Battery module conducting bar structure
By combining the high-temperature fusion PI film layer with the conductor in the conductive row, the damage problem caused by poor ductility of the insulating layer is solved, and the stability and electrical performance of the conductive row in the 3D bending process is achieved.
Patent Information
- Application Number
- CN202421703450.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-17
- Publication Date
- 2025-06-13
- Estimated Expiration
- 2034-07-17
AI Technical Summary
The insulating layer of the existing conductive row has poor ductility and is prone to breakage during bending and forming, resulting in failure to pass the electrical performance test.
The PI film layer is combined with the conductor through high-temperature heating and melting to form a conductive row structure that can maintain a complete conductive row during the 3D bending process.
The good ductility of the PI film layer allows the conductive row to be bent in any 3D to form various required shapes, and can pass electrical performance testing to ensure the stability of electrical performance.
Smart Images
Figure CN222980721U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of conductive bars, in particular to a conductive bar structure for a battery module. Background Technique
[0002] A power battery module is a power source that provides power for tools, mostly referring to a storage battery that provides power for electric vehicles, electric trains, electric bicycles, and golf carts. The power battery module is a core component of new energy vehicles and an important direction for future energy transformation. It is mainly different from the starting battery used for starting the automobile engine. Valve-regulated lead-acid batteries, open-type tubular lead-acid batteries, and lithium iron phosphate batteries are mostly used.
[0003] A power battery module usually consists of multiple power batteries, and these power batteries are connected in series and parallel through conductive bars. Currently, the main structure of the conductive bar includes a conductor and an insulating layer coated on the outer surface of the conductor. During production, the insulating layer is first set outside the conductor to form the body, and then the body is bent to form the required shape.
[0004] However, in the prior art, the insulating layer is generally formed by extrusion, so that the ductility of the insulating layer is poor. When the body is bent and formed, the insulating layer is very easy to be damaged and cannot pass the electrical performance test. Therefore, it is necessary to improve the current conductive bar. Content of the Utility Model
[0005] In view of this, in view of the deficiencies of the prior art, the main purpose of the present utility model is to provide a conductive bar structure for a battery module, which can effectively solve the problem that the insulating layer of the existing conductive bar is easily damaged and cannot pass the electrical performance test.
[0006] To achieve the above purpose, the present utility model adopts the following technical solutions:
[0007] A conductive bar structure for a battery module includes a body, which is formed by combining a conductor and a PI film layer; the conductor is 3D bent to form a vertically bent part, a horizontal part, a twisted part, a vertical part, and a flat bent part that are connected in sequence. A first connection part extends from the tail end of the vertically bent part, and a second connection part extends from the tail end of the flat bent part; the PI film layer is sintered on the conductor by high-temperature heating, and the PI film layer completely covers the vertically bent part, the horizontal part, the twisted part, the vertical part, and the flat bent part, and the two ends of the PI film layer are respectively exposed at the first connection part and the second connection part.
[0008] As a preferred solution, the conductor is made of copper or aluminum.
[0009] As a preferred solution, the first connection part extends horizontally along the length direction of the vertically bent part, and a first fixing hole is opened on the first connection part for external fixed connection and conduction.
[0010] As a preferred solution, the second connecting portion is bent at the end of the flat bending portion and extends horizontally, and a second fixing hole is formed in the second connecting portion for external fixed connection and conduction.
[0011] As a preferred solution, the PI film layer is formed by high-temperature heating and sintering of a PI film tape. The PI film tape is inclined and wound around the outer surface of the conductor at an angle of 30-60°, and overlaps by 1-2 mm, so that when cut at any position, the PI film layer 20 does not loosen and is closely adhered to the conductor 10.
[0012] As a preferred solution, the thickness of the PI film layer is 0.1-0.3 mm, which can better pass the electrical performance test, can withstand a temperature of 250 °C, and the flame retardant grade is UL94-VO.
[0013] Compared with the prior art, the present utility model has obvious advantages and beneficial effects. Specifically, as can be seen from the above technical solutions:
[0014] In this product, the PI film layer is sintered on the conductor by high-temperature heating. By virtue of the good extensibility of the PI film layer, the body can be bent arbitrarily in 3D to form various required shapes to meet the usage requirements. The PI film layer is not easily damaged and can well pass the electrical performance test to meet the usage requirements.
[0015] To more clearly illustrate the structural features and functions of the present utility model, the present utility model will be described in detail below with reference to the accompanying drawings and specific embodiments. Description of the Drawings
[0016] Figure 1 is a perspective schematic diagram of a preferred embodiment of the present utility model;
[0017] Figure 2 is a perspective schematic diagram of another angle of a preferred embodiment of the present utility model;
[0018] Figure 3 is a schematic diagram of the manufacturing state of a preferred embodiment of the present utility model.
[0019] Description of the Reference Numerals in the Drawings:
[0020] 10. Conductor 11. Vertical bending portion
[0021] 12. Horizontal portion 13. Twisting bending portion
[0022] 14. Vertical portion 15. Flat bending portion
[0023] 16. First connecting portion 17. Second connecting portion
[0024] 101. First fixing hole 102. Second fixing hole
[0025] 20. PI film layer 21. PI film strip. Detailed implementation manner
[0026] Please refer to Figures 1 to 3 As shown, it shows the specific structure of the preferred embodiment of the present utility model, including a body, which is formed by combining a conductor 10 and a PI film layer 20.
[0027] The conductor 10 is formed by 3D bending into a vertical bending part 11, a horizontal part 12, a twisted bending part 13, a vertical part 14 and a flat bending part 15 that are connected in sequence. The tail end of the vertical bending part 11 extends out a first connecting part 16, and the tail end of the flat bending part 15 extends out a second connecting part 17. In this embodiment, the conductor 10 is made of copper or aluminum, which is not limited. The first connecting part 16 extends horizontally along the length direction of the vertical bending part 11, and a first fixing hole 101 is opened on the first connecting part 16 for external fixed connection and conduction. The second connecting part 17 is bent at the tail end of the flat bending part 15 and extends horizontally, and a second fixing hole 102 is opened on the second connecting part 17 for external fixed connection and conduction, and the horizontal extension direction of the second connecting part 17 is perpendicular to the horizontal extension direction of the first connecting part 16.
[0028] The PI film layer 20 is sintered on the conductor 10 by high-temperature heating. The PI film layer 20 completely covers the vertical bending part 11, the horizontal part 12, the twisted bending part 13, the vertical part 14 and the flat bending part 15. The first connecting part 16 and the second connecting part 17 are respectively exposed at both ends of the PI film layer 20. The PI film layer 20 is formed by sintering a PI film strip 21 by high-temperature heating. The PI film strip 21 is inclined and wound around the outer surface of the conductor 10 at an angle of 30-60°, and overlaps by 1-2 mm, so that when cut at any position, the PI film layer 20 does not loosen and adheres tightly to the conductor 10. The thickness of the PI film layer is 0.1-0.3 mm, which can better pass the electrical performance test, can withstand a temperature of 250 °C, and the flame retardant grade is UL94-VO.
[0029] The manufacturing process of this embodiment is described in detail as follows:
[0030] First, take a straight and unbent conductor 10, and then wrap a PI film tape 21 around the outer surface of the conductor 10. Since the PI film tape 21 itself has F46 glue, after wrapping, heat the conductor 10 to 180 - 200 °C through a high-frequency device, so that the PI film tape 21 fuses and adheres to the outer surface of the conductor 10 to form a PI film layer 20. At this time, the PI film layer 20 and the conductor 10 are combined together to form a body. Then, perform 3D bending on the body, and form a vertical bending part 11, a horizontal part 12, a twisted bending part 13, a vertical part 14, and a flat bending part 15 through 3D bending. The PI film layer 20 on the surfaces of the vertical bending part 11, the horizontal part 12, the twisted bending part 13, the vertical part 14, and the flat bending part 15 has good extensibility and can pass the electrical performance test. During the test, apply a voltage of DC1500V or AC1000V to the PI film layer 20 at any place of the body, and the insulation resistance is greater than 100 MΩ.
[0031] The design focus of the present utility model lies in that: in this product, the PI film layer is fused to the conductor through high-temperature heating. By utilizing the good extensibility of the PI film layer, the body can be subjected to arbitrary 3D bending to form various required shapes to meet the usage requirements. The PI film layer is not easily damaged and can well pass the electrical performance test to meet the usage requirements.
[0032] The above is only a preferred embodiment of the present utility model, and does not impose any limitation on the technical scope of the present utility model. Therefore, any minor modification, equivalent change, and modification made to the above embodiments based on the technical essence of the present utility model still fall within the scope of the technical solution of the present utility model.
Claims
1. A battery module conductive bar structure, characterized in that: The invention comprises a main body, which is formed by combining a conductor and a PI film layer; the conductor is formed by 3D bending to have a vertical bending part, a horizontal part, a twisted bending part, a vertical part and a flat bending part which are connected in sequence, a first connecting part extends from the tail end of the vertical bending part, and a second connecting part extends from the tail end of the flat bending part; the PI film layer is sintered on the conductor by high-temperature heating, and the PI film layer completely covers the vertical bending part, the horizontal part, the twisted bending part, the vertical part and the flat bending part, and the first connecting part and the second connecting part are respectively exposed at both ends of the PI film layer.
2. The battery module conductive bar structure according to claim 1, characterized in that: The conductor is made of copper or aluminum.
3. The battery module conductive bar structure according to claim 1, characterized in that: The first connection portion extends horizontally along the length direction of the vertical bending portion, and a first fixing hole is formed on the first connection portion.
4. The battery module conductive bar structure according to claim 1, characterized in that: The second connection portion is bent at the tail end of the flat bent portion and extends horizontally, and a second fixing hole is formed on the second connection portion.
5. The battery module conductive bar structure according to claim 1, characterized in that: The PI film layer is formed by high-temperature heating and sintering of a PI film tape, and the PI film tape is wrapped around the outer surface of the conductor at an angle of 30-60 degrees and overlapped by 1-2 mm.
6. The battery module conductive bar structure according to claim 1, characterized in that: The thickness of the PI film layer is 0.1-0.3 mm.