Mounting base and computing device

Abstract

The embodiment of the utility model provides a mounting seat and computing equipment. The mounting seat comprises a mounting seat body and a plurality of pins, the plurality of pins are arranged in the mounting seat body at intervals, each pin comprises a first pin section and a second pin section, the second pin section is mounted in the mounting seat body, and the first pin section comprises a transmission section and a connection end connected with the transmission section; one end, far away from the connecting end, of the transmission section is connected with the part, exposed out of the mounting seat body, of the second pin section, an insulating layer is arranged on the outer surface of the transmission section, and the connecting end is used for being electrically connected with a component. According to the mounting base provided by the embodiment of the invention, the impedance of the mounting base is relatively small, so that the signal transmission rate and stability in the computing equipment can be improved.

Description

Technical Field

[0001] Embodiments of the present application relate to the technical field of computing devices, and particularly to a mounting base and a computing device. Background Art

[0002] With the development of big data, cloud computing, and AI (Artificial Intelligence), the computing power density of computing devices is increasing.

[0003] A circuit board and a processor are included in a computing device. As the computing power density of the processor increases, the size of the processor becomes larger and the number of pins becomes more, making it inconvenient to directly solder the processor onto the circuit board. The processor can be mounted on the circuit board through a processor support. Specifically, the processor support is disposed on the circuit board and is electrically connected to the circuit board. The processor is located on a side of the processor support away from the circuit board and is electrically connected to the processor support. The processor is mounted on the circuit board through the processor support and the processor is electrically connected to the circuit board through the processor support. When a signal is transmitted between the processor and the circuit board, the transmission link is from the processor to the processor support and then to the circuit board, or from the circuit board to the processor support and then to the processor.

[0004] The impedance of some regions in the processor support is relatively large. Therefore, the impedance on the transmission link will be increased. Summary of the Utility Model

[0005] Embodiments of the present application provide a mounting base and a computing device. The impedance of the mounting base is relatively small. Therefore, the transmission rate and stability of signals in the computing device can be improved.

[0006] In a first aspect, an embodiment of the present application provides a mounting base, including: a mounting base body and a plurality of pins. The plurality of pins are arranged at intervals in the mounting base body. Each pin includes a first pin segment and a second pin segment. The second pin segment is mounted in the mounting base body. The first pin segment includes a transmission segment and a connection end connected to the transmission segment. One end of the transmission segment away from the connection end is connected to a part of the second pin segment exposed from the mounting base body. An insulating layer is provided on an outer surface of the transmission segment. The connection end is used for electrically connecting to a component.

[0007] For the mounting base provided by the embodiment of the present application, by providing the mounting base body and the plurality of pins, the plurality of pins are arranged at intervals in the mounting base body. Each pin includes a first pin segment and a second pin segment. The second pin segment is inserted into the mounting base body. The first pin segment includes a transmission segment and a connection end. The transmission segment is connected to the second pin segment. An insulating layer is provided on the outer surface of the transmission segment. The connection end is used for electrically connecting to a component. By wrapping the insulating layer on the outer surface of the transmission segment, the impedance when the signal is transmitted in the transmission segment can be reduced. Therefore, the transmission rate and stability of signals in the computing device can be improved.

[0008] In a possible implementation manner, for the mounting base provided in the embodiments of the present application, the relative permittivity of the insulating layer is greater than or equal to 2 and less than or equal to 7. The relative permittivity of the insulating layer is greater than that of dry air by 1. When the relative permittivity of the insulating layer is too large, the impedance of the first pin segment will be less than that of the pin segment, resulting in a still large impedance difference in the entire transmission link. Therefore, the relative permittivity of the insulating layer can be set to be greater than or equal to 2 and less than or equal to 7.

[0009] In a possible implementation manner, for the mounting base provided in the embodiments of the present application, the thickness of the insulating layer is 0.5 - 2 times the thickness of the transmission segment. When the thickness of the insulating layer is small, the effect of reducing the impedance is small. When the thickness of the insulating layer is large, the elastic deformation amount of the transmission segment will be reduced. Therefore, when coating the insulating layer, the coating thickness can be controlled to be 0.5 - 2 times the thickness of the transmission segment.

[0010] In a possible implementation manner, for the mounting base provided in the embodiments of the present application, the insulating layer is made of fluoride or plastic material. Fluoride or plastic material also has good anti - corrosion, waterproof, temperature - resistant and other properties. Thus, the insulating layer can also protect the transmission segment.

[0011] In a possible implementation manner, for the mounting base provided in the embodiments of the present application, the material of the insulating layer is the same as that of the mounting base body. Thus, the impedance values of the transmission segment and the second pin segment can be made relatively close to avoid impedance mutation when the signal is transmitted in the entire transmission link. Impedance mutation will cause some signals to be reflected back to the signal source end, thereby reducing the stability of signal transmission.

[0012] In a possible implementation manner, for the mounting base provided in the embodiments of the present application, an adhesive layer is provided between the outer surface of the insulating layer and the first pin segment. The adhesive layer can reliably bond the insulating layer to the transmission segment to prevent the insulating layer from falling off.

[0013] In a possible implementation manner, for the mounting base provided in the embodiments of the present application, the mounting base is a processor mounting base. The mounting base body includes a first surface and a second surface. The parts of the first pin segment and the second pin segment exposed on the second surface are connected. The processor mounting base further includes a first contact terminal, and the first contact terminal is electrically connected to the connection end.

[0014] In a possible implementation manner, for the mounting base provided in the embodiments of the present application, the processor mounting base further includes a second contact terminal. The second contact terminal is located on one side of the second surface, and the second pin segment extends to the second surface to be electrically connected to the second contact terminal.

[0015] In a possible implementation, for the mounting base provided in the embodiments of the present application, the processor mounting base further includes a pressing plate. The pressing plate and the first contact terminal are used to clamp the opposite two sides of the processor. The first pin segment is elastically deformable, and the first contact terminal is used to be reliably electrically connected to the processor under the action of the elastic force of the first pin segment.

[0016] In a possible implementation, for the mounting base provided in the embodiments of the present application, the mounting base is a memory mounting base. The mounting base body includes a third surface and a fourth surface. The exposed part of the third surface of the first pin segment is connected to the second pin segment. The transmission segment is elastically deformable, and the two opposite transmission segments are used to clamp the opposite two surfaces of the memory so that the connection end is electrically connected to the memory.

[0017] In a possible implementation, for the mounting base provided in the embodiments of the present application, a part of the second pin segment is exposed on the fourth surface for electrically connecting to the circuit board.

[0018] In a second aspect, the embodiments of the present application further provide a computing device, including a circuit board, components, and the above-mentioned mounting base. The mounting base is arranged on the circuit board, and the components are arranged on the mounting base; the connection end in the mounting base is electrically connected to the components, and the second pin segment in the mounting base is electrically connected to the circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 is a schematic structural diagram of the computing device provided in the embodiments of the present application;

[0020] Figure 2 is Figure 1 a side view of;

[0021] Figure 3 is a schematic structural diagram of the mounting base provided in the embodiments of the present application;

[0022] Figure 4 is a usage state diagram of the mounting base provided in the embodiments of the present application;

[0023] Figure 5 is Figure 4 a partial schematic diagram of;

[0024] Figure 6 is another schematic structural diagram of the mounting base provided in the embodiments of the present application;

[0025] Figure 7 is another usage state diagram of the mounting base provided in the embodiments of the present application;

[0026] Figure 8 is a schematic structural diagram of the processor;

[0027] Figure 9 is yet another schematic structural diagram of the mounting base provided in the embodiments of the present application;

[0028] Figure 10 It is a schematic structural diagram of the memory;

[0029] Figure 11 It is a schematic structural diagram of the pins in the mounting base provided by the embodiment of the present application;

[0030] Figure 12a It is an impedance simulation diagram of the transmission link when using the mounting base in the related art;

[0031] Figure 12b It is the impedance simulation value of the transmission link after using the mounting base provided by the embodiment of the present application;

[0032] Figure 13 It is a cross-sectional view of the transmission section in the mounting base provided by the embodiment of the present application.

[0033] Explanation of reference numerals:

[0034] 10, computing device;

[0035] 100, circuit board;

[0036] 110, second contact;

[0037] 120, fourth contact;

[0038] 200, component; 200a, processor; 200b, memory;

[0039] 210, first contact;

[0040] 220, third contact;

[0041] 300, mounting base; 300a, processor mounting base; 300b, memory mounting base;

[0042] 310, mounting base body; 310a, first surface; 310b, second surface; 310c, third surface; 310d, fourth surface;

[0043] 311, limiting structure;

[0044] 312, first device;

[0045] 320, pin;

[0046] 321, first pin segment; 3211, transmission segment; 3212, connection end;

[0047] 322, second pin segment;

[0048] 323, insulating layer;

[0049] 330, first contact terminal;

[0050] 340. Second contact terminal;

[0051] 350. Pressure plate;

[0052] 360. Slot;

[0053] D1. First thickness;

[0054] D2. Second thickness;

[0055] D3. Third thickness;

[0056] X. First direction;

[0057] Y. Second direction;

[0058] Z. Third direction. Detailed implementation manners

[0059] The terms used in the implementation manners part of this application are only for explaining the specific embodiments of this application, rather than aiming to limit this application. The implementation manners of the embodiments of this application will be described in detail below with reference to the accompanying drawings.

[0060] The embodiments of this application provide a mounting base and a computing device. The mounting base has a small impedance, which can improve the signal transmission rate and stability.

[0061] Figure 1 is a schematic structural diagram of the computing device provided by the embodiment of this application; Figure 2 is Figure 1 side view of.

[0062] See Figure 1 and Figure 2 As shown, the computing device 10 includes a circuit board 100, components 200, and a mounting base 300. The mounting base 300 is disposed on the circuit board 100, and the components 200 are disposed on the mounting base 300.

[0063] The number of components 200 can be multiple. The components 200 can be a processor 200a, the components 200 can also be a memory 200b, and the components 200 can also be other components. For example, the components 200 can be a PCIE card electrically connected to the circuit board 100. In Figure 1 and Figure 2 a processor 200a and a memory 200b are schematically shown. The circuit board 100 is used to support each component 200 in the computing device 10, and each component 200 can be electrically connected through the internal traces of the circuit board 100.

[0064] The mounting base 300 can be a processor mounting base 300a or a memory mounting base 300b. The processor mounting base 300a is disposed on the circuit board 100. The processor 200a is disposed on the processor mounting base 300a and is electrically connected to the circuit board 100 through the processor mounting base 300a. The memory mounting base 300b is disposed on the circuit board 100. The memory 200b is disposed on the memory mounting base 300b and is electrically connected to the circuit board 100 through the memory mounting base 300b.

[0065] Figure 3 It is a schematic structural diagram of the mounting base provided by the embodiment of the present application; Figure 4 It is a diagram of the usage state of the mounting base provided by the embodiment of the present application; Figure 5 is Figure 4 partial schematic diagram of; Figure 6 It is another schematic structural diagram of the mounting base provided by the embodiment of the present application; Figure 7 It is another usage state diagram of the mounting base provided by the embodiment of the present application. Among them, Figure 3 is a schematic structural diagram of the processor mounting base 300a, Figure 6 is a schematic structural diagram of the memory mounting base 300b.

[0066] Refer to Figures 3 to 7 As shown, the mounting base 300 provided by the embodiment of the present application includes a mounting base body 310 and a plurality of pins 320. The plurality of pins 320 are arranged at intervals in the mounting base body 310. The pin 320 includes a first pin segment 321 and a second pin segment 322. The second pin segment 322 is inserted into the mounting base body 310 to mount the second pin segment 322 in the mounting base body 310. The first pin segment 321 includes a transmission segment 3211 and a connection end 3212 connected to the transmission segment 3211. One end of the transmission segment 3211 far from the connection end 3212 is connected to the part of the second pin segment 322 exposed from the mounting base body 310. An insulating layer 323 is disposed on the outer surface of the transmission segment 3211. The connection end 3212 is used for electrically connecting to the component 200.

[0067] Among them, the mounting base 300 can be a processor mounting base 300a, the mounting base 300 can also be a memory mounting base 300b, and the mounting base 300 can also be a mounting base for mounting other devices.

[0068] First, with reference to Figures 3 to 5 the structure of the processor mounting base 300a will be described.

[0069] The processor mounting socket 300a includes a first surface 310a and a second surface 310b. The first pin segment 321 is connected to the second pin segment 322 exposed from the first surface 310a. The processor mounting socket 300a also includes a first contact terminal 330 which is electrically connected to the connection end 3212.

[0070] It should be noted that the portion of the second lead segment 322 exposed from the first surface 310 a is flush with the first surface 310 a .

[0071] Specifically, the mounting seat body 310 may be a base made of insulating material, and the shape of the mounting seat body 310 may be adapted to the shape of the processor 200a. Figure 3 and Figure 4 The mounting seat body 310 shown in FIG. 3 is a flat rectangular parallelepiped, and the mounting seat body 310 includes a first direction X, a second direction Y and a third direction Z.

[0072] exist Figures 3 to 5 In the embodiment, the first surface 310 a and the second surface 310 b of the mounting seat body 310 are arranged opposite to each other along the third direction Z, the first surface 310 a faces the processor 200 a , and the second surface 310 b faces the circuit board 100 .

[0073] The mounting seat body 310 is used to support a plurality of pins 320. The plurality of pins 320 are arranged on the mounting seat body 310 at intervals. The plurality of pins 320 are separated by the mounting seat body 310, and the plurality of pins 320 are not conductive. The portion of the pin 320 inserted into the mounting seat body 310 is the second pin segment 322, and the portion of the pin 320 extending from the mounting seat body 310 is the first pin segment 321. Specifically, the mounting seat body 310 can be formed by injection molding, and the second pin segment 322 is integrally formed with the mounting seat body 310 during injection molding. It should be noted that the first pin segment 321 and the second pin segment 322 can be an integral structure.

[0074] The first pin segment 321 extends from the first surface 310 a and includes a transmission segment 3211 and a connection end 3212 . The transmission segment 3211 is connected to the second pin segment 322 . The connection end 3212 may be disposed at one end of the first pin segment 321 away from the second pin segment 322 .

[0075] Figure 8 It is a schematic diagram of the structure of the processor. Figure 8 3 shows the side of the processor 200a facing the mounting seat body 310.

[0076] See also Figure 8 As shown, the processor 200a has a plurality of first contacts 210, and the plurality of first contacts 210 are arranged at intervals. Figure 4 andFigure 5 As shown, the first contacts 210 are electrically connected to the connection terminals 3212 in a one-to-one correspondence, thereby electrically connecting the processor 200 a to the first lead segments 321 in a one-to-one correspondence.

[0077] The connection end 3212 may be provided with a first contact terminal 330, and the connection end 3212 is electrically connected to the first contact point 210 on the processor 200a through the first contact terminal 330. Specifically, in one embodiment, the first contact terminal 330 may be a surface of the connection end 3212 to increase the contact area between the connection end 3212 and the first contact point 210 on the processor 200a. In another embodiment, the first contact terminal 330 may be a protrusion on the connection end 3212 to facilitate electrical connection with the contact point 210 on the processor 200a.

[0078] Please continue to see Figure 4 and Figure 5 As shown, the processor mounting socket 300 a further includes a second contact terminal 340 , which is located on one side of the second surface 310 b , and the second lead segment 322 extends to the second surface 310 b to be electrically connected to the second contact terminal 340 .

[0079] The second pin segment 322 extends away from the first pin segment 321 to the second surface 310b in the mounting seat body 310, one end of the second pin segment 322 is electrically connected to the first pin segment 321, and one end of the second pin segment 322 facing the second surface 310b is electrically connected to the second contact terminal 340, and the second contact terminal 340 is arranged at intervals on the second surface 310b. The board surface of the circuit board 100 has a second contact point 110, and the second contact terminal 340 is electrically connected to the second contact point 110 on the circuit board 100 in a one-to-one correspondence, so as to electrically connect the second pin segment 322 to the circuit board 100.

[0080] Thus, the processor 200 a is electrically connected to the circuit board 100 via the first contact point 210 , the first contact terminal 330 , the first lead segment 321 , the second lead segment 322 , the second contact terminal 340 and the second contact point 110 in sequence.

[0081] The second contact terminal 340 may be a solder point, the second contact 110 may be a solder pad, and the second contact terminal 340 and the second contact 110 may be electrically connected by welding. The second contact terminal 340 may be a pin, the second contact 110 may be a socket, and the second contact terminal 340 and the second contact 110 may be electrically connected by crimping.

[0082] Next, the electrical connection between the first contact terminal 330 and the first contact point 210 will be described.

[0083] For details, please refer to Figure 3As shown, the processor mounting base 300a further includes a pressing plate 350. The pressing plate 350 and the first contact terminal 330 are used to clamp opposite sides of the processor 200a. The first pin segment 321 is elastically deformable, and the first contact terminal 330 is used to electrically connect to the processor 200a under the action of the elastic force of the first pin segment 321.

[0084] Specifically, one end of the pressing plate 350 is rotatably connected to the mounting base body 310. When placing the processor 200a in the processor mounting base 300a, first open the pressing plate 350, place the processor 200a in the mounting base body 310, with the side of the processor 200a having the first contact 210 facing the first side 310a of the mounting base body 310, so that the first contacts 210 on the processor 200a are aligned with the first contact terminals 330 on the mounting base body 310 one by one.

[0085] Then press down the pressing plate 350. The pressing plate 350 abuts against the side of the processor 200a where the first contact 210 is not provided. Under the pressure of the pressing plate 350, the first pin segment 321 undergoes slight elastic deformation. Under the action of the rebounding force of the first pin segment 321, the first contact terminal 330 can reliably contact the first contact 210 on the processor 200a, so that a reliable electrical connection is established between the first contact terminal 330 and the first contact 210.

[0086] When it is necessary to repair or replace the processor 200a, open the pressing plate 350 and take out the processor 200a from the mounting base 300. Thus, by providing the pressing plate 350 and through the elastic deformation of the first pin segment 321, while ensuring a reliable electrical connection between the processor 200a and the mounting base 300, it is also convenient for the repair or replacement of the processor 200a.

[0087] Please continue to refer to Figure 3 As shown, the mounting base body 310 further has a first device 312. The first device 312 can be a resistor or a capacitor. During signal transmission, the capacitor and the resistor can play a filtering role. The first contacts 210 are not provided at the positions corresponding to the area of the first device 312 on the side of the processor 200a facing the mounting base body 310.

[0088] Figure 9 This is another structural schematic diagram of the mounting base provided by the embodiment of the present application.

[0089] Refer to Figure 9 As shown, on the basis of the embodiment shown in Figure 4 the mounting base body 310 further includes a limiting structure 311. The limiting structure 311 is used to limit the processor 200a to align the first contacts 210 with the first contact terminals 330 one by one. In Figure 9In the illustrated view, the limiting structure 311 partially blocks the first pin segment 321, or the first pin segment blocks a portion of the limiting structure 311. In actual products, the limiting structure 311 and the first pin segment 321 are staggered. Figure 3 The grid structure in the middle mounting seat body 310 , in which the first pin segment 321 is located, can limit the first contact 210 so as to align the first contact 210 with the connection end 3212 .

[0090] As described above, the processor 200a is electrically connected to the circuit board 100 via the first contact 210, the first contact terminal 330, the first pin segment 321, the second pin segment 322, the second contact terminal 340 and the second contact 110 in sequence, and the signal transmission link is the processor 200a, the first pin segment 321, the second pin segment 322 and the circuit board 100 or the circuit board 100, the second pin segment 322, the first pin segment 321 and the processor 200a.

[0091] The transmission section 3211 in the first pin section 321 is exposed to the air, and the surface of the second pin section 322 is wrapped by the mounting seat body 310. The relative dielectric constant of air is smaller than the relative dielectric constant of the mounting seat body 310, and the impedance is inversely proportional to the relative dielectric constant. The larger the relative dielectric constant, the smaller the impedance. Therefore, the impedance of the signal transmitted in the transmission section 3211 is greater than the impedance transmitted in the second pin section 322, thereby making the impedance of the entire transmission link larger. The transmission section 3211 is elastically deformable, so the transmission section 3211 cannot be wrapped by the mounting seat body 310. The embodiment of the present application reduces the impedance of the signal when it is transmitted in the first pin section 321 by wrapping an insulating layer 323 on the transmission section 3211. In addition, the insulating layer 323 can also be wrapped on the portion of the connection end 3212 that does not need to contact the first contact 210 of the processor 200a. For example, in Figure 4 and Figure 5 In the embodiment, the region of the connection end 3212 where the first contact terminal 330 is not provided is also covered with the insulating layer 323. Thus, the outer surface of the first lead segment 321 can be covered by the insulating layer 323 as much as possible, further reducing the impedance of the signal when it is transmitted in the first lead segment 321.

[0092] Please continue to see Figure 4As shown, an insulating substance can be coated on the outer surface of the transmission section 3211 on the processor mounting base 300a by spraying, printing or manual brushing to form an insulating layer 323. The insulating layer 323 can be a fluoride or a plastic material. Therefore, the insulating layer 323 has a certain flexibility and has little influence on the elastic deformation of the transmission section 3211. It should be noted that when coating the insulating substance on the transmission section 3211, it is necessary to avoid coating the insulating layer 323 on the connection end 3212. During specific coating, a barrier can be pasted at the position of the first contact terminal 330 first, and then the barrier can be removed after the coating is completed. Fluoride or plastic materials also have good anti-corrosion, waterproof, temperature-resistant and other properties. Thus, the insulating layer 323 can also protect the transmission section 3211.

[0093] Next, the specific structure of the memory mounting base 300b will be described.

[0094] Refer to Figure 6 and Figure 7 As shown, the mounting base body 310 of the memory mounting base 300b includes a third surface 310c and a fourth surface 310d. The exposed part of the first pin section 321 on the third surface 310c is connected to the exposed part of the second pin section 322. The transmission section 3211 can be elastically deformed, and the two opposite transmission sections 3211 are used to clamp the two opposite surfaces of the memory 200b so that the connection end 3212 is electrically connected to the memory 200b.

[0095] In some embodiments, the exposed part of the second pin section 322 on the third surface 310c is flush with the third surface 310c.

[0096] Figure 10 It is a schematic structural diagram of the memory.

[0097] Refer to Figure 10 As shown, the memory 200b includes two opposite surfaces along its thickness direction. There are third contacts 220 on the two surfaces of the memory 200b (only one surface of the third contacts 220 is shown in Figure 10 and the third contacts 220 on the other surface are blocked). The third contacts 220 can be gold fingers. The memory mounting base 300b has a slot 360. The two side walls of the slot 360 are the third surface 310c. There are two relatively arranged pins 320 on the two side walls. The part of the pin 320 extending out of the third surface 310c is the first pin section 321, and the part of the pin 320 inserted into the mounting base body 310 is the second pin section 322. The distance between the two opposite first pin sections 321 is slightly less than the thickness of the memory 200b.

[0098] When the memory 200b is inserted into the slot 360, the two opposite faces of the memory 200b in the thickness direction correspond to the two first pin segments 321 one by one. The two first pin segments 321 are in contact with the third contacts 220 on the two faces of the memory 200b, and the two first pin segments 321 undergo slight elastic deformation. Under the action of the restoring force of the first pin segments 321, reliable contact can be achieved between the ends of the first pin segments 321 and the third contacts 220 on the memory 200b, so that a reliable electrical connection is established between the first pin segments 321 and the third contacts 220 to electrically connect the memory 200b and the first pin segments 321.

[0099] Please continue to refer to Figure 6 and Figure 7 As shown, a part of the second pin segment 322 is exposed on the fourth face 310d for electrical connection to the circuit board 100.

[0100] The fourth face 310d is the side of the memory mount 300b facing the circuit board 100. The end of the second pin segment 322 extends from the fourth face 310d. The circuit board 100 has a fourth contact 120, and the second pin segment 322 is electrically connected to the fourth contact 120 to electrically connect the second pin segment 322 and the circuit board 100. The fourth contact 120 can be a jack, and the end of the second pin segment 322 and the fourth contact 120 can be electrically connected by crimping. The end of the second pin segment 322 is a solder joint, the fourth contact 120 can be a solder pad, and the end of the second pin segment 322 can also be soldered to the fourth contact 120.

[0101] Of course, in other embodiments, the part of the second pin segment 322 exposed on the fourth face 310d can also be that the end face of the second pin segment 322 is exposed on the fourth face 310d. The end face of the second pin segment 322 can be flush with the fourth face 310d or protrude from the fourth face 310d.

[0102] Thus, the memory 200b is electrically connected to the circuit board 100 through the first pin segments 321, the second pin segments 322, and the fourth contacts 120 in sequence. The signal transmission link is the memory 200b, the first pin segments 321, the second pin segments 322, and the circuit board 100 or the circuit board 100, the first pin segments 321, the second pin segments 322, and the memory 200b.

[0103] The transmission segment 3211 is exposed to the air, and the surface of the second pin segment 322 is wrapped by the memory mounting base 300b. The relative permittivity of the air is less than that of the mounting base body 310. The impedance is inversely proportional to the relative permittivity. The larger the relative permittivity, the smaller the impedance. Therefore, the impedance of the signal transmitted in the transmission segment 3211 is greater than that transmitted in the second pin segment 322. As a result, the impedance of the entire transmission link will be relatively large. And the transmission segment 3211 can be elastically deformed, so the transmission segment 3211 cannot be wrapped by the mounting base body 310. In the embodiment of the present application, an insulating layer 323 is wrapped on the transmission segment 3211 to reduce the impedance of the signal when it is transmitted in the transmission segment 3211. In addition, please continue to refer to Figure 6 and Figure 7 In, an insulating layer 323 can also be wrapped on the part of the connection end 3212 that does not need to contact the third contact 220 of the memory 200b. Thus, the outer surface of the first pin segment 321 can be wrapped by the insulating layer 323 as much as possible, further reducing the impedance of the signal when it is transmitted in the first pin segment 321.

[0104] Specifically, an insulating substance can be coated on the outer surface of the transmission segment 3211 on the memory mounting base 300b by spraying, printing or manual brushing to form the insulating layer 323. It should be noted that when coating the insulating substance on the transmission segment 3211, it is necessary to avoid coating the insulating layer 323 on the connection end 3212. During specific coating, a barrier can be pasted at the position of the connection end 3212, and after the coating is completed, the barrier can be removed.

[0105] The processor 200a transfers the data to be operated to the memory 200b for operation, and when the operation is completed, the processor 200a transmits the result. That is to say, frequent signal transmission is required between the processor 200a and the memory 200b. The processor mounting base 300a and the memory mounting base 300b are electrically connected through the internal traces of the circuit board 100. Insulating layers 323 are coated on the transmission segments 3211 of both the processor mounting base 300a and the memory mounting base 300b, so that when the processor 200a and the memory 200b perform signal transmission, the impedance on the transmission link is relatively small.

[0106] Figure 11 is a schematic structural diagram of the pins in the mounting base provided by the embodiment of the present application; Figure 12a is an impedance simulation diagram of the transmission link when using the mounting base in the related art; Figure 12b is the impedance simulation value of the transmission link after using the mounting base provided by the embodiment of the present application. Among them, Figure 11 also shows the second contact terminal 340.

[0107] In Figure 12a andFigure 12b In this figure, the abscissa represents the time period during simulation, the ordinate represents the impedance value, m1 represents the impedance value at the first contact terminal 330, m2 represents the impedance value at the first pin segment 321, m3 and m4 represent the impedance values at different points of the second pin segment 322, and m5 represents the impedance value at the second contact terminal 340.

[0108] See Figure 12a As shown, in the related art, the impedance value m2 at the transmission segment 3211 is about 160, and the impedance values m1 at the connection end 3212, m3 and m4 at the second pin segment 322, and m5 at the second contact terminal 340 are in the range of about 70 - 100. It can be seen that the impedance value at the transmission segment 3211 is greater than the impedance values at other positions.

[0109] See Figure 12b As shown, the impedance value m2 at the transmission segment 3211 is about 80, and the impedance values m1 at the connection end 3212, m3 and m4 at the second pin segment 322, and m5 at the second contact terminal 340 are in the range of about 70 - 100. That is to say, by providing the insulating layer 323 on the outer surface of the transmission segment 3211, the impedance value of the transmission segment 3211 can be reduced.

[0110] The mounting base 300 provided by the embodiment of the present application includes a mounting base body 310 and a plurality of pins 320. The plurality of pins 320 are arranged at intervals in the mounting base body 310. The pins 320 include a first pin segment 321 and a second pin segment 322. The second pin segment 322 is inserted into the mounting base body 310. The first pin segment 321 includes a transmission segment 3211 and a connection end 3212. The transmission segment 3211 is connected to the second pin segment 322. The outer surface of the transmission segment 3211 is provided with an insulating layer 323. The connection end 3212 is used for electrically connecting to the component 200. By wrapping the insulating layer 323 on the outer surface of the transmission segment 3211, the impedance of the signal during transmission in the transmission segment 3211 can be reduced.

[0111] In a possible implementation manner, the relative permittivity of the insulating layer 323 is greater than or equal to 2 and less than or equal to 7.

[0112] The relative permittivity of dry air is 1. Therefore, when selecting an insulating material to form the insulating layer 323, the relative permittivity of the insulating material needs to be greater than 1, so that the permittivity of the insulating layer 323 formed by the insulating material is greater than 1. When the relative permittivity of the insulating layer 323 is too large, the impedance of the first pin segment 321 will be less than the impedance of the pin segment 322, resulting in a relatively large impedance difference in the entire transmission link. Therefore, the relative permittivity of the insulating layer 323 can be set to be greater than or equal to 2 and less than or equal to 7. For example, the relative permittivity of the insulating layer 323 can be 2, 3, 4, 5, 6, or 7.

[0113] In a possible implementation, the thickness of the insulating layer 323 is 0.5 - 2 times the thickness of the transmission segment 3211.

[0114] Specifically, the cross-section of the transmission segment 3211 can be circular, elliptical, or polygonal. Hereinafter, the case where the cross-section of the transmission segment 3211 is rectangular will be described.

[0115] Figure 13 It is a cross-sectional view of the transmission segment in the mounting base provided by the embodiment of the present application.

[0116] See Figure 13 As shown, the thickness of the transmission segment 3211 refers to the size of the short side of the rectangle, which is shown as the first thickness D1, and the thickness of the insulating layer 323 is the second thickness D2. When the transmission segment 3211 is circular, the thickness of the transmission segment 3211 refers to the diameter of the circle. When the transmission segment 3211 is elliptical, the thickness of the transmission segment 3211 refers to the length of the minor axis of the ellipse.

[0117] When the thickness of the insulating layer 323 is small, the effect of reducing the impedance is small. When the thickness of the insulating layer 323 is large, the elastic deformation amount of the transmission segment 3211 will be reduced. Therefore, when coating the insulating layer 323, the coated second thickness D2 can be controlled to be 0.5 - 2 times the first thickness D1.

[0118] In addition, the relationship between the impedance value and the first thickness D1, the second thickness D2, and the relative permittivity can be expressed by the following formula:

[0119]

[0120] Where, Z 0 is the impedance value, ε is the permittivity, D3 is the third thickness, and the third thickness D3 is the total thickness of the cross-section of the first pin segment 321 after coating the insulating layer 323, D3 = 2D2 + D1. It can be seen that Z 0 has an inverse relationship with ε, and at the same time, the ratio of the third thickness D3 to the first thickness D1 can be used as a factor to affect the impedance value Z 0 .

[0121] In a possible implementation manner, the material of the insulating layer 323 is the same as that of the mounting base body 310.

[0122] The material of the insulating layer 323 can be selected according to the material of the mounting base body 310, so that the material of the insulating layer 323 is the same as that of the mounting base body 310, and the dielectric constant of the insulating layer 323 is as close as possible to the dielectric constant of the mounting base body 310. Thus, the impedance values of the transmission section 3211 and the second pin section 322 can be made relatively close. Thus, impedance mutation during signal transmission in the entire transmission link can be avoided. Impedance mutation will cause some signals to be reflected back to the signal source end, thereby reducing the stability of signal transmission.

[0123] In a possible implementation manner, an adhesive layer is provided between the insulating layer 323 and the outer surface of the transmission section 3211.

[0124] Specifically, before coating the insulating layer 323, an adhesive can be first coated on the outer surface of the transmission section 3211 to form an adhesive layer, and the adhesive layer can reliably bond the insulating layer 323 to the transmission section 3211 to prevent the insulating layer from falling off. The adhesive can be an organic adhesive, thus, the influence of the adhesive layer on impedance can be minimized.

[0125] In the description of the embodiments of the present application, it should be noted that unless otherwise clearly specified and limited, the terms "mount", "connect", and "couple" should be understood in a broad sense. For example, it can be a fixed connection, or an indirect connection through an intermediate medium, and can be the internal communication of two components or the interaction relationship between two components. For those of ordinary skill in the art, the specific meanings of the above terms in the embodiments of the present application can be understood according to specific situations.

[0126] Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the embodiments of the present application, and are not intended to limit them; although the embodiments of the present application have been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that: they can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements on some or all of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A mounting seat, the mounting seat is used to mount components on a circuit board, characterized in that: include: A mounting seat body and a plurality of pins, wherein the plurality of pins are arranged at intervals in the mounting seat body, the pins include a first pin segment and a second pin segment, the second pin segment is installed in the mounting seat body, the first pin segment includes a transmission segment and a connecting end connected to the transmission segment, an end of the transmission segment away from the connecting end is connected to a portion of the second pin segment exposed from the mounting seat body, an outer surface of the transmission segment is provided with an insulating layer, and the connecting end is used to be electrically connected to the component.

2. The mounting seat according to claim 1, characterized in that: The relative dielectric constant of the insulating layer is greater than or equal to 2 and less than or equal to 7.

3. The mounting seat according to claim 2, characterized in that: The thickness of the insulating layer is 0.5-2 times the thickness of the transmission section.

4. The mounting seat according to claim 3, characterized in that: The material of the insulating layer is the same as that of the mounting seat body.

5. The mounting seat according to claim 4, characterized in that: An adhesive layer is provided between the insulating layer and the outer surface of the transmission section.

6. The mounting seat according to any one of claims 1 to 5, characterized in that: The mounting seat is a processor mounting seat, the mounting seat body includes a first surface and a second surface, the first pin segment is connected to the portion of the second pin segment exposed from the first surface, and the processor mounting seat also includes a first contact terminal, and the first contact terminal is electrically connected to the connection end.

7. The mounting seat according to claim 6, characterized in that: The processor mounting socket further includes a second contact terminal, the second contact terminal is located on one side of the second surface, and the second lead segment extends to the second surface to be electrically connected to the second contact terminal.

8. The mounting seat according to any one of claims 1 to 5, characterized in that: The mounting seat is a memory mounting seat, the mounting seat body includes a third surface and a fourth surface, the first pin segment is connected to the portion of the second pin segment exposed from the third surface, the transmission segment is elastically deformable, and the two opposite transmission segments are used to clamp on two opposite surfaces of the memory so that the connection end is electrically connected to the memory.

9. The mounting seat according to claim 8, characterized in that: The second lead segment is partially exposed from the fourth surface for electrical connection with a circuit board.

10. A computing device, characterized in that It comprises a circuit board, components and a mounting seat as claimed in any one of claims 1 to 9, wherein the mounting seat is arranged on the circuit board, and the components are arranged on the mounting seat; The connection end in the mounting base is electrically connected to the component, and the second pin segment in the mounting base is electrically connected to the circuit board.

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