Water-cooling integrated heat dissipation device for computer

Abstract

The utility model discloses a water-cooling integrated heat dissipation device for a computer, which comprises a case and is characterized in that a water tank is mounted in the top of the case, a water pipe is arranged at the bottom of the water tank, a shell is arranged at the bottom of the water pipe, a cooling cavity is formed in the shell, and a top cover is mounted on the front side of the shell. A heat dissipation plate is arranged on the back face of the cooling cavity, a protection cover is installed on the right side of the case, a heat dissipation platform is arranged in the protection cover, a round hole is formed in the heat dissipation platform, a fan is installed in the round hole, a heat dissipation pipe is arranged on the front face of the heat dissipation platform, and a water pump box is arranged at the top of the heat dissipation platform; the bottom of the water pump box is connected with the heat dissipation pipe. The top of the water pump box is connected with the water tank through a water pipe. The heat dissipation device is arranged outside the case, and air in the case is in an internal circulation state, so that dust is prevented from entering the case, and the situation that equipment and instruments are interfered and damaged due to dust deposition is effectively prevented.

Description

Technical Field

[0001] The utility model relates to the technical field of computer heat dissipation, in particular to a computer water-cooled integrated heat dissipation device. Background Technique

[0002] In a common personal computer, there are usually two power-consuming components. One is the CPU, and the other is the graphics card. High energy consumption naturally means high heat generation. How to match a suitable CPU cooler has been a hot topic for many years. The water-cooled integrated heat dissipation device is one of the most commonly used heat dissipation methods. It works by the cooperation of a water-cooled heat dissipation pipe and a fan to dissipate heat from components such as the CPU or graphics card, and has the advantages of convenient installation, good heat dissipation, and high safety index.

[0003] In a conventional water-cooled integrated heat dissipation device, due to the need for the cooperation of a heat dissipation pipe and a fan, for the convenience of installation and to reduce space, the fan usually needs to be installed on the side wall to realize the air circulation inside and outside the computer case. For example, in the prior art: CN207623903U, a high-efficiency heat dissipation device for a computer main case, includes a U-shaped base. A first metal dust-proof net is fixed in the middle of the inner cavity of the U-shaped base. A heat dissipation fan is arranged below the first metal dust-proof net. A computer case main body is arranged on the upper surface of the first metal dust-proof net. A plurality of air inlet holes are evenly and equidistantly arranged at the bottom of the computer case main body. Serpentine cooling water pipes are installed on the side walls around the inner cavity of the computer case main body. A return pipe is fixed at the top of the inner cavity of the computer case main body. A plurality of heat absorption holes are evenly arranged on the return pipe. The end of the return pipe is connected to an air extractor through an air extraction pipe. The utility model is provided with a heat dissipation fan, a return pipe and an air extractor. The heat dissipation fan blows air into the computer case main body for heat dissipation. The air extractor inhales hot air from the heat absorption holes of the return pipe and then discharges it, accelerating the air circulation and improving the heat dissipation efficiency. The serpentine cooling water pipes are provided, and the cooling water enters the serpentine cooling water pipes from the cooling water inlet and then discharges from the cooling water outlet, with good heat dissipation effect and further improving the heat dissipation efficiency.

[0004] There is also prior art:

[0005] CN218446601U A computer water-cooled structure

[0006] CN207623903U A high-efficiency heat dissipation device for a computer main case

[0007] After the above solutions achieve the heat dissipation effect, the external air dust is likely to enter the inside of the computer case through the fan circulation. The equipment inside the computer case is likely to accumulate dust after long-term use. If not cleaned, it may affect the equipment. Content of the Utility Model

[0008] The purpose of the utility model is to provide a computer water-cooled integrated heat dissipation device to solve the problems raised in the above background technique.

[0009] To achieve the above object, the present utility model provides the following technical solutions: A computer water-cooled integrated heat dissipation device, including a chassis, characterized in that: a water tank is installed inside the top of the chassis, a water pipe is provided at the bottom of the water tank, a housing is provided at the bottom of the water pipe, a cooling cavity is opened inside the housing, a top cover is installed on the front of the housing, a heat dissipation plate is provided at the back of the cooling cavity, a protective cover is installed on the right side of the chassis, a heat dissipation platform is provided inside the protective cover, a round hole is opened inside the heat dissipation platform, a fan is installed inside the round hole, a heat dissipation pipe is provided on the front of the heat dissipation platform, a water pump box is provided on the top of the heat dissipation platform, and the bottom of the water pump box is connected to the heat dissipation pipe. The top of the water pump box is connected to the water tank through a water pipe.

[0010] Preferably, heat dissipation fins are provided on the front of the heat dissipation plate, and the heat dissipation plate and the heat dissipation fins are made of copper or aluminum.

[0011] Preferably, a water pump is installed inside the water pump box.

[0012] Preferably, a rubber pad is provided between the heat dissipation plate and the housing, and the rubber pad is a water-tight rubber.

[0013] Preferably, clamping claws are provided at the four corners of the housing.

[0014] Preferably, a heat insulation material is provided on the surface of the water pipe.

[0015] Preferably, the diameter of the heat dissipation pipe is smaller than that of the water pipe.

[0016] Compared with the prior art, the beneficial effects of the present utility model are:

[0017] 1. For this computer water-cooled integrated heat dissipation device, by arranging the heat dissipation device outside the chassis, the air inside the chassis is in an internal circulation state, isolating dust from entering the chassis, and effectively preventing the situation that the equipment and instruments are interfered and damaged due to dust deposition.

[0018] 2. For this computer water-cooled integrated heat dissipation device, the heat is conducted from the heat dissipation plate to the coolant in the cooling cavity, and finally enters the heat dissipation pipe along the water pipe. By increasing the surrounding air flow through the fan, the temperature of the coolant in the heat dissipation pipe is reduced, so as to achieve the purpose of cooling. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a schematic structural diagram of the present utility model;

[0020] Figure 2 It is a cross-sectional view of the structure of the present utility model;

[0021] Figure 3 It is a partial schematic diagram of the structure of the present utility model.

[0022] In the figure: 1, chassis; 2, water tank; 3, water pipe; 4, outer shell; 5, top cover; 6, claw; 7, cooling cavity; 8, heat dissipation plate; 9, heat dissipation fin; 10, rubber pad; 11, water pump box; 12, water pump; 13, heat dissipation pipe; 14, heat dissipation platform; 15, fan; 16, protective cover. Specific implementation manner

[0023] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0024] Embodiment: Please refer to Figure 1 , the present invention provides a technical solution: a water-cooled integrated heat dissipation device for a computer.

[0025] Among them, a water tank 2 is installed inside the top of the chassis 1, a water pipe 3 is arranged at the bottom of the water tank 2, an outer shell 4 is arranged at the bottom of the water pipe 3, a cooling cavity 7 is opened inside the outer shell 4, a top cover 5 is installed on the front of the outer shell 4, a heat dissipation plate 8 is arranged on the back of the cooling cavity 7, heat dissipation fins 9 are arranged on the front of the heat dissipation plate, and a rubber pad 10 is arranged between the heat dissipation plate 8 and the outer shell 4. A protective cover 16 is installed on the right side of the chassis 1, a heat dissipation platform 14 is arranged inside the protective cover 16, a round hole is opened inside the heat dissipation platform 14, a fan 15 is installed in the round hole, a heat dissipation pipe 13 is arranged on the front of the heat dissipation platform 14, a water pump box 11 is arranged on the top of the heat dissipation platform 14, and the bottom of the water pump box 11 is connected to the heat dissipation pipe 13. The top of the water pump box 11 is connected to the water tank 2 through the water pipe 3.

[0026] In this embodiment, the temperature is transferred to the coolant in the cooling cavity 7 through the heat dissipation plate 8. After the coolant flows into the water tank 2 along the water pipe 3, it then enters the water pump box 11, and finally enters the heat dissipation pipe 13. The fan 15 accelerates the air flow around the heat dissipation pipe 13 to lower the surrounding temperature. The heat in the coolant is dissipated into the air, then returns to the water tank 2 through the water pump box 11, and finally returns to the cooling cavity 7.

[0027] Among them, the heat dissipation plate 8 and the heat dissipation fins 9 are made of copper or aluminum.

[0028] In this embodiment, copper has better thermal conductivity, while aluminum has lower thermal conductivity but lower cost and higher cost performance.

[0029] Among them, a water pump 12 is installed inside the water pump box 11.

[0030] In this embodiment, the rotation directions of the water pumps 12 in the two water pump boxes 11 are different. The left water pump injects coolant into the heat dissipation pipe, and the right water pump extracts coolant from the heat dissipation pipe.

[0031] Among them, the rubber pad 10 is a water-tight rubber.

[0032] In this embodiment, the rubber pad 10 functions to isolate the coolant and prevent the coolant from flowing out and damaging the internal equipment. Its common material is nitrile rubber, and it should be noted that the rubber should not contain materials that will react with the coolant.

[0033] Among them, clamping claws 6 are provided at the four corners of the outer shell.

[0034] In this embodiment, there are holes in the clamping claws 6 through which fasteners can pass to tightly attach the heat dissipation plate to the CPU.

[0035] Among them, a heat insulation material is provided on the surface of the water pipe 3.

[0036] In this embodiment, the heat insulation material isolates the heat from dissipating and prevents high temperature from damaging the surrounding equipment.

[0037] Among them, the diameter of the heat dissipation pipe 13 is smaller than that of the water pipe 3.

[0038] In this embodiment, on the one hand, the smaller diameter of the heat dissipation pipe 13 reduces the flow rate, enabling the coolant to flow on the heat dissipation platform 14 for a longer time. At the same time, the dispersed coolant has a larger contact area with the air blown by the fan 15, both of which play a better role in heat dissipation.

[0039] Working principle: Apply thermal grease on the surface of the CPU, press the heat dissipation plate on the CPU, and lock the clamping claws 6 in the chassis 1 through screws. When the CPU generates heat, the temperature is transferred to the coolant in the cooling cavity 7 through the heat dissipation plate 8. The water pumps in the water pump boxes 11 operate, causing the coolant in the device to start internal circulation. The coolant in the cooling cavity 7 flows along the water pipe 3 into the water tank 2, then enters the water pump box 11, and finally enters the heat dissipation pipe 13. The fan 15 accelerates the air flow around the heat dissipation pipe 13 to reduce the surrounding temperature. The heat in the coolant is dissipated into the air, then returns to the water tank 2 through the water pump box 11, and finally returns to the cooling cavity 7 to complete the cycle.

[0040] In the description of the present utility model, it should also be noted that unless otherwise clearly specified and defined, the terms "set", "installed", "connected", and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.

[0041] Although embodiments of the present utility model have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principle and spirit of the present utility model. The scope of the present utility model is defined by the appended claims and their equivalents.

Claims

1. A water-cooled integrated heat dissipation device for a computer, comprising a case (1), characterized in that: A water tank (2) is installed on the top of the case (1), a water pipe (3) is arranged at the bottom of the water tank (2), a shell (4) is arranged at the bottom of the water pipe (3), a cooling chamber (7) is provided inside the shell (4), a top cover (5) is installed on the front of the shell (4), a heat sink (8) is arranged on the back of the cooling chamber (7), a protective cover (16) is installed on the right side of the case (1), a heat dissipation platform (14) is arranged inside the protective cover (16), a circular hole is arranged inside the heat dissipation platform (14), a fan (15) is installed in the circular hole, a heat dissipation pipe (13) is arranged on the front of the heat dissipation platform (14), a water pump box (11) is arranged on the top of the heat dissipation platform (14), the bottom of the water pump box (11) is connected to the heat dissipation pipe (13), and the top of the water pump box (11) is connected to the water tank (2) through the water pipe (3).

2. A water-cooled integrated heat dissipation device for a computer according to claim 1, characterized in that: The front of the heat sink (8) is provided with heat sink fins (9); the heat sink (8) and the heat sink fins (9) are made of copper or aluminum.

3. The computer water-cooling integrated heat dissipation device according to claim 1, characterized in that: A water pump (12) is installed in the water pump box (11).

4. The computer water-cooling integrated heat dissipation device according to claim 1, characterized in that: A rubber pad (10) is provided between the heat sink (8) and the housing (4), and the rubber pad (10) is made of watertight rubber.

5. The computer water-cooling integrated heat dissipation device according to claim 1, characterized in that: The four corners of the housing are provided with claws (6).

6. The computer water-cooling integrated heat dissipation device according to claim 1, characterized in that: The surface of the water pipe (3) is provided with heat insulation material.

7. The computer water-cooling integrated heat dissipation device according to claim 1, characterized in that: The diameter of the heat dissipation pipe (13) is smaller than that of the water pipe (3).

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