Discharging device for silicon wafers

Abstract

The utility model relates to an emptying device for silicon wafers, which comprises a moving mechanism, a clamping seat and a supporting plate, and is characterized in that the moving mechanism comprises a transverse rod, a sliding seat and a vertical rod, the transverse rod is transversely arranged, the sliding seat is connected with the transverse rod in a sliding manner, and the vertical rod is arranged on the sliding seat in a sliding manner; the clamping base is connected with the vertical rod, hooks are arranged on the two opposite sides of the clamping base respectively, and a vertical telescopic assembly is further arranged on the clamping base. The supporting plate is arranged below the clamping base and connected with the telescopic assembly. After the silicon wafer rack is fixed in the bearing groove through the clamping seat, the supporting plate can be matched with the bearing groove to support the silicon wafer up and down, so that the silicon wafer is prevented from toppling and shifting due to lack of support in the process of unloading the silicon wafer from the silicon wafer rack to clamping the silicon wafer in the bearing groove. And the stability of the silicon wafers in transfer is ensured.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductors, in particular to a material discharging device for silicon wafers. Background Art

[0002] As the main base material for transistors and other devices, silicon wafers are widely used in microelectronics, semiconductors, photovoltaics and other industries. Silicon wafers are generally divided into single-crystal silicon wafers and multi-crystal silicon wafers. Their processing technology mainly includes squaring, slicing, chamfering, grinding, etching, cleaning, etc. Therefore, the silicon wafer processing process usually includes multiple steps.

[0003] When transferring the silicon wafer to the bearing tank of the next process, the silicon wafer on the transfer table is placed in the silicon wafer rack, and the robot lifts the entire silicon wafer rack and places it in the bearing tank. Then the silicon wafer rack releases the clamping parts, removes the silicon wafer, and the robot lifts the silicon wafer rack. The limit clamping parts in the bearing tank clamp the silicon wafer and place the silicon wafer in the bearing tank. In the process of unloading the silicon wafer from the silicon wafer rack to clamping the silicon wafer in the bearing tank, the silicon wafer is supported only at the bottom, and it is very easy to tip over and shift in the bearing tank, affecting subsequent processing. Utility Model Content

[0004] In view of the above-mentioned shortcomings of the prior art, the purpose of the utility model is to provide a material discharge device for silicon wafers to improve the stability of the silicon wafers during transportation.

[0005] The technical solution of the utility model is as follows:

[0006] A material discharge device for silicon wafers comprises a moving mechanism, a clamping seat and a support plate, wherein the moving mechanism comprises a transversely arranged crossbar, a slide seat slidably connected to the crossbar and a vertical rod slidably arranged on the slide seat; the clamping seat is connected to the vertical rod, hooks are respectively arranged on two opposite sides of the clamping seat, and a vertical telescopic component is also arranged on the clamping seat; the support plate is arranged below the clamping seat and connected to the telescopic component.

[0007] The beneficial technical effects of the utility model are as follows:

[0008] (1) The silicon wafer discharge device in the utility model is connected to the clamping seat through a moving mechanism, driving the clamping to perform parallel and lifting movements to transport the silicon wafer. In addition, a support plate is also provided below the clamping seat. The support plate is connected to the clamping seat through a telescopic assembly to achieve relative movement with the clamping seat. After the clamping seat fixes the silicon wafer rack into the bearing slot, the support plate can cooperate with the bearing slot to support the silicon wafer up and down to prevent the silicon wafer from tipping over and shifting due to lack of support when the silicon wafer rack unloads the silicon wafer and clamps the silicon wafer into the bearing slot. The stability of the silicon wafer during transportation is ensured.

[0009] (2) Further, two hooks are respectively arranged on two opposite sides of the clamping seat, and a bidirectional telescopic member is arranged between the two hooks on the same side. The two hooks on the same side are driven to close and approach each other, or to move away from each other by the bidirectional telescopic member, so as to automatically hook the wafer holder.

[0010] (3) Further, an elastic layer is arranged at the lower part of the support plate to fully fit the upper part of the wafer, so as to ensure the support stability. Description of the Drawings

[0011] Figure 1 The three-dimensional structural schematic diagram of the wafer feeding device of the present utility model is shown.

[0012] Reference signs in the drawings:

[0013] 1. Moving mechanism; 11. Cross bar; 12. First slide rail; 13. First rack; 14. Slide seat; 15. Driving member; 16. Vertical rod; 17. Second rack; 18. Drag chain; 2. Clamping seat; 21. Second slide rail; 22. Hook; 23. Slide block; 24. Hook part; 25. Bidirectional telescopic member; 26. Telescopic assembly; 3. Support plate; 31. Guide rod. Detailed Embodiment

[0014] In order to make the objectives, features and advantages of the present utility model more obvious and understandable, please refer to the attached drawings. It should be noted that the structures, ratios, sizes, etc. shown in the drawings of this specification are only used to cooperate with the content disclosed in the specification for those who are familiar with this technology to understand and read, and are not used to limit the limiting conditions for the implementation of the present utility model. Therefore, they do not have any technical essence. Any modification of the structure, change of the proportional relationship or adjustment of the size should still fall within the scope that can be covered by the technical content disclosed in the present utility model without affecting the effects that the present utility model can produce and the objectives that can be achieved.

[0015] In the description of the present utility model, the orientation or positional relationship indicated by the defined terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", "axial", "radial", "circumferential", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation to the present utility model.

[0016] Figure 1 The three-dimensional structural schematic diagram of the wafer feeding device of the present utility model is shown. Please refer to Figure 1, A wafer feeding device, comprising a moving mechanism 1, a clamping seat 2 and a support plate 3. The moving mechanism 1 includes a horizontally arranged cross bar 11, a sliding seat 14 slidably connected to the cross bar 11, and a vertical bar 16 slidably disposed on the sliding seat 14. The clamping seat 2 is connected to the vertical bar 16 and moves horizontally and vertically along the cross bar 11 and the vertical bar 16. Two pairs of sides of the clamping seat 2 are respectively provided with hooks 22, and a wafer rack (not shown in the figure) is connected through the hooks 22. A vertical telescopic component 26 is also provided on the clamping seat 2. The support plate 3 is disposed below the clamping seat 2 and connected to the telescopic component 26, and the support plate 3 is driven to move relative to the clamping seat 2 through the telescopic component 26. After the clamping seat 2 fixes the wafer rack into the bearing groove, the support plate 3 can cooperate with the bearing groove to support the wafer up and down, avoiding the wafer from tilting and shifting due to lack of support during the process of unloading the wafer from the wafer rack to the bearing groove and clamping the wafer. Ensure the stability during wafer transfer.

[0017] The specific structures of the clamping seat 2 and the support plate 3 are described as follows:

[0018] Please refer to Figure 1 , On two pairs of sides of the clamping seat 2, two hooks 22 are respectively provided, and a two-way telescopic member 25 is arranged between the two hooks 22 on the same side. A second slide rail 21 is provided on the clamping seat 2 and connected to a slider 23. The two-way telescopic member 25 is connected to the slider 23, and the hook 22 is slidably connected to the clamping seat 2 through the slider 23. The two hooks 22 on the same side are driven by the two-way telescopic member 25 to close and approach each other, or to move away from each other, automatically hooking the wafer rack. The hook parts 24 of the two hooks 22 on the same side are arranged back to back. With such an arrangement of the hook parts 24, when hooking the wafer rack, the hook parts 24 perform an opening action from the inside to the outside, reducing the opening size of the hook parts 24, reducing the length of the second slide rail 21, and reducing the occupied area and material consumption. A vertical guide rod 31 is provided on the clamping seat 2, and the guide rod 31 is connected to the support plate 3 to increase the stability of the support plate 3 during movement. An elastic layer is provided at the lower part of the support plate 3 to fully fit the upper part of the wafer and ensure the support stability.

[0019] The specific structure of the moving mechanism 1 is described as follows:

[0020] Please refer to Figure 1, a force sensor is provided on the vertical rod 16. The force sensor can be a commercially available HPS-FT060 six-axis force sensor. It monitors the gravity of the wafer holder to avoid damage to the feeding device due to excessive gravity. A first rack 13 is horizontally provided on the crossbar 11, a second rack 17 is vertically provided on the vertical rod 16, and a driving member 15 that outputs torque on the sliding seat 14 meshes with the first rack 13 and the second rack 17. The driving member 15 can be a motor, and the output shaft of the motor meshes with the first rack 13 or the second rack 17, and the movement is controlled by controlling the torque output by the motor. First sliding rails 12 are respectively provided on the crossbar 11 and the vertical rod 16 to connect the sliding seat 14. The first sliding rails 12 increase the stability of the sliding seat 14 during movement. The moving mechanism 1 further includes a drag chain 18. The lines and pipes connecting the driving member 15, the bidirectional telescopic member 25, and the telescopic assembly 26 are fixed inside the drag chain 18 to protect the lines and pipes.

[0021] The specific working process of the present utility model is as follows:

[0022] When transporting the wafer holder loaded with wafers, different driving members 15 respectively mesh with the first rack 13 and the second rack 17 and output torque, driving the clamping seat 2 to move along the crossbar 11 and the vertical rod 16 to above the wafer holder. The bidirectional telescopic member 25 drives the hooks 22 on the same side to open and move away, and the hook portion 24 of the hook 22 moves to below the wafer holder by the hook portion 24. The driving member 15 outputs torque, driving the clamping seat 2 to move along the crossbar 11 and the vertical rod 16, the hook portion 24 hooks the wafer holder, and places the wafer holder in a carrying slot (not shown in the figure). Then the telescopic assembly 26 extends to drive the support plate 3 to move downward to abut against the upper side of the wafer, and at the same time the wafer holder releases the wafer, and the driving member 15 drives the clamping seat 2 and drives the wafer holder to move upward. Until the wafer is completely separated from the wafer holder, and after the carrying slot clamps the wafer, the telescopic assembly 26 retracts to drive the support plate 3 to move upward away from the wafer, completing the feeding of this group of wafers.

[0023] It can be seen that for the above wafer feeding device, after the clamping seat 2 fixes the wafer holder into the carrying slot, the support plate 3 can cooperate with the carrying slot to support the wafer up and down, avoiding the wafer from tipping and shifting due to lack of support during the process of unloading the wafer from the wafer holder to the carrying slot clamping the wafer. Ensure the stability of wafer transportation.

[0024] The technical features of the above-described embodiments can be combined arbitrarily. For the sake of brevity of description, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, it should be considered as the scope recorded in this specification.

[0025] The above-described embodiments merely represent several implementation manners of the present utility model. The description is relatively specific and detailed, but it should not be construed as a limitation on the scope of the utility model patent. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present utility model, several modifications and improvements can still be made, and these all fall within the protection scope of the present utility model. Therefore, the protection scope of the present utility model patent shall be subject to the appended claims.

Claims

1. A discharging device for silicon wafers, characterized in that: Including a moving mechanism, a clamping seat and a supporting plate, The moving mechanism comprises a horizontally arranged crossbar, a sliding seat slidably connected to the crossbar, and a vertical rod slidably arranged on the sliding seat; The clamping seat is connected to the vertical rod, hooks are respectively arranged on two opposite sides of the clamping seat, and a vertical telescopic component is also arranged on the clamping seat; The support plate is arranged below the clamping seat and connected to the telescopic assembly.

2. The silicon wafer unloading device according to claim 1, characterized in that: Two hooks are respectively arranged on two opposite sides of the clamping seat, and a bidirectional telescopic member is arranged between the two hooks on the same side.

3. The silicon wafer unloading device according to claim 2, characterized in that: The hook parts of the two hooks on the same side are arranged to face away from each other.

4. The silicon wafer unloading device according to claim 1, characterized in that: A vertical guide rod is arranged on the clamping seat, and the guide rod is connected to the support plate.

5. The silicon wafer unloading device according to claim 1, characterized in that: An elastic layer is arranged at the lower part of the support plate.

6. The silicon wafer unloading device according to claim 1, characterized in that: A force sensor is arranged on the vertical rod.

7. The silicon wafer unloading device according to claim 1, characterized in that: A first rack is horizontally arranged on the crossbar, a second rack is vertically arranged on the vertical bar, and a driving member for outputting torque is arranged on the slide seat to mesh the first rack and the second rack.

8. The silicon wafer unloading device according to claim 1, characterized in that: The cross bar and the vertical bar are respectively provided with first slide rails for connecting with the slide seat.

9. The silicon wafer unloading device according to claim 1, characterized in that: The moving mechanism also includes a drag chain.

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