Packaging and dismounting device based on heat dissipation structure of power device

Abstract

The utility model discloses a packaging and dismounting device based on a power device heat radiation structure, the packaging device comprises a power device, an adapter plate, a hollow tube and an insulation spacer, the insulation spacer is located between the adapter plate and the power device, and the insulation spacer, the adapter plate and the power device are integrated together; a plurality of screwing parts are arranged on the adapter plate; and the lower end of the hollow pipe is detachably fixed on the adapter plate. The dismounting device is composed of a dismounting rotary drum and a long rod installed in the dismounting rotary drum, the tail end of the long rod extends to the outer side of the dismounting rotary drum, and one end of the dismounting rotary drum is provided with a dismounting screwing thread matched with the screwing component. The beneficial effects of the utility model are that the power device is integrated, the layout space of the power device is reduced, the layout of the PCB is more flexible, the size of the machine is reduced, the installation and disassembly are easy, and the heat conduction performance is good.

Description

Technical Field

[0001] The utility model relates to the field of circuit board power device packaging, in particular to a packaging and disassembly device based on a power device heat dissipation structure. Background Art

[0002] For power devices such as IGBT tubes on PCB, they will generate heat during use. If the temperature of components is too high, it will affect the service life. Therefore, for IGBT, it is very important to solve the heat dissipation problem. Now the common method on the market is to install the power device between the heat sink and the PCBA board. How to fix the IGBT has a great impact on heat dissipation. The common method is to connect the IGBT and the heat sink through the fixing parts. To realize the assembly of the IGBT tube and the heat sink, it is also necessary to meet the requirements of electrical safety regulations. At the same time, due to the use of different materials for filling, the thermal conductivity, specific heat capacity, Poisson's ratio and thermal expansion coefficient of each material are also different, and the stress generated by thermal expansion between each material is also different. With the development of science and technology, the power of various electronic devices is getting bigger and bigger. Some equipment will generate a lot of heat when working, and this excess heat cannot be quickly dissipated and accumulates to generate high temperature, which may destroy the working equipment. At this time, a heat sink is needed, and how to effectively combine the heat dissipation structure with the heat generating equipment for efficient heat dissipation is the problem faced by many machines at present;

[0003] Currently, there are two forms of IGBT tube heat dissipation. One is to use a flexible and detachable heat dissipation connection between the IGBT tube and the insulating gasket, and between the insulating gasket and the radiator. This heat dissipation form is the most common, with high thermal resistance and low heat dissipation efficiency. The other is to use a physically fixed heat dissipation connection method (including but not limited to welding) without using an insulating gasket. Although this form has high heat dissipation efficiency and can avoid aging and loosening of silicone grease and has high reliability, the cost of scrapping is higher. If an IGBT tube explodes, the entire radiator and module will be scrapped. It lacks flexibility and has too high after-sales costs. Utility Model Content

[0004] The purpose of the utility model is to provide a packaging and disassembly device based on a power device heat dissipation structure in order to solve the above problems.

[0005] The utility model achieves the above-mentioned purpose through the following technical solutions:

[0006] A packaging device based on a power device heat dissipation structure comprises a power device, an adapter plate, a hollow tube and an insulating gasket, wherein the insulating gasket is located between the adapter plate and the power device, and the insulating gasket, the adapter plate and the power device are integrated together; the adapter plate is provided with a plurality of screw-on components; the lower end of the hollow tube is detachably fixed to the adapter plate.

[0007] Furthermore, the lower end of the hollow tube is detachably fixed to the adapter plate. Specifically, an external thread is provided on the outer side of one end of the hollow tube, and the hollow tube is screwed into the screwing component through the external thread.

[0008] Furthermore, the upper end of the hollow tube is used for detachably fixing to the PCB circuit board. Specifically, a plurality of hollow tube card holes are provided on the PCB circuit board, and the hollow tube is used for inserting into the hollow tube card holes.

[0009] Furthermore, a buckle / limit post is fixedly installed on the outer wall of the hollow tube, and the buckle / limit post is used for pressing against the side surface of the PCB circuit board far from the adapter plate.

[0010] Furthermore, the adapter plate is used for detachably fixing to the radiator. Specifically, a through hole in the slot is provided in the slot of the screwing component, a packaging screw is inserted into the through hole in the slot, and a screw fastening hole is provided on the base of the radiator, and the end of the packaging screw is used for screwing into the screw fastening hole.

[0011] Furthermore, a structural strip hole is provided on the tube wall of the hollow tube.

[0012] Furthermore, the connection modes of the two side surfaces of the insulating gasket with the power device and the adapter plate are any one of welding, bonding, silicone grease, phase change film, silicone rubber pad, and thermal curing.

[0013] Furthermore, the indirect contact mode between the adapter plate and the radiator is any one of bonding, silicone grease, phase change film, silicone rubber pad, and thermal curing.

[0014] Furthermore, the screwing component is a disassembly and assembly screwing slot of the adapter plate or a hollow nut.

[0015] Furthermore, the adapter plate is a metal heat sink.

[0016] The present utility model also discloses a disassembly device, which is composed of a disassembly rotating cylinder and a long rod installed in the disassembly rotating cylinder. The end of the long rod extends to the outside of the disassembly rotating cylinder, and a disassembly screwing thread matching the screwing component is provided at one end of the disassembly rotating cylinder.

[0017] The beneficial effects are as follows: The packaging device of the present utility model can not only be compatible with the packaging structure using two layers of thermal conductive silicone grease (i.e., a flexible detachable heat dissipation connection mode) in the prior art, but also solve the problems of high cost and inability to provide after-sales service existing in the packaging structures with non-detachable heat dissipation connection modes (such as welding, etc.).

[0018] The encapsulation device of the present utility model can integrate and integrate power devices, avoiding the embarrassing situation where traditional combined transistor pressure plates can only lock two transistors. It is possible to fix an entire encapsulation device using only one or two locking structures, reducing the layout space of power devices, making the layout of the PCB more flexible, reducing the volume of the machine, and making it more portable and compact.

[0019] The disassembly device of the present utility model shares components such as screw connection parts, through holes in the slots, and screw fastening holes during use, without the need for additional settings, making the disassembly of the encapsulation device convenient. Therefore, the structural design of the present utility model is ingenious, and thus it can save volume, weight, cost, etc. Description of the Drawings

[0020] Figure 1 is a three-dimensional view of the encapsulation device of the present utility model based on the heat dissipation structure of power devices;

[0021] Figure 2 is a schematic diagram of the installation of the encapsulation device of the present utility model based on the heat dissipation structure of power devices and a radiator;

[0022] Figure 3 is a cross-sectional view of the installation of the encapsulation device of the present utility model based on the heat dissipation structure of power devices, a PCB circuit board, and a radiator;

[0023] Figure 4 is a partial schematic diagram of the encapsulation device of the present utility model based on the heat dissipation structure of power devices;

[0024] Figure 5 is a three-dimensional view of another encapsulation device of the present utility model based on the heat dissipation structure of power devices;

[0025] Figure 6 For the present utility model Figure 5 schematic diagram of the installation of the encapsulation device based on the heat dissipation structure of power devices and a radiator;

[0026] Figure 7 For the present utility model Figure 5 cross-sectional view of the installation of the encapsulation device based on the heat dissipation structure of power devices, a PCB circuit board, and a radiator;

[0027] Figure 8 is the present utility model Figure 5 schematic diagram of the connecting plate in the encapsulation device based on the heat dissipation structure of power devices;

[0028] Figure 9 is another encapsulation device of the present utility model based on the heat dissipation structure of power devices;

[0029] Figure 10 is another encapsulation device of the present utility model based on the heat dissipation structure of power devices;

[0030] Figure 11 is another packaging device of the utility model based on the heat dissipation structure of power devices;

[0031] Figure 12 is another packaging device of the utility model based on the heat dissipation structure of power devices;

[0032] Figure 13 is another packaging device of the utility model based on the heat dissipation structure of power devices;

[0033] Figures 14 - 15 shows a sectional view of a disassembly device of the utility model applied to a packaging device based on the heat dissipation structure of power devices;

[0034] The description of the reference numerals is as follows:

[0035] 1. PCB circuit board; 2. Adapter board; 3. Heat sink; 4. Packaging screw; 5. Hollow tube; 6. Disassembly rotating cylinder; 7. Disassembly screw thread; 8. Long rod; 9. External thread; 10. Snap; 11. Power device, 12. Insulating gasket; 13. Screw connection part; 14. Through hole in the groove; 15. Structural strip hole; 16. Screw fastening hole; 17. Disassembly device. Specific embodiments

[0036] The following further describes the utility model with reference to the drawings:

[0037] As Figures 1 - 13 shown, a packaging device based on the heat dissipation structure of power devices includes a power device 11, an adapter board 2, a hollow tube 5 and an insulating gasket 12; the insulating gasket 12 is located between the adapter board 2 and the power device 11, and the insulating gasket 12, the adapter board 2 and the power device 11 are integrated together; the number of the insulating gaskets 12 is adapted to the number of the power devices 11; multiple power devices 11 are carried on one adapter board 2.

[0038] The adapter board 2 is provided with a screw connection part 13, the lower end of the hollow tube 5 is detachably fixed on the adapter board 2, the upper end of the hollow tube 5 is used for detachably fixing on the PCB circuit board 1, and the adapter board 2 is used for detachably fixing on the heat sink 3.

[0039] In one embodiment, the screw connection part 13 is a disassembly and assembly screw connection groove for the adapter board, a through hole 14 in the groove is opened in the disassembly and assembly screw connection groove for the adapter board, a packaging screw 4 is inserted into the through hole 14 in the groove, and in use, the end of the packaging screw 4 is screwed into a screw fastening hole 16 provided on the base of the heat sink 3 to realize the quick installation and fixation of the adapter board 2 and the heat sink 3. The heat sink 3, as a heat conduction and dissipation device, also has a fixed installation function;

[0040] In one embodiment, an external thread 9 is provided on the outer side of one end of the hollow tube 5. The hollow tube 5 is screwed into the dismounting and connecting slot 13 of the adapter plate through the external thread 9, so as to detachably fix the lower end of the hollow tube 5 to the adapter plate 2. In use, the hollow tube 5 is inserted into the corresponding hollow tube clamping hole provided on the PCB circuit board 1, so as to detachably fix the upper end of the hollow tube to the PCB circuit board. A buckle 10 is fixedly installed on the outer wall of the hollow tube 5, and the buckle 10 is pressed against the side surface of the PCB circuit board 1 away from the adapter plate 2. In this embodiment, the power device 11 is an IGBT power device, or a MOSFET power device, or other types of power devices. In use, the pins of the power device 11 pass through the PCB circuit board 1 from bottom to top and are fixed to the PCB circuit board 1 by soldering or other means. An insulating gasket 12 is installed on the side surface of the adapter plate 2 away from the radiator 2, and the power device 11 is installed between the insulating gasket 12 and the PCB circuit board 1.

[0041] In another embodiment, the buckle 10 is replaced by a limiting post or other pre-locking components, as long as the pre-locking function between the encapsulation device and the PCB circuit board can be achieved.

[0042] In another embodiment, the screwing component 13 can be a hollow nut, and the hollow nut can be directly pressed on the adapter plate 2 by a riveting process.

[0043] As Figures 1 - 13 shown, the present utility model also discloses the following various more optimized specific structures:

[0044] Structural strip holes 15 are provided on the wall of the hollow tube 5, which saves materials and is also convenient for clamping and rotation.

[0045] In different embodiments, the screwing component 13 can be one, two or more, and the corresponding number of hollow tubes 5 can be one, two or more than two.

[0046] In one embodiment, the adapter plate 2 is of a symmetrical shape, such as centrosymmetric or axisymmetric.

[0047] In one embodiment, two or more screwing components 13 are symmetrically distributed, and the corresponding two or more hollow tubes 5 are symmetrically distributed.

[0048] In one embodiment, the adapter plate 2 is a metal heat sink, including but not limited to copper heat sinks, aluminum heat sinks, copper substrate heat sinks, aluminum substrate heat sinks, so as to facilitate heat dissipation.

[0049] In one embodiment, a metal material is attached to the surface of the adapter plate 2, and the attachment methods of the metal material include but are not limited to electroplating and physical spraying.

[0050] The insulating gasket 12 is made of a heat dissipation interface material, which includes but is not limited to ceramic chips, DBC, and insulating and heat-conducting films - polyimide films. Both sides of the insulating gasket 12 can be connected to the power device 11 and the adapter board 2 by detachable or non-detachable heat dissipation connection methods to achieve heat conduction. The detachable methods include but are not limited to bonding, silicone grease, phase change film, silicone rubber pad, and heat curing. The non-detachable methods include welding, etc.

[0051] The lower surface of the adapter board 2 can be in direct contact with the upper surface of the radiator 3, or the lower surface of the adapter board 2 can be indirectly in contact with the radiator 3 through bonding, silicone grease, phase change film, silicone rubber pad, heat curing, etc. to achieve heat conduction. For example, in the case of silicone grease, a silicone grease layer is provided between the adapter board 2 and the radiator 3, and the silicone grease layer is laid by coating; in the case of a phase change film, a phase change film is provided between the adapter board 2 and the radiator 3; in the case of fixing with a silicone rubber pad, a silicone rubber pad is provided between the adapter board 2 and the radiator 3; in the case of heat curing, a heat-curing gel is provided between the adapter board 2 and the radiator 3, and the gel is melted by heating and then fixed to the adapter board 2 and the radiator 3 after cooling.

[0052] Figure 1 、 Figure 2 、 Figure 5 、 Figures 9 - 13 Illustrates the packaging device based on the power device heat dissipation structure under different embodiments, where Figure 1 It contains five power devices 11 and two hollow tubes 5, and the five power devices 11 are arranged in a straight line; Figure 2 It contains four power devices 11 and two hollow tubes 5, and the four power devices 11 are arranged in a straight line; Figure 5 It contains two power devices 11 and one hollow tube 5, and the hollow tube 5 is located in the middle of the two power devices 11; Figure 9 It contains two power devices 11 and two hollow tubes 5, and the two hollow tubes 5 are located at both ends of the two power devices 11; Figure 10 It contains four power devices 11 and two hollow tubes 5, and the four power tubes 11 are arranged in a square; Figure 11 It contains eight power devices 11 and two hollow tubes 5, and the power devices 11 are arranged in an H shape; Figure 12 、 Figure 13 Both contain twelve power devices 11 and two hollow tubes 5. The difference between them lies in the different shapes of the adapter board 2 and the different layouts of the power devices 11 and the hollow tubes 5. Figure 12 The power devices in it are arranged in a three-row and four-column matrix. Figure 13The power devices in it are arranged in a rectangular shape. These diagrams only show a part of the form of the packaging device. In practice, the number and layout of the power devices 11 and the hollow tubes 5 in the packaging device, as well as the shape of the adapter board, etc. can be designed according to needs. For example, the arrangement of the power devices 11 can be triangular, diagonal, etc. No matter how many power devices 11 there are, at most two locking structures (hollow tubes 5) are needed. This structure can reduce the layout space of power devices such as IGBT tubes, make the layout of the PCB more flexible and integrated, reduce the volume of the machine to make it more portable and compact, and the form of this packaging device can be arbitrarily planned according to the layout of the PCB and the number of power devices 11. Layouts such as long strips, squares, and some special-shaped layouts can all be satisfied.

[0053] When the packaging device based on the heat dissipation structure of the power device shown in the present utility model is being packaged, the insulating gasket 12, the power device 11, and the adapter board 2 are integrated and then installed between the radiator 3 and the PCB circuit board 1. Among them, the pins of the power device 11 are welded to the PCB circuit board 1 to achieve electrical connection. Then, the hollow tube 5 is screwed onto the adapter board 2 through the hollow tube card hole on the PCB circuit board 1. The upper end of the hollow tube 5 is buckled on the PCB circuit board 1, and the packaging screw 4 enters the through hole 14 in the groove through the lumen of the hollow tube 5, realizing the quick installation of the adapter board 2 and the radiator 3, thereby realizing the quick installation of the packaging device and the radiator 3.

[0054] Figures 14 - 15 In it, 17 is a disassembly device 17 applied to the packaging device based on the heat dissipation structure of the power device. The disassembly device 17 is composed of a disassembly rotating cylinder 6 and a long rod 8 installed inside the cylinder of the disassembly rotating cylinder 6. The end of the long rod 8 extends to the outside of the disassembly rotating cylinder 6. One end of the disassembly rotating cylinder 6 is provided with a disassembly screwing thread 7 that matches the adapter board disassembly and assembly screwing groove 13. When disassembling, first remove all the packaging screws 4 (which can be removed by rotation), remove at least one hollow tube 5 (which can be removed by rotation), and then the disassembly rotating cylinder 6 extends into the card hole corresponding to the removed hollow tube. Its end is screwed into the screwing part 13 through the disassembly screwing thread 7. At the same time, the end of the long rod 8 extends into the screw fastening hole through the through hole 14 in the groove, thereby realizing the pressing on the radiator 3. As the disassembly rotating cylinder 6 rotates, the pressing force increases, realizing the quick separation of the adapter board 2 and the radiator 3, thereby realizing the separation of the packaging device and the radiator 3.

[0055] Compared with the prior art, the structure of this packaging device integrates and integrates the power devices. The insulating gasket 12, the power device 11, and the adapter board 2 are integrated into one body, which is convenient for connection with the PCB circuit board and the radiator; at the same time, it has the advantage of good heat conduction performance.

[0056] In addition, since the disassembly device 17 of the present utility model shares components such as the screw-connecting component 13, the through-hole in the groove 14, and the screw fastening hole 16 during use without the need for additional setting, the disassembly of the encapsulation device is convenient. Therefore, the structural design of the present utility model is ingenious, thus saving volume, weight, cost, etc.

[0057] Those skilled in the art should understand that the present utility model is not limited by the above embodiments. What is described in the above embodiments and the specification is only to illustrate the principle of the present utility model. Without departing from the spirit and scope of the present utility model, the present utility model will have various changes and improvements, and these changes and improvements all fall within the scope of the present utility model claimed.

Claims

1. A packaging device based on a power device heat dissipation structure, characterized in that: It includes a power device, an adapter plate, a hollow tube and an insulating gasket, wherein the insulating gasket is located between the adapter plate and the power device, and the insulating gasket, the adapter plate and the power device are integrated together; the adapter plate is provided with a plurality of screw-on components; the lower end of the hollow tube can be detachably fixed to the adapter plate.

2. A packaging device based on a power device heat dissipation structure according to claim 1, characterized in that: The lower end of the hollow tube is detachably fixed to the adapter plate. Specifically, an outer side of one end of the hollow tube is provided with an external thread, and the hollow tube is screwed into the screw-on component through the external thread.

3. A packaging device based on a power device heat dissipation structure according to claim 1, characterized in that: The upper end of the hollow tube is used to be detachably fixed on the PCB circuit board. Specifically, the PCB circuit board is provided with a plurality of hollow tube clamping holes, and the hollow tube is used to be inserted into the hollow tube clamping holes.

4. A packaging device based on a power device heat dissipation structure according to claim 3, characterized in that: A buckle / limiting column is fixedly installed on the outer tube wall of the hollow tube, and the buckle / limiting column is used to be clamped onto a side plate surface of the PCB circuit board away from the adapter plate.

5. The packaging device based on the heat dissipation structure of a power device according to claim 1, characterized in that: The adapter plate is used to be detachably fixed to the radiator. Specifically, a through hole is opened in the groove of the screw-on component, a packaging screw is inserted into the through hole, a screw fastening hole is provided on the base of the radiator, and the end of the packaging screw is used to be screwed into the screw fastening hole.

6. The packaging device based on the heat dissipation structure of a power device according to claim 1, characterized in that: The tube wall of the hollow tube is provided with structural strip holes.

7. The packaging device based on the power device heat dissipation structure according to claim 1, characterized in that: The two side surfaces of the insulating gasket are connected to the power device and the adapter plate by any one of welding, bonding, silicone grease, phase change film, silicone pad, and thermal curing.

8. The packaging device based on the heat dissipation structure of a power device according to claim 5, characterized in that: The indirect contact method between the adapter plate and the heat sink is any one of bonding, silicone grease, phase change film, silicone pad, and thermal curing.

9. The packaging device based on the heat dissipation structure of a power device according to claim 1, characterized in that: The rotational connection component is a rotational connection groove or a hollow nut for disassembling and assembling the adapter plate.

10. A disassembly device applied to the packaging device according to any one of claims 1 to 9, characterized in that: The disassembly device consists of a disassembly drum and a long rod installed in the disassembly drum, the end of the long rod extends to the outside of the disassembly drum, and one end of the disassembly drum is provided with a disassembly screw thread matching the screw-on component.

Images