on the rack, and the tin bead blocking mechanism of the tin soldering machine comprises a tin blocking support which is inserted in front of the tin melting mechanism in a lifting mode and used for supporting; the first driving source is fixedly arranged on one side of the tin blocking support and used for providing overturning power; the tin blocking assembly is rotatably arranged on the tin blocking support; the first driving source can drive the tin blocking assembly to overturn back and forth in a reciprocating mode. Through the arrangement of the tin blocking assembly, when tin pick-up is carried out, splashing tin beads can be blocked by the tin scraping plate, the situation that defective products are increased due to the fact that the tin beads are splashed and adhere to the wire frame is avoided, and the tin soldering quality is improved. The utility model further discloses a tin soldering machine.
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Description

Technical Field

[0001] The utility model relates to the technical field of tin dipping equipment, in particular to a tin bead blocking mechanism for a soldering machine and a soldering machine with the same. Background Art

[0002] A tin dipping equipment is a device used for dipping tin on components. It usually has a tin melting pool to heat and melt the tin bar to make it in a molten state. Then, the wire frame product is moved to the tin dipping station by a machine, and the wire descends so that the tin dipping part of the wire frame product is inserted into the tin melting pool to perform the tin dipping operation.

[0003] However, each time the machine performs automatic tin dipping, due to the effect of rosin, tin beads will stick to the wire frame during tin dipping, resulting in damage to the copper wire on the wire frame and affecting the product quality.

[0004] Therefore, it is necessary to improve the existing technology to overcome the defects in the existing technology. Summary of the Invention

[0005] The purpose of the utility model is to provide a tin bead blocking mechanism for a soldering machine and a soldering machine with the same to solve the above problems.

[0006] To achieve the above technical solution, the technical solution of the utility model is as follows: A tin bead blocking mechanism for a soldering machine is applied to a soldering machine. The soldering machine includes a frame and a tin melting mechanism mounted on the frame. The tin bead blocking mechanism for the soldering machine includes:

[0007] A tin blocking bracket, which is inserted in front of the tin melting mechanism in a liftable manner for support;

[0008] A first driving source, fixedly arranged on one side of the tin blocking bracket, for providing flipping power; and

[0009] A tin blocking component, rotatably arranged on the tin blocking bracket; the first driving source can drive the tin blocking component to reciprocally flip back and forth;

[0010] Wherein: when the coil handling manipulator inserts the wire frame to be tinned into the tin blocking component and then presses down until the pins are tinned and then retracts in the reverse direction, the excess tin will be blocked and removed by the tin blocking component under the action of capillary suction.

[0011] Further, the first driving source is a cylinder; the cylinder is fixedly arranged on the tin blocking bracket through a cylinder mounting block, and a gear-rack element is detachably arranged at the output end of the cylinder; sensors are arranged corresponding to the telescopic positions of the cylinder.

[0012] Further, the tin shielding bracket includes guide shafts symmetrically inserted on the tin melting mechanism; a flipping seat is provided at the top of the guide shafts; an elastic member is provided between adjacent flipping seats and the tin melting mechanism; a rack moving block is provided at one end of the flipping seat; the gear-rack element is slidably arranged on the rack moving block; the tin shielding assembly is rotatably arranged on the flipping seat through a bearing.

[0013] Further, the tin shielding assembly includes a rotating shaft; a limiting seat is provided at one end of the rotating shaft; a mounting plate is fixedly arranged on the rotating shaft; a tin scraping plate is detachably arranged on the mounting plate; a positioning plate is adjustably arranged on the tin scraping plate.

[0014] Further, through holes for scraping are arrayed at one end of the tin scraping plate; positioning shoulders are bent upward at both ends of the tin scraping plate; protruding portions are arrayed outward on one side of the positioning plate.

[0015] Further, the tin shielding bead mechanism of the soldering machine further includes a cleaning assembly and a collection assembly; the cleaning assembly is located on one side of the tin shielding bracket and is used for cleaning the tin shielding assembly; the collection assembly is movably arranged below the cleaning assembly and is used for collecting the solder scraped by the cleaning assembly.

[0016] Further, the cleaning assembly includes a cleaning bracket; a transverse moving cylinder is arranged on the cleaning bracket; a cleaning brush roller assembly is movably arranged at the top of the cleaning bracket; the transverse moving cylinder can drive the cleaning brush roller assembly to move back and forth; a longitudinal moving cylinder is fixedly arranged on one side of the cleaning bracket; the longitudinal moving cylinder can drive the cleaning brush roller assembly to approach or move away from the cleaning brush roller assembly.

[0017] In addition, the present invention also provides a soldering machine, including

[0018] a frame

[0019] a tin melting mechanism arranged on the frame and used for heating and melting tin bars;

[0020] a tin feeding mechanism obliquely arranged on the frame and used for automatically feeding tin bars to the tin melting mechanism quantitatively;

[0021] the tin shielding bead mechanism of the soldering machine as described in any one of the above, which is used for cleaning the excess tin liquid adhered to the wire rack; and

[0022] a slag removing mechanism telescopically arranged on the top of the tin melting mechanism and used for scraping the impurities floating on the top of the tin melting mechanism.

[0023] Compared with the prior art, the present invention has the following beneficial effects: through the setting of the tin shielding assembly, when tin dipping is carried out, the splashing tin beads will be blocked by the tin scraping plate, avoiding splashing and adhesion on the wire rack and causing an increase in defective products, and improving the quality of soldering. Brief Description of the Drawings

[0024] To further illustrate each embodiment, the present utility model provides drawings. These drawings are a part of the disclosure of the present utility model, mainly used to illustrate the embodiments, and can be combined with the relevant descriptions in the specification to explain the operating principle of the embodiments. With reference to these contents, those of ordinary skill in the art should be able to understand other possible implementation manners and the advantages of the present utility model. The components in the drawings are not drawn to scale, and similar component symbols are usually used to represent similar components.

[0025] Figure 1 is a three-dimensional structural schematic diagram of the solder bead blocking mechanism of the soldering machine;

[0026] Figure 2 is a three-dimensional structural schematic diagram of the soldering machine;

[0027] Figure 3 is an exploded view of the soldering machine. Detailed Embodiment

[0028] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without making creative efforts belong to the scope of protection of the present utility model.

[0029] In order to enable those skilled in the art in the technical field to better understand the solution of the present utility model, the present utility model will be further described in detail below in conjunction with the drawings and specific implementation manners.

[0030] Please refer to the attached Figure 1As shown in the figure: A soldering machine includes a frame 1, a tin melting mechanism 2, a tin feeding mechanism 9, a solder bead blocking mechanism for the soldering machine, and a slag removal mechanism 8. The frame 1 is a cuboid-shaped frame 1 structure with a common outer covering of sheet metal parts and moving wheels assembled at the bottom. Inside the frame 1, there is a control device electrically connected to the tin melting mechanism 2, the tin feeding mechanism 9, the solder bead blocking mechanism for the soldering machine, and the slag removal mechanism 8. This control device is used to control the operation of the soldering machine equipment. The automation control part of this control device can be specifically set by those skilled in the art according to the requirements of the soldering process, the structure and working process of the soldering machine equipment described below, and will not be elaborated here. The tin melting mechanism 2 is arranged on the frame 1 and is used to heat the tin bar to melt it, facilitating subsequent dipping of the relay pins with tin; the tin feeding mechanism 9 is inclinedly arranged on the frame 1 and is used to automatically supply tin bars to the tin melting mechanism 2 quantitatively to ensure that the liquid level of the tin liquid always remains at the same height during each soldering; the solder bead blocking mechanism for the soldering machine is movably arranged on the tin melting mechanism 2 and is used to clean the excess tin liquid adhered to the relay wire frame to ensure that the quality of each solder joint is balanced and consistent; the slag removal mechanism 8 is telescopically arranged on the top of the tin melting mechanism 2 and is used to scrape the impurities floating on the top of the tin melting mechanism 2. In this example, through the cooperation of equipment such as the tin melting mechanism 2, the tin feeding mechanism 9, the solder bead blocking mechanism for the soldering machine, the slag removal mechanism 8, and the control device (PLC controller), automatic tin dipping and cleaning are realized, thereby ensuring that the amount of tin dipped each time is consistent, the product quality is good, the production working time is reduced, and the production efficiency is improved. The structure of the present utility model is simple, cost-saving, high in work efficiency, low in production cost, good in product quality, high in finished product rate, and high in equipment utilization rate.

[0031] Based on the above embodiment, the solder bead blocking mechanism for the soldering machine includes: a solder bead blocking bracket 3, a first driving source 4, and a solder bead blocking assembly 5. The solder bead blocking bracket 3 is inserted in front of the tin melting mechanism 2 in a liftable manner and is used to provide support for the installation of the first driving source 4 and the solder bead blocking assembly 5; the first driving source 4 is fixedly arranged on one side of the solder bead blocking bracket 3 and is used to provide flipping power; the solder bead blocking assembly 5 is rotatably arranged on the solder bead blocking bracket 3; the first driving source 4 can drive the solder bead blocking assembly 5 to flip back and forth; specifically, when the coil handling manipulator inserts the wire frame to be dipped with tin into the solder bead blocking assembly 5 and presses down until the pins are dipped with tin and then retracts in the reverse direction, under the action of capillary suction, the excess tin will be blocked and removed by the solder bead blocking assembly 5. By adopting the above technical solution, in the present utility model, through the setting of the solder bead blocking assembly, when dipping with tin, the splashing solder beads will be blocked by the tin scraping plate, avoiding splashing and sticking to the wire frame and causing an increase in defective products, and improving the quality of soldering. In addition: when the wire frame is removed, the excess tin liquid is adhered to the solder bead blocking assembly 5 under the action of liquid capillary suction, effectively ensuring that the amount of tin liquid finally adhered to each pin is the same, thereby improving the tin dipping accuracy of the product and the product yield.

[0032] Based on the above embodiments, the first driving source 4 is a cylinder; the cylinder is fixedly arranged on the solder blocking bracket 3 through a cylinder mounting block, and a gear-rack element is detachably arranged at the output end of the cylinder; sensors are arranged corresponding to the telescopic positions of the cylinder. Of course, in other embodiments, the first driving source 4 can also be an electric type, a cylinder type or other mechanical structures with reciprocating movement, which are not specifically limited herein.

[0033] Based on the above embodiments, the solder blocking bracket 3 includes guide shafts 31 symmetrically inserted on the tin melting mechanism 2, which provides bidirectional positioning for the entire solder bead blocking mechanism of the soldering machine to move vertically, improving the movement accuracy and the accuracy of the docking wire rack; a flipping seat 32 is arranged at the top of the guide shaft 31; an elastic member 33 is arranged between the adjacent flipping seat 32 and the tin melting mechanism 2 for buffering to avoid rigid impact between parts and cause damage; a rack moving block 34 is arranged at one end of the flipping seat 32; the gear-rack element is slidably arranged on the rack moving block 34; the solder blocking assembly 5 is rotatably arranged on the flipping seat 32 through a bearing.

[0034] Based on the above embodiments, the solder blocking assembly 5 includes a rotating shaft 51; a limiting seat 52 is arranged at one end of the rotating shaft 51; a mounting plate 53 is fixedly arranged on the rotating shaft 51; a tin scraping plate 54 is detachably arranged on the mounting plate 53; a positioning plate 55 is adjustably connected to the tin scraping plate 54.

[0035] Based on the above embodiments, through holes are arrayed at one end of the tin scraping plate 54; positioning shoulders are bent upwards at both ends of the tin scraping plate 54; protruding parts are arrayed outwards on one side of the positioning plate 55.

[0036] Based on the above embodiments, the solder bead blocking mechanism of the soldering machine further includes a cleaning component 6 and a collection component 7; the cleaning component 6 is located on one side of the solder blocking bracket 3 for cleaning the solder blocking assembly 5; the collection component 7 is movably arranged below the cleaning component 6 for collecting the solder scraped by the cleaning component 6.

[0037] Based on the above embodiments, the cleaning component 6 includes a cleaning bracket 61; a transverse moving cylinder 62 is arranged on the cleaning bracket 61; a cleaning brush roller assembly 63 is movably arranged at the top of the cleaning bracket 61; the transverse moving cylinder 62 can drive the cleaning brush roller assembly 63 to move back and forth; a longitudinal moving cylinder 64 is fixedly arranged on one side of the cleaning bracket 61; the longitudinal moving cylinder 64 can drive the cleaning brush roller assembly 63 to approach or move away from the cleaning brush roller assembly 63.

[0038] The design point of the present utility model is that when the on-line rack is tinned, through the setting of the tin blocking component, in this way, when tinning, the splashing tin beads will be blocked by the tin scraping plate, avoiding splashing and sticking on the on-line rack and causing an increase in defective products, and improving the quality of soldering.

[0039] The above are only the preferred embodiments of the present invention, and do not impose any form of limitation on the present invention. Although the present invention has been disclosed above with the preferred embodiments, it is not intended to limit the present invention. Any person skilled in the art should be able to make equivalent embodiments of equivalent changes by using the above-disclosed technical content with some modifications within the scope of the technical solution of the present invention. However, as long as it does not depart from the content of the technical solution of the present invention, any brief modifications, equivalent changes and modifications made to the above embodiments based on the technical essence of the present invention still fall within the scope of the technical solution of the present invention.

Claims

1. A soldering machine tin bead blocking mechanism, applied to a soldering machine, the soldering machine comprising a frame (1) and a tin melting mechanism (2) mounted on the frame (1); characterized in that: The solder bead blocking mechanism of the soldering machine includes: A tin-blocking bracket (3) is liftable and inserted in front of the tin-melting mechanism (2) for support; A first driving source (4) is fixed to one side of the tin blocking bracket (3) and is used to provide turning power; and The tin blocking component (5) is rotatably arranged on the tin blocking bracket (3); the first driving source (4) can drive the tin blocking component (5) to flip back and forth; Wherein: the coil handling robot inserts the wire rack to be dipped into the tin blocking component (5) and presses it down until the pin is dipped with tin and then retracts in the opposite direction. Under the action of capillary suction, excess tin will be blocked and removed by the tin blocking component (5).

2. The solder bead blocking mechanism for a soldering machine as claimed in claim 1, characterized in that: The first driving source (4) is a cylinder; the cylinder is fixed on the tin blocking bracket (3) through a cylinder mounting block; a gear rack element is detachably provided at the output end of the cylinder; sensors are provided corresponding to the telescopic positions of the cylinder.

3. The solder bead blocking mechanism for a soldering machine as claimed in claim 2, characterized in that: The tin blocking bracket (3) comprises a guide shaft (31) symmetrically inserted on the tin melting mechanism (2); a turning seat (32) is provided on the top of the guide shaft (31); an elastic member (33) is provided between the adjacent turning seat (32) and the tin melting mechanism (2); a rack moving block (34) is provided at one end of the turning seat (32); the gear rack element can be slidably arranged on the rack moving block (34); and the tin blocking assembly (5) is rotatably arranged on the turning seat (32) through a bearing.

4. The solder bead blocking mechanism for a soldering machine as claimed in claim 3, characterized in that: The tin blocking assembly (5) comprises a rotating shaft (51); a limiting seat (52) is provided at one end of the rotating shaft (51); a mounting plate (53) is fixedly provided on the rotating shaft (51); a tin scraping plate (54) is detachably provided on the mounting plate (53); and a positioning plate (55) is adjustably provided on the tin scraping plate (54).

5. The solder bead blocking mechanism for a soldering machine as claimed in claim 4, characterized in that: One end of the tin scraping plate (54) is provided with an array of through-scraping holes; both ends of the tin scraping plate (54) are bent upwards to provide positioning shoulders; one side of the positioning plate (55) is provided with an array of protrusions facing outwards.

6. The solder bead blocking mechanism for a soldering machine as claimed in any one of claims 1 to 5, characterized in that: The soldering machine tin bead blocking mechanism further comprises a cleaning component (6) and a collecting component (7); the cleaning component (6) is located on one side of the tin blocking bracket (3) and is used to clean the tin blocking component (5); the collecting component (7) is movably arranged below the cleaning component (6) and is used to collect the solder cleaned by the cleaning component (6).

7. The solder bead blocking mechanism for a soldering machine as claimed in claim 6, characterized in that: The cleaning assembly (6) comprises a cleaning bracket (61); a transverse moving cylinder (62) is provided on the cleaning bracket (61); a cleaning roller brush assembly (63) is movably provided on the top of the cleaning bracket (61); the transverse moving cylinder (62) can drive the cleaning roller brush assembly (63) to move back and forth; a longitudinal moving cylinder (64) is fixedly provided on one side of the cleaning bracket (61); the longitudinal moving cylinder (64) can drive the cleaning roller brush assembly (63) to move closer to or away from the cleaning roller brush assembly (63).

8. A soldering machine, characterized in that: include Rack(1) A tin melting mechanism (2), arranged on the frame (1), for heating and melting the tin bar; A tin feeding mechanism (9) is obliquely arranged on the frame (1) and is used for automatically supplying a quantitative amount of tin bars to the tin melting mechanism (2); The solder bead blocking mechanism of a soldering machine as claimed in any one of claims 1 to 7 is used to clean excess tin liquid on a wire rack; as well as The slag removal mechanism (8) is telescopically arranged on the top of the tin melting mechanism (2) and is used to scrape off impurities floating on the top of the tin melting mechanism (2).