Packaging structure of power module

Abstract

The utility model discloses a packaging structure of a power module, which comprises a bottom plate, a first power unit and a second power unit, the first power unit and the second power unit are positioned on the bottom plate, and the first power unit comprises a first substrate and a first three-phase full-bridge circuit positioned on the first substrate; the second power unit comprises three second substrates and a second three-phase full-bridge circuit, and each phase of circuit is located on one second substrate; wherein the first substrate and the second substrate are both located on the first surface of the bottom plate, and the first power unit and the second power unit are arranged in the same shell. By integrating the two power units into the packaging structure of the power module, the size and the weight of the packaging structure of the power module are reduced, the power density and the reliability of the packaging structure of the power module can be improved, the packaging structure of the power module is more convenient to install, and the cost is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductors, and more specifically, to a packaging structure of a power module. Background Art

[0002] A power module is a power semiconductor device that realizes power conversion control in a power electronic system, and has advantages such as high current density, low saturation voltage, and high voltage resistance. Currently, it is widely used in various fields such as automobiles, photovoltaic power generation, and wind power generation.

[0003] In a dual-motor controller system, two independent power modules are usually used to form two three-phase full-bridge circuit topologies. Among them, one is used as a power generation module to control a generator, and the other is used as an inverter module to control a drive motor. The two independent power modules will occupy a large space, resulting in a low power density and high cost of the system. In addition, generally, in a motor controller system, a magnetic ring for detecting an output current is usually assembled on a circuit board, which occupies a large circuit board area, will further reduce the power density of the system, and will increase the risk of circuit board vibration failure. Summary of the Utility Model

[0004] In view of the above problems, the purpose of the utility model is to provide a packaging structure of a power module, which is applicable to a dual-motor control system, improves the power density and reliability of the packaging structure of the power module, and reduces costs.

[0005] A packaging structure of a power module provided by the utility model includes: a bottom plate, a first power unit and a second power unit located on the bottom plate. The first power unit includes a first substrate and a first three-phase full-bridge circuit located on the first substrate; the second power unit includes three second substrates and a second three-phase full-bridge circuit, and each phase circuit is respectively located on one of the second substrates; wherein, the first substrate and the second substrate are both located on the first surface of the bottom plate, and the first power unit and the second power unit are arranged in the same housing.

[0006] Optionally, the length of the packaging structure does not exceed 300 mm.

[0007] Optionally, the length of the packaging structure does not exceed 250 mm.

[0008] Optionally, the length of the packaging structure does not exceed 200 mm.

[0009] Optionally, the width of the first substrate and the width of the second substrate do not exceed 100 mm.

[0010] Optionally, the width of the first substrate and the width of the second substrate do not exceed 70 mm.

[0011] Optionally, the first power unit is used to control the power generation module, and the second power unit is used to control the inverter module.

[0012] Optionally, the first power unit is used to control the inverter module, and the second power unit is used to control the power generation module.

[0013] Optionally, both the first power unit and the second power unit are used to control the inverter module.

[0014] Optionally, both the first power unit and the second power unit are used to control the power generation module.

[0015] Optionally, a current detection device is further included. Current detection devices are respectively arranged at at least two AC output power terminals of the first power unit, and current detection devices are respectively arranged at at least two AC output power terminals of the second power unit. The current detection devices are partially or entirely embedded in the housing.

[0016] Optionally, current detection devices are respectively arranged at two AC output power terminals of the first power unit, and current detection devices are respectively arranged at three AC output power terminals of the second power unit.

[0017] Optionally, current detection devices are respectively arranged at two AC output power terminals located at the edge of the first power unit.

[0018] Optionally, the current detection device includes a magnetic ring. The magnetic ring is U-shaped, the magnetic ring semi-surrounds the corresponding AC output power terminal, and the U-shaped opening of the magnetic ring is arranged facing away from the bottom plate.

[0019] Optionally, both the first power unit and the second power unit include DC power supply terminals and AC output power terminals. The DC power supply terminals and the AC output power terminals are electrically connected to the first substrate and the second substrate. One end of the DC power supply terminal extends out from the first side of the housing, and one end of the AC output power terminal extends out from the second side of the housing. The second side is opposite to the first side.

[0020] Optionally, the DC power supply terminal includes a positive terminal and a negative terminal, and the positive terminal and the negative terminal are arranged in a stacked manner along a direction perpendicular to the bottom plate.

[0021] Optionally, the positive terminal of the DC power supply terminal is arranged close to the bottom plate side, and the positive terminal has a bend, and the end after bending is perpendicular to the bottom plate.

[0022] Optionally, the DC power supply terminals include a positive terminal and a negative terminal, and the positive terminal and the negative terminal are arranged side by side along the first side.

[0023] Optionally, the positive terminals of the DC power supply for each phase of the first power unit share a positive terminal of a DC power supply terminal, and the negative terminals of the DC power supply for each phase of the first power unit share a negative terminal of a DC power supply terminal.

[0024] Optionally, a heat dissipation structure is provided on the second surface of the base plate, and the first surface is opposite to the second surface.

[0025] Optionally, the first power unit and the second power unit further respectively include a plurality of signal terminals, the plurality of signal terminals are perpendicular to the first substrate and the second substrate, and the signal terminals are respectively electrically connected to their respective first substrate and second substrate.

[0026] Optionally, a cover plate is further included, the cover plate is located above the first substrate and the second substrate, the cover plate matches the housing, the cover plate includes through holes corresponding to the signal terminals, and the tops of the signal terminals pass through the through holes of the cover plate.

[0027] Optionally, the first three-phase full-bridge circuit and the second three-phase full-bridge circuit include IGBT chips and FRD chips.

[0028] Optionally, the first three-phase full-bridge circuit and the second three-phase full-bridge circuit include MOSFET chips or RC-IGBT chips.

[0029] Optionally, the first three-phase full-bridge circuit includes 6 IGBT chips and 6 FRD chips, and each phase circuit of the second three-phase full-bridge circuit includes 2 IGBT chips and 2 FRD chips.

[0030] Optionally, the first power unit and the second power unit further respectively include thermistors to respectively detect the temperatures of the first power unit and the second power unit.

[0031] Optionally, the DC power supply terminals include the first DC power supply terminal in the first power unit, the U-phase DC power supply terminal, the V-phase DC power supply terminal, and the W-phase DC power supply terminal in the second power unit; the AC output power terminals include the first U-phase output power terminal, the first V-phase output power terminal, the first W-phase output power terminal in the first power unit, the second U-phase output power terminal, the second V-phase output power terminal, and the second W-phase output power terminal in the second power unit.

[0032] According to the packaging structure of the power module provided by the present utility model, the first power unit and the second power unit are integrated into the packaging structure of the same power module, so that the packaging structure of the power module can be applied to a dual-motor control system. Specifically, the first power unit is used to control the power generation module, and the second power unit is used to control the drive motor. By integrating the two power units into the packaging structure of one power module, the volume and weight of the packaging structure of the power module are reduced, the power density and reliability of the packaging structure of the power module can be improved, making it more convenient for installation and reducing costs.

[0033] Furthermore, the first three-phase full-bridge circuit in the first power unit shares the first substrate and the DC power supply terminals, further enhancing the power density of the packaging structure of the power module.

[0034] Furthermore, a current detection device (magnetic ring) is provided at the AC output power terminals of the packaging structure of the power module, and the magnetic ring is partially or fully embedded into the housing by injection molding, so that the magnetic ring no longer needs to be installed on the circuit board, which helps to reduce the weight of the circuit board, reduce the vibration load, and improve the reliability of the packaging structure of the power module.

[0035] Furthermore, in the packaging structure of the power module, the positive and negative terminals of each DC power supply terminal adopt a stacked design, significantly reducing the stray inductance in the packaging structure of the power module, reducing the system loss, and improving the electrical performance of the packaging structure of the power module. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] Through the following description of the embodiments of the present utility model with reference to the drawings, the above and other objects, features and advantages of the present utility model will become clearer. In the drawings:

[0037] Figure 1 A front schematic view of the packaging structure of the power module showing the first embodiment of the present utility model;

[0038] Figure 2 An internal layout schematic view of the packaging structure of the power module showing the first embodiment of the present utility model;

[0039] Figure 3 A back schematic view of the packaging structure of the power module showing the first embodiment of the present utility model;

[0040] Figure 4 A side schematic view of the packaging structure of the power module showing the first embodiment of the present utility model;

[0041] Figure 5 A circuit structure schematic view of the first power unit in the packaging structure of the power module showing the first embodiment of the present utility model;

[0042] Figure 6 Schematic diagram of the circuit structure of the second power unit in the packaging structure of the power module according to the first embodiment of the present invention;

[0043] Figure 7 Three-dimensional schematic diagram of the packaging structure of the power module according to the second embodiment of the present invention;

[0044] Figure 8 Three-dimensional schematic diagram of the packaging structure of the power module according to the third embodiment of the present invention. Detailed implementation manners

[0045] The present invention will be described in more detail below with reference to the accompanying drawings. For clarity, the various parts in the drawings are not drawn to scale. In addition, some well-known parts may not be shown. Many specific details of the present invention are described below, but as those skilled in the art can understand, the present invention can be implemented without these specific details.

[0046] The present invention can be presented in various forms, and some examples will be described below.

[0047] Figure 1 Front schematic diagram of the packaging structure of the power module according to the first embodiment of the present invention; As Figure 1 shown, the packaging structure of the power module includes a first power unit located in the first region and a second power unit located in the second region. The two power units are, for example, located in the same housing 11. A bottom plate 10 is provided on the back (lower side) of the housing 11. The first power unit and the second power unit also have a plurality of signal terminals 13 perpendicular to the bottom plate 10. Above the first substrate 110 and the second substrate 120, a cover plate 12 matching the housing 11 is provided. Through holes are provided on the cover plate 12, and the plurality of signal terminals 13 pass through the through holes of the cover plate 12 for electrical connection with the outside. The length of the packaging structure of the power module does not exceed 300 mm. Preferably, its length does not exceed 250 mm. Further preferably, its length does not exceed 200 mm. The above length can be adjusted according to the power range of the packaging structure of the power module.

[0048] Figure 2 The cover plate 12 is removed in the [description] to better show the internal layout structure of the packaging structure of the power module according to the first embodiment, as Figure 2As shown, the first power unit located in the first region is used to control a generator, for example. The first three-phase full-bridge circuit in the first power unit shares the same first substrate 110. The first power unit includes the first substrate 110 and multiple FRD (fast recovery diode) chips 14 and multiple IGBT (insulated gate bipolar transistor) chips 15 located on the first substrate 110. Further, a thermistor 16 is also provided on the first substrate 110. A signal terminal 13 perpendicular to the first substrate 110 and leading out the electrical signals of the first substrate 110 is also provided on the first substrate 110. The first power unit further includes a first DC power supply terminal 111 located on the first side of the housing 11, and a first U-phase output power terminal 112, a first V-phase output power terminal 113, and a first W-phase output power terminal 114 located on the second side of the housing 11. Specifically, the first DC power supply terminal 111 extends out from the first side of the housing 11, and the first U-phase output power terminal 112, the first V-phase output power terminal 113, and the first W-phase output power terminal 114 extend out from the second side of the housing 11. The first side and the second side are opposite to each other. The first DC power supply terminal 111 and each phase output power terminal 112-114 are all electrically connected to the first substrate 110. The positions of the first U-phase output power terminal 112, the first V-phase output power terminal 113, and the first W-phase output power terminal 114 can be interchanged. The first DC power supply terminal 111 includes a positive terminal and a negative terminal, and the two are arranged in a stacked manner in a direction perpendicular to the bottom plate 10, that is, the two are stacked up and down and completely overlap in a top view.

[0049] A second power unit is arranged in the second region of the packaging structure of the power module. The second power unit is used to control a drive motor, for example. Each phase circuit of the second three-phase full-bridge circuit in the second power unit is respectively located on a second substrate 120. Each second substrate 120 includes an FRD chip 14, an IGBT chip 15, and a thermistor 16. Correspondingly, the second power unit further includes a U-phase DC power supply terminal 121, a V-phase DC power supply terminal 123, a W-phase DC power supply terminal 125 located on the first side of the housing 11, and a second U-phase output power terminal 122, a second V-phase output power terminal 124, and a second W-phase output power terminal 126 located on the second side of the housing 11. The U-phase DC power supply terminal 121, the V-phase DC power supply terminal 123, and the W-phase DC power supply terminal 125 extend out from the first side of the housing 11, and the second U-phase output power terminal 122, the second V-phase output power terminal 124, and the second W-phase output power terminal 126 extend out from the second side of the housing 11. Among them, each of the above DC power supply terminals and each output power terminal are electrically connected to the corresponding second substrate 120. The U-phase DC power supply terminal 121, the V-phase DC power supply terminal 123, and the W-phase DC power supply terminal 125 each include a positive terminal and a negative terminal. The positive terminals and negative terminals of the U-phase DC power supply terminal 121, the V-phase DC power supply terminal 123, and the W-phase DC power supply terminal 125 are stacked in a direction perpendicular to the bottom plate 10, that is, they are stacked up and down, and completely overlap in a top view.

[0050] Of course, the positions of the three second substrates 120 in the second power unit can be interchanged, that is, the positions of the U, V, and W phases can be interchanged. The widths of the first substrate 110 and the second substrate 120 in a direction perpendicular to the first side do not exceed 100 mm. Preferably, the widths of the first substrate 110 and the second substrate 120 in a direction perpendicular to the first side do not exceed 70 mm. The above widths can be adjusted according to the power range of the packaging structure of the power module.

[0051] Of course, in other embodiments, the first power unit can be used to control an inverter module, and the second power unit can be used to control a power generation module; or, both the first power unit and the second power unit are used to control an inverter module; or, both the first power unit and the second power unit are used to control a power generation module.

[0052] The above-mentioned first substrate 110 and second substrate 120 are both ceramic insulating substrates, such as DBC (Direct Bonding Copper) substrates or AMB (Active Metal Brazing) substrates. The IGBT chip 15, FRD chip 14, and thermistor 16 are assembled onto the first substrate 110 and second substrate 120 through connection processes such as welding or sintering. The signal terminal 13 is assembled onto the first substrate 110 and second substrate 120 through, for example, an ultrasonic welding process. The first substrate 110 and second substrate 120 are connected to the first surface of the bottom plate 10 by welding or sintering. A cross beam 130 can also be provided between the first substrate 110 and second substrate 120, and between the second substrate 120 and the second substrate 120 to improve the structural strength of the packaging structure of the power module.

[0053] The first DC power supply terminal 111, the first U-phase output power terminal 112, the first V-phase output power terminal 113, the first W-phase output power terminal 114, the U-phase DC power supply terminal 121, the V-phase DC power supply terminal 123, the W-phase DC power supply terminal 125, the second U-phase output power terminal 122, the second V-phase output power terminal 124, and the second W-phase output power terminal 126 are all embedded in the housing 11 and integrally injection-molded with the housing 11, and one end is connected to the first substrate 110 and second substrate 120 through processes such as ultrasonic welding. The first substrate 110 of the first power unit and the three second substrates 120 of the second power unit are arranged side by side. A current detection device is also provided on the second side of the housing 11. The current detection device is, for example, a magnetic ring 17. Magnetic rings 17 are respectively provided at at least two AC output power terminals of the first power unit, and magnetic rings 17 are respectively provided at at least two AC output power terminals of the second power unit. The magnetic rings 17 are partially or entirely embedded in the housing 11 and fixed to the corresponding output power terminals by injection molding. The magnetic ring 17 is, for example, in a U shape and semi-surrounds the output power terminal, and the opening of the U shape is, for example, arranged facing the cover plate 12. In this embodiment, a magnetic ring 17 is provided at the first U-phase output power terminal 112, and a magnetic ring 17 is provided at the first W-phase output power terminal 114; a magnetic ring 17 is respectively provided at the second U-phase output power terminal 122, the second V-phase output power terminal 124, and the second W-phase output power terminal 126, but is not limited thereto.

[0054] Figure 3 The figure shows a schematic view of the back of the packaging structure of the power module according to the first embodiment of the present invention; in order to obtain better heat dissipation capacity, a heat dissipation structure 18 is also provided on the second surface of the bottom plate 10 of the packaging structure of the power module. The heat dissipation structure 18 is, for example, a plurality of heat dissipation pin fins or fins arranged in an array, and the second surface of the bottom plate 10 is opposite to the first surface.

[0055] Figure 4 A side schematic view showing the packaging structure of the power module according to the first embodiment of the present invention. The packaging structure of the power module includes a bottom plate 10, a housing 11, and a first power unit and a second power unit located on the first surface of the bottom plate 10 and inside the housing 11. A heat dissipation structure 18 is provided on the second surface of the bottom plate 10. The housing 11 is assembled on the first surface of the bottom plate 10 by means of glue bonding and screw locking processes and surrounds the peripheries of the first substrate 110 and the second substrate 120. The signal terminals 13 in the first power unit and the second power unit pass through the cover plate 12. Specifically, Figure 4 For example, Figure 1 The right view of the packaging structure of the medium power module. Taking the W-phase circuit on the rightmost side of the second power unit as an example, from Figure 4 it can be seen that on the first side of the housing 11, a W-phase DC power supply power terminal 125 is provided, which includes a negative terminal 1251 and a positive terminal 1252; on the second side of the housing 11, a second W-phase output power terminal 126 is provided. The negative terminal 1251 and the positive terminal 1252 are arranged in parallel and stacked. The positive terminal 1252, for example, has a bending structure, and the end portion of the positive terminal 1252 after bending is perpendicular to the bottom plate 10 so as to be staggered from the negative terminal 1251 for convenient installation. It can be understood that the positive terminals of the first DC power supply power terminal 111, the U-phase DC power supply power terminal 121, and the V-phase DC power supply power terminal 123 also all have bending structures. In other embodiments, the positions of the positive and negative terminals can also be interchanged.

[0056] Figure 5 A circuit structure schematic diagram of the first power unit in the packaging structure of the power module according to the first embodiment of the present invention; the first three-phase full-bridge circuit of the first power unit is all located on the first substrate 110, and each phase circuit includes an FRD chip 14 and an IGBT chip 15; the positive DC power supply terminals of each phase of the first three-phase full-bridge circuit are connected and led out through the power supply positive terminal P1, and the negative DC power supply terminals of each phase of the first three-phase full-bridge circuit are connected and led out through the power supply negative terminal N1. The power supply positive terminal P1 and the power supply negative terminal N1 respectively correspond to the positive terminal and the negative terminal in the first DC power supply power terminal 111; the output power terminals UG, VG, and WG of the first three-phase full-bridge circuit are respectively led out through the corresponding first U-phase output power terminal 112, the first V-phase output power terminal 113, and the first W-phase output power terminal 114. A thermistor NTC1(16) is also provided on the first substrate 110 of the first power unit, and the nodes T11, T12, G1 to G6, and E1 to E6 in the first power unit are respectively led out through the signal terminals 13.

[0057] Figure 6The schematic circuit diagram of the second power unit in the packaging structure of the power module according to the first embodiment of the present invention is shown. Each phase circuit of the second three-phase full-bridge circuit of the second power unit is respectively located on a second substrate 120. Each phase circuit includes an FRD chip 14, an IGBT chip 15, and a thermistor 16; the positive power supply terminal P2 of the U phase, the positive power supply terminal P3 of the V phase, and the positive power supply terminal P4 of the W phase are led out through the positive terminals of the U-phase DC power supply terminals 121, the positive terminals of the V-phase DC power supply terminals 123, and the positive terminals of the W-phase DC power supply terminals 125 respectively. The negative power supply terminal N2 of the U phase, the negative power supply terminal N3 of the V phase, and the negative power supply terminal N4 of the W phase are led out through the negative terminals of the U-phase DC power supply terminals 121, the negative terminals of the V-phase DC power supply terminals 123, and the negative terminals of the W-phase DC power supply terminals 125 respectively. The output power terminals UT, VT, and WT of the second three-phase full-bridge circuit are led out through the corresponding second U-phase output power terminals 122, second V-phase output power terminals 124, and second W-phase output power terminals 126 respectively. A thermistor is respectively arranged in each phase circuit of the second three-phase full-bridge circuit in the second power unit, that is, the thermistors NTC2 to NTC4 respectively detect the temperature of each phase circuit. Similar to the first power unit, the nodes T21, T22, T31, T32, T41, T42, G7 to G12, and E7 to E12 in the second power unit are respectively led out through signal terminals 13.

[0058] The first power unit includes a first three-phase full-bridge circuit, and the second power unit includes a second three-phase full-bridge circuit. The first three-phase full-bridge circuit and the second three-phase full-bridge circuit include power semiconductor chips. The power semiconductor chips include IGBT chips and FRD chips, or MOSFET chips, or RC-IGBT chips. Specifically, the first three-phase full-bridge circuit includes 6 IGBT chips and 6 FRD chips, and each phase circuit of the second three-phase full-bridge circuit includes 2 IGBT chips and 2 FRD chips.

[0059] Figure 7 The three-dimensional schematic diagram of the packaging structure of the power module according to the second embodiment of the present invention is shown; the parts of the packaging structure of the power module in the second embodiment that are the same as those in the first embodiment will not be described in detail. The parts different from the first embodiment are that the positive terminals 1112 of the first DC power supply terminal 111, the positive terminals 1212 of the U-phase DC power supply terminals 121, the positive terminals 1232 of the V-phase DC power supply terminals 123, and the positive terminals 1252 of the W-phase DC power supply terminals 125 are not provided with bending structures. In this embodiment, the positive terminals are, for example, all longer than the negative terminals. In other embodiments, the positions of the positive and negative terminals can also be interchanged.

[0060] Figure 8A three-dimensional schematic diagram showing the packaging structure of the power module according to the third embodiment of the present invention; as Figure 8 shown, the parts of the packaging structure of the power module in the third embodiment that are the same as those in the first embodiment will not be described in detail. The parts different from the first embodiment are that the positive and negative terminals of the first DC power supply terminal 111, the U-phase DC power supply terminal 121, the V-phase DC power supply terminal 123, and the W-phase DC power supply terminal 125 are arranged side by side along the first side, that is, the positive terminal 1112, the negative terminal 1111 of the first DC power supply terminal 111, the positive terminal 1212, the negative terminal 1211 of the U-phase DC power supply terminal 121, the positive terminal 1232, the negative terminal 1231 of the V-phase DC power supply terminal 123, the positive terminal 1252, and the negative terminal 1251 of the W-phase DC power supply terminal 125 are arranged side by side in sequence along the first side. The distances of the positive and negative terminals from the bottom plate 10 can be the same or different. In other embodiments, the positions of the positive and negative terminals can also be interchanged. According to the packaging structure of the power module provided by the present invention, the first power unit and the second power unit are integrated in the packaging structure of the same power module, so that the packaging structure of the power module can be applied to a dual-motor control system. Specifically, the first power unit is used to control the power generation module, and the second power unit is used to control the drive motor. By integrating the two power units into the packaging structure of one power module, the volume and weight of the packaging structure of the power module are reduced, the power density and reliability of the packaging structure of the power module can be improved, making it more convenient for installation and reducing costs.

[0061] Furthermore, the first three-phase full-bridge circuit in the first power unit shares the first substrate and the DC power supply terminal, further improving the power density of the packaging structure of the power module.

[0062] Furthermore, a current detection device (magnetic ring) is also provided at the AC output power terminal of the packaging structure of the power module, and the magnetic ring is partially or completely embedded into the housing by injection molding, so that the magnetic ring no longer needs to be installed on the circuit board, which helps to reduce the weight of the circuit board, reduce the vibration load, and improve the reliability of the packaging structure of the power module.

[0063] Furthermore, in the packaging structure of the power module, the positive and negative terminals of each DC power supply terminal adopt a stacked design, significantly reducing the stray inductance in the packaging structure of the power module, reducing the system loss, and improving the electrical performance of the packaging structure of the power module.

[0064] It should be noted that in this text, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the term "comprising", "including" or any other variant thereof is intended to cover non-exclusive inclusion, so that a process, method, article or device comprising a series of elements not only includes those elements, but also includes other elements not expressly listed, or elements inherent to such process, method, article or device. Without further limitation, an element defined by the statement "comprising an..." does not exclude the presence of additional identical elements in the process, method, article or device comprising the element.

[0065] As described above in accordance with the embodiments of the present utility model, these embodiments do not describe all the details in detail, nor do they limit the utility model to the specific embodiments described. Obviously, many modifications and variations can be made according to the above description. The present specification selects and specifically describes these embodiments in order to better explain the principles and practical applications of the present utility model, so that those skilled in the art can make good use of the present utility model and its modifications based on the present utility model. The present utility model is only limited by the claims and their full scope and equivalents.

Claims

1. A packaging structure of a power module, characterized in that: include: a base plate, a first power unit and a second power unit located on the base plate, The first power unit includes a first substrate and a first three-phase full-bridge circuit located on the first substrate; The second power unit includes three second substrates and a second three-phase full-bridge circuit, and each phase circuit is located on one of the second substrates; The first substrate and the second substrate are both located on the first surface of the bottom plate, and the first power unit and the second power unit are arranged in the same housing.

2. The packaging structure of the power module according to claim 1, characterized in that: The length of the packaging structure does not exceed 300 mm.

3. The packaging structure of the power module according to claim 1, characterized in that: The length of the packaging structure does not exceed 250 mm.

4. The packaging structure of the power module according to claim 1, characterized in that: The length of the packaging structure does not exceed 200 mm.

5. The packaging structure of the power module according to claim 1, characterized in that: The width of the first substrate and the width of the second substrate are both less than 100 mm.

6. The packaging structure of the power module according to claim 1, characterized in that: The width of the first substrate and the width of the second substrate are both no more than 70 mm.

7. The packaging structure of the power module according to claim 1, characterized in that: The first power unit is used to control the power generation module, and the second power unit is used to control the inverter module.

8. The packaging structure of the power module according to claim 1, characterized in that: The first power unit is used to control the inverter module, and the second power unit is used to control the power generation module.

9. The packaging structure of the power module according to claim 1, characterized in that: The first power unit and the second power unit are both used to control the inverter module.

10. The packaging structure of the power module according to claim 1, characterized in that: The first power unit and the second power unit are both used to control the power generation module.

11. The packaging structure of the power module according to claim 1, characterized in that: It also includes a current detection device, wherein at least two AC output power terminals of the first power unit are respectively provided with a current detection device, and at least two AC output power terminals of the second power unit are respectively provided with a current detection device, and the current detection device is partially or completely embedded in the shell.

12. The packaging structure of the power module according to claim 11, characterized in that: Two AC output power terminals of the first power unit are respectively provided with current detection devices, and three AC output power terminals of the second power unit are respectively provided with current detection devices.

13. The packaging structure of the power module according to claim 12, characterized in that: Two AC output power terminals of the first power unit located at the edge of the first power unit are respectively provided with current detection devices.

14. The packaging structure of the power module according to claim 11, characterized in that: The current detection device comprises a magnetic ring, which is U-shaped and half surrounds the corresponding AC output power terminal. The U-shaped opening of the magnetic ring is arranged toward a side away from the bottom plate.

15. The packaging structure of the power module according to claim 1, characterized in that: The first power unit and the second power unit each include a DC power supply terminal and an AC output power terminal, the DC power supply terminal and the AC output power terminal are electrically connected to the first substrate and the second substrate, one end of the DC power supply terminal extends from a first side of the housing, and one end of the AC output power terminal extends from a second side of the housing, and the second side is opposite to the first side.

16. The packaging structure of the power module according to claim 15, characterized in that: The DC power supply terminal includes a positive terminal and a negative terminal, and the positive terminal and the negative terminal are stacked and arranged in a direction perpendicular to the bottom plate.

17. The packaging structure of the power module according to claim 16, characterized in that: The positive terminal of the DC power supply terminal is arranged close to one side of the bottom plate, and the positive terminal is bent, and the bent end is perpendicular to the bottom plate.

18. The packaging structure of the power module according to claim 15, characterized in that: The DC power supply terminal includes a positive terminal and a negative terminal, and the positive terminal and the negative terminal are arranged side by side along the first side.

19. The packaging structure of the power module according to claim 16 or 18, characterized in that: Each phase DC power supply positive end of the first power unit shares a positive terminal of a DC power supply terminal, and each phase DC power supply negative end of the first power unit shares a negative terminal of a DC power supply terminal.

20. The packaging structure of the power module according to claim 1, characterized in that: A heat dissipation structure is disposed on the second surface of the bottom plate, and the first surface is opposite to the second surface.

21. The packaging structure of the power module according to claim 1, characterized in that: The first power unit and the second power unit further include a plurality of signal terminals respectively. The plurality of signal terminals are perpendicular to the first substrate and the second substrate, and the signal terminals are electrically connected to the first substrate and the second substrate respectively.

22. The packaging structure of the power module according to claim 21, characterized in that: It also includes a cover plate, which is located above the first substrate and the second substrate, matches the housing, includes through holes corresponding to the signal terminals, and the top ends of the signal terminals pass through the through holes of the cover plate.

23. The packaging structure of the power module according to claim 1, characterized in that: The first three-phase full-bridge circuit and the second three-phase full-bridge circuit include an IGBT chip and an FRD chip.

24. The packaging structure of the power module according to claim 1, characterized in that: The first three-phase full-bridge circuit and the second three-phase full-bridge circuit include MOSFET chips or RC-IGBT chips.

25. The packaging structure of the power module according to claim 23, characterized in that: The first three-phase full-bridge circuit includes 6 IGBT chips and 6 FRD chips, and each phase circuit of the second three-phase full-bridge circuit includes 2 IGBT chips and 2 FRD chips.

26. The packaging structure of the power module according to claim 1, characterized in that: The first power unit and the second power unit further include a thermistor respectively to detect the temperature of the first power unit and the second power unit respectively.

27. The packaging structure of the power module according to claim 15, characterized in that: The DC power supply terminal includes a first DC power supply terminal in the first power unit, a U-phase DC power supply terminal, a V-phase DC power supply terminal and a W-phase DC power supply terminal in the second power unit; the AC output power terminal includes a first U-phase output power terminal, a first V-phase output power terminal, a first W-phase output power terminal in the first power unit, a second U-phase output power terminal, a second V-phase output power terminal and a second W-phase output power terminal in the second power unit.

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