Fixture for dismounting, changing and welding of BGA (Ball Grid Array) packaged chip
By designing a BGA package chip disassembly and modifying welding fixture that integrates articulation design, electric drive, precision guidance and intelligent limiting technologies, the existing fixtures have solved the problems of simple structure, lack of flexibility and adaptability, and efficient and precise clamping and welding are achieved, which significantly improves welding quality and production efficiency.
Patent Information
- Application Number
- CN202421883761.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-05
- Publication Date
- 2025-06-13
- Estimated Expiration
- 2034-08-05
AI Technical Summary
The existing BGA packaging chip disassembly and welding fixtures have simple structure design, lack flexibility and adaptability, making it difficult to achieve efficient and precise clamping and welding.
A fixture including base, crossbar, slider, hinge rod, mounting plate, clamp frame, fixing clip and mobile clip is designed. Through hinge design, electric drive, precision guidance and intelligent limiting technology, it can achieve efficient and precise clamping and welding of BGA chips.
It significantly improves welding quality and production efficiency, enhances clamping accuracy and stability, reduces operational difficulty and labor costs, improves automation level, and ensures high-quality performance of BGA packaging chips during processing.
Smart Images

Figure CN222971353U_ABST
Abstract
Description
Technical Field
[0001] The utility model belongs to the technical field of chip disassembly, modification and welding, and particularly relates to a fixture for disassembly, modification and welding of BGA packaged chips. Background Art
[0002] The BGA packaging technology is an advanced integrated circuit packaging technology. It uses circular or columnar solder joints distributed in an array form on the I / O terminals under the package body. Due to the large number of solder joints and I / O pins, the welding is tight, and the power consumption also increases. As a result, it often easily fails and needs to be disassembled, modified and welded, and this process requires manual disassembly and assembly.
[0003] Many existing fixtures for disassembly, modification and welding of BGA packaged chips often adopt relatively simple structural designs. Although these designs have low costs, they often lack sufficient flexibility and adaptability. Summary of the Utility Model
[0004] The utility model provides a fixture for disassembly, modification and welding of BGA packaged chips, aiming to solve the problem that the currently used fixtures often adopt relatively simple structural designs and lack sufficient flexibility and adaptability proposed in the above background art.
[0005] To solve the above problems, the utility model is realized as follows. A fixture for disassembly, modification and welding of BGA packaged chips includes: two bases, a cross bar fixedly installed on the two bases, two sliders slidably sleeved on the cross bar, and articulated rods articulated on the two sliders.
[0006] A mounting plate, the mounting plate is arranged above the cross bar, an articulated block is fixedly installed at the bottom of the mounting plate, and the articulated block is articulated with the two articulated rods; a clamping frame, the clamping frame is arranged on the mounting plate, a fixed clamp is fixedly installed on one inner wall of the clamping frame, and a movable clamp is slidably installed on one inner wall of the clamping frame.
[0007] Preferably, a threaded cylinder is rotatably installed on one side of the clamping frame, a threaded rod is threadedly installed on the threaded cylinder, and one end of the threaded rod is connected to the movable clamp.
[0008] Preferably, a driving motor is fixedly installed on one side of the clamping frame, a driving gear is fixedly installed on the output shaft of the driving motor, multiple teeth are arranged on the threaded cylinder, and the teeth are meshed with the driving gear.
[0009] Preferably, an electric telescopic rod is fixedly installed on one side of the base, and the output rod of the electric telescopic rod is connected to the slider.
[0010] Preferably, a guiding cylinder is fixedly installed on the base, a guiding rod is slidably installed on the guiding cylinder, and the top end of the guiding rod is connected to the mounting plate.
[0011] Preferably, a suction cup that can be adsorbed is fixedly installed at the bottom of the base, and the suction cup is used for fixedly adsorbing to the workbench.
[0012] Preferably, a limiting rod is fixedly installed on one inner wall of the clamping frame, a groove is formed on one side of the threaded rod, and one end of the limiting rod is in sliding contact with the groove.
[0013] Compared with the related art, the fixture for BGA package chip disassembly, modification and soldering provided by the present utility model has the following beneficial effects:
[0014] Compared with the prior art, the fixture for BGA package chip disassembly, modification and soldering provided by this solution realizes efficient and precise clamping of BGA package chips as a whole, significantly improves the soldering quality and production efficiency. By integrating advanced technologies such as electric drive, precise guidance, stable fixation and intelligent limiting, it not only significantly improves the accuracy and stability of clamping, but also greatly improves the operation efficiency and automation level, ensures the high-quality performance of BGA package chips during the processing, reduces the operation difficulty and labor cost at the same time, and enhances the fixation of the fixture on the workbench, preventing movement or shaking during the operation, and has significant advantages in improving the clamping accuracy, stability and production efficiency. Description of the Drawings
[0015] Figure 1 is the front view structural schematic diagram of a fixture for BGA package chip disassembly, modification and soldering provided by the present utility model;
[0016] Figure 2 is the front view sectional structural schematic diagram of a fixture for BGA package chip disassembly, modification and soldering provided by the present utility model;
[0017] Figure 3 is Figure 2 the enlarged structural schematic diagram of part A shown in
[0018] Reference numerals: 1, base; 2, cross bar; 3, slider; 4, articulated rod; 5, mounting plate; 6, articulated block; 7, clamping frame; 8, fixed clamp; 9, moving clamp; 10, threaded cylinder; 11, threaded rod; 12, drive motor; 13, drive gear; 14, tooth; 15, electric telescopic rod; 16, guiding cylinder; 17, guiding rod; 18, suction cup; 19, limiting rod; 20, groove. Detailed Embodiments
[0019] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the technical field to which this application belongs; the terms used in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application; the terms "including" and "having" and any variations thereof in the specification and claims of this application and the above drawings are intended to cover non-exclusive inclusion. The terms "first", "second", etc. in the specification and claims of this application or the above drawings are used to distinguish different objects and not to describe a specific order; the orientation or positional relationship indicated by the terms "inside", "outside", "left", "right" is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present utility model.
[0020] Reference to "embodiments" herein means that a particular feature, structure, or characteristic described in connection with the embodiments can be included in at least one embodiment of the application. The phrase appears in various places in the specification and does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment mutually exclusive with other embodiments. Those skilled in the art will explicitly and implicitly understand that the embodiments described herein can be combined with other embodiments.
[0021] An embodiment of the present utility model provides a fixture for the disassembly, modification, and soldering of BGA package chips, as Figures 1-3 shown. The fixture for the disassembly, modification, and soldering of BGA package chips includes: two bases 1, a cross bar 2 is fixedly installed on the two bases 1, two sliders 3 are slidably sleeved on the cross bar 2, and two articulated rods 4 are hingedly installed on the two sliders 3; a mounting plate 5, the mounting plate 5 is arranged above the cross bar 2, a hinge block 6 is fixedly installed at the bottom of the mounting plate 5, and the hinge block 6 is hinged to the two articulated rods 4; a clamping frame 7, the clamping frame 7 is arranged on the mounting plate 5, a fixed clamp 8 is fixedly installed on one inner wall of the clamping frame 7, and a movable clamp 9 is slidably installed on one inner wall of the clamping frame 7.
[0022] In this embodiment, two bases 1 stably support the entire fixture. The cross bar 2 is fixedly installed on the base 1 and serves as a support and guiding structure. The slider 3 slides on the cross bar 2 and is connected to the hinge block 6 at the bottom of the mounting plate 5 through the hinge rod 4, allowing the slider 3 to move freely on the cross bar 2. Furthermore, it drives the mounting plate 5 and the clamping frame 7 thereon to adjust the height position, increasing the flexibility of the fixture, enabling the clamping frame 7 to adjust the height of the clamping frame 7 according to the specific situation of the welding operator. The mounting plate 5 serves as the support platform for the clamping frame 7, and the hinge block 6 at its bottom is connected to the hinge rod 4, realizing the linkage between the mounting plate 5 and the cross bar 2. Through the hinge design, fine adjustment of the mounting plate 5 and the clamping frame 7 in the horizontal and vertical directions is achieved, enhancing the adaptability and operation convenience of the fixture. The clamping frame 7 is used to fix the BGA chip. Among them, the fixed clamp 8 is fixed on one inner wall of the clamping frame 7, while the movable clamp 9 is slidably installed on the same inner wall, forming a clamping mechanism. Through the cooperative use of the fixed clamp 8 and the movable clamp 9, effective clamping and positioning of the BGA chip are realized. The slidable design of the movable clamp 9 enables the fixture to adapt to chips of different sizes, improving the versatility and adaptability of the fixture.
[0023] In a further preferred embodiment of the present utility model, a threaded cylinder 10 is rotatably installed on one side of the clamping frame 7, and a threaded rod 11 is threadedly installed on the threaded cylinder 10. One end of the threaded rod 11 is connected to the movable clamp 9.
[0024] In this embodiment, the threaded cylinder 10 is rotatably installed on one side of the clamping frame 7 and serves as the rotation fulcrum of the threaded rod 11. By rotating the threaded cylinder 10, the threaded rod 11 threadedly connected thereto can be driven to perform a linear motion, thereby realizing precise adjustment of the position of the movable clamp 9. One end of the threaded rod 11 is threadedly connected to the threaded cylinder 10, and the other end is connected to the movable clamp 9. As the threaded cylinder 10 rotates, the threaded rod 11 will perform a linear motion along its axis, thereby driving the movable clamp 9 to move. The linear motion of the threaded rod 11 enables the movable clamp 9 to accurately approach or move away from the fixed clamp 8, thus realizing the clamping and positioning of BGA chips of different sizes.
[0025] In a further preferred embodiment of the present utility model, a driving motor 12 is fixedly installed on one side of the clamping frame 7. The output shaft of the driving motor 12 is fixedly installed with a driving gear 13. A plurality of teeth 14 are provided on the threaded cylinder 10, and the teeth 14 are engaged with the driving gear 13.
[0026] In this embodiment, the drive motor 12 is fixedly installed on one side of the clamping frame 7, and its output shaft is connected to the drive gear 13, providing power for the entire drive mechanism. Through the automatic control of the drive motor 12, the electric adjustment of the position of the moving clamp 9 is realized, greatly simplifying the operation process and improving work efficiency. The drive gear 13 is fixed on the output shaft of the drive motor 12 and meshes with the teeth 14 on the threaded cylinder 10. As the motor rotates, the drive gear 13 drives the threaded cylinder 10 to rotate together. The meshing design of the drive gear 13 and the teeth 14 ensures the reliability and stability of power transmission. At the same time, due to the high precision of gear transmission, precise control of the position of the moving clamp 9 can be achieved. The outer surface of the threaded cylinder 10 is provided with a plurality of teeth 14, which mesh with the drive gear 13 to form a gear transmission mechanism, enabling the threaded cylinder 10 to rotate with the rotation of the drive gear 13, and then driving the threaded rod 11 to perform linear motion through a threaded connection, not only simplifying the structure but also improving the transmission efficiency and precision.
[0027] In a further preferred embodiment of the present utility model, an electric telescopic rod 15 is fixedly installed on one side of the base 1, and the output rod of the electric telescopic rod 15 is connected to the slider 3.
[0028] In this embodiment, the electric telescopic rod 15 is fixedly installed on one side of the base 1, and its output rod is connected to the slider 3. By controlling the telescopic movement of the electric telescopic rod 15, the slider 3 can be driven to slide on the cross bar 2, and then drive the entire clamping mechanism (including the mounting plate 5, the clamping frame 7, the fixed clamp 8, the moving clamp 9, etc.) to move horizontally, which can be adjusted according to the usage requirements of the staff.
[0029] In a further preferred embodiment of the present utility model, a guide cylinder 16 is fixedly installed on the base 1, and a guide rod 17 is slidably installed on the guide cylinder 16, and the top end of the guide rod 17 is connected to the mounting plate 5.
[0030] In this embodiment, the guide cylinder 16 is fixedly installed on the base 1 as the sliding track of the guide rod 17. The guide rod 17 is slidably installed in the guide cylinder 16, and its top end is connected to the mounting plate 5. With the drive of the electric telescopic rod 15, the guide rod 17 will move vertically along the track of the guide cylinder 16, and then drive the mounting plate 5 and the clamping mechanism to move together, not only realizing the stable movement of the mounting plate 5 and the clamping mechanism, but also ensuring the accuracy of the movement path, which helps to keep the chip stable and accurately aligned during the clamping process, improving the welding quality and success rate.
[0031] In a further preferred embodiment of the present utility model, a suction cup 18 that can be adsorbed is fixedly installed at the bottom of the base 1, and the suction cup 18 is used for fixedly adsorbing to the workbench.
[0032] In this embodiment, the suction cup 18 is fixedly installed at the bottom of the base 1 and is in close contact with the surface of the workbench through its suction force, realizing the stable fixation of the fixture on the workbench. The suction force of the suction cup 18 can effectively prevent the fixture from moving or shaking during the working process, ensuring the stability of the clamping mechanism during operation, thereby improving the accuracy and success rate of welding. Compared with the traditional mechanical fixation method, the suction fixation of the suction cup 18 is more convenient and fast, without additional fasteners or tools, reducing the operation difficulty and labor intensity.
[0033] In a further preferred embodiment of the present utility model, a limiting rod 19 is fixedly installed on one inner wall of the clamping frame 7, and a groove 20 is formed on one side of the threaded rod 11, and one end of the limiting rod 19 is in sliding contact with the groove 20.
[0034] In this embodiment, the limiting rod 19 is fixedly installed on one inner wall of the clamping frame 7, and its position corresponds to the groove 20 on the threaded rod 11. When the threaded rod 11 rotates and moves in the threaded barrel 10, the limiting rod 19 will slide along the track of the groove 20, thereby restricting the rotation angle and moving range of the threaded rod 11. By restricting the rotation angle and moving range of the threaded rod 11, the precise movement of the movable clamp 9 during the clamping process is ensured, thereby improving the accuracy and stability of clamping.
[0035] In summary, compared with the related technology, the present device realizes the efficient and precise clamping of the BGA package chip as a whole, significantly improving the welding quality and production efficiency. By integrating advanced technologies such as electric drive, precise guidance, stable fixation, and intelligent limiting, not only the accuracy and stability of clamping are significantly improved, but also the operation efficiency and automation level are greatly enhanced, ensuring the high-quality performance of the BGA package chip during the processing process. At the same time, the operation difficulty and labor cost are reduced, and the fixation of the fixture on the workbench is enhanced, preventing movement or shaking during the operation process, and having significant advantages in improving the clamping accuracy, stability, and production efficiency.
[0036] In several embodiments provided by the present application, it should be understood that the disclosed device can be implemented in other ways.
[0037] The above embodiments are only used to illustrate the technical solutions of the present utility model, rather than limiting the protection scope of the utility model. Obviously, the described embodiments are only partial embodiments of the present utility model, rather than all embodiments. Based on these embodiments, all other embodiments obtained by those of ordinary skill in the art without creative efforts belong to the scope of protection of the present utility model. Although the present utility model has been described in detail with reference to the above embodiments, those of ordinary skill in the art can still, without conflict and without creative efforts, combine, add or delete the features in the embodiments of the present utility model according to the situation or make other adjustments, so as to obtain different technical solutions that essentially do not deviate from the concept of the present utility model, and these technical solutions also belong to the scope of protection of the present utility model.
Claims
1. A fixture for disassembling and welding BGA packaged chips, characterized in that: include: Two bases, a cross bar is fixedly mounted on the two bases, two sliders are slidably sleeved on the cross bar, and hinged rods are hingedly mounted on the two sliders; A mounting plate, the mounting plate is arranged above the cross bar, a hinge block is fixedly mounted on the bottom of the mounting plate, and the hinge block is hinged to the two hinge rods; A clamp frame is arranged on the mounting plate, a fixed clamp is fixedly installed on an inner wall of one side of the clamp frame, and a movable clamp is slidably installed on an inner wall of one side of the clamp frame.
2. The fixture for disassembling and welding BGA packaged chips as claimed in claim 1, characterized in that: A threaded barrel is rotatably mounted on one side of the clamp frame, a threaded rod is threadedly mounted on the threaded barrel, and one end of the threaded rod is connected to the movable clamp.
3. The fixture for disassembling and welding BGA packaged chips as claimed in claim 2, characterized in that: A driving motor is fixedly mounted on one side of the clamp frame, a driving gear is fixedly mounted on the output shaft of the driving motor, a plurality of teeth are arranged on the threaded barrel, and the teeth are meshed with the driving gear.
4. The fixture for disassembling and welding BGA packaged chips as claimed in claim 1, characterized in that: An electric telescopic rod is fixedly mounted on one side of the base, and an output rod of the electric telescopic rod is connected to the sliding block.
5. The fixture for disassembling and welding BGA packaged chips as claimed in claim 1, characterized in that: A guide cylinder is fixedly mounted on the base, a guide rod is slidably mounted on the guide cylinder, and the top end of the guide rod is connected to the mounting plate.
6. The fixture for disassembling and welding BGA packaged chips as claimed in claim 1, characterized in that: A sucker capable of being adsorbed is fixedly mounted on the bottom of the base, and the sucker is used for being fixedly adsorbed to the workbench.
7. The fixture for disassembling and welding BGA packaged chips as claimed in claim 2, characterized in that: A limiting rod is fixedly mounted on an inner wall of one side of the clamp frame, and a groove is provided on one side of the threaded rod, and the groove is in sliding contact with one end of the limiting rod.