Unidirectional heat conduction composite structure and heat conduction device

Abstract

The utility model discloses a unidirectional heat conduction composite structure and a heat conduction device, the unidirectional heat conduction composite structure comprises a plurality of laminated hierarchical units, and each hierarchical unit comprises an infrared radiation layer, a waveguide layer and a photothermal conversion layer; the infrared radiation layer is located on one side close to a heating device, is made of a high-emissivity infrared radiation material and is used for converting heat emitted by the heating device into light energy to be emitted outwards; the waveguide layer is located on the side, away from the heating device, of the infrared radiation layer, the waveguide layer is made of a low-heat-conduction material and has high absorptivity, high refractive index and low reflectivity for light rays emitted by the infrared radiation layer, and the waveguide layer is used for absorbing the light rays converted by the infrared radiation layer and emitting the light rays outwards; the photothermal conversion layer is located on the other side of the waveguide layer and used for converting light energy transmitted by the waveguide layer into heat energy to be transmitted outwards, and heat generated by an integrated circuit and a circuit device is transmitted out while external heat is isolated.

Description

Technical Field

[0001] The utility model relates to the technical field of unidirectional heat conduction, and particularly relates to a unidirectional heat conduction composite structure and a heat conduction device. Background Art

[0002] With the rapid development of electronic technology, as the core component of electronic devices, the performance and stability of integrated circuits are crucial for the operation of the entire system. Encapsulating integrated circuits with heat-insulating materials / structures is a common method to protect the stable operation of integrated circuits. Although the existing heat-insulating materials / structures can isolate external high temperatures, they cannot quickly discharge the heat generated by the power consumption of the integrated circuits themselves, resulting in potential safety hazards during the operation of the integrated circuits.

[0003] Therefore, it is necessary to provide a unidirectional heat conduction composite structure and a heat conduction device to solve the problems mentioned in the above background art. Summary of the Utility Model

[0004] To achieve the above object, the utility model provides the following technical solution: A unidirectional heat conduction composite structure includes: a plurality of stacked hierarchical units, and each of the hierarchical units includes an infrared radiation layer, a waveguide layer, and a photo-thermal conversion layer arranged in sequence from top to bottom;

[0005] The infrared radiation layer is located on the side close to the heat-generating device, and the infrared radiation layer is used to convert the heat emitted by the heat-generating device into light energy and emit it outward;

[0006] The waveguide layer is used to absorb and emit the light converted by the infrared radiation layer;

[0007] The photo-thermal conversion layer is used to convert the light energy transmitted by the waveguide layer into heat energy and transmit it outward.

[0008] As a preferred technical solution of the utility model, the infrared radiation layer is a high-emissivity infrared radiation material layer.

[0009] As a preferred technical solution of the utility model, the infrared radiation layer is a lanthanum aluminate layer, a ferrite layer, a silicon dioxide ceramic layer, or a zirconia layer.

[0010] As a preferred technical solution of the utility model, the wavelength of the infrared light radiated by the infrared radiation layer is 0.76 micrometers - 1000 micrometers.

[0011] As a preferred technical solution of the utility model, the waveguide layer is a polymer material layer.

[0012] As a preferred technical solution of the utility model, one or more heat sinks are arranged on the outside of the outermost hierarchical unit, and the heat sinks are in contact with the photo-thermal conversion layer.

[0013] The present utility model also provides a heat conduction device, which includes the above-mentioned unidirectional heat conduction composite structure. The heat conduction device is installed between a heat generating element and a heat dissipation device of an electronic device, and is used to conduct the heat generated by the heat generating element to the heat dissipation device along a specific direction.

[0014] Compared with the prior art, the present utility model provides a unidirectional heat conduction composite structure and a heat conduction device, which have the following beneficial effects:

[0015] In the present utility model, a hierarchical unit is formed by sequentially preparing an infrared radiation layer, a waveguide layer, and a photo-thermal conversion layer. The hierarchical unit is used to perform a one-way conversion of thermal energy-light energy-thermal energy on the heat dissipated by integrated circuits, circuit devices, etc. At the same time, this structure has a high thermal conductivity coefficient on the side of the heat generating elements such as integrated circuits and circuit devices, and a lower thermal conductivity coefficient on the opposite side of the heat generating elements, so as to transfer the heat dissipated by the integrated circuits, circuit devices, etc. while isolating external high temperature, ensuring the normal operation of the device and avoiding overheating damage. In addition, the close arrangement of multiple hierarchical units enables the heat transfer in the structure to be more efficient, which helps to improve the overall heat conduction efficiency and enables the heat to be transferred from the heat source to the heat dissipation area faster. Description of the Drawings

[0016] Figure 1 It is a schematic diagram of the overall structure of a unidirectional heat conduction composite structure;

[0017] In the figure: 1, hierarchical unit; 11, infrared radiation layer; 12, waveguide layer; 13, photo-thermal conversion layer; A, heat dissipation direction of the heat generating device; n, number of stacked hierarchical units. Detailed Embodiments

[0018] Please refer to Figure 1 , the present utility model provides a unidirectional heat conduction composite structure, including: a plurality of stacked hierarchical units 1, and each of the hierarchical units 1 includes an infrared radiation layer 11, a waveguide layer 12, and a photo-thermal conversion layer 13 which are sequentially arranged from top to bottom;

[0019] The infrared radiation layer 11 is located on the side close to the heat generating device, and the infrared radiation layer 11 is used to convert the heat dissipated by the heat generating device into light energy and emit it outward;

[0020] The waveguide layer 12 is used to absorb and emit the light rays converted by the infrared radiation layer 11;

[0021] The photo-thermal conversion layer 13 is used to convert the light energy transmitted by the waveguide layer 12 into thermal energy and transmit it outward.

[0022] It should be noted that during use, the heat absorbed by the infrared radiation layer 11 is quickly converted into light and emitted outward, reducing the temperature of the heat-generating devices such as integrated circuits and circuit devices. Then, the waveguide layer 12 absorbs the light and transfers it outward to the photo-thermal conversion layer 13. Finally, the photo-thermal conversion layer 13 converts the light energy into heat energy and transfers it outward. By utilizing the characteristics of one-way thermal-optical-thermal conversion between the layers, one-way transfer of the heat of the heat-generating devices is achieved.

[0023] In addition, the setting of the multi-layer hierarchical unit 1 can form a more compact heat conduction structure, enabling more efficient heat transfer in the structure, helping to improve the overall heat conduction efficiency, and allowing heat to be transferred from the heat source to the heat dissipation area faster.

[0024] In this embodiment, the infrared radiation layer 11 is a high-emissivity infrared radiation material layer.

[0025] Specifically, the infrared radiation layer 11 is a lanthanum aluminate layer, a ferrite layer, a silica ceramic layer, or a zirconia ceramic layer. Preferably, the ferrite layer is spinel copper ferrite. Since most of the high-emissivity infrared radiation materials used are powders, those skilled in the art can attach the powders to the surface of an insulating and high-temperature-resistant silicone layer or epoxy resin layer when fabricating this layer.

[0026] In this embodiment, the wavelength of the infrared light radiated by the infrared radiation layer 11 is 0.76 micrometers - 1000 micrometers.

[0027] In this embodiment, the waveguide layer 12 is a polymer material layer.

[0028] Specifically, since the surface of the infrared radiation layer 11 is rough after preparation, when preparing the waveguide layer 12, only a polymer material with a very low reflectivity to the required infrared band and a low thermal conductivity is needed to fill the gaps using a polymerization process. The polymer material used in the implementation process of this application is polyimide.

[0029] In this embodiment, one or more heat sinks are provided on the outside of the outermost layer of the hierarchical unit 1, and the heat sinks are in contact with the photo-thermal conversion layer 13.

[0030] The present utility model also provides a heat conduction device, including the above-mentioned one-way heat conduction composite structure. The heat conduction device is installed between the heat-generating element and the heat dissipation device of an electronic device, and is used to conduct the heat generated by the heat-generating element to the heat dissipation device along a specific direction.

[0031] A preparation method of a one-way heat conduction composite structure includes:

[0032] S1. For part or all of the integrated circuits and devices that require one-way heat conduction, prepare a layer of insulating and high-temperature-resistant silicone layer or epoxy resin layer and attach infrared radiation material powders on its outside;

[0033] After the first infrared radiation layer 11 is prepared, a waveguide layer 12 is prepared on the infrared radiation layer 11 by a polymerization process;

[0034] After the waveguide layer 12 is prepared, a photothermal conversion layer 13 is further compounded and prepared on the waveguide layer 12;

[0035] Step S4: Repeat the above steps S1 - S3 to prepare n layers.

[0036] The above is only the preferred specific implementation mode of the present utility model, but the protection scope of the present utility model is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present utility model, according to the technical solution and the inventive concept of the present utility model, making equivalent replacements or changes should be covered within the protection scope of the present utility model.

Claims

1. A unidirectional heat-conducting composite structure, characterized in that: It comprises a plurality of layered units (1) arranged in a stacked manner, each of the layered units (1) comprising an infrared radiation layer (11), a waveguide layer (12) and a light-to-heat conversion layer (13) arranged in sequence from top to bottom; The infrared radiation layer (11) is located on a side close to the heating device, and the infrared radiation layer (11) is used to convert the heat emitted by the heating device into light energy and emit it outward; The waveguide layer (12) is used to absorb the light converted by the infrared radiation layer (11) and emit it outwards; The light-to-heat conversion layer (13) is used to convert the light energy transmitted by the waveguide layer (12) into heat energy and transmit it outwards.

2. The one-way heat-conducting composite structure according to claim 1, characterized in that: The infrared radiation layer (11) is a high-emissivity infrared radiation material layer, and the surface of the infrared radiation layer (11) has a rough property.

3. A unidirectional heat-conducting composite structure according to claim 2, characterized in that: The infrared radiation layer (11) radiates infrared light with a wavelength of 0.76 micrometers to 1000 micrometers.

4. The one-way heat-conducting composite structure according to claim 1, characterized in that: The waveguide layer (12) is a polymer material layer, and the raw material for preparing the polymer material layer is polyimide.

5. The one-way heat-conducting composite structure according to claim 1, characterized in that: One or more heat sinks are arranged on the outer side of the outermost layer unit (1), and the heat sinks are in contact with the light-to-heat conversion layer (13).

6. A heat conducting device, characterized in that It comprises a unidirectional heat-conducting composite structure as described in any one of claims 1 to 5, wherein the heat-conducting device is installed between a heating element and a heat dissipation device of an electronic device, and is used to conduct the heat generated by the heating element to the heat dissipation device along a specific direction.

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